Fabrication of nanostructured silicon surface using selective chemical etching

A two-stage process based on selective chemical etching induced by metal nanoclusters is used to fabricate nanostructured surfaces of silicon plates with a relatively low reflectance. At silicon surfaces covered with silver nanoclusters, the SERS effect is observed for rhodamine concentrations of about 10^–12 M. At certain technological parameters, the depth of the nanostructured layer weakly depends on the conditions for the two-stage etching, in particular, etching time. Under otherwise equal conditions for etching, the rate of the formation of textured layer in the p-type silicon is two times greater than the formation rate in the n-type silicon.     

Fabrication of microstructures in Foturan glass using infrared femtosecond laser pulses and chemical etching

In this study, a method for the fabrication of microstructures on the surface and inside Foturan glass by femtosecond laser-induced modification was developed. This technique was followed by heat treatment to crystallize the modified area, and the specimen was then placed in an 8% HF acid solution for chemical etching. The fabricated microstructures were observed using scanning electron microscopy (SEM). The results demonstrated that the etching time is an important parameter in the fabrication of microstructures on Foturan glass. An example of a tapered U-shaped microchannel with a minimized neck diameter of about 5 μm at the central point for cell detection is presented.     

Fabrication of microchannels in glass using focused femtosecond laser radiation and selective chemical etching

We use the combination of femtosecond laser dielectric modification and selective chemical etching to fabricate high-quality microchannels in glass. The photoinduced modification morphology has been studied in fused silica and in borosilicate glass BK7, using ultra-high spatial resolution techniques of selective chemical etching followed by atomic force or scanning electron microscopy. The analysis shows that the high differential etch rate inside the modified regions, is determined by the presence of polarization-dependent self-ordered periodic nanocracks or nanoporous structures. We also investigate the optimum irradiation conditions needed to produce high-aspect ratio microchannels with small symmetric cross-sections and smooth walls. PACS 42.62.-b; 42.65.Re; 81.05.Kf; 87.80.Mj     

Fabrication of three-dimensional periodic microstructures by means of two-photon polymerization

Received: 7 October 1998     

Contribution to time-resolved enhanced chemical etching and simultaneous annealing of ion implantation amorphized silicon under intense laser irradiation

Surfaces of single-crystal silicon wafers are amorphized by high-dose phosphorous ion implantation. These surfaces of the wafers, immersed in concentrated KOH, are laser-chemically etched by pulse irradiation of a ruby laser. Simultaneously, the remaining parts of the amorphous layer are annealed. The time dependence of the etching process enhanced during pulse irradiation is recorded and analysed. Reasons for the etching rates which differ between amorphous and single-crystal silicon are given on the basis of experimental and numerical results.     

Formation of three‐dimensional GaAs microstructures by combination of wet and metal‐assisted chemical etching

Previously, plasma‐enhanced dry etching has been used to generate three‐dimensional GaAs semiconductor structures, however, dry etching induces surface damages that degrade optical properties. Here, we demonstrate the fabrication method forming various types of GaAs microstructures through the combination etching process using the wet‐chemical solution. In this method, a gold (Au)‐pattern is employed as an etching mask to facilitate not only the typical wet etching but also the metal‐assisted chemical etching (MacEtch). High‐aspect‐ratio, tapered GaAs micropillars are produced by using [HF]:[H₂O₂]:[EtOH] as an etching solution, and their taper angle can be tuned by changing the molar ratio of the etching solution. In addition, GaAs microholes are formed when UV light is illuminated during the etching process. Since the wet etching process is free of the surface damage compared to the dry etching process, the GaAs microstructures demonstrated to be well formed here are promising for the applications of III–V optoelectronic devices such as solar cells, laser diodes, and photonic crystal devices. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

A comparative study of the structure and cytotoxicity of polytetrafluoroethylene after ion etching and ion implantation

The ion-plasma treatment has been widely used for modifying the surface structure of polymers in order to improve their properties, but it can lead to destruction of the surface and, as a consequence, to an increase in their toxicity. A comparative study of the structure and cytotoxicity of polytetrafluoroethylene (PTFE) after the ion etching (IE) and ion implantation (II) for 10 min with energy densities of 363 and 226 J/cm², respectively, has been performed. It has been shown that, unlike the ion implantation, the ion etching results in the destruction of the polymer and in the appearance of the cytotoxicity. The factors responsible for this effect, which are associated with the bulk and surface treatment, as well as with the influence of the temperature, have been discussed.     

摆动刻蚀法制作高衍射效率凸面闪耀光栅

通过摆动离子束刻蚀方法,制作了用于短波红外高光谱成像光谱仪的凸面闪耀光栅。该方法通过在光栅子午方向上进行摆动刻蚀,解决了凸面光栅子午方向的闪耀角一致性问题。建立了摆动刻蚀模型来分析摆动速度、束缝宽度等工艺参数对槽型演化的影响,并计算了优化的刻蚀工艺参数。制备了基底尺寸为67 mm,曲率半径为156.88 mm,刻线密度为45.5 gr/mm,闪耀角为2.2°的凸面闪耀光栅,并对其表面形貌及衍射效率进行了测量。实验结果表明,摆动刻蚀法能够制作出闪耀角一致性好、衍射效率高的小闪耀角凸面光栅,满足成像光谱仪对光谱分辨率和便携性的使用要求。     

Sulfur-doped black silicon formed by metal-assist chemical etching and ion implanting

We fabricated sulfur-doped black silicon by metal-assist chemical etching (MCE) and ion implanting. The morphologies of silicon nanowire (SiNW) arrays and the concentration of sulfur in black silicon were analyzed by scanning electron microscope (SEM). Sulfur-doped black silicon shows higher absorption in entire 0.3–2.5 μm wavelength range as compared to undoped SiNW arrays and flat silicon. The changes in the absorption spectra of black silicon with different etching durations and annealing temperature are also shown. Upon annealing, the absorption decreases significantly in 2–2.5 μm wavelength region. The novel results clearly indicate that sulfur implanting could produce below band gap absorption in the silicon substrate.     

Realization of silicon quantum wires by selective chemical etching and thermal oxidation

Ultra-fine silicon quantum wires with SiO₂ boundaries were successfully fabricated by combining SiGe/Si heteroepitaxy, selective chemical etching and subsequent thermal oxidation. The results are observed by scanning electron microscopy. The present method provides a very controllable way to fabricate ultra-fine silicon quantum wires, which is fully compatible with silicon microelectronic technology. As one of the key processes of controlling the lateral dimensions of silicon quantum wires, the wet oxidation of silicon wires has been investigated, self-limiting wet oxidation phenomenon in silicon wires is observed. The characteristic of the oxidation retardation of silicon wires is discussed.     

Investigating the lateral motion of SiGe islands by selective chemical etching

SiGe islands grown by deposition of 10 monolayers of Ge on Si(0 0 1) at 740 °C were investigated by using a combination of selective wet chemical etching and atomic force microscopy. The used etchant, a solution consisting of ammonium hydroxide and hydrogen peroxide, shows a high selectivity of Ge over Si_xGe_1−x and is characterized by relatively slow etching rates for Si-rich alloys. By performing successive etching experiments on the same sample area, we are able to gain a deeper insight into the lateral displacement the islands undergo during post growth annealing.     

Fabrication of glass micro-prisms using ultra-fast laser pulses with chemical etching process

In this study, a new process of glass micro-prism structures is investigated by an ultra-fast laser irradiation with chemical etching process. The ultra-fast laser is employed by an all-in-one femtosecond laser (FS-laser) system with the amplifier as an excitation source for patterning the structures. Here, the center wavelength of laser is frequency-doubled to 517 nm. Besides, the repetition rate and pulse width of laser are 100 kHz and 350 fs, respectively. First, the embedded gratings of glass with different pitches can be fabricated using a FS-laser process. Afterwards, the glass samples are placed in the hydrofluoric acid (HF) solution for 15 min to develop structures. Finally, the results of this study demonstrated that the V-cut micro-prisms are successfully formed by controlling etching concentration between intrinsic glass material and modified areas.     

Fabrication of silicon wafer with ultra low reflectance by chemical etching method

A pyramid and nanowire binary structure of monocrystalline silicon wafer was fabricated by chemical etching. Much lower reflectance of silicon wafer with this structure was obtained compared with that of single pyramid or nanowaire arrays. The morphology, reflectivity and etching thickness of this structure were studied, as well as the influence on them caused by etching time and thickness of silver film. An average reflectance of 0.9% was obtained under optimized condition. The formation mechanism of silicon nanowires was explained by experimental evidence.     

Formation of biaxial texture in metal films by selective ion beam etching

The formation of in-plane texture via ion bombardment of uniaxially textured metal films was investigated. In particular, selective grain Ar ion beam etching of uniaxially textured (0 0 1) Ni was used to achieve in-plane aligned Ni grains. Unlike conventional ion beam assisted deposition, the ion beam irradiates the uniaxially textured film surface with no impinging deposition flux. The initial uniaxial texture is established via surface energy minimization with no ion irradiation. Within this sequential texturing method, in-plane grain alignment is driven by selective etching and grain overgrowth. Biaxial texture was achieved for ion beam irradiation at elevated temperature.     

Fabrication of high-aspect-ratio silicon nanopillar arrays with the conventional reactive ion etching technique

We fabricate silicon nanopillar arrays with pillar diameters smaller than 200 nm by using the conventional reactive ion etching (RIE) technique and nickel masks. We use the ratio between the lateral and vertical etching rates as an estimate of the etching anisotropy. The dependence of this ratio on the rf power, the chamber pressure, and the gas mixture is investigated systematically to achieve the largest etching anisotropy. Using the optimized etching parameters in the RIE process, we demonstrate silicon pillars with smooth surface, vertical sidewalls, and aspect ratios higher than 20. In addition, we employ dilute aqua regia to treat the pillars and shrink the diameters to 70 nm. The pillar height remains ∼2500 nm after the treatment. PACS 52.77.Bn; 81.65.Cf; 85.40.Hp     

Microstructure array on Si and SiOx generated by micro-contact printing, wet chemical etching and reactive ion etching

A method, combining micro-contact printing (μCP), wet chemical etching and reactive ion etching (RIE), is reported to fabricate microstructures on Si and SiOx. Positive and negative structures were generated based on different stamps used for μCP. The reproducibility of the obtained microstructures shows the methodology reported herein could be useful in Micro-Electro-Mechanical Systems (MEMS), optical and biological sensing applications.     

Fabrication of self-ordered nanohole arrays on Si by localized anodization and subsequent chemical etching

Nanohole arrays with a 60 nm hole periodicity were fabricated on a Si substrate by the anodization of an aluminum film sputtered on a Si substrate in sulfuric acid and subsequent chemical etching. The transfer of the nanoporous pattern of anodic alumina into the Si substrate was achieved by the selective removal of silicon oxide, which was produced by the anodic oxidation of the underlying Si substrate through the anodic porous alumina used as a mask.     

Fabrication of long-period optical fiber gratings by use of ion implantation

We report the fabrication of long-period optical fiber gratings by use of a refractive-index increase induced by ion implantation. Helium ions were implanted in an optical fiber core through a metal mask that had a 170-microm -pitch grating with spacing of 60 microm . We obtained a wavelength-dependent effective transmission loss by use of the grating.     

Three-dimensional structuring of sapphire by sequential He+ ion-beam implantation and wet chemical etching

We present a method for the selective two- and three-dimensional patterning of sapphire using light ion-beam implantation to generate severe lattice damage to depths exceeding 1 μm and subsequent selective wet chemical etching of the damaged regions by hot H₃PO₄. C-cut sapphire crystals were implanted through contact masks using ion fluences of 1×10¹⁶ to 5×10¹⁷ He⁺/cm² and energies up to 400 keV. The etching process is characterized by a high selectivity and a rate of approximately 19 nm/min. Whereas an implantation that produces a continuously damaged pathway results in complete etching from the surface, sole in-depth implantation using only high-energy ions leads to under-etching of the crystalline surface layer. By a combination of these processes we have fabricated three-dimensional structures such as channels and bridges in sapphire. Received: 14 October 2002 / Accepted: 15 October 2002 / Published online: 26 February 2003 RID="*" ID="*"Corresponding author. Fax +41-21/693-3701, E-mail: aurelian.crunteanustanescu@epfl.ch     

Gas sensing properties of single crystalline ZnO nanowires grown by thermal evaporation technique

The ZnO NWs were applied as effective material for the fabrication of ethanol (C₂H₅OH) and carbon monoxide (CO) gas sensor. The ZnO NWs were grown by thermal evaporation techniques on non-catalytic Si (100) substrates. The average width and length of ZnO NWs was 60 nm and 20 μm, respectively and they were single crystalline in nature. The maximum response was 51.64 at 300 °C for 1000 ppm of CO gas, while 104.23 at 400 °C for 250 ppm of ethanol gas. The response of ZnO NWs was very high for ethanol compared to the CO, whereas the recovery time for ethanol was very poor compare to CO gas. The response of ZnO NWs was about 25 times higher for ethanol compare to CO, at 400 °C for 100 ppm of each gas. The high response for ethanol is related to electron donating effect of ethanol (10e^?) which was higher than the CO gas (2e^?). The high response of ZnO NWs was attributed to large contacting surface area for electrons, oxygen, target gas molecule, and abundant channels for gas diffusion.