Bio-based benzoxazine from renewable L-tyrosine: Synthesis,polymerization, and properties

Developing thermosets derived from renewable sources is of great importance. In this work, a fully bio-based benzoxazine monomer, 3,6-bis((3-(furan-2-ylmethyl)-3,4-dihydro-2H-benzo[e][1,3]oxazin-6-yl)methyl)piperazine-2,5-dione (TCDPF), is conveniently synthesized from L-tyrosine cyclic dipeptide (TCDP), furfurylamine and paraformaldehyde. The chemical structure of TCDPF is confirmed by nuclear magnetic resonance spectroscopy and Fourier transform infrared spectroscopy (FT-IR) techniques. The curing behavior of TCDPF is investigated by differential scanning calorimetry and in situ FT-IR techniques. After temperature-programmed curing, the thermomechanical property and thermal stability of the resulting TCDPF polymer (PTCDPF) are evaluated by dynamic mechanical analysis and thermogravimetric analysis techniques, respectively. It is found that PTCDPF have excellent comprehensive performance such as high glass transition temperature (T_g = 322 °C), high thermal degradation temperature (T_5% = 342 °C, T_10% = 395 °C in N₂ atmosphere), and high char yield (CY = 51.3% at 800 °C in N₂ atmosphere). The results demonstrate that L-tyrosine is a promising bio-based raw material for preparing high performance polybenzoxazines.     

Poly(silarylene–siloxane)polyimides from allyl‐terminated oligoimides and hydride‐functional silarylene–siloxanes via hydrosilylation polymerization

This research was focused on the design and execution of new synthetic routes to low‐temperature‐curable poly(silarylene–siloxane)polyimides. The synthesis of individual oligoimide and silarylene–siloxane blocks was followed by hydrosilylation polymerization to produce crosslinked copolymers. The silarylene–siloxane and polyimide blocks were structurally characterized by IR and ¹H NMR spectroscopy and size exclusion chromatography. The high‐temperature resistance of the copolymers was evaluated through the measurement of heat distortion temperatures (T_HD's) via thermomechanical analysis and by the determination of the weight loss at elevated temperatures via thermogravimetric analysis. Glass‐transition temperatures (T_g's) of the silarylene–siloxane segments were measured by differential scanning calorimetry. Hydrosilylation curing was conducted at 60 °C in the presence of chloroplatinic acid (H₂PtCl₆). The copolymers displayed both high‐temperature resistance and low‐temperature flexibility. We observed T_g of the silarylene–siloxane segment as low as ?77 °C and T_HD of the polyimide segment as high as 323 °C. The influence of various oligoimide molecular weights on the properties of copolymers containing the same silarylene–siloxane was examined. The effect of various silarylene–siloxane molecular weights on the properties of copolymers containing the same oligoimide was also examined. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4922–4932, 2005     

Determination of ultra-low glass transition temperature via differential scanning calorimetry

A novel method was developed to determine the ultra-low glass transition temperature (T_g) of materials through physical blending via differential scanning calorimetry. According to the Fox equation for polymer blends, a blend of two fully compatible polymers has only one T_g. The single T_g is a function of the T_gs of the two simple polymers. Thus, the ultra-low T_g of one material can be obtained from the T_gs of another polymer and their blends. The error of T_g measurements depends on the measurement error of the T_gs for the blends and another polymer. The method was successfully applied to determine the T_gs of acetyl tributyl citrate (ATBC), tributyl citrate (TBC) and poly(ethylene glycol)s (PEG)s with different molecular weights. The T_gs for ATBC, TBC, PEG-4000 and PEG-800 were ?57.0 °C, ?62.7 °C, ?76.6 °C and ?83.1 °C, respectively. For all the samples, the standard deviation of measurements was less than 3.3 °C, and the absolute error of measurements was theoretically not more than 5.3 °C. These results indicate that this method has acceptable precision and accuracy.     

Cationic concentration effects on electron beam cured of carbon-epoxy composites

Electron beam (e-beam) curing is a technology that offers advantages over the thermal curing process, that usually requires high temperature and are time-consuming. E-beam curing is faster and occurs at low temperatures that help reduce residual mechanical stresses in a thermoset composite. The aim of the present study is to analyze the effects of cationic initiator (diaryliodonium hexafluoroantimonate) ranged from 1 to 3 wt% in DGEBA (diglycidyl ether of bisphenol A) epoxy resin when cured by a 1.5 MeV electron beam. The specimens were cured to a total dose of 200.4 kGy for 40 min. Analyses by dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC) show that the e-beam irradiated samples with 2 wt% cationic initiator were 96% cured obtained a glass transition temperature (tan δ) of 167 °C. The same epoxy resin, thermally cured for 16 h with an anhydride hardener, reached a T_g (tan δ) of 136 °C. So, the irradiated sample had its T_g increased approximately 20% and the curing process was much less time consuming.     

Impact of chain architecture (branching) on the thermal and mechanical behavior of polystyrene thin films

The modulus and glass transition temperature (T_g) of ultrathin films of polystyrene (PS) with different branching architectures are examined via surface wrinkling and the discontinuity in the thermal expansion as determined from spectroscopic ellipsometry, respectively. Branching of the PS is systematically varied using multifunctional monomers to create comb, centipede, and star architectures with similar molecular masses. The bulk‐like (thick film) T_g for these polymers is 103 ± 2 °C and independent of branching and all films thinner than 40 nm exhibit reductions in T_g. There are subtle differences between the architectures with reductions in T_g for linear (25 °C), centipede (40 °C), comb (9 °C), and 4 armed star (9 °C) PS for ≈ 5 nm films. Interestingly, the room temperature modulus of the thick films is dependent upon the chain architecture with the star and comb polymers being the most compliant (≈2 GPa) whereas the centipede PS is most rigid (≈4 GPa). The comb PS exhibits no thickness dependence in moduli, whereas all other PS architectures examined show a decrease in modulus as the film thickness is decreased below ～40 nm. We hypothesize that the chain conformation leads to the apparent susceptibility of the polymer to reductions in moduli in thin films. These results provide insight into potential origins for thickness dependent properties of polymer thin films. © 2011 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2012     

Bulk Copolymerization of Conjugated Linoleic Acid With Styrene and Butyl Acrylate: Reactivity Ratio Estimation

Free radical bulk copolymerizations of conjugated linoleic acid (CLA)/styrene (Sty) and CLA/butyl acrylate (BA) were performed at 80°C. Copolymers were characterized for composition, conversion, molecular weights and glass transition temperature (T_g). A pseudo-kinetic model was developed and validated with experimental data. Reactivity ratios estimations were performed and one impurity commonly found in CLA, oleic acid, influenced the reaction kinetics significantly. The T_g of CLA homopolymer was predicted to be 5°C.     

Amorphization of a crystalline active pharmaceutical ingredient and thermoanalytical measurements on this glassy form

Amorphization is nowadays a method that is frequently applied in the pharmaceutical industry. The primary aim of this study is to achieve the amorphization of clopidogrel hydrogen sulphate as an active pharmaceutical ingredient (API) with various solvents and to choose the most suitable one. A secondary aim was to determine the glass-transition temperature (T _g) of this API and to classify it as a good or poor glass former. To investigate the amorphous form, differential scanning calorimetry, X-ray powder diffraction, and FT-IR analysis were applied. The melting point (T _m) was 177.4 °C (450.6 K), and T _g was determined to be 88.9 °C (362.1 K). The quotient T _g/T _m was 0.80, and this API was therefore classified as a good glass former.     

Synthesis and thermal behavior of phenylethynyl‐terminated linear and hyperbranched polyphenylquinoxalines

A phenylquinoxaline (PQ) AB monomer mixture was treated with monofunctional and difunctional end‐capping agents and with and without a coupling agent to afford phenylethynyl‐terminated linear PQ oligomers. The resulting PQ oligomers were soluble in common organic solvents and had intrinsic viscosities (IVs) of 0.21–0.30 dL/g. The glass‐transition temperature (T_g) of the diphenylethynyl‐end‐capped PQ oligomer on both sides increased the most, from 215 °C (before curing) to 251 °C (after curing). The PQ AB₂ monomer, which acted as both a coupling agent and a monomer for the hyperbranched polymer, was treated with an AB monomer and end‐capping agents to afford phenylethynyl‐terminated hyperbranched polyphenylquinoxalines (PPQs). They were also soluble in common organic solvents, had IVs of 1.00–1.65 dL/g and T_g's of 251–253 °C, and underwent exothermic cure with maxima around 412–442 °C. The T_g's of the cured hyperbranched PPQs ranged from 258 to 261 °C, depending on the number of phenylethynyl groups on the surface. After further curing, they displayed a T_g of 316 °C in one sample and turned into a fully crosslinked network. The dynamic melt viscosities of a linear oligomer (IV = 0.21 dL/g), a hyperbranched sample (IV = 1.00 dL/g), and a linear reference PPQ (IV = 1.29 dL/g) were compared with respect to the processing temperature. The PQ oligomer and hyperbranched PPQ had low melt viscosities. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 6318–6330, 2004     

Effects of POSS nanoparticles on glass transition temperatures of ultrathin poly(t‐butyl acrylate) films and bulk blends

As a model system, thin films of trisilanolphenyl‐POSS (TPP) and two different number average molar mass (5 and 23 kg mol^?1) poly(t‐butyl acrylate) (PtBA) were prepared as blends by Langmuir–Blodgett film deposition. Films were characterized by ellipsometry. For comparison, bulk blends are prepared by solution casting and the samples are characterized via differential scanning calorimetry. The increase in T_g as a function of TPP content for bulk high and low molar mass samples are in the order of ～10 °C. Whereas bulk T_g shows comparable increases for both molar masses (～10 °C), the increase in surface T_g for higher molar mass PtBA is greater than for low molar mass (～22 °C vs. ～10 °C). Nonetheless, the total enhancement of T_g is complete by the time 20 wt % TPP is added without further benefit at higher nanofiller loads. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 175–182     

Comparative Studies on Thermomechanical Behavior of Veriflex®, a Shape Memory Polymer,for a Low Strain (ϵm = 70%): Laser Experiments

An interesting comparative case study on thermomechanical cycles including programming, cooling, unloading and heating to trigger the 1WE was done using Veriflex® at 62°C (T < T_g close to and below 5°C of T_g) and also at 72°C (T > T_g, close to and above 5°C of T_g) for slightly low strains (?_m = 70%) and the recovery time of 10 min. Accumulation of strain was estimated during the thermomechanical treatments for using both 70% strains at 62°C (T < T_g), as well as at 72°C (T > T_g). Recovery ratios for 70% strains at 62°C (T < T_g), as well as for 72°C (T > T_g) were also estimated. It turns out that programming, cooling, unloading and heating to trigger the 1WE causes an increase of irreversible strain and is associated with a corresponding decrease of the intensity of the 1WE, in particular, during the first thermomechanical cycles. A LSCM (Laser Scanning Confocal Microscopic) study shows very little change in surface structure which evolved during cycling up to 70% strains at 72°C (T > T_g).     

Homopolyimides containing both benzimidazole and benzoxazole with high Tg and low coefficient of thermal expansion

A pair of isomer diamines containing both benzimidazole and benzoxazole and derived homopolyimides were synthesized for the first time. Due to rich rigid and linear benzoazole units, as well as the strong intermolecular interactions from the hydrogen bonding and the charge transfer complexation (CTC), the obtained polyimides (PIs) exhibited outstanding thermal properties, including high thermal weight loss temperature (T_d5% = 540–561°C), high glass transition temperature (T_g = 392–421°C), and low coefficient of thermal expansion (CTE = 1.3–20.9 ppm/°C). In addition, the obtained PIs also showed ideal mechanical properties (T_S = 189–240 MPa, T_M = 4.1–5.0 GPa and E_B = 2.9%–4.7%). These potential novel PI films with high T_g and low CTE were expected to be applied to next generation of flexible display substrate material.     

BDMA-catalyzed DDA-epoxy resin system: Temperature and composition effects on curing mechanism

DSC and IR data on benzyldimethylamine-catalyzed dicyandiamide-DGEBA prepolymer system have been utilized to investigate the influences of temperature and composition on the curing mechanism. Etherification as a competitive reaction is favored at lower temperature. On the other hand, the reaction pathway of dicyandiamide (DDA) varies with temperature, especially at the first stage of reaction. At 100°C, the reaction of DDA is shown to be essentially the substitution of the hydrogen atoms by ring-opening of epoxy groups, giving rise to N-alkyl cyanoguanidine. But at 140°C or 160°C, the initial reaction of DDA involves a transformation of nitrile groups to imine groups. A greater amount of BDMA and a higher amine-to-epoxy ratio favor the etherification. The glass transition temperature T_g is a complex function of these different mechanisms; higher T_g could be reached with a amino-to-epoxy ratio equal to 0.6 and after a curing cycle including a precure at 100°C.     

Revealing defects hampering the formation of epoxy networks with extremely high thermal properties: Theory and experiments

We present a combined experimental and theoretical investigation of thermal properties of cycloaliphatic epoxy networks. The networks are prepared from 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ERL-4221 as a monomer and 4-methylhexahydrophthalic anhydride as a curing agent and their glass transition temperature T_g is evaluated by dynamic mechanical and thermal mechanical analyses as well as by differential scanning calorimetry. It is found that the cured epoxy networks have high T_g values reaching 233–238 °C. The method of anharmonic oscillators is first proposed to simulate the effect of network structure on the thermal properties. It suggests that further increase of T_g values is not attained because of the formation of intramolecular cyclic structures. Studies of model reaction by mass-spectrometry confirm the formation of such structures at curing.     

Glass transition of polymer/single-walled carbon nanotube composite films

The glass-transition temperatures (T_g's) of nanocomposites of polystyrene (PS) and single-walled carbon nanotubes were measured in the bulk and in thin films with differential scanning calorimetry and spectroscopic ellipsometry, respectively. The bulk T_g of the nanocomposites increased by approximately 3 °C and became much broader than that of PS. For the nanocomposite films thinner than 45 nm, T_g decreased with decreasing film thickness [i.e., ΔT_g(nano) < 0]. This phenomenon also occurred in thin PS films, the magnitude of the depression in PS [ΔT_g(PS)] being somewhat larger. The film thickness dependence and the differences in the magnitude of ΔT_g in the two systems were examined in light of current theory, and a quantitative comparison was made. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 3339–3345, 2003     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Epoxy resins (DGEBA): The curing and physical aging process

Differential scanning calorimetry (DSC) and infrared spectroscopy (IR) were used to monitor the degree of cure of partially cured epoxy resin (Epon 828/MDA) samples. The extent of cure, as determined by residual heat of reaction, concurred with that determined by monitoring the infrared radiation absorbance of the epoxide group near 916 cm^?l. The fictive temperature T_{f, g} was found to increase with the degree of cure, increasing rapidly during cure until reaching a value near the cure temperature T_c of 130°C (approximately 80% cure) where the material vitrified. The greatly reduced reaction rate during the final 20% of cure was not only a consequence of vitrification but, as revealed by infrared spectroscopy, the result of the depletion in the number of reactive epoxide groups. The endothermic peak areas and peak temperatures evident during the DSC scans were used as a measure of the extent of “physical aging” which took place during the cure of this resin, and after, fully cured samples were aged 37°C below their ultimate glass temperature for various periods of time. The rate of physical aging slowed as the temperature increment (T_t,g ? T_c) increased. Although an endothermic peak was evident after only 1 h of cure (T_{f, g} = 138.3°C), such a peak did not appear until fully cured samples were aged for 16 h or more. Enthalpy data revealed that for partially cured material, the fictive temperature T_{f, a}, reflecting physical aging, increased with curing time. In contrast, the T_{f, a}, for fully cured samples decreased with sub-T_g aging time. The characteristic jump in the heat capacity ΔC_p which occurred at the T_{f, g} decreased as curing progressed. This decrease appears to be dependent upon the rotational and vibrational degrees of freedom of the glass. Finally, a graphical method of determining the fictive temperature T_{f, a}, of partially and fully cured epoxy material from measured endothermic peak areas was developed.     

Synthesis and characterization of a novel polytriazole resin with low‐temperature curing character

A novel low‐temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70°C. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355°C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol^?1. The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185°C. Copyright © 2007 John Wiley & Sons, Ltd.     

Phenylethynyl-pendant polyphenylquinoxalines curable by an intramolecular cycloaddition reaction

Polyphenylquinoxalines containing 2,2′-bis(phenylethynyl)diphenylene moieties along the polymer backbone have been synthesized. As anticipated, these polymers were found to undergo a novel curing reaction consisting of an intramolecular cycloaddition (IMC) of pendant groups to a dibenzoanthracene backbone structure. The IMC reduces chain mobility, and the fused ring structure increases the glass transition temperature of the polymer. The potential of this approach to curing high-temperature polymers was demonstrated in the processing of one such polymer having an initial T_g of 215°C. Curing at 245°C with no evolution of volatiles produced a T_g of 365°C. This very significant increase in potential use temperature via a volatiles-free IMC cure provides promise for a tough phenyiquinoxaline resin system which can be used to fabricate reinforced composites that have use temperatures far exceeding processing temperatures.     

Influence of Isosorbide on Glass‐Transition Temperature and Crystallinity of Poly(butylene terephthalate)

Copolyesters of isosorbide and 1,4‐butane diol were prepared by Ti(OBu)₄‐catalyzed transesterifications with dimethyl terephthalate in bulk at temperatures up to 250°C. The content of isosorbide was considerably lower than expected from the feed ratio and the molar masses were low, so that no DSC measurements were conducted. Copolycondensations of isosorbide and 1,4‐butane diol with terephthaloyl chloride were either performed in dichloromethane at 40°C or in toluene at 100°C. The second method gave the higher molar masses. However, both series of polycondensations had the content of isosorbide roughly paralleled the feed ratios in common. The DSC measurements revealed that even 6 mol% of isosorbide is sufficient to raise the glass‐transition temperature (T_g) by 10–12°C (up to 55°C). With 50 mol% of isosorbide, the T_g reaches 100°C. Yet, incorporation of isosorbide also reduces the melting temperature T_m and the degree of crystallinity, and a mol percentage above 30% prevents crystallization completely. In summary, incorporation of isosorbide allows for fine‐tuning of T_g and T_m of poly(butylene terephthalate) over a wide range.     

Evaluation of interfacial region of microphase-separated SEBS using modulated differential scanning calorimetry and dynamic mechanical thermal analysis

The continuous structural changes of Poly(styrene-b-ethylene-butylene-b-styrene) [SEBS] due to the effect of temperature are hard to evaluate using conventional differential scanning calorimetry (DSC). This paper presents an accurate and simple way to evaluate microstructural and glass transitions of SEBS using modulated differential scanning calorimetry (MDSC). The weak crystalline nature of –(CH₂-CH₂)–_n in the ethylene-butylene (EB) block melted around 36 °C. The premature molecular moment and Tg of the styrene block were at 62 °C and 96 °C, respectively. The interfacial region at high temperature was explained with respect to order-order transition (OOT) at 144 °C and a prominent Order-Disorder Transition (ODT) at around 202 °C. Dynamic mechanical thermal analysis (DMTA) and dynamic mechanical rheological testing (DMRT) measurements also revealed that the T_g of the PS transition were consistent at around 96 °C.