Transmission electron microscopy investigation of AlN growth on Si(111)

AlN layers with a thickness of 250 nm were grown by plasma-assisted gas source molecular-beam epitaxy on Si(111) at substrate temperatures between 600 °C and 900 °C. The surface morphology and microstructure of the AlN layers were analyzed by scanning and transmission electron microscopy. Different defect types are observed in the AlN layers and at the AlN/Si(111) interfaces as a function of the temperature: inclusions of pure Al in the Si-substrate, crystallites of the cubic AlN phase, dislocations, stacking faults and inversion domain boundaries. The formation and concentration of the defects depends strongly on the substrate temperature during the growth. X-ray diffraction rocking curves for the (0002) reflection yield minimum full width at half maximum values for the sample grown at the 900 °C under Al-rich conditions indicating optimum structural quality. However, the discussion of the entity of defects will show that a more differentiated view is required to assess the overall quality of the AlN layers.     

Crystalline growth of germanium thin films on single crystal silicon substrates by solid phase crystallization

We have studied the epitaxial-like growth of germanium (Ge), due to solid phase crystallization (SPC) from amorphous Ge (a-Ge) deposited on single crystal silicon (Si) substrate. The crystalline growth of Ge following the orientation of Si substrates was successfully obtained by the SPC at 400 °C or higher. The preferential growth on Si (111) substrates continues up to 10,000 Å. Different orientations from the substrate orientation in XRD patterns are slightly observed in the growth on Si (100) substrates at 450 °C, but the preferential growth of (100) orientation continued in the whole film thickness in TEM images. The epitaxial-like growth of Ge may be more preferable on the Si (111) substrate than the (100) one.     

Effects of substrate orientation on aluminum grown on MgAl2O4 spinel using molecular beam epitaxy

Al thin films have been grown on single-crystal MgAl₂O₄ spinel substrates using solid source molecular beam epitaxy. The structural properties of Al layers were systematically investigated as a function of substrate orientation. X-ray diffraction reveals that Al layers are coherently grown on both (0 0 1)- and (1 1 1)-oriented spinel substrates. However, scanning electron microscopy and atomic force microscopy show that Al layers on (0 0 1) spinel substrates display smoother surface morphology than those grown on (1 1 1) spinel substrates. Additionally, electron backscatter diffraction and transmission electron microscopy demonstrate the presence of a high density of twin domain structures in Al thin films grown on (1 1 1) spinel substrates.     

Low temperature molecular beam epitaxy growth of cubic GaCrN

Cubic GaCrN layers are grown on MgO(0 0 1) substrates at 350–700 °C by plasma-assisted molecular beam epitaxy. Substrate temperature dependences of their structural and magnetic properties were systematically studied. It is found that the solubility limit of Cr atoms in cubic GaCrN is dramatically improved by the low temperature (350 °C) growth, though crystalline quality becomes poorer. It is also observed that the magnetic ordering increases with Cr content in the low Cr content region, but after showing highest ordering it decreases in the high Cr content region. The Cr content range showing ferromagnetic behavior increases with lowering substrate temperature. However, the magnetization vs. magnetic field curve shows “emaciated” hysteresis for the low temperature grown samples.     

Growth and characterization of GaN and AlN films on (1 1 1) and (0 0 1) Si substrates

GaN and AlN films were grown on (1 1 1) and (0 0 1) Si substrates by separate admittances of trimethylgallium (or trimethylaluminum) and ammonia (NH₃) at 1000°C. A high temperature (HT) or low temperature (LT) grown AlN thin layer was employed as the buffer layer between HT GaN (or HT AlN) film and Si substrate. Experimental results show that HT AlN and HT GaN films grown on the HT AlN-coated Si substrates exhibit better crystalline quality than those deposited on the LT AlN-coated Si substrates. Transmission electron microscopy (TEM) of the HT GaN/HT AlN buffer layer/(1 1 1)Si samples shows a particular orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. High quality HT GaN films were achieved on (1 1 1) Si substrates using a 200 Å thick HT AlN buffer layer. Room temperature photoluminescence spectra of the high quality HT GaN films show strong near band edge luminescence at 3.41 eV with an emission linewidth of ∼110 meV and weak yellow luminescence.     

Epitaxial growth of CoO films on semiconductor and metal substrates by constructing a complex heterostructure

Epitaxial growth of CoO films was studied using reflection high-energy electron diffraction (RHEED), electron energy loss spectroscopy (EELS), ultraviolet photoelectron spectroscopy (UPS) and Auger electron spectroscopy (AES). The RHEED results indicated that an epitaxial CoO film grew on semiconductor and metal substrates (CoO (0 0 1)∥GaAs (0 0 1), Cu (0 0 1), Ag (0 0 1) and [1 0 0]CoO∥[1 0 0] substrates) by constructing a complex heterostructure with two alkali halide buffer layers. The AES, EELS and UPS results showed that the grown CoO film had almost the same electronic structure as bulk CoO. We could show that use of alkali halide buffer layers was a good way to grow metal oxide films on semiconductor and metal substrates in an O₂ atmosphere. The alkali halide layers not only works as glue to connect very dissimilar materials but also prevents oxidation of metal and semiconductor substrates.     

Low-temperature growth of high-quality ZnO layers by surfactant-mediated molecular-beam epitaxy

High-quality ZnO layers are grown on Zn-polar ZnO substrates by surfactant-mediated plasma-assisted molecular-beam epitaxy (P-MBE) using atomic hydrogen as a surfactant. Careful investigation with atomic force microscopy (AFM) and reflection high-energy electron diffraction (RHEED) reveals that two-dimensional growth is preserved down to 400 °C by irradiating atomic hydrogen during growth, while the low-temperature limit of two-dimensional growth is 600 °C without atomic hydrogen irradiation. The crystal quality of ZnO layers grown at 400 °C by surfactant-mediated MBE is evaluated to be the same as those grown at 600 °C by conventional MBE in terms of X-ray diffraction and photoluminescence properties.     

Selective area molecular beam epitaxy of InAs on GaAs (110) masked substrates for direct fabrication of planar nanowire field-effect transistors

We have synthesized InAs nanowires (NWs) by selective area molecular beam epitaxy (SA-MBE) on GaAs masked substrates. In particular, we have obtained in-plane-oriented NWs on the (110) plane, and then directly applied the NWs to planar nanowire field-effect transistors (NWFETs) using conventional electron beam lithography without a NW dispersion process. We have measured output and transfer characteristics of the NWFETs at room temperature, and obtained a current swing but no turning off, and a field-effect mobility peak of 150 cm²/V-s. We have also observed almost no temperature influence on field-effect mobility between 2 K and 300 K, suggesting a high-dense surface accumulation layer even at low temperatures.     

Growth of pure ZnO thin films prepared by chemical spray pyrolysis on silicon

Structural, morphological, optical and electrical properties of ZnO thin films prepared by chemical spray pyrolysis from zinc acetate (Zn(CH₃COO)₂ 2H₂O) aqueous solutions, on polished Si(1 0 0), and fused silica substrates for optical characterization, have been studied in terms of deposition time and substrate temperature. The growth of the films present three regimes depending on the substrate temperature, with increasing, constant and decreasing growth rates at lower, middle, and higher-temperature ranges, respectively. Growth rate higher than 15 nm min⁻¹ can be achieved at T_s=543 K. ZnO film morphological and electrical properties have been related to these growth regimes. The films have been characterized by X-ray diffraction, scanning electron microscopy and X-ray photoelectron spectroscopy.     

Polarities of AlN films and underlying 3C-SiC intermediate layers grown on (1 1 1) Si substrates

The hydride vapor phase epitaxy (HVPE) of {0 0 0 1} AlN films on {1 1 1} Si substrates covered with epitaxial {1 1 1} cubic SiC (3C-SiC intermediate layers) was carried out. 3C-SiC intermediate layers are essential to obtain high-quality AlN films on Si substrates, because specular AlN films are obtained with 3C-SiC intermediate layers, whereas rough AlN films are obtained without 3C-SiC intermediate layers. We determined the polarities of AlN films and the underlying 3C-SiC intermediate layers by convergent beam electron diffraction (CBED) using transmission electron microscopy. For the first time, the polarities of the AlN films and the 3C-SiC intermediate layers were determined as Al and Si polarities, respectively. The AlN films were hardly etched by aqueous KOH solution, thereby indicating Al polarity. This supports the results obtained by CBED. The result is also consistent with electrostatic arguments. An interfacial structure was proposed. The 3C-SiC intermediate layers are promising for the HVPE of AlN films on Si substrates.     

Growth of thick,continuous GaN layers on 4-in. Si substrates by metalorganic chemical vapor deposition

We report on the growth of thick GaN epilayers on 4-in. Si(1 1 1) substrates by metalorganic chemical vapor deposition. Using intercalated AlN layers that contribute to counterbalance the tensile strain induced by the thermal mismatch between gallium nitride and the silicon substrate, up to 6.7 μm thick crack-free group III-nitride layers have been grown. Root mean-squares surface roughness of 0.5 nm, threading dislocation densities of 1.1×10⁹ cm^?2, as well as X-ray diffraction (XRD) full widths at half-maximum (FWHM) of 406 arcsec for the GaN(0 0 2) and of 1148 arcsec for the GaN(3 0 2) reflection have been measured. The donor bound exciton has a low-temperature photoluminescence line width of 12 meV. The correlation between the threading dislocation density and XRD FWHM, as well as the correlation between the wafer curvature and the GaN in-plane stress is discussed. An increase of the tensile stress is observed upon n-type doping of GaN by silicon.     

The growth of ZnSe by photo-assisted metalorganic chemical vapor deposition (MOCVD)

ZnSe epitaxy layers were grown on (1 0 0)GaAs substrates by photo-assisted MOCVD using DMZn and DMSe as group II and VI sources, respectively. Irradiation can improve the growth rate efficiently, but the irradiation intensity influences the growth rate and the crystalline quality negligibly in a large range. Due to an oxidation reaction on the surface of ZnSe, the growth rate and the flow ratio of group II and VI sources influence the crystalline quality.     

ZnO growth on Si with low-temperature ZnO buffer layers by ECR-assisted MBE

High-quality ZnO films were grown on Si(1 0 0) substrates with low-temperature (LT) ZnO buffer layers by an electron cyclotron resonance (ECR)-assisted molecular-beam epitaxy (MBE). In order to investigate the optimized buffer layer temperature, ZnO buffer layers of about 1.1 μm were grown at different growth temperatures of 350, 450 and 550 °C, followed by identical high-temperature (HT) ZnO films with the thickness of 0.7 μm at 550 °C. A ZnO buffer layer with a growth temperature of 450 °C (450 °C-buffer sample) was found to greatly enhance the crystalline quality of the top ZnO film compared to others. The root mean square (RMS) roughness (3.3 nm) of its surface is the smallest, compared to the 350 °C-buffer sample (6.7 nm), the 550 °C-buffer sample (7.4 nm), and the sample without a buffer layer (6.8 nm). X-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were carried out on these samples at room temperature (RT) in order to characterize the crystalline quality of ZnO films. The preferential c-axis orientations of (0 0 2) ZnO were observed in the XRD spectra. The full-width at half-maximum (FWHM) value of the 450 °C-buffer sample was the narrowest as 0.209°, which indicated that the ZnO film with a buffer layer grown at this temperature was better for the subsequent ZnO growth at elevated temperature of 550 °C. Consistent with these results, the 450 °C-buffer sample exhibits the highest intensity and the smallest FWHM (130 meV) of the ultraviolet (UV) emission at 375 nm in the PL spectrum. The ZnO characteristic peak at 438.6 cm⁻¹ was found in Raman scattering spectra for all films with buffers, which is corresponding to the E₂ mode.     

Growth of Zn3As2 on GaAs by liquid phase epitaxy and their characterization

Zn₃As₂ epitaxial layers were grown on GaAs (1 0 0) substrates by liquid phase epitaxy (LPE) using Ga as the solvent. Zinc mole fraction in the growth melt was varied from 1.07×10^?2 to 6×10^?2. X-ray diffraction spectrum exhibits a sharp peak at 43.3° characteristic of Zn₃As₂ crystalline layer. The peak intensity increases with increase in zinc mole fraction in the growth melt. The compositions of the as-grown Zn₃As₂ layers were confirmed by energy dispersive X-ray (EDX) analysis. Surface morphology was studied using scanning electron microscopy (SEM) and the thickness of the epilayers was also determined. The Hall measurements at 300 K indicate that Zn₃As₂ epilayers are unintentionally p-doped. With an increase of zinc mole fraction in the growth melt, carrier concentration increases and carrier mobility decreases. Infrared optical absorption spectroscopy showed a sharp absorption edge at 1.0 eV corresponding to the reported band gap of Zn₃As₂.     

Microstructure of interfacial HgTe/CdTe superlattice layers for growth of HgCdTe on CdZnTe (2 1 1)B substrates

Transmission electron microscopy has been used to characterize the microstructure of HgTe/CdTe superlattices (SLs) grown by molecular beam epitaxy on CdZnTe(2 1 1) B substrates. The purpose of these intermediate layers was to improve the quality of subsequent HgCdTe (MCT) epilayers intended for infrared detectors. The observations confirmed that the SLs smoothed out the surface roughness of the substrate, and showed that threading dislocations were prevented from reaching the MCT epilayers. High-quality growth of MCT on CdZnTe using the HgTe/CdTe interfacial layers has been demonstrated.     

Structural study of undoped and (Mn, In)-doped SnO2 thin films grown by RF sputtering

Undoped and 5%(Mn, In)-doped SnO₂ thin films were deposited on Si(1 0 0) and Al₂O₃ (R-cut) by RF magnetron sputtering at different deposition power, sputtering gas mixture and substrate temperature. X-ray reflectivity was used to determine the films thickness (10–130 nm) and roughness (～1 nm). The combination of X-ray diffraction and Mössbauer techniques evidenced the presence of Sn⁴⁺ in an amorphous environment, for as-grown films obtained at low power and temperature, and the formation of crystalline SnO₂ for annealed films. As the deposition power, substrate temperature or O₂ proportion are increased, SnO₂ nanocrystals are formed. Epitaxial SnO₂ films are obtained on Al₂O₃ at 550 °C. The amorphous films are quite uniform but a more columnar growth is detected for increasing deposition power. No secondary phases or segregation of dopants were detected.     

High-quality AlN layers grown by hot-wall MOCVD at reduced temperatures

We report on a growth of AlN at reduced temperatures of 1100 °C and 1200 °C in a horizontal-tube hot-wall metalorganic chemical vapor deposition reactor configured for operation at temperatures of up to 1500–1600 °C and using a joint delivery of precursors. We present a simple route—as viewed in the context of the elaborate multilayer growth approaches with pulsed ammonia supply—for the AlN growth process on SiC substrates at the reduced temperature of 1200 °C. The established growth conditions in conjunction with the particular in-situ intervening SiC substrate treatment are considered pertinent to the accomplishment of crystalline, relatively thin, ～700 nm, single AlN layers of high-quality. The feedback is obtained from surface morphology, cathodoluminescence and secondary ion mass spectrometry characterization.     

The growth of high-quality and self-separation GaN thick-films by hydride vapor phase epitaxy

About 1.2 mm thick GaN bulk crystals were obtained by combining a pulsed NH₃-flow modulation (PFM) method and a self-separation method of short-shutting NH₃ flow when using hydride vapor phase epitaxy (HVPE). High crystal quality of bulk GaN was evaluated by X-ray rocking curves (XRC) and the full width at half maximum (FWHM) values were 110, 72 and 83 arcsec for (002), (102) and (100) reflection planes, respectively. The PFM method is proved to be effective in reducing cracks and keeping the surface smooth. And the method of short-shutting NH₃ flow can lead to GaN thick layer separate from sapphire substrate when cooling from the high growth temperature. Growth and separation mechanisms were investigated. Two states were found in PFM method. With PFM method modulating between high quality state and low stress state, 300 μm thick GaN layers without cracks were obtained. Study of spontaneous separation mechanism revealed that the separation attributed to formation of voids inside the GaN layer.     

Correlation between the photoluminescence and different types of Si nano-clusters in amorphous silicon

This paper presents the results of PL spectrum study for Si nano-clusters in amorphous silicon matrix. The hydrogenated amorphous Si layers were prepared by the hot-wire CVD method on glass substrates. The layers were deposited at different wafer temperatures 280, 360, 420 and 460 °C and at one filament temperature of 1650 °C. The joint analysis of PL and X-ray diffraction spectra in dependence on the technological conditions and on different sizes of Si nano-clusters has been done. The mechanisms of PL are discussed as well.     

Amorphous to crystalline transition and optoelectronic properties of nanocrystalline indium tin oxide (ITO) films sputtered with high rf power at room temperature

ITO thin films were deposited on quartz substrates by the rf sputtering technique using various rf power keeping the substrates at room temperature. The influence of rf power on the structural, electrical, optical and morphological properties was studied by varying the rf power in the range 50–350 W. X-ray diffraction results show an amorphous – crystalline transition with nano grains. At a power of 250 W, the ITO film showed preferential orientation along (4 0 0) peak. It is observed from the optical transmission studies that the optical band gap increased from 3.57 to 3.69 eV when the rf power was increased from 50 to 250 W. The resistivity value is minimum and grain size is maximum for the ITO film deposited at 250 W. The X-ray photoelectron spectroscopy (XPS), Energy dispersive X-ray (EDX) and Atomic force microscopy AFM results confirm that the ITO films are stoichiometric and the surface contained nano-sized grains distributed uniformly all over the surface. It can be concluded that the ITO film deposited at room temperature with 250 W rf power, can provide the required optical and electrical properties useful for developing optoelectronic devices at lower temperatures.