Carbonyldiimidazole‐accelerated efficient cure of epoxidized soybean oil with dicyandiamide

This study investigates the curing of epoxidized soybean oil (ESO) using dicyandiamide (DICY) and combinations of DICY with several accelerators as curing agents. The differential scanning calorimetry (DSC) results indicated that carbonyldiimidazole (CDI) is a highly efficient accelerator for the ESO‐DICY curing system. CDI accelerated ESO‐DICY curing system can gel within a short period of 13 min at 190 °C. The activation energies of the ESO‐DICY curing systems with and without CDI are 95 and 121 kJ mol^?1, respectively. Similar acceleration effect was observed in the ESO‐diglycidyl ether of biphenyl A (DGEBA) blending formulations. When the molar part of the glycidyl epoxy groups of DGEBA was equal to the internal epoxy groups of ESO in the mixture, gelation of the DICY curing system accelerated by CDI was achieved in 3 min at 160 °C. Furthermore, the DSC results with FTIR analysis suggest that the stoichiometric curing molar ratio was 3 ESO epoxy units per 1 DICY molecule. Two epoxy units reacted with DICY to give secondary alcohols, while the other one linked to the nitrile group. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 375–382     

Efficient accelerating effect of carbonyldiimidazole on epoxy‐dicyandiamide curing system

Carbonyldiimidazole (CDI) was inventively used as an accelerator for the curing reaction of diglycidyl ether of bisphenol A (DGEBA) with dicyandiamide (DICY) and a high acceleration more effective than imidazole in double usage was observed. This result implies the accelerating role of CDI in the curing process is complex and involved not only the release of imidazole. To detail the accelerating mechanism of CDI, a series of curing reactions was studied by differential scanning calorimetry (DSC), NMR, IR, and viscosity monitoring. The results suggested that the accelerating mechanism of CDI involves (1) acylation of DICY with CDI to give the corresponding adduct with enhanced solubility, (2) the consequent release of imidazole that can react with epoxide, and (3) abstraction of proton of DICY by the alkoxide moiety to give the corresponding DICY anion endowed with enhanced nucleophilicity. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Accelerating effects of N‐aryl‐N′,N′‐dialkyl ureas on epoxy‐dicyandiamide curing system

This report focuses on epoxy‐dicyandiamide (DICY) curing system accelerated by N‐aryl‐N′,N′‐dialkyl urea, aiming at clarifying the accelerating mechanism and the relationship between accelerating effect and molecular structure of the accelerators. Nine N‐aryl‐N′,N′‐dialkyl ureas were synthesized and investigated with measurements of differential scanning calorimetry, thermo gravimetric/differential thermal analysis and NMR spectroscopy. The results revealed that the ureas released the corresponding secondary amines by the thermal dissociation in the presence of epoxide, which led to the formation of tertiary amines that catalyze the addition reaction of DICY to epoxide. Moreover, a tendency that the ureas able to release more compact amines exhibited higher acceleration effects was discovered. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

TSC study and electro‐optical properties of epoxy/acrylic polymer‐dispersed liquid‐crystal film in DICY thermal cure

We report on the structures and electro‐optical properties of epoxy/acrylic polymer‐dispersed liquid‐crystal (PDLC) films. A thermal stimulated current (TSC) analysis was used to investigate the physical structures of PDLC. In the TSC spectrum of PDLC, three relaxation peaks were observed: the glass transition of the liquid crystal, the glass transition of the polymer matrix, and the ρ transition. The ρ transition represents the discharge behavior of space charges, and its intensity increased as the curing time and content of the curing agent dicyandiamide (DICY) increased. The pre‐UV‐cured films with different DICY contents were thermally cured at 130 °C for various periods. The electro‐optical properties of PDLC, such as the contrast ratio and switching voltage, increased as the curing time of DICY, the content of DICY, or both increased. As the ambient temperature increased from 10 to 40 °C, the contrast ratio and switching voltage of PDLC gradually decreased. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 507–514, 2001     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

Acceleration of amine/epoxy reactions with N‐methyl secondary amines

Kinetic studies established that the monomethylation of a primary amine leads to significantly higher reaction rates with glycidyl ethers. The relative rates for approximately 25 amines were determined in an alcohol solvent under pseudo‐first‐order conditions (excess epoxy). The rates were referenced to aniline. For the aliphatic amines, reactivity consistently increased upon going from a primary amine to the corresponding N‐methyl secondary amine. This acceleration effect was not seen for aniline. The enhanced reactivity was also seen in curing systems, both with pure methylated amine curing agents and with complex mixtures obtained from the partial methylation of polyamines. Economically viable partially methylated amine curing agents were obtained by the reductive alkylation of commercial polyamines with formaldehyde and by the reaction of monomethylamine with 3‐(N‐methylamino)propionitrile in the presence of hydrogen and a hydrogenation catalyst. Although actual cure performance is based on a complex combination of several factors, the acceleration due to monomethylation could be a useful tool for enhancing amine/epoxy curing reactions. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 921–930, 2000     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

High‐Tg and low‐dielectric epoxy thermosets based on a propargyl ether‐containing phosphinated benzoxazine

A propargyl ether‐containing benzoxazine (4) was prepared from a potassium carbonate‐catalyzed nucleophilic substitution of propargyl bromide and a phenolic OH‐containing benzoxazine (3) , which was prepared from 1‐(4‐hydroxyphenyl)‐1‐(4‐aminophenyl)‐1‐(6‐oxido‐6H ‐dibenz <c,e><1,2> oxaphosphorin‐6‐yl)ethane (1) by a three‐step procedure. The curing reactions of (4) were monitored by IR and DSC. A reaction mechanism was proposed based on the observation. Benzoxazines (3) and (4) were applied as epoxy curing agents. The microstructure and the structure‐property relationship of the resulting thermosets are discussed. The double‐strand structure in (4) ‐cured epoxy thermosets afforded higher crosslinking density, and led to higher thermal properties. In addition, the (4) ‐cured epoxy thermosets possess half the amount of highly polar hydroxyl groups than those of the (3) ‐cured epoxy thermosets, resulting in a lower dielectric constant, dissipation factor, and water absorption. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 1359–1367     

Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Nanostructured epoxy thermoset templated by an amphiphilic PCL‐b‐PES‐b‐PCL triblock copolymer

The PCL‐b‐PES‐b‐PCL triblock copolymer is used to incorporate into epoxy resin when the blends are cured with 4,4'‐diaminodiphenylsulfone (DDS) to afford the nanostructured epoxy thermosets. The differential scanning calorimetry (DSC) and Fourier transform‐infrared spectroscopy (FT‐IR) show that the nanostructured PCL‐b‐PES‐b‐PCL thermosets are accessed through the formation of the intermolecular hydrogen bonding interactions. The nanostructures are further evidenced by means of small‐angle X‐ray scattering (SAXS) and transmission electron microscopy (TEM). By considering the miscibility of the subchains of block copolymer with epoxy before and after the curing reaction, it is judged that the formation of the nanostructures follows the mechanism of reaction‐induced microphase separation. It is noted that the epoxy resin is significantly toughened in terms of the measurement of critical stress field intensity factor (K_IC). © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016 , 54, 424–432     

Facile,one‐pot synthesis of aromatic diamine‐based benzoxazines and their advantages over diamines as epoxy hardeners

Three aromatic diamine‐based benzoxazines were successfully prepared by a facile, clean, one‐pot procedure from 1,4‐phenylenediamine ( 1 ), 4,4′‐diaminodiphenyl ether ( 2 ), and 4,4′‐diaminodiphenyl methane ( 3 ), respectively. Their structures were confirmed by NMR spectra and single crystal diffractogram. The effect of the reactivity of diamines on the purity of the resultant benzoxazines was discussed. The resultant benzoxazines were applied as hardeners for cresol novolac epoxy (CNE). The processing window, the latent curing characteristic, and the miscibility of benzoxazine/CNE systems were discussed. Compared with diamines ( 1 and 3 ), ( 1 and 3 )‐based benzoxazines show latent curing characteristic as epoxy hardeners, and wide processing windows can be obtained. Compared with diamine ( 2 ) which is immiscible with CNE in the molten state, ( 2 )‐based benzoxazine shows good miscibility with CNE. Dynamic mechanical analysis shows the T_gs of the benzoxazine/CNE thermosets are as high as 242–243 °C. Thermogravimetric analysis shows the outstanding thermal stability of the resultant thermosets. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 2430–2437, 2010     

Functional off‐stoichiometry thiol‐ene‐epoxy thermosets featuring temporally controlled curing stages via an UV/UV dual cure process

We present a facile two‐stage UV/UV activation method for the polymerization of off‐stoichiometry thiol‐ene‐epoxy, OSTE+, networks. We show that the handling and processing of these epoxy‐based resins is made easier by introducing a material with a controlled curing technique based on two steps, where the first step offers excellent processing capabilities, and the second step yields a polymer with suitable end‐properties. We investigate the sequential thiol‐ene and thiol‐epoxy reactions during these steps by studying the mechanical properties, functional group conversion, water absorption, hydrolytic stability, and thermal stability in several different thiol‐ene‐epoxy formulations. Finally, we conclude that the curing stages can be separated for up to 24 h, which is promising for the usefulness of this technique in industrial applications. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 2604‐2615     

Novel flame‐retardant thermosets: Phosphine oxide‐containing diglycidylether as curing agent of phenolic novolac resins

Phosphorus‐containing novolac–epoxy systems were prepared from novolac resins and isobutyl bis(glycidylpropylether) phosphine oxide (IHPOGly) as crosslinking agent. Their curing behavior was studied and the thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured. The T_g and decomposition temperatures of the resulting thermosets are moderate and decrease when the phosphorous content increases. Whereas the phosphorous species decrease the thermal stability, at higher temperatures the degradation rates are lower than the degradation rate of the phosphorous‐free resin. V‐O materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3516–3526, 2004     

Syntheses of conductive adhesives based on epoxy resin and polyanilines by using N‐tert‐butyl‐5‐methylisoxazolium perchlorate as a thermally latent curing reagent

Conductive composites consisted of epoxy resin and polyanilines (PANIs) doped with dodecylbenzenesulfonic acid ( 1 ), dodecylsulfonic acid (2), di(2‐ethylhexyl)sulfosuccinic acid (3), and HCl were synthesized by use of N‐tert‐butyl‐5‐methylisoxazolium perchlorate (5) under various reaction conditions. It was found that the composites with PANI doped with acid 2 (PANI‐2) prepared by curing with 10 mol % of reagent 5 at 80 °C for 12 h showed high electroconductivity along with the low conducting percolation threshold (3 wt % of PANI‐2). Furthermore, the composite with even ?10 wt % of PANI‐2 exhibited ?10^?1 S/cm of electroconductivity. The UV–vis and IR measurements indicated that the conductive emeraldine salt form of PANI‐2 in the composite was maintained after the curing reaction. The thermal stability was studied by TGA and DSC measurements, and then, the T_d10 and T_g of the composite with 5 and 10 wt % of PANI‐2 were found to be similar to those with the cured epoxy resin itself. In addition, the similar investigation with an oxetane resin instead of the epoxy resin was also carried out. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 718–726, 2006     

Mechanistic study of ring‐opening copolymerization of ɛ‐caprolactam with epoxide: Development of novel thermosetting epoxy resin system

We investigated the mechanism of the ring‐opening copolymerization of ?‐caprolactam (?‐CL) with glycidyl phenyl ether (GPE) to afford poly(?‐CL‐co‐GPE) as a model reaction of the thermal curing of certain epoxy resins with ?‐CL. The reaction of ?‐CL and GPE proceeded efficiently in the presence of 1,8‐diazabicyclo[5.4.0]undec‐7‐ene (DBU) at 170^°C for 2 h. The monomer reactivities r₁ of ?‐CL and r₂ of GPE calculated according to the Fineman‐Ross method and the Kelen‐Tüdös method were 0.58 and 5.52, respectively. These values indicate that poly(?‐CL‐co‐GPE) has a pseudo‐block gradient copolymer. Based on these results, we examined the thermal curing reactions of certain epoxy resins with ?‐CL. The corresponding novel cured products were obtained quantitatively, and each of them showed a high glass transition temperature and high thermal stability, presumably due at least in part to a pseudo‐block gradient primary structure resembling that of poly(?‐CL‐co‐GPE). © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2220–2228     

Nanostructured hybrid polymer networks from in situ self‐assembly of RAFT‐synthesized POSS‐based block copolymers

A series of well‐defined hybrid block copolymers PMACyPOSS‐b‐PMMA and PMAiBuPOSS‐b‐PMMA exhibiting high POSS weight contents have been synthesized by RAFT polymerization and further studied as modifiers for epoxy thermosets based on diglycidyl ether of bisphenol A. The hybrid block copolymers self‐assembled within the epoxy precursors into micelles possessing an inorganic core and a PMMA corona. Thanks to the presence of the PMMA blocks that remain miscible until the end of the reaction, curing of the resulting blends afforded nanostructured hybrid organic/inorganic networks with well‐dispersed inorganic‐rich nanodomains with diameters on the order of 20 nm. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

3‐Phenylethynyl phthalimide end‐capped imide oligomers and the cured polymers

In the past decades, 4‐phenylethynyl phthalic anhydride (4‐PEPA) has been the most important endcapper used for thermoset polyimide. As the isomer of4‐PEPA, 3‐phenylethynyl phthalic anhydride (3‐PEPA) has attracted our interest. In this article, 3‐PEPA was synthesized and a comparative study with 4‐PEPA on curing temperature, curing rate, thermal and mechanical properties of oligomers and cured polymers was presented. The new phenylethynyl endcapped model compound, N‐phenyl‐3‐phenylethynyl phthalimide, was synthesized and characterized. The molecular structure of model compound was determined via single‐crystal X‐ray diffraction and the thermal curing process was investigated by Fourier transform infrared. Differential scanning calorimetry clearly showed that the model compound from 3‐PEPA had about 20 °C higher curing onset and peak temperature than the 4‐PEPA analog. This result was further proved by the dynamic rheological analysis that the temperature of minimum viscosity for oligomers end‐capped with 3‐PEPA was above 20 °C higher than that of the corresponding 4‐PEPA endcapped oligomers with the same calculated number average molecular weight. The cured polymer from 3‐PEPA displayed slightly higher thermal oxidative stability than those from 4‐PEPA by thermogravimetric analysis. The thermal curing kinetics of 3‐PEPA endcapped oligomer (OI‐5) and 4‐PEPA endcapped oligomer (OI‐6) fitted a first‐order rate law quite well and revealed a similar rate acceleration trend. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4227–4235, 2008     

Cellulose‐based macroinitiator for crosslinked poly(butyl methacrylate‐co‐pentaerythritol triacrylate) oil‐absorbing materials by SET‐LRP

Cellulose produced from cotton fibers was used as substrate for synthesis of oil‐absorbing materials by single electron transfer‐living radical polymerization. The cellulose macroinitiator was prepared by esterification of hydroxyl group with 2‐bromoisobutyryl bromide (BiBB), followed by grafting with butyl methacrylate (BMA) and pentaerythritol triacrylate (PETA) to render a three‐dimensional architecture. The polymerization was catalyzed by Cu(0) powder/hexamethylenetetramine (HMTA) and performed in N,N‐dimethylformamide (DMF). Effects of cellulose, catalyst, reaction temperature, and time were investigated in detail. The maximum oil absorption to chloroform and toluene could reach 29.0 and 15.4 g·g^?1, respectively. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2013