In源流量与Ⅲ族流量之比对InGaN/GaN多量子阱性质的影响

利用x射线三轴晶衍射和光致发光谱研究了生长参数In源流量与Ⅲ族流量之比对InGaN/GaN多量子阱结构缺陷(如位错密度和界面粗糙度)和光致发光的影响.通过对（0002）对称和（1012）非对称联动扫描的每一个卫星峰的ω扫描，分别测量出了多量子阱的螺位错和刃位错平均密度，而界面粗糙度则由（0002）对称衍射的卫星峰半高全宽随级数的变化得出.试验发现多量子阱中的位错密度特别是刃位错密度和界面粗糙度随In源流量与Ⅲ族源流量比值的增加而增加，导致室温下光致发光性质的降低，从而也证明了刃位错在InGaN/GaN 关键词： x射线三轴晶衍射 界面粗糙度 位错 InGaN/GaN多量子阱     

Intersubband transitions in InxAl（l-x）N/InyGa（l-y）N quantum well operating at 1.55 μm

In this paper, we theoretically study the effects of doping concentration ND and an external electric field on the intersubband transitions in InxAl（l-x）N/InyGa（l-y）N single quantum well by solving the Schrodinger and Poisson equations self-consistently. Obtained results including transition energies, the band structure, and the optical absorption have been discussed. The lowest three intersubband transitions （E2 -El）, （E3 -El）, and （E3 -E2） are calculated as functions of doping concentration ND. By increasing the doping concentration ND, the depletion effect can be reduced, and the ionized electrons will compensate the internal electric field which results from the spontaneous polarization. Our results show that an optimum concentration ND exists for which the transition 0.8 eV （1.55 μm） is carried out. Finally, the dependence of the optical absorption α13（ω） on the external electric field and doping concentration is studied. The maximum of the optical absorption can be red-shifted or blue-shifted through varying the doping concentration and the external electric field. The obtained results can be used for designing optical fiber telecommunications operating at 1.55 μm.     

蓝光激光器结构中InGaN/GaN多量子阱界面效应的精细光致发光光谱研究

金属有机化学气相沉积(MOCVD)方法制备InGaN/GaN多量子阱结构时,在GaN势垒层生长的N2载气中引入适量H2,能够有效改善阱/垒界面质量从而提升发光效率.本工作利用光致发光(PL)光谱技术,对蓝光激光器结构中的InGaN/GaN多量子阱的发光性能进行了精细的光谱学测量与表征,研究了通H2生长对量子阱界面的调控...     

Effect of Si doping in wells of AlGaN/GaN superlattice on the characteristics of epitaxial layer

An AlGaN/GaN superlattice grown on the top of a GaN buffer induces the broadening of the full width at half maximum of (102) and (002) X-ray diffraction rocking curves. With an increase in the Si-doped concentration in the GaN wells, the full width at half maximum of the (102) rocking curves decreases, while that of the (002) rocking curves increases. A significant increase of the full width at the half maximum of the (002) rocking curves when the doping concentration reaches 2.5 × 1019 cm-3 indicates the substantial increase of the inclined threading dislocation. High level doping in the AlGaN/GaN superlattice can greatly reduce the biaxial stress and optimize the surface roughness of the structures grown on the top of it.     

Effect of Si doping in wells of A1GaN/GaN superlattice on the characteristics of epitaxial layer

An A1GaN/GaN superlattice grown on the top of a GaN buffer induces the broadening of the full width at half maximum of （102） and （002） X-ray diffraction rocking curves. With an increase in the Si-doped concentration in the GaN wells, the full width at half maximum of the （102） rocking curves decreases, while that of the （002） rocking curves increases. A significant increase of the full width at the half maximum of the （002） rocking curves when the doping concentration reaches 2.5 × 10^19 cm-3 indicates the substantial increase of the inclined threading dislocation. High level doping in the A1GaN/GaN superlattice can greatly reduce the biaxial stress and optimize the surface roughness of the structures grown on the top of it.     

Efficiency enhancement of an InGaN light-emitting diode with a p-AIGaN/GaN superlattice last quantum barrier

In this study, the efficiency droop of an InGaN light-emitting diode （LED） is reduced slgnlncanUy oy using a p-AlGaN/GaN superlattice last quantum barrier. The reduction in efficiency droop is mainly caused by the decrease of electron current leakage and the increase of hole injection efficiency, which is revealed by investigating the light currents, internal quantum efficiencies, energy band diagrams, carrier concentrations, carrier current densities, and radiative recombination efficiencies of three LED structures with the advanced physical model of semiconductor device （APSYS）.     

An improved EEHEMT model for kink effect on AIGaN/GaN HEMT

In this paper, a new current expression based on both the direct currect （DC） characteristics of the A1GaN/GaN high election mobility transistor （HEMT） and the hyperbolic tangent function tanh is proposed, by which we can describe the kink effect of the A1GaN/GaN HEMT well. Then, an improved EEHEMT model including the proposed current expression is presented. The simulated and measured results of Ⅰ-Ⅴ, S-parameter, and radio frequency （RF） large-signal characteristics are compared for a self-developed on-wafer A1GaN/GaN HEMT with ten gate fingers each being 0.4-μm long and 125-p-m wide （Such an A1GaN/GaN HEMT is denoted as A1GaN/GaN HEMT （10 × 125 μm））. The improved large signal model simulates the Ⅰ-Ⅴ characteristic much more accurately than the original one, and its transconductance and RF characteristics are also in excellent agreement with the measured data.     

The degradation mechanism of an AIGaN/GaN high electron mobility transistor under step-stress

Step-stress experiments are performed in this paper to investigate the degradation mechanism of an AIGaN/GaN high electron mobility transistor （HEMT）. It is found that the stress current shows a recoverable decrease during each voltage step and there is a critical voltage beyond which the stress current starts to increase sharply in our experiments. We postulate that defects may be randomly induced within the A1GaN barrier by the high electric field during each voltage step. But once the critical voltage is reached, the trap concentration will increase sharply due to the inverse piezoelectric effect. A leakage path may be introduced by excessive defect, and this may result in the permanent degradation of the A1GaN/GaN HEMT.     

InGaN/GaN多量子阱蓝光发光二极管老化过程中的光谱特性

系统地研究了小注入电流(＜4 mA)下InGaN/GaN多量子阱结构蓝光发光二极管的发光光谱特性在老化过程中的变化。对比老化前后的电致发光(EL)光谱,发现在注入电流1 mA下的峰值波长(peak wavelength)和半高宽(FWHM)随老化时间增加而减小,变化过程分两个阶段：前期(＜100 h)减小速度较快,而后逐渐变缓,呈现出与LEDs的发光光功率一致的变化规律,说明LEDs的等效极化电场在老化过程中减弱,这一变化和量子阱内缺陷的增加有明确的关系。通过电学特性测量发现同一结电压(V_j=1.8 V)下的结电容C_j和由交流小信号I—V方法计算得到的注入电流1 mA下的结电压V_j随老化时间增加而增大,明确了在同等小注入电流下量子阱内的载流子浓度随老化过程增加。分析表明在老化过程中InGaN/GaN 多量子阱结构蓝光发光二极管量子阱内的缺陷及其束缚的载流子数量增加,形成了增强的极化电场屏蔽效应,减弱的等效极化电场导致了量子阱的能带倾斜变小,带边辐射复合能量增大,能态密度增多,对应的发光过程的峰值波长变短(蓝移),半高宽变窄。     

Significant performance enhancement in A1GaN/GaN high electron mobility transistor by high-κ organic dielectric

The electrical properties of A1GaN/GaN high electron mobility transistor （HEMT） with and without high-κ organic dielectrics are investigated. The maximum drain current ID max and the maximum transconductance gm max of the organic dielectric/A1CaN/GaN structure can be enhanced by 74.5%, and 73.7% compared with those of the bare A1GaN/GaN HEMT, respectively. Both the threshold voltage VT and gm max of the dielectric/AlGaN/GaN HEMT are strongly dielectric-constant-dependent. Our results suggest that it is promising to significantly improve the performance of the A1GaN/GaN HEMT by introducing the high-κ organic dielectric.     

The effects of ^60Co γ-ray irradiation on the DC characteristics of enhancement-mode A1GaN/GaN high-electron-mobility transistors

The effects of ^60Co γ-ray irradiation on the DC characteristics of AlGaN/GaN enhancement-mode high-electron- mobility transistors （E-mode HEMTs） are investigated. The results show that having been irradiated by^60Co γ-rays at a dose of 3 Mrad （Si）, the E-mode HEMT reduces its saturation drain current and maximal transconductance by 6% and 5%, respectively, and significantly increases both forward and reverse gate currents, while its threshold voltage is affected only slightly. The obvious performance degradation of E-mode A1GaN/GaN HEMTs is consistent with the creation of electronegative surface state charges in the source-gate spacer and gate-drain spacer after being irradiated.     

Effects of SiNx on two-dimensional electron gas and current collapse of A1GaN/GaN high electron mobility transistors

SiNx is commonly used as a passivation material for AlGaN/GaN high electron mobility transistors (HEMTs). In this paper, the effects of SiN x passivation film on both two-dimensional electron gas characteristics and current collapse of AlGaN/GaN HEMTs are investigated. The SiNx films are deposited by high- and low-frequency plasma-enhanced chemical vapour deposition, and they display different strains on the AlGaN/GaN heterostructure, which can explain the experiment results.     

Characterization of Al2O3/GaN/AIGaN/GaN metal- insulator-semiconductor high electron mobility transistors with different gate recess depths＊

In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonstrate better performances of recessed-gate A1203 MIS-HEMTs which are fabricated by Fluorine-based Si3N4 etching and chlorine- based A1CaN etching with three etching times （15 s, 17 s and 19 s）. The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of A1GaN/CaN HEMT. Through the recessed-gate etching, the transconductanee increases effectively. When the recessed-gate depth is 1.02 nm, the best interface performance with Tit----（0.20--1.59） p~s and Dit ：（0.55-1.08）x 1012 cm-2.eV- 1 can be obtained. After chlorine-based etching, the interface trap density reduces considerably without generating any new type of trap. The accumulated chlorine ions and the N vacancies in the AIGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices. By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times, it is found that a low power chlorine-based plasma etching for a short time （15 s in this paper） can enhance the performances of MIS-HEMTs effectively.     

Enhancement-mode A1GaN/GaN high electronic mobility transistors with thin barrier＊

An enhancement-mode （E-mode） A1GaN/GaN high electron mobility transistor （HEMTs） was fabricated with 15-nm A1GaN barrier layer. E-mode operation was achieved by using fluorine plasma treatment and post-gate rapid thermal annealing. The thin barrier depletion-HEMTs with a threshold voltage typically around -1.7 V, which is higher than that of the 22-nm barrier depletion-mode HEMTs （-3.5 V）. Therefore, the thin barrier is emerging as an excellent candidate to realize the enhancement-mode operation. With 0.6-tim gate length, the devices treated by fluorine plasma for 150-W RF power at 150 s exhibited a threshold voltage of 1.3 V. The maximum drain current and maximum transconductance are 300 mA/mm, and 177 mS/ram, respectively. Compared with the 22-nm barrier E-mode devices, VT of the thin barrier HEMTs is much more stable under the gate step-stress,     

Performance improvement of blue InGaN light-emitting diodes with a specially designed n-AIGaN hole blocking layer

Blue InGaN light-emitting diodes （LEDs） with a conventional electron blocking layer （EBL）, a common n-A1GaN hole blocking layer （HBL）, and an n-A1GaN HBL with gradual A1 composition are investigated numerically, which involves analyses of the carrier concentration in the active region, energy band diagram, electrostatic field, and internal quantum efficiency （IQE）. The results indicate that LEDs with an n-AIGaN HBL with gradual AI composition exhibit better hole injection efficiency, lower electron leakage, and a smaller electrostatic field in the active region than LEDs with a conven tional p-A1GaN EBL or a common n-A1GaN HBL. Meanwhile, the efficiency droop is alleviated when an n-A1GaN HBL with gradual A1 composition is used.     

Optical and crystal improvements of semipolar (11-22) GaN/m-sapphire by in-situ thermal etching process

We investigated the optical and crystal qualities of semipolar (11-22) GaN grown on m-plane sapphire using three-step growth technique which consisted of seed GaN growth, in-situ thermal etching process (I-STEP), and lateral growth step. By introducing three-step growth, we achieved high optical and crystal qualities of semipolar (11-22) GaN films compared with those grown by conventional one-step growth. In particular, as the positions of I-STEP were decreased from 1.0 to 0.25 μm toward sapphire substrate, the full width at half maximum of the X-ray rocking curve was effectively decreased from 1083 to 828 arcsec, respectively. Furthermore, photoluminescence results showed that the bandedge emission intensity of semipolar (11-22) GaN with I-STEP was 56% higher than that with conventional growth technique. Based on these results, we suggested that the three-step growth would be effective to improve the crystal and optical qualities of semipolar (11-22) GaN/m-sapphire.     

外延在蓝宝石衬底上的非掺杂GaN研究

采用改变生长条件的方法制备GaN薄膜,在(0001)面蓝宝石衬底上利用金属有机物化学气相沉积技术制备了不同样品,并借助X射线双晶衍射仪(XRD)、PL谱测试仪和光学显微镜对材料进行了分析。XRD(0002)面和(1012)面测试均表明TMGa流量为70 cm3/min时样品位错密度最低。利用该TMGa流量进一步制备了改变生长温度的样品。XRD和PL谱测试结果表明,提高生长温度有利于提高GaN样品的晶体质量和光学性能。最后,利用光学显微镜对样品的表面形貌进行了分析。     

Low-resistance Ohmic contact on polarization-doped AIGaN/GaN heterojunction

High electronic density is achieved by polarization doping without an impurity dopant in graded AIGaN films. Low specific contact resistance is studied on the polarization-doped A1GaN/GaN heterojunctions by using the transmission line method （TLM）. The sheet density of polarization-doped A1GaN/GaN heterojunction is 6 × 10 14 cm-2 at room temperature. The linearly graded material structure is demonstrated by X-ray diffraction. The cartier concentration and mobility are characterized by a temperature-dependent Hall measurement. Multiple-layer metal （Ti/A1/Ti/Au） is deposited and annealed at 650 ℃ to realize the Ohmic contacts on the graded A1GaN/GaN heterojunctions.     

MOVPE生长的InGaN/GaN单量子阱的光致发光和光吸收特性

研究了用金属有机物气相外延(MOVPE)法在蓝宝石衬底上生长的In组分浓度保持不变的InGaN/GaN单量子阱结构在室温下的发光特性和光吸收特性.实验结果表明,在InGaN厚度<3nm时,随着样品InGaN势阱层宽度的增加(1nm),光致发光(PL)谱的发光峰值波长出现明显的红移33nm现象,而且发光强度下降8%,谱线半峰全宽(FWHM)展宽,通过对样品的透射、反射光谱研究发现,量子阱层窄(1.5nm)的样品在波长接近红外区时出现无吸收的现象,即R+T达到了100%,而在阱层较宽的样品中没有发现这一现象,对引起这些现象的原因进行了讨论.这些结果有助于开发和优化三族氮化物半导体光电器件的进一步研究工作.     

The influence of A1GaN/GaN superlattices as electron blocking layers on the performance of blue InGaN light-emitting diodes

P-A1GaN/P-GaN superlattices are investigated in blue InGaN light-emitting diodes as electron blocking layers. The simulation results show that efficiency droop is markedly improved due to two reasons： （i） enhanced hole concentration and hole carrier transport efficiency in A1GaN/GaN superlattices, and （ii） enhanced blocking of electron overflow between multiple quantum-wells and A1CaN/GaN superlattices.