Oligomeric aliphatic–aromatic ether containing phthalonitrile resins

A versatile synthetic method has been developed for oligomeric aliphatic–aromatic ether containing phthalonitrile (PN) resins and applied to the preparation of three unique resin systems. The oligomeric PN monomers were prepared from the reaction of an excess amount of bisphenol A with a dihalo‐aliphatic containing compound in the presence of K₂CO₃ in dimethylsulfoxide, followed by end‐capping with 4‐nitrophthalonitrile in a two‐step, one‐pot reaction. These PN resin systems exhibited excellent viscosities for molding various shaped articles after thermal curing to yield crosslinked polymers. These polymers offered more mechanical flexibility, when compared with an all aromatic backbone, while still maintaining good thermal stability, dielectric properties, and low water absorption. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2015 , 53, 2186–2191     

Synthesis of bisphenol A‐free oligomeric phthalonitrile resins with sulfone and sulfone‐ketone containing backbones

Two new oligomeric sulfone and sulfone‐ketone containing phthalonitrile (PN) resins with excellent processability have been developed. The PN monomers were prepared from the reaction of an excess amount of bisphenol S with 4‐(chlorophenyl)sulfone or 4,4‐dichlorobenzophenone in the presence of a base in a solvent mixture (dimethylsulfoxide/toluene), followed by end‐capping with 4‐nitro‐PN in a two‐step, one‐pot reaction. These PN resins exhibited good viscosities and cure times for molding into various shapes. After being thermally cured to yield crosslinked polymers, these polymers demonstrated superb mechanical properties, thermo‐oxidative stability, and maintained good dielectric properties. Published 2016. 1 J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 1639–1646     

Synthesis and properties of a novel high temperature pyridine‐containing phthalonitrile polymer

A novel pyridine‐containing aromatic phthalonitrile monomer, 2,6‐bis[4‐(3,4‐dicyanophenoxy)benzoyl]pyridine (BCBP) was synthesized from the nitro displacement of 4‐nitrophthalonitrile by the phenoxide of 2,6‐bis (4‐hydroxybenzoyl)pyridine (BHBP). 4‐(Aminophenoxy) phthalonitrile (APPH) was selected to promote the curing reaction, and the curing behavior has been investigated by differential scanning calorimetric (DSC), suggesting a wide processing window about 64 °C. Different curing additive concentrations resulted in polymers with different crosslinking degrees and subsequently influenced the performance of resins. The resulting BCBP polymer exhibited high glass transition temperatures exceeding 400 °C, outstanding thermo‐oxidative stability with weight retention of 95% at 530 °C, indicating a significant improvement in thermal properties endowed by pyridine units. Additionally, it also showed a lower overall water absorption after submersion in boiling water for 50 hours. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 3819–3825     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Investigation of processing,thermal, and mechanical properties of a new composite matrix‐benzoxazine containing aldehyde group

A new benzoxazine aldehyde group containing monomer 3‐phenyl‐6‐formyl‐3, 4‐dihydro‐2H‐1, 3‐benzoxazine (Ald‐B) was synthesized via the Mannich reaction of formaldehyde, p‐hydroxybenzaldehyde, and aniline. The viscosities and curing behavior of the resins were studied. The results indicated that Ald‐B has an initial viscosity lower than 0.110 Pa s at 90°C and the maximum temperature of the exotherm was at 196°C. Dynamic mechanical analysis (DMA) of the copolymer of Ald‐B and methylenedianiline‐type bis‐benzoxazine (B‐BOZ) showed only one T_g of 251°C and high crosslink density in the matrix. The thermal stability of the copolymer was improved noticeably and the char yield at 800°C is 68.4%. The tensile strength and flexural strength of this resin cast are 72 and 137 MPa, respectively. Copyright © 2009 John Wiley & Sons, Ltd.     

Enhanced properties of phthalonitrile resins under lower curing temperature via complex curing agent

High curing temperature has been restricting the application and development of phthalonitrile resin. A complex curing agent containing melamine (ME) and ZnCl₂ was developed to promote the curing reaction of resorcinol‐based phthalonitrile resin (DPPH). The thermal stability of ME can be significantly enhanced via adding ZnCl₂, which was due to the interaction between ZnCl₂ and amino group in ME. Moreover, the activities of pristine ZnCl₂ and ME were improved via mixing, especially, the curing temperature for DPPH can be effectively reduced. Even at a curing temperature of 300°C, the 5% weight loss temperature of the resulting resin cured with complex curing agent still exceeded 500°C, which was much higher than those with pristine curing agents. In addition, the good long‐term oxidation stability and relatively low water absorption can also be obtained in the resins cured with novel curing agent. This work affords a facile route for designing high‐performance curing agent to improve the curing process of phthalonitrile resin.     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

Novel flame‐retardant thermosets: Diglycidyl ether of bisphenol A as a curing agent of boron‐containing phenolic resins

Boron‐containing novolac resins were synthesized by the modification of a commercial novolac resin with different contents of bis(benzo‐1,3,2‐dioxaborolanyl)oxide. These novolac resins were crosslinked with diglycidyl ether of bisphenol A (DGEBA), and their thermal, thermodynamomechanical, and flame‐retardant properties were evaluated. The boron‐containing novolac resins were less thermally stable than the unmodified novolac resin. Their modification degree and DGEBA content were related to the crosslinking density of the materials. The boron‐containing novolac resins generated boric acid at high temperatures and gave an intumescent char that slowed down the degradation and prevented it from being total. They also showed good flame‐retardant properties. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1701–1710, 2006     

Synthesis and characterization of novel phenolic resins containing aryl‐boron backbone and their utilization in polymeric composites with improved thermal and mechanical properties

In the present study, a novel aryl‐boron‐containing phenolic resin named as PBPR has been synthesized from phenol and formaldehyde in the presence of phenylboronic acid. The chemical structure of the PBPR was confirmed by Fourier transform infrared, nuclear magnetic resonance and X‐ray photoelectron spectroscopy. The molecular weight, viscosity and curing behavior were examined to demonstrate that PBPRs have better processability than common boric acid‐modified phenolic resin. The thermal stability and fracture toughness of the cured PBPRs were greatly enhanced, where the char yield at 1000°C (nitrogen atmosphere) and the glass transition temperature reached 70.0% and 218°C, respectively. The excellent mechanical and ablative properties of the PBPR composites may have benefited from the good interfacial adhesion between the resin matrix and the reinforced fiber. The flexural strength and the linear ablative rate are 436.8 ± 5.2 MPa and 0.010 mm/sec, respectively. This study opens a new window for the preparation of high‐performance ablative composites by designing a resin matrix containing an aryl‐boron backbone. Copyright © 2013 John Wiley & Sons, Ltd.     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

New powder coatings with low curing temperature and enhanced mechanical properties obtained from DGEBA epoxy resins and Meldrum acid using erbium triflate as curing agent

New low curing temperature powder coatings obtained by copolymerization of epoxy resins with Meldrum acid (MA) initiated by erbium (III) trifluoromethanesulfonate have been formulated. Their mechanical and thermomechanical properties have been studied and compared with a commonly used industrial system (o-tolylbiguanide/epoxy resin) and with an already formulated epoxy powder coating homopolymerized by erbium trifluoromethanesulfonate. Systems containing low proportions of MA and initiated by erbium trifluoromethanesulfonate lead to a great reduction of curing conditions (temperature/time). Moreover, the new formulated systems present very good mechanical properties, adhesion, and impact resistance. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 2316–2327, 2007     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Novel propargyl‐substituted azo‐coupled phenolic resins

Novel propargyl that contains phenolic resins via azo‐coupling reaction was synthesized. Peculiarities of curing process were investigated by differential scanning calorimetry analysis. Polymerization of resins with azo groups was estimated to be affected by radicals obtained at resin decomposition causing 10°C peak shift to lower temperatures in comparison with resin containing only propargyl group. At the same time, polymerization of triple propargyl bond was shown to not proceed at radical initiation until Cleisen rearrangement and chromene formation. Thermogravimetric analysis revealed increase of thermal stability by 170–190°C and char yield by up to 20% for modified resins in comparison with original novolac resin. Heat deflection temperature estimated by dynamic mechanical analysis was also shown to be increased by at least 110°C for modified resins in comparison with novolac resin. All the synthesized resins are soluble in acetone and used for preparation of unidirectional glass fiber‐based composites. Flexural strength and modulus for modified resins‐based composites were shown to increase by at least 25% and 10% correspondingly in comparison with novolac‐based composite. Copyright © 2015 John Wiley & Sons, Ltd.     

Synthesis and characterization of self‐catalyzed imide‐containing pthalonitrile resins

Some new amino‐ and imide‐containing phthalonitrile compounds with 1:1 molar ratio of amino group to pthalonitrile unit were successfully synthesized. The molecular structures were characterized by spectroscopic techniques. They were thermally polymerized under nitrogen/air, even in the absence of curing additives. The thermal properties of the cured products were characterized by thermogravimetric analysis and differential scanning calorimetry. The 5% weight loss temperatures ranged from 525 to 528 °C and 513 to 520 °C under nitrogen and air, respectively. Char yields (900 °C) were in the range of 62–70%. Rheometric measurements showed that the rate of the cure reaction differs for all the three monomers. The glass transition temperature advances with increasing extent of cure and disappears on postcure at 375 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

High‐Tg and low‐dielectric epoxy thermosets based on a propargyl ether‐containing phosphinated benzoxazine

A propargyl ether‐containing benzoxazine (4) was prepared from a potassium carbonate‐catalyzed nucleophilic substitution of propargyl bromide and a phenolic OH‐containing benzoxazine (3) , which was prepared from 1‐(4‐hydroxyphenyl)‐1‐(4‐aminophenyl)‐1‐(6‐oxido‐6H ‐dibenz <c,e><1,2> oxaphosphorin‐6‐yl)ethane (1) by a three‐step procedure. The curing reactions of (4) were monitored by IR and DSC. A reaction mechanism was proposed based on the observation. Benzoxazines (3) and (4) were applied as epoxy curing agents. The microstructure and the structure‐property relationship of the resulting thermosets are discussed. The double‐strand structure in (4) ‐cured epoxy thermosets afforded higher crosslinking density, and led to higher thermal properties. In addition, the (4) ‐cured epoxy thermosets possess half the amount of highly polar hydroxyl groups than those of the (3) ‐cured epoxy thermosets, resulting in a lower dielectric constant, dissipation factor, and water absorption. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 1359–1367     

Physical gelation of water‐borne thermosetting resins by percolation theory—Urea‐formaldehyde,melamine‐urea‐formaldehyde,and melamine‐formaldehyde resins

Percolation and effective‐medium theories are applied for calculating the connectivity threshold of colloid particles of given shapes, observed during the physical gelation, distinguished from chemical gelation, of aminoplastic resins. The rigidity threshold, being the critical solid fraction at which a rigid network is first formed, was also calculated. For that purpose, it was assumed that the central forces that act between the colloidal particles and aggregates were not alone, thus corresponding to the case of physical gelation. It was shown that the observed change of morphology exhibited by such particles and aggregates as a function of time, from elongated to spherical, significantly delays the gel point. Consequently, the latter occurs only after a rather high fraction of solid phase (typically from 30 to 60%) is formed. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 971–978, 2008     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006