短沟道金属-氧化物半导体场效应晶体管的散粒噪声模型

随着金属-氧化物半导体场效应晶体管(MOSFET)器件的尺寸进入到纳米量级,器件的噪声机理逐渐开始转变.传统的热噪声与漏源电流模型精度出现下降,散粒噪声成为器件噪声不可忽略的因素.本文通过求解能量平衡方程,推导了短沟道MOSFET器件的沟道电子温度和电子速度表达式,由此建立了漏源电流模型;基于漏源电流模型建立了适用于40 nm以下器件的散粒噪声模型和热噪声模型.研究了n型金属-氧化物半导体场效应晶体管(NMOSFET)器件在不同偏置电压下,器件尺寸对散粒噪声抑制因子和噪声机理的影响.研究表明:已有的热噪声模型与散粒噪声模型的精度随着器件尺寸的减小而下降,导致相应的散粒噪声抑制因子被高估.当NMOSFET器件的尺寸减小到10 nm时,器件的噪声需由热噪声与受抑制的散粒噪声共同表征.本文建立的短沟道器件散粒噪声模型可应用于纳米尺寸NMOSFET器件噪声性能的分析与建模.     

10 nm金属氧化物半导体场效应晶体管中的热噪声特性分析

随着金属氧化物半导体场效应晶体管(MOSFET)器件等比例缩小至纳米级的较小尺寸,一方面导致的短沟道效应已严重影响热噪声;另一方面使栅、源、漏区及衬底区的热噪声占有比越来越高,而传统热噪声模型主要考虑较大尺寸器件的沟道热噪声,且其模型未考虑到沟道饱和区.本文针对小尺寸纳米级MOSFET器件,并根据器件结构特征和热噪声的基本特性,建立了10 nm器件的热噪声模型,该模型体现沟道区、衬底区及栅、源、漏区,同时考虑到沟道饱和区的热噪声.在模型的基础上,分析沟道热噪声、总热噪声随偏置参量及器件参数之间的关系,验证了沟道饱和区热噪声的存在,并与已有实验结果一致,所得结论有助于提高纳米级小尺寸MOSFET器件的工作效率、寿命及响应速度等.     

AlGaN/GaN 高速电子迁移率晶体管器件电流坍塌效应与界面热阻和温度的研究

本文系统研究了AlGaN/GaN基高速电子迁移率晶体管器件界面热阻和工作温度对器件在高功率下的电流坍塌效应的影响规律.研究发现低漏极电压下热电子是导致负微分输出电导的重要因素,器件工作温度变高会使负微分输出电导减小.高漏极电压下自加热效应是导致电流坍塌的一个重要因素.随着界面热阻的增加,器件跨导降低,阈值电压增大.同时,由于工作环境温度的增高,器件随之温度增高,载流子迁移率会显著降低. 最终这两种因素会引起AlGaN/GaN基高速电子迁移率晶体管器件显著的电流坍塌效应,从而降低了器件整体性能. 关键词： AlGaN/GaN HEMT 器件 热电子效应 自加热效应 电流坍塌效应     

AIGaN／GaN高速电子迁移率晶体管器件电流坍塌效应与界面热阻和温度的研究

本文系统研究了A1GaN／GaN基高速电子迁移率晶体管器件界面热阻和工作温度对器件在高功率下的电流坍塌效应的影响规律．研究发现低漏极电压下热电子是导致负微分输出电导的重要因素,器件工作温度变高会使负微分输出电导减小．高漏极电压下自加热效应是导致电流坍塌的一个重要因素．随着界面热阻的增加,器件跨导降低,阂值电压增大．同时,由于工作环境温度的增高,器件随之温度增高,载流子迁移率会显著降低．最终这两种因素会引起A1GaN／GaN基高速电子迁移率晶体管器件显著的电流坍塌效应,从而降低了器件整体性能．     

SiC/SiO_2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型 ,并对 6H SiC反型层迁移率进行了单电子的MonteCarlo模拟 ,模拟中考虑了沟道区的量子化效应 .模拟结果表明 ,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好 .模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著 ,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响 ,温度升高会引起沟道迁移率降低 .     

总剂量效应致0.13μm部分耗尽绝缘体上硅N型金属氧化物半导体场效应晶体管热载流子增强效应

空间科学的进步对航天用电子器件提出了更高的性能需求, 绝缘体上硅(SOI)技术由此进入空间科学领域, 这使得器件的应用面临深空辐射环境与地面常规可靠性的双重挑战. 进行SOI N型金属氧化物半导体场效应晶体管电离辐射损伤对热载流子可靠性的影响研究, 有助于对SOI器件空间应用的综合可靠性进行评估. 通过预辐照和未辐照、不同沟道宽长比的器件热载流子试验结果对比, 发现总剂量损伤导致热载流子损伤增强效应, 机理分析表明该效应是STI辐射感生电场增强沟道电子空穴碰撞电离率所引起. 与未辐照器件相比, 预辐照器件在热载流子试验中的衬底电流明显增大, 器件的转移特性曲线、输出特性曲线、跨导特性曲线以及关键电学参数V_T, GM_max, ID_SAT退化较多. 本文还对宽沟道器件测试中衬底电流减小以及不连续这一特殊现象进行了讨论.     

沟道宽度对ZnO-TFT电学性能的影响

用射频磁控溅射法生长的ZnO薄膜作为有源层,制备出了ZnO基薄膜晶体管(ZnO-TFT),并在空气环境下350℃退火1 h,研究了沟道宽度对ZnO-TFT器件性能的影响。实验结果表明:阈值电压随着沟道宽度的减小而增加,这是由于沟道越窄,载流子被捕获的几率越大,在相同栅压下沟道内可动载流子浓度越小,相应的阈值电压就越大;饱和迁移率随着沟道宽度的减小而增加,认为这是由源/漏电阻的侧壁效应及边缘电子场效应引起的附加电流所致。     

基于钴和坡莫合金纳磁体的全自旋逻辑器件开关特性研究

基于纳磁体动力学和自旋传输机理, 建立了全自旋逻辑(ASL)器件的自旋传输-磁动力学模型. 基于该模型分别研究了钴纳磁体构成的全自旋逻辑(CoASL)器件和坡莫合金纳磁体构成的全自旋逻辑(PyASL)器件在不同沟道长度和电源电压下的开关特性. 结果显示PyASL器件在开关延迟时间和功耗上要小于CoASL器件, 且能可靠工作的最大沟道长度要大于CoASL器件. 另外, 两种ASL器件的开关延迟时间可通过减小沟道长度或增加电源电压来减小; 而功耗可通过减小沟道长度或电源电压来减小. 同时, 减小沟道长度能有效抑制热噪声对开关延迟时间和功耗的影响, 但增大电源电压只能抑制热噪声对开关延迟时间的影响. 上述研究结果将为优化ASL器件磁性材料和器件结构提供重要的参数选择依据.     

SiC/SiO2界面粗糙散射对沟道迁移率影响的Monte Carlo研究

提出了一种SiC反型层表面粗糙散射的指数模型,并对6H-SiC反型层迁移率进行了单电子的Monte Carlo模拟,模拟中考虑了沟道区的量子化效应.模拟结果表明,采用表面粗糙散射的指数模型能够使SiC反型层迁移率的模拟结果和实验值符合得更好.模拟结果还反映出有效横向电场较高时表面粗糙散射的作用会变得更显著,电子的屏蔽效应降低了粗糙散射对沟道迁移率的影响,温度升高会引起沟道迁移率降低. 关键词： 6H-SiC 反型层迁移率 表面粗糙散射 指数模型     

GaN高电子迁移率晶体管强电磁脉冲损伤效应与机理

提出了一种新型GaN异质结高电子迁移率晶体管在强电磁脉冲下的二维电热模型,模型引入材料固有的极化效应,高场下电子迁移率退化、载流子雪崩产生效应以及器件自热效应,分析了栅极注入强电磁脉冲情况下器件内部的瞬态响应,对其损伤机理和损伤阈值变化规律进行了研究.结果表明,器件内部温升速率呈现出"快速-缓慢-急剧"的趋势.当器件局部温度足够高时(2000 K),该位置热电子发射与温度升高形成正反馈,导致温度急剧升高直至烧毁.栅极靠近源端的柱面处是由于热积累最易发生熔融烧毁的部位,严重影响器件的特性和可靠性.随着脉宽的增加,损伤功率阈值迅速减小而损伤能量阈值逐渐增大.通过数据拟合得到脉宽τ与损伤功率阈值P和损伤能量阈值E的关系.     

A unified drain current 1/f noise model for GaN-based high electron mobility transistors

In this work, we present a theoretical and experimental study on the drain current 1/f noise in the AIGaN/GaN high electron mobility transistor （HEMT）. Based on both mobility fluctuation and carrier number fluctuation in a two- dimensional electron gas （2DEG） channel of AlGaN/GaN HEMT, a unified drain current 1/f noise model containing a piezoelectric polarization effect and hot carrier effect is built. The drain current 1/f noise induced by the piezoelectric polarization effect is distinguished from that induced by the hot carrier effect through experiments and simulations. The simulation results are in good agreement with the experimental results. Experiments show that after hot carrier injection, the drain current 1/f noise increases four orders of magnitude and the electrical parameter degradation Agm/gm reaches 54.9%. The drain current 1/f noise degradation induced by the piezoelectric effect reaches one order of magnitude; the electrical parameter degradation Agm/gm is 11.8%. This indicates that drain current 1/f noise of the GaN-based HEMT device is sensitive to the hot carrier effect and piezoelectric effect. This study provides a useful reliability characterization tool for the A1GaN/GaN HEMTs.     

新型槽栅nMOSFET凹槽拐角效应的模拟研究

应用二维器件仿真程序PISCES Ⅱ，模拟计算了新型槽栅结构器件中凹槽拐角效应的影响与作用，讨论了槽栅结构MOSFET的沟道电场特征及其对热载流子效应、阈值电压特性等的影响.槽栅结构的凹槽拐角效应对抑制短沟道效应和抗热载流子效应是十分有利的，并且拐角结构在45°左右时拐角效应最大.调节拐角与其他结构参数，器件的热载流子效应、阈值电压特性、亚阈值特性、输出特性等都会有较大的变化. 关键词： 槽栅MOSFET 拐角效应 阈值电压 热载流子退化     

Hot-Electron Magneto-Transport in InSb

The balance equations are used to investigate the hot electron magneto-transport in narrowgap semiconductor InSb at 77 K in crossed weak magnetic field and electric field. In the case of vanishing transverse velocity, the drift mobility and the Hall mobility are calculated and it is shown that the Hall factor in InSb at 77K is less than 1 and decreases with electric field. In the case of vanishing transverse electric field, the longitudinal velocity and the transverse velocity are calculated as a function of the magnetic field and the electric field. The effect of the magnetic field on the longitudinal velocity is different from that on the transverse velocity.     

Numerical simulation of transconductance of AlGaN/GaN heterojunction field effect transistors at high temperatures

Based on the investigation of the influence of temperatures on parameters, including polarization, electron mobility, thermal conductivity, and conduction band discontinuity at the interface between AlGaN and GaN, the temperature dependence of transconductance for AlGaN/GaN heterojunction field effect transistors (HFETs) has been obtained by using a quasi-two-dimensional approach, and the calculated results are in good agreement with the experimental data. The reduction in transconductance at high temperatures is primarily due to the decrease in electron mobility in the channel. Calculations also demonstrate that the self-heating effect becomes serious as environment temperature increases.     

Theoretical analytic model for RESURF AlGaN/GaN HEMTs

In this paper, we propose a two-dimensional(2D) analytic model for the channel potential and electric field distribution of the RESURF AlGaN/GaN high electron mobility transistors(HEMTs). The model is constructed by two-dimensional Poisson's equation with appropriate boundary conditions. In the RESURF AlGaN/GaN HEMTs, we utilize the RESURF effect generated by doped negative charge in the AlGaN layer and introduce new electric field peaks in the device channels,thus, homogenizing the distribution of electric field in channel and improving the breakdown voltage of the device. In order to reveal the influence of doped negative charge on the electric field distribution, we demonstrate in detail the influences of the charge doping density and doping position on the potential and electric field distribution of the RESURF AlGaN/GaN HEMTs with double low density drain(LDD). The validity of the model is verified by comparing the results obtained from the analytical model with the simulation results from the ISE software. This analysis method gives a physical insight into the mechanism of the AlGaN/GaN HEMTs and provides reference to modeling other AlGaN/GaN HEMTs device.     

高功率微波作用下高电子迁移率晶体管的损伤机理

本文针对高电子迁移率晶体管在高功率微波注入条件下的损伤过程和机理进行了研究,借助SentaurusTCAD仿真软件建立了晶体管的二维电热模型,并仿真了高功率微波注入下的器件响应.探索了器件内部电流密度、电场强度、温度分布以及端电流随微波作用时间的变化规律.研究结果表明,当幅值为20 V,频率为14.9 GHz的微波信号由栅极注入后,器件正半周电流密度远大于负半周电流密度,而负半周电场强度高于正半周电场.在强电场和大电流的共同作用下,器件内部的升温过程同时发生在信号的正、负半周内.又因栅极下靠近源极侧既是电场最强处,也是电流最密集之处,使得温度峰值出现在该处.最后,对微波信号损伤的高电子迁移率晶体管进行表面形貌失效分析,表明仿真与实验结果符合良好.     

Hot electron transverse conductivity in quantizing magnetic fields

In this work the general expression of the electron transverse conductivity tensor of an electron-phonon system being in crossed strong electric and quantizing magnetic fields is considered starting from the Kubo-Kalashnikov formula. An explicit formula for the hot electron transverse conductivity σ _xx is obtained and it is compared to a Titeica-type formula with the temperature of electrons replaced by an effective electron temperature depending on the electric field.     

Analytical modeling and simulation of subthreshold behavior in nanoscale dual material gate AlGaN/GaN HEMT

A two-dimensional (2-D) analytical model for a Dual Material Gate (DMG) AlGaN/GaN High Electron Mobility Transistor (HEMT) has been developed to demonstrate the unique attributes of this device structure in suppressing short channel effects (SCEs). The model accurately predicts the channel potential, electric field variation along the channel, and sub-threshold drain current, taking into account the effect of lengths of the two gate metals, their work functions, barrier layer thicknesses, and applied drain biases. It is seen that the SCEs and hot carrier effects in DMG AlGaN/GaN HEMT are suppressed due to the work function difference of the two metal gates, thereby screening the drain potential variations by the gate near the drain. Besides, a more uniform electric field along the channel leads to improved carrier transport efficiency. The accuracy of the results obtained from our analytical model has been verified using ATLAS device simulations.     

有机二极管基于通用迁移率模型的解析电流电压关系

提出一种有机半导体二极管电流电压关系的解析表达式.该表达式是基于Pasveer等人[Phys.Rev.Lett.94,206601 (2005)]的迁移率模型建立的,其中考虑了影响有机半导体载流子输运最重要的因素,包括温度、载流子浓度和电场强度.将Pasveer等人迁移率公式中的载流子浓度和电场强度用常数迁移率下严格解...