苯乙炔封端的BTDA系列酰亚胺预聚体的研究

合成了具有苯侧基的二胺单体1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ), 并与3,3',4,4'-苯酮四羧酸二酐(BTDA)进行缩聚反应, 分别以4-苯乙炔苯酐(PEPA)和4-苯乙炔-1,8-萘二甲酸酐(PENA)作为封端剂, 合成了两个系列的苯乙炔封端的酰亚胺预聚体. DSC测试结果表明, 此类预聚体具有比PETI-5更宽的加工窗口; 利用所合成的预聚体制成了具有较高热分解温度热固性交联PI薄膜. 结果表明, PI预聚体加工性能良好, 其交联后具有优异的力学和热学性能; 同时PEPA封端的预聚体树脂具有比PENA封端的树脂更为优异的综合性能.     

4-苯乙炔基苯胺封端聚酰亚胺树脂的合成与性能研究

使用4-苯乙炔基苯胺(4-PEA)作为反应性封端剂,和3,3′,4,4′-二苯醚四酸二酐(ODPA),3,3′,4,4′-联苯四酸二酐(BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和3,4′-二氨基二苯醚(3,4-′ODA)反应合成了系列4-苯乙炔基苯基封端的聚酰亚胺低聚物,对低聚物的化学结构、热性能和熔体粘度以及固化后树脂的热性能等进行了研究.实验结果表明,低聚物均具有一定的结晶性,含有ODPA的聚酰亚胺低聚物较之含有BPDA的低聚物具有更低的熔体粘度,且出现最低熔体粘度的温度更低;固化后的树脂表现出良好的热性能,含有BPDA的树脂具有更高的玻璃化转变温度;系列低聚物中二胺单体的比例对于低聚物的熔体粘度和固化后树脂的热稳定性有一定影响.     

4-苯乙炔苯酐封端聚酰亚胺树脂的合成与性能研究

使用3,3′,4,4′-二苯醚四酸二酐(ODPA)、3,3′,4,4′-联苯四酸二酐(BPDA)、1,3-双(4-氨基苯氧基)苯(1,3,4-APB)、3,4′-二氨基二苯醚(3,4′-ODA)和反应性封端剂4-苯乙炔苯酐(4-PEPA)合成了设计分子量为5000的系列苯乙炔基封端的聚酰亚胺低聚物,并使用XRD、DSC、TGA、FT-IR、DMA和流变仪等对低聚物的化学结构、热性能和熔体性能,固化后树脂的热性能和力学性能进行了测试.研究结果表明基于ODPA的低聚物具有低的熔体粘度和良好的熔体粘度稳定性,固化后的树脂具有很高的热失重温度,较高的玻璃化转变温度以及良好的力学性能尤其是高的断裂伸长率(>10%);基于BPDA的低聚物具有一定的结晶性,其结晶熔融温度与苯乙炔基固化交联温度相近,影响了材料的成型工艺性能.     

含硅氧烷结构聚酰亚胺树脂的耐热稳定性及高温结构演变

基于含硅芳香二胺双(4-氨基苯氧基)二甲基硅烷(APDS)设计制备了系列苯乙炔基封端的含硅氧烷结构聚酰亚胺树脂预聚物(PEPA-PIS), 考察了硅氧烷含量对树脂固化物耐热稳定性的影响规律. 利用非反应性苯酐基团封端的模型预聚物(PA-PIS)证明了温度对于硅氧烷结构演变的影响. 通过对树脂固化物高温固化处理后耐热稳定性与微观结构和表面形貌的关系进行深入研究, 发现在高温下硅氧烷结构发生氧化交联反应, 并在树脂表面形成具有无机特性的二氧化硅结构, 这种有机/无机杂化特性可显著提高聚酰亚胺树脂的耐热稳定性.     

新型乙炔封端聚酰亚胺的制备及性能

用双酚A型二醚二酐(BPADA)和3-乙炔基苯胺(m-APA)进行缩聚反应合成了乙炔基封端的聚酰亚胺预聚体, 并对预聚体的熔体黏度、稳定性和热性能等进行研究. 结果表明, 此类预聚体具有较宽的加工窗口和较低的加工温度, 适合模压成型工艺制备树脂基复合材料. 预聚体经250 ℃固化后显示了优异的热性能, 动态力学分析显示其玻璃化转变温度为363 ℃, 在氮气和空气气氛下5%热失重温度分别为490和492 ℃.     

耐高温交联侧基苯乙炔封端酰亚胺预聚体

合成了含有苯乙炔基的二胺单体 3,5-二氨基-4'-苯乙炔苯甲酮(DPEB), 并与3,3',4,4'-联苯四酸二酐(s-BPDA)和1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应, 以4-苯乙炔苯酐作为封端剂, 合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4). DSC测试结果表明, 引入交联侧基后预聚体依然保持着较宽的加工窗口. 利用所合成的预聚体在370℃热压1 h制备了热固性薄膜. DMA测试结果表明, 引入交联侧基的预聚体树脂具有更高的玻璃化转变温度, 并且其储存模量在玻璃化转变后有很好的保持.     

均苯型聚酰亚胺模塑粉的制备与性能

用含有扭曲非共平面结构的二胺1,3-二(3-氨基苯氧基-4'-苯酰基 )苯(BABB)与均苯四甲酸二酐(PMDA)缩聚制备了具有3种不同分子量的均苯型热塑性聚酰亚胺模塑粉, 并研究了其组成、 聚集态结构、 熔体黏度、 稳定性和热性能, 将模塑粉模压成型后进行机械性能测试. 结果表明, 引入柔性的二胺, 模塑粉的玻璃化转变温度(T_g)与传统的均苯型聚酰亚胺相比明显下降, 熔体黏度大幅度下降, 且具有良好的熔体黏度稳定性. 同时, 均苯四甲酸酐的存在保证了该模塑粉具有优异的热稳定性和优异的机械性能及较低的吸水率.     

适用于RTM成型聚酰亚胺材料研究进展

综述了适用于RTM成型耐高温聚酰亚胺材料的研究进展，主要包括降冰片烯酸酐（NA）封端的PMR聚酰亚胺树脂和使用苯乙炔基封端剂合成的酰亚胺低聚物，在这其中采用苯乙炔基封端剂合成的酰亚胺低聚物具有低的熔体粘度和良好的熔体稳定性，固化交联后的聚合物及树脂基复合材料具有良好的热性能和力学性能。本文介绍了上述聚合物化学合成、结构与性能之间的关系，并对适用于RTM成型耐高温聚酰亚胺材料的应用进行了简单介绍。     

以2-苯基-4,4'-二氨基二苯醚为基础的热固性聚酰亚胺树脂及其复合材料

以2-苯基-4,4'-二氨基二苯醚(p-ODA)、异构二苯醚二酐(ODPA)和苯乙炔基苯酐(PEPA)为原料,通过两步法合成了聚合度分别为1,2和3的酰亚胺树脂低聚物,并通过模压成型法制备了单向碳纤维增强的聚酰亚胺复合材料.表征了酰亚胺树脂低聚物的溶解性、熔体黏度及其固化物聚酰亚胺树脂的热性能,结果表明,聚酰亚胺树脂具有良好的溶解性,在N,N-二甲基乙酰胺(DMAc)、四氢呋喃(THF)及1,4-二氧六环等溶剂中的溶解度大于30%;所有酰亚胺树脂低聚物的最低熔体黏度均在10 Pa·s以下,具有良好的成型工艺性;聚酰亚胺树脂具有良好的热性能,玻璃化转变温度(Tg)最高可达300℃,5%热失重温度(T5%)最高可达545℃,碳纤维增强聚酰亚胺复合材料PIC-4,4'-ODPA-2具有最佳的高低温力学性能.     

基于乙炔基-苯并噁嗪单元双重交联反应的聚酰亚胺树脂的制备与性能

为开发可低温固化的聚酰亚胺树脂, 通过分子结构设计将苯并噁嗪单元引入聚酰亚胺树脂中, 合成了含苯并噁嗪单元及乙炔基封端的双官能化新型聚酰亚胺预聚体(PIBzA). 经高温处理, 苯并噁嗪单元发生开环交联, 同时, 乙炔基端基发生三聚成环反应, 从而在固化树脂中形成双重交联网络结构. 苯并噁嗪单元的引入使聚酰亚胺树脂最快固化反应温度降低约32 ℃, 有效降低了固化温度. 同时, 苯并噁嗪单元的引入未大幅度降低树脂的耐热稳定性, 其玻璃化转变温度(T_g)介于266~290 ℃之间, 5%热失重温度(T_d,5%)接近500 ℃, 依然可以满足耐高温复合材料的应用需求. 此外, PIBzA固化树脂具有低介电特性, 其介电常数k介于2.3~3.0, 介电损耗介于0.002~0.008, 可满足透波复合材料及先进微电子封装材料的应用需求.     

耐高温可溶性聚酰亚胺树脂及其复合材料

制备了2种耐高温可溶型聚酰亚胺树脂(PI-1, PI-2)及其复合材料, 系统研究了树脂的工艺性, 纯树脂固化物的热性能及其复合材料的界面形貌、 介电性能和力学性能. 研究结果表明, 树脂低聚物在极性非质子溶剂中具有良好的溶解性, 且熔体黏度较低, 表明其具有优异的加工性能. 两种树脂固化物在空气中的5%热失重温度均高于550 ℃, PI-1树脂的玻璃化转变温度(T_g)为430 ℃, PI-2树脂的T_g为380 ℃. 石英纤维/PI-1和石英纤维/PI-2复合材料具有较低的介电常数和介电损耗. 碳纤维/PI-1复合材料在420 ℃下的弯曲强度保持率可达62%, 层间剪切强度保持率可达48%, 具有较优异的高温力学性能. 采用普通模压工艺制备了厚度高达45 mm的复合材料制件, 进一步证明这2种树脂具有优异的工艺性.     

Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

Thermosetting resin matrix is the key component of advanced wave-transparent composites,where low dielectric constant,excellent processability,high thermal stability,as well as good bonding ability are required for resins.Herein,we prepared a series of phenylethynyl terminated polyimide(PI)resins by grafting amine-functionalized hyperbranched polysiloxane(HBPSi)to PI chains during the in situ polymerization.The effects of HBPSi on the processability of oligomers,molecular packing,thermal stability,dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in detail.The dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal stability.Meanwhile,the 10 wt％HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the interfacial shear strength(IFSS)of 37.64 MPa,compared with that of neat PI-6 matrix(27.34 MPa),and better adhesion to metal with the lap shear strength of 10.48 MPa,50％higher than that of neat resin PI-6(6.98 MPa).These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties,indicating their great potential as low-dielectric constant resin matrix in radar radome.     

Transfer molding imide resins based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride

Phenylethynyl containing imide oligomers have been under investigation as part of an effort to develop resins for non-autoclave composite fabrication processes such as resin transfer molding (RTM). These high performance/high temperature composites are potentially useful on advanced aerospace vehicles such as reusable launch vehicles (RLVs). New phenylethynyl terminated imide oligomers (PETI) based upon 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) were prepared and characterized primarily by rheological behavior and cured glass transition temperature (Tg). In comparison to resins from the symmetrical isomer (3,3′,4,4′-biphenyltetracarboxylic dianhydride, s-BPDA), a-BPDA afforded corresponding resins with lower melt viscosities and upon curing, higher Tgs. Several resins exhibited an attractive combination of properties such as low and stable melt viscosities required for RTM composite fabrication, high cured Tgs, and moderate toughness. One resin (P10) was used to fabricate flat, void free laminates by RTM. The laminates exhibited high mechanical properties at temperatures to 288°C. The chemistry and physical properties of these new PETIs and the laminate properties of one composition are discussed.     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Highly Soluble Phenylethynyl-terminated Imide Oligomers and Thermosetting Polyimides Based on 2,2′3,3′-Biphenyltetracarboxylic Dianhydride

The properties of a series of imide oligomers were characterized according to their molecular weights, solubility, and thermal and rheological properties. This series of imide oligomers was synthesized via a two-step method using 2,2′,3,3′-biphenyltetracarboxylic dianhydride(3,3′-BPDA) and aromatic diamines as the monomers, and 4-phenylethynyl phtlialic anhydride(PEPA) as the end-capping agent. The imide oligomers based on 3,3′-BPDA showed excellent solubility in low boiling point solvents and low melt viscosity, which were attributed to their unique bent architectures. High-performance thermosetting polyimides were produced from these oligomers via thermal crosslinking of the phenylethynyl groups. The mechanical and thermal properties of the thermosets were studied using tensile testing, dynamic mechanical thermal analysis(DMTA), and thermogravimetric analysis(TGA). The 3,3′EPDA-based thermosets exhibited excellent thermal properties, with glass transition temperatures of up to 455℃, and 5% mass loss temperatures of up to 569℃ in air. The thermosets based on 3,3-BPDA showed superior thermal properties compared to those derived from TriA-X series oligomers.     

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

To improve the processability and thermal stability of polyimide, a series of novel phenylethynyl-endcapped oligoimides(PEPA-oligoimides) with calculated molecular weights(M_nC) were successfully prepared from thermal imidization of 4,4'-(9-fluorenylidene) dianiline(BAFL) as fluorenyl diamine, 4,4′-oxy-diphthalic anhydride(ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride(4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides, the thermal, dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa·s at around 310 °C and wide melting processing window, suitable for resin transfer molding(RTM). Besides, its corresponding thermal-cured polyimide resin possessed glass transition temperature(T_g) as high as 514 °C. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the M_nC. The mechanical properties of the polyimide neat resins were improved gradually with increasing MnC. Finally, the carbon fiber/polyimide(C_f/PI) composite laminates showed excellent mechanical strength retention rate at 350 °C, might be long-term served at extremely high temperature in aerospace and aviation field.     

共聚结构和分子量对热塑性聚酰亚胺树脂熔融与耐热性能的影响

基于具有刚性主链结构的4,4'-(六氟亚异丙基)双邻苯二甲酸酐/对苯二胺(6FDA/p-PDA)树脂体系, 通过共聚引入间苯二胺(m-PDA)、 4,4'-二氨基-2,2'-双三氟甲基联苯(TFDB)和9,9'-双(4-氨基苯基)芴(BAFL)等主链刚性且兼具大自由体积特性的芳香二胺, 以非反应性封端剂邻苯二甲酸酐(PA)对分子量进行调控, 设计制备了系列分子量可控的热塑性聚酰亚胺(TPI)树脂. 系统研究了共聚结构和分子量对TPI树脂熔融性能和耐热性能的影响, 构建了聚合物的聚集态结构与树脂熔融性能的对应关系, 并对树脂的室温和高温力学性能进行了评价. 研究结果表明, 大自由体积的芳香二胺共聚结构的引入可有效降低分子链堆砌密度, 增大聚合物的自由体积, 从而赋予树脂良好的熔融性能. 降低设计分子量可进一步改善树脂的熔融加工性. 这类具有刚性主链结构的TPI树脂兼具优异的耐热性能和力学性能, 树脂的玻璃化转变温度在308~338 ℃之间, 以TFDB和BAFL共聚制备的TPI-C-25K和TPI-D-25K树脂表现出高强高韧的特性, 拉伸和弯曲强度分别超过120 MPa和190 MPa, 断裂伸长率大于8.2%, 并且在250 ℃高温下表现出良好的耐热稳定性.     

Synthesis and characterization of phenylethynyl-terminated polyimide oligomers derived from 2,3,3′,4′-diphenyl ether tetracarboxylic acid dianhydride and 3,4′-oxydianiline

With the goal of improving processability of imide oligomers and achieving high toughness of thermosetting polyimides, a series of 4-phenylethynylphthalic anhydride(PEPA)-terminated imide oligomers prepared by the reaction of 2,3,3',4'-diphenyl ether tetracarboxylic acid dianhydride(a-ODPA) and 3,4'-oxydianiline(3,4'-ODA) with different molecular weights(degree of polymerization: n = 1?9) were formed. The resultant oligomers with different molecular weights were characterized for their chemical architecture, cure behavior, thermal properties, solubility in organic solvents and rheological characteristics. Besides, the thermal properties and tensile test of cured polyimide films were also evaluated. The imide oligomer(degree of polymerization: n = 1) has some somewhat crystalline phase, and imide oligomers(degree of polymerization: n = 2?9) showed excellent solubility(40 wt%) in N-methyl-2-pyrrolidone(NMP) and N,Ndimethylacetamide(DMAc) at room temperature. Furthermore, the rheological properties of imide oligomers showed very low melt viscosity and wider processing window. The cured films exhibited good thermal properties with the glass transition temperatures of 282?373 ?C and 5 wt% thermal decomposition temperatures higher than 551 ?C in nitrogen atmosphere. The elongation at break of the prepared films was found to be high(almost 9.3%).