基于晶体塑性理论的孔洞生长行为研究

采用率相关晶体塑性模型,建立三维胞元计算模型,研究了晶粒取向和晶界对孔洞生长和聚合的影响.比较了不同晶粒取向的单晶和双晶体中孔洞的生长趋势,发现晶粒取向对孔洞生长方向,孔洞形状等有着显著的影响.     

表面微空洞长大和相互作用的晶体有限元分析

通过建立空洞长大和相互作用的3D模型,采用晶体塑性有限元模拟研究了FCC晶体表面空洞的长大和相互作用行为,分析了晶体取向和微空洞在表面的深度变化对表面空洞长大和相互作用的影响.模拟结果表明:晶体取向除了影响空洞形状和长大方向外,还会影响空洞长大速度;总体而言,在固定位移边界条件下硬取向晶粒表面的空洞长大和相互作用大于软取向.随着空洞在单晶体表面深度的增加,空洞周围的最大塑性变形增加,变形局部化更加严重,空洞长大速度增加.     

单晶与纳米多晶锡层裂的分子动力学研究

低熔点金属的层裂是目前延性金属动态断裂的基础科学问题之一。采用非平衡态分子动力学方法模拟了冲击压力在13.5～61.0 GPa下单晶和纳米多晶锡的经典层裂和微层裂过程。研究结果表明：在加载阶段,冲击速度不影响单晶模型中的波形演化规律,但影响纳米多晶模型中的波形演化规律,其中经典层裂中晶界滑移是影响应力波前沿宽度的重要因素;在单晶模型中,经典层裂和微层裂中孔洞成核位置位于高势能处;在纳米多晶模型中,经典层裂中的孔洞多在晶界（含三晶界交界处）处成核,并沿晶定向长大,产生沿晶断裂,而微层裂中孔洞在晶界和晶粒内部成核,导致沿晶断裂、晶内断裂和穿晶断裂;孔洞体积分数呈现指数增长,相同冲击速度下单晶和纳米多晶Sn孔洞体积分数变化规律一致;经典层裂中孔洞体积分数曲线的两个转折点分别表示孔洞成核与长大的过渡和材料从损伤到断裂的灾变性转变。     

晶粒的取向和变形性质对双晶体循环变形影响的模拟研究

应用晶体细观力学方法，分析了双晶体循环变形过程中组元晶粒取向及其变形性质（Ｂａｕｓｃｈｉｎｇｅｒ效应和循环硬化）的影响，发现双晶体的反向屈服及循环硬化行为为主要由组元晶粒性质支配，晶间内应力的影响是次要的，晶粒取向对宏微观应力应变行为有重要的影响，取向对称性较弱或罗硬差别较大的双晶体晶界影响较大。     

含球形孔洞双晶铜单向拉伸性能的分子动力学模拟

采用分子动力学方法模拟了在单向拉伸载荷作用下含孔洞双晶铜晶体的力学行为,研究了晶粒内部孔洞和晶界孔洞对晶体力学行为的影响。结果表明,孔洞可以显著降低双晶体的弹性模量和屈服应力。对于晶粒内部关于晶界对称的孔洞,随着孔间距的增大,晶体弹性模量和屈服应力都有明显的提高;当保持孔间距不变而改变孔半径时,随着孔体积的不断增大,晶体弹性模量和屈服应力又都呈现出递减趋势。对于晶界上的孔洞,孔洞形状对晶体拉伸性能有显著影响,并且随着孔半径的增大,晶体弹性模量和屈服应力呈现出递减趋势,如果保持孔洞总体积恒定而依次增加孔洞数量,则晶体弹性模量和屈服应力逐渐减小。     

考虑两种晶界的各向异性双晶和三晶体晶界附近弹塑性应力场分析

采用率相关的晶体滑移有限元程序对具有不同晶体取向的双晶体晶界附近及三晶体三晶粒交汇处的弹塑性应力场进行了计算,考虑了几何晶界和物理晶界的影响.计算结果表明:双晶体及三晶体考虑几何晶界和物理晶界时,这两种晶界具有相同的应力分布趋势,只是物理晶界比几何晶界的应力集中程度小,双晶体晶界附近有较大的应力梯度,存在应力集中现象.三晶体三晶粒交汇处可能是应力集中之地也可能不造成应力集中,这主要取决于晶粒晶体取向及加载方向.由此可见,要准确理解金属材料的断裂过程,还需要从细观的角度对晶界的力学响应进行细致和深入的研究.     

多晶体变形、应力的不均匀性及宏观响应

从单晶滑移变形分析的角度探讨多晶体塑性变形和应力的不均匀性及宏观力学响应：建议了 一种当前构形下以应力为基本变量的单晶黏塑性增量迭代计算方法；用Voronoi晶粒集合体 模型研究多晶体由于晶粒几何及取向的随机性造成的变形和应力的不均匀性, 进行了多晶集 合体的宏观响应和晶粒位向演化数值分析. 结果表明：(1)多晶体内等效塑性应变和应力分量在统计上呈现高斯分布，在应变硬化过程中, 随着塑性变形增加多晶体微观应力的统计变异系数会越来越大；(2)用Voronoi模型计算可得到沿最大剪应力方向的滑移变形带；(3)多晶体内最高三轴拉应力一般出现在晶界特别是三晶交界处；(4)Voronoi模型能用于织构分析.     

单晶高温合金中铸造微孔洞的扩长

基于有限变形晶体塑性本构关系及轴对称体胞模型,采用有限元的方法,分析了在不同取向偏角及不同滑移系开动,单晶高温合金中铸造微孔洞扩长的力学行为。分析结果表明:取向偏角对铸造微孔洞的扩长具有重要的意义,但对铸造微孔洞的形状改变影响不大,为改善单晶高温合金热端部件的疲劳、蠕变性能,控制晶体的取向偏角是很必要的;滑移系族开动的类型对铸造微孔洞的扩长有很大的影响,这种影响与Schmid因子、加载的取向相关,为更加准确地分析单晶高温热端部件的寿命,确定滑移系族开动类型至关重要。     

含与不含晶界空穴的双晶体蠕变行为研究

基于晶体滑移理论,建立了各向异性镍基合金双晶体的蠕变本构模型和蠕变寿命预测模型,通过MARC用户子程序CRPLAW将上述本构模型进行了有限元实现,并对双晶体蠕变行为进行了计算分析,考虑了:(1)晶体取向的影响;(2)垂直、倾斜和平行于外载方向的三种位向晶界情况;(3)晶界处引进空间空穴的影响。结果表明,双晶体上特别是微空穴和晶界附近区域的蠕变应力应变呈现不同的变化规律,对此晶粒晶体取向和晶界位向有较大的影响;微空穴的存在削弱了双晶体的承载能力,显著地影响了双晶体蠕变持久寿命;相同条件下,垂直晶界对双晶体模型的蠕变损伤影响最为强烈,倾斜晶界次之,平行晶界最小;微空穴的生长与晶界位向和晶体取向有强烈的依赖关系,其中垂直晶界更有利于晶体滑移和微空穴生长。     

单晶高温材料中铸造微孔洞的扩长

基于有限变形晶体塑性本构关系及三维体胞模型,采用有限元的方法,分析了在不同应力三维度、不同罗德参数、不同滑移系开动及不同加载取向下,单晶高温合金中铸造微孔洞扩长的力学行为。分析结果表明:累积剪切应变在铸造微孔洞的扩长中起着很重要的作用,大的累积剪切应变对应高含量的铸造微孔洞;开动滑移系族的类型对铸造微孔扩长的影响不容忽视,故准确的确定开动滑移系的类型,对于评估单晶热端部件的寿命至关重要。由于不同的取向具有不同的Schmid因子、弹性模量及开动滑移系,单晶高温合金中的铸造微孔洞的扩长还与取向密切相关,因此根据热端部件工况,合理的选择其取向是有必要的。     

磁电弹复合材料和刚性导电导磁圆柱压头的二维微动接触分析

本文求解平面应变状态下磁电弹复合材料半平面和刚性导电导磁圆柱压头的二维微动接触问题。假设压头具有良好的导电导磁性,且表面电势和磁势是常数。微动接触依赖载荷的加载历史,所以首先求解单独的法向加载问题,然后在法向加载问题的基础上求解循环变化的切向加载问题。整个接触区可以分为内部的中心粘着区和两个外部的滑移区,其中滑移区满足Coulomb摩擦法则。利用Fourier积分变换,磁电弹半平面的微动接触问题将简化为耦合的Cauchy奇异积分方程组,然后数值离散为线性代数方程组,利用迭代法求解未知的粘着/滑移区尺寸、电荷分布、磁感应强度、法向接触压力和切向接触力。数值算例给出了摩擦系数、总电荷和总磁感应强度对各加载阶段的表面接触应力、电位移和磁感应强度的影响。     

Void growth and coalescence in single crystals

Void growth and coalescence in single crystals are investigated using crystal plasticity based 3D finite element calculations. A unit cell involving a single spherical void and fully periodic boundary conditions is deformed under constant macroscopic stress triaxiality. Simulations are performed for different values of the stress triaxiality, for different crystal orientations, and for low and high work-hardening capacity. Under low stress triaxiality, the void shape evolution, void growth, and strain at the onset of coalescence are strongly dependent on the crystal orientation, while under high stress triaxiality, only the void growth rate is affected by the crystal orientation. These effects lead to significant variations in the ductility defined as the strain at the onset of coalescence. An attempt is made to predict the onset of coalescence using two different versions of the Thomason void coalescence criterion, initially developed in the framework of isotropic perfect plasticity. The first version is based on a mean effective yield stress of the matrix and involves a fitting parameter to properly take into account material strain hardening. The second version of the Thomason criterion is based on a local value of the effective yield stress in the ligament between the voids, with no fitting parameter. The first version is accurate to within 20% relative error for most cases, and often more accurate. The second version provides the same level of accuracy except for one crystal orientation. Such a predictive coalescence criterion constitutes an important ingredient towards the development of a full constitutive model for porous single crystals.     

Size effects on void growth in single crystals with distributed voids

The effect of void size on void growth in single crystals with uniformly distributed cylindrical voids is studied numerically using a finite deformation strain gradient crystal plasticity theory with an intrinsic length parameter. A plane strain cell model is analyzed for a single crystal with three in-plane slip systems. It is observed that small voids allow much larger overall stress levels than larger voids for all the stress triaxialities considered. The amount of void growth is found to be suppressed for smaller voids at low stress triaxialities. Significant differences are observed in the distribution of slips and on the shape of the deformed voids for different void sizes. Furthermore, the orientation of the crystalline lattice is found to have a pronounced effect on the results, especially for the smaller void sizes.     

Lattice orientation effects on void growth and coalescence in fcc single crystals

Void growth and coalescence in fcc single crystals were studied using crystal plasticity under uniaxial and biaxial loading conditions and various orientations of the crystalline lattice. A 2D plane strain unit cell with one and two cylindrical voids was employed using three-dimensional 12 potentially active slip systems. The results were compared to five representative orientations of the tensile axis on the stereographic triangle. For uniaxial tension conditions, the void volume fraction increase under the applied load is strongly dependent on the crystallographic orientation with respect to the tensile axis. For some orientations of the tensile axis, such as [1 0 0] or [1 1 0], the voids exhibited a growth rate twice as fast compared with other orientations ([1 0 0], [2 1 1]). Void growth and coalescence simulations under uniaxial loading indicated that during deformation along some orientations with asymmetry of the slip systems, the voids experienced rotation and shape distortion, due mainly to lattice reorientation. Coalescence effects are shown to diminish the influence of lattice orientation on the void volume fraction increase, but noteworthy differences are still present. Under biaxial loading conditions, practically all differences in the void volume fraction for different orientations of the tensile axes during void growth vanish. These results lead to the conclusion that at microstructural length scales in regions under intense biaxiality/triaxiality conditions, such as crack tip or notched regions, the plastic anisotropy due to the initial lattice orientation has only a minor role in influencing the void growth rate. In such situations, void growth and coalescence are mainly determined by the stress triaxiality, the magnitude of accumulated strain, and the spatial localization of such plastic strains.     

Cylindrical void in a rigid-ideally plastic single crystal. Part I: Anisotropic slip line theory solution for face-centered cubic crystals

The fracture toughness of ductile materials depends upon the ability of the material to resist the growth of microscale voids near a crack tip. Mechanics analyses of the elastic–plastic deformation state around such voids typically assume the surrounding material to be isotropic. However, the voids exist predominantly within a single grain of a polycrystalline material, so it is necessary to account for the anisotropic nature of the surrounding material. In the present work, anisotropic slip line theory is employed to derive the stress and deformation state around a cylindrical void in a single crystal oriented so that plane strain conditions are admitted from three effective in-plane slip systems. The deformation state takes the form of angular sectors around the circumference of the void. Only one of the three effective slip systems is active within each sector. Each slip sector is further subdivided into smaller sectors inside of which it is possible to derive the stress state. Thus the theory predicts a highly heterogeneous stress and deformation state. In addition, it is shown that the in-plane pressure necessary to activate plastic deformation around a cylindrical void in an anisotropic material is significantly higher than that necessary for an isotropic material. Experiments and single crystal plasticity finite element simulations of cylindrical voids in single crystals, both of which exhibit a close correspondence to the analytical theory, are discussed in a companion paper.     

Evaluation of creep damage behavior of nickel-base directionally solidified superalloys with different crystallographic orientations

A crystallographic creep damage constitutive model is developed for nickel-base directionally solidified superalloys. The rates of material degradation and grain boundary void growth are considered. The governing parameters are determined from the creep test data of single crystals and directionally solidified superalloys with a crystallographic orientation. A finite element program is used to analyze the creep damage behavior of nickel-base directionally solidified superalloys for different crystallographic orientations. The results depend on the number of grains modelled and compare well with the experimental data.     

Effects of void band orientation and crystallographic anisotropy on void growth and coalescence

The effects of void band orientation and crystallographic anisotropy on void growth and linkage have been investigated. 2D model materials were fabricated by laser drilling a band of holes into the gage section of sheet tensile samples using various orientation angles with respect to the tensile axis normal. Both copper and magnesium sheets have been studied in order to examine the role of crystallographic anisotropy on the void growth and linkage processes. The samples were pulled in uniaxial tension inside the chamber of an SEM, enabling a quantitative assessment of the growth and linkage processes. The void band orientation angle has a significant impact on the growth and linkage of the holes in copper. As the void band orientation angle is increased from 0° to 45°, the processes of coalescence and linkage are delayed to higher strain values. Furthermore, the mechanism of linkage changes from internal necking to one dominated by shear localization. In contrast, the void band orientation does not have a significant impact on the void growth and linkage processes in magnesium. Void growth in these materials occurs non-uniformly due to interactions between the holes and the microstructure. The heterogeneous nature of deformation in magnesium makes it difficult to apply a coalescence criterion based on the void dimensions. Furthermore, the strain at failure does not show a relationship with the void band orientation angle. Failure associated with twin and grain boundaries interrupts the plastic growth of the holes and causes rapid fracture. Therefore, the impact of the local microstructure outweighs the effects of the void band orientation angle in this material.