木质素对木质素-脲醛共聚树脂的影响及反应机理

通过调控甲醛与尿素摩尔比, 降低脲醛树脂胶黏剂中游离甲醛的含量, 以生物质玉米芯为原材料, 用碱液提取得到的碱木质素溶液与甲醛和尿素进行三元逐步共聚, 弥补降低醛脲比带来的胶合强度的快速下降问题. 以降低游离甲醛含量同时兼顾胶合强度为原则进行探索, 得到最佳实验条件为甲醛与尿素摩尔比(F/U)为0.91∶1, 木质素添加量为20%(质量分数), 在此条件下木质素-尿素-甲醛共聚树脂(LUF)胶合强度为0.99 MPa, 游离甲醛含量为0.26%. 对共聚树脂进行了结构表征, 表明木质素参与到反应中, 并能提高树脂的热稳定性和耐水性, 同时对反应的机理进行了讨论.     

新型环氧丙烯酸树脂增韧剂的合成

用马来酸酐和聚乙二醇1000合成具有反应活性端基的聚乙二醇,用红外与核磁共振进行了表征,并用其对环氧丙烯酸树脂进行改性;研究反应温度、反应时间对反应及产物性能的影响;用红外对反应性聚乙二醇和环氧丙烯酸树脂的固化物进行分析.结果表明,反应性聚乙二醇参与了环氧丙烯酸树脂的固化反应,可在交联网络中构成不同长度的柔性链段,显著地提高了环氧丙烯酸树脂的冲击强度.     

光催化降解甲醛的波长效应研究

分别以紫外杀菌灯和黑光灯为光源,研究了TiO2薄膜催化剂上甲醛的光催化氧化反应.实验结果表明,紫外杀菌灯照射下,甲醛的光催化降解率明显低于以黑光灯为光源时甲醛的光催化降解率.采用傅立叶红外光谱(FT-IR)和热分析(TG-DTA)对反应后的TiO2光催化剂进行分析和表征,对两种不同光源照射下甲醛光催化降解率的差异进行了初步探讨.     

对苯二酚型蛇笼氧化还原树脂结构的设想与论证

根据模板聚合理论与对苯二酚型蛇笼氧化还原树脂的性能实验结果,设想本树脂具有蛇笼氧化还原结构,被吸留于其中的对苯二酚-甲醛线形树脂是能起氧化还原作用的“蛇”,交联基体树脂是“笼”。通过电镜实验及该树脂中的对苯二酚-甲醛线形树脂的抽提实验和红外光谱与氮元素定量分析实验,论证了我们所设想的结构模式。     

二硫代氨基甲酸酚醛型螯合树脂的合成及其对Ag~+的吸附性能研究

以乙二醇单苯醚-甲醛负载三乙烯四胺螯合树脂(PB-TETA)为前驱体,经氨基与二硫化碳反应,得到含二硫代氨基甲酸基酚醛型螯合树脂(PB-TETA-CS2)。对所制备的新型螯合树脂进行了红外光谱和元素分析等表征,研究了树脂对Ag+、Hg2+、Cu2+、Pb2+和Ni2+等金属离子的静态饱和吸附量及树脂对Ag+的动力学及热力学吸附性能。结果表明,该树脂对Ag+的吸附量最高;pH=4时的最大吸附量为0.18mmol/g。树脂对Ag+的吸附受液膜扩散控制,等温吸附过程符合Langmuir单分子吸附模型。     

离子交换树脂支载的加氢催化剂的制备及在乙二醇精制中的应用

制备了一种离子交换树脂支载的Ni-B非晶态合金催化剂,对催化剂形态及孔结构等进行了表征;将该催化剂用于催化加氢法降低乙二醇中甲醛含量的实验,考察了反应温度、乙二醇空速和压力对该催化剂催化条件下甲醛去除率的影响。结果表明,Ni-B分散在树脂载体表面和内部的孔中,催化剂孔径约20nm,属于介孔范围;在反应温度353K、乙二醇液时空速3h-1、压力0.5MPa条件下,催化剂连续运行500h,乙二醇中甲醛含量由45μg/g降低至3μg/g以下,甲醛去除率达到95%。     

硫脲甲醛聚合反应中的半结晶沉淀现象

首次报道了硫脲甲醛聚合反应中的半结晶沉淀现象.定量分析结果显示硫脲甲醛之间的聚合反应接近一种线性交替共聚反应过程.红外光谱的结果证明不同硫脲甲醛物质的量比反应条件下产物中始终存在较强的N—H特征振动吸收峰(v=3311cm-1,δ=1541cm-1).当甲醛用量较高和硫脲用量增加时分别在1008和1137cm-1处检测到较强的C—O—C和C=S伸缩振动吸收峰.结合XRD和核磁共振分析结果推测:硫脲甲醛聚合产物中存在着一种氢键导向型结晶结构;分子中含有醚键的聚合产物因具有复杂的氢键作用没有结晶性.扫描电镜分析显示较高硫脲用量反应条件下生成了层状半结晶碎片产物,而高甲醛比例条件得到的产物为细小的层状碎片交联聚集成的球形粒子.     

木质素对酚醛/木质素嵌段共聚树脂制备的影响及反应机理

以工业木糖生产残渣为原料, 用不同条件下碱提取得到的碱木质素液与苯酚和甲醛原位反应制备酚醛/木质素嵌段共聚树脂. 以所制备树脂中甲醛释放量最小为原则, 得到木质素的最佳提取条件: 碱浓度5%(质量分数), 固液体积比1:12, 反应时间3 h. 在此条件下树脂中甲醛释放量为0.115%, 相应的胶合强度为1.197 MPa, 均远优于GB/T14074-2006中对于一类胶合板用酚醛胶的要求(甲醛释放量≤0.3%, 胶合强度≥0.7 MPa). 实验结果表明, 碱木质素液能参与到反应中, 提高酚醛/木质素嵌段共聚树脂的热稳定性及胶合强度, 降低甲醛释放量, 有利于树脂的储存及应用. 同时讨论了碱木质素与苯酚和甲醛的可能反应机理.     

环氧树脂固化过程的红外光谱研究

通过对环氧树脂和顺丁烯二酸酐在加热固化过程中红外光谱演变情况的观察,阐明了树脂在不同固化阶段和不同固化温度所进行的各类反应和相应的结构变化。在固化过程中使树脂的分子量增大和形成交联结构的主要反应是酯化反应。Fisch等提出的醚化反应在红外光谱中没有得到证实。树脂在酯化反应中生成的顺丁烯二酸酯的结构受热的影响会产生顺、反异构化反应。反应的进程取决于固化温度。在180℃加热已固化的树脂将导致部分碳-碳双键和剩余环氧基的减少,同时产生新的羟基和羰基。     

一种有机膦树脂的合成及在锂镁分离中的应用

本文以线性酚醛树脂为母体,其经溴甲基化、三乙氧基磷亲核取代及Arbuzov重排反应,合成一种有机膦树脂。该树脂经红外,电镜扫描,热重等方法进行了表征。另外,通过Gauss软件对产物结构单元类似物的单体进行频率计算,得到其理论计算红外图谱,与产物红外图谱进行比对,表明对酚醛树脂高分子骨架上官能团改造是成功的,合成了一种有机膦树脂。用该树脂对锂镁分离进行了简单的分离实验,结果表明该有机膦树脂对锂镁吸附的分离系数(β)为2.3。     

Effects of novel polyhedral oligomeric silsesquioxane containing hydroxyl group and epoxy group on the dicyclopentadiene bisphenol dicyanate ester composites

Two types of novel Polyhedral Oligomeric Silsesquioxanes respectively containing hydroxyl group and epoxy group (P-POSS and E-POSS) were achieved and evaluated. The structure had been characterized by IR spectra and NMR spectra. Dicyclopentadiene bisphenol dicyanate ester (DCPDCE) composites were then prepared using P-POSS and E-POSS respectively. Their effect on the curing kinetics, dielectric, mechanical, flame-retardant and thermal properties and water absorption of the resulting composites were investigated. The results suggested that the addition of modified POSS could facilitate the curing reaction of DCPDCE. Besides, the DCPDCE composites containing modified POSS exhibited excellent flame-retardant property over pure DCPDCE resin. Adding only a little amount as small as 1.5 wt% P-POSS or 2.5 wt% E-POSS could change the UL-94V of DCPDCE resin from V-2 to V-0. The composite with P-POSS exhibited better flame-retardant and thermal properties than the composite with E-POSS. However, composite filled with E-POSS presented better dielectric property and lower water absorption.     

Synthesis of methacrylic copolymers with nona‐1‐butoxy trititanosiloxane as side groups and its application as a thermosetting resin

Methacrylic copolymers with a hydroxyl group on one end of the main chain and nona‐1‐butoxytrititanosiloxane as side groups (called methacrylic hybrid copolymers) were synthesized for use as baked‐finish‐type coating resins. The chemical structures of the side groups in the methacrylic hybrid copolymers were confirmed with the ash weight of the copolymers after combustion, the elemental ratio analysis of Si and Ti in the ash determined by inductively coupled plasma emission spectrometry, and the characteristic absorption band determined by Fourier transform infrared spectrophotometry. The methacrylic hybrid copolymers were cured at temperatures less than 150 °C in the absence of a curing accelerator. The cured copolymers exhibited a high thermal stability. The curing temperature of the copolymers was determined by the change in the absorption peak strength (peak area) of the 1655 cm⁻¹ band in the IR difference spectrum. The thermal stability of the copolymers was evaluated as the thermal‐degradation temperature measured by thermogravimetric analysis. The methacrylic hybrid copolymers were then be used as effective curing resins. The mixture, consisting of thermoplastic methacrylic terpolymer with hydroxyl and carboxyl groups and the methacrylic hybrid copolymers, were cured at less than 150 °C in the absence of a curing accelerator and exhibited a higher thermal‐degradation temperature than the copolymers. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 1090–1098, 2001     

Synthesis and characterization of thiocarbonohydrazone-based epoxy resins

Novel epoxy resins of various thiocarbonohydrazones have been synthesized by reacting the aldehyde or ketone derivatives of thiocarbohydrazide with excess of epichlorohydrin. The resins have been characterized by elemental analyses, epoxy equivalents, ¹H-NMR and IR spectra, thermal analyses, and viscosity measurements. Curing of the resins has been carried out by mixing with thiocarbohydrazide or ethylenediamine and heating at 80°C for 48 h. A comparison of the thermal stability of the cured resin samples has been made.     

香草醛异烟酰腙与钴、镍、铜、锌和镉配合物的合成和性质研究

本文合成了香草醛异烟酰腙(H_2L~Ⅰ)和邻香草醛异烟酰腙(H_2L~Ⅱ)与钴(Ⅱ)、镍(Ⅱ)、铜(Ⅱ)、锌(Ⅱ)和镉(Ⅱ)的九个新配合物:M(HL~Ⅰ)_2·nH_2O[M(Ⅱ)=Co、Ni、Cu、Zn和Cd,n=0,2]和M(HL~Ⅱ)_2·nH_2O[M(Ⅱ)=Co、Ni、Cu和Zn,n=0-3]。采用元素分析、红外光谱、电子光谱、电导、磁化率、X-射线粉末衍射和热分析研究了两系列配合物的组成和性质。     

用红外光谱法对热固性酚醛树脂固化过程的研究

用红外光谱法研究了四种热固性酚醛树脂在固化过程中的化学变化。结果表明热固性酚醛树脂的固化过程,首先是羟甲基发生缩合反应,缩合反应形成醚键是主要的。热固性酚醛树脂在进一步固化时(150—200°)出现了羰基,它的出现不是亚甲基氧化所致,而是部分醚键断裂形成了醛羰基。对热固性酚醛树脂的固化过程的机理进行了讨论。     

Prediction of Heat Shield Performance in Terms of Epoxy Resin Structure

Abstract

High-strength, readily processable, char-forming, insulative materials are being sought for application in ablative heat shields for re-entry vehicles. Toward this end, the family of epoxy resins has been evaluated. The structure of epoxy resins and curing agents in terms of their functionality, aromaticity, and chemical nature is discussed in relation to its effect on ablative properties. The concept of controlled, constructive thermal degradation is extremely important in ablative epoxide compositions. Bridged Diels-Alder adducts based upon cyclic dienes and maleic anhydride perform well as epoxy resin curing agents in this respect. The mechanism of thermal ablative degradation of these systems is discussed in terms of in situ thermal control and char-forming reactions. The position of attachment of glycidyl groups, as well as the nature and position of other sub-stituents around the aromatic nucleus, has little effect in general upon the ablative properties of epoxy resins. Thermal and ablative data of both benzene and naphthalene derivatives are given. A new epoxy resin based upon 2-nitro resorcinol has been synthesized. This resin gives significant char increases, both quantitatively and qualitatively, over conventional epoxides. The unusual mechanism of polymerization and thermal degradation of this resin is discussed.     

Preparation, Curing Reactivity and Thermal Properties of Titanium-doped Silicone Resins

Novel titanium-doped silicone resins were synthesized from low-cost silane monomers and tetrabutyl titanate as raw materials and hydrochloric acid as catalyst, with titanium element as dopant into principal chain of Si-O-Si. The resins were characterized by means of FTIR, 1 H NMR and 13 C NMR spectra, their thermal properties and curing properties were investigated and their corresponding films were determined. The results show that the thermal stability and storage stability of the resins were influenced by the types of silane monomers containing different carbon atomicities of organic group. The thermal stability of the titanium-doped silicone resin with a molar ratio of silane monomer B(n-propyl triethoxysilane) to silane monomer C(n-octyl triethoxysilane) being 1:1 is superior to that of the resin with a molar ratio of silane monomer B to silane monomer C being 1:3. However, the storage stability of the former is inferior to that of the latter.This work also showed that the synthesized titanium-doped silicone resins have the highest thermal stability up to 450―500 °C with an atomicity molar ratio of 1:4 of titanium to silicon in the reactants. But the best storage stability of the resin prepared from the reactants with an atomicity molar ratio of 1:6[n(Ti):n(Si)] was obtained. The effect of the type and content of curing agent on the curing properties of the resin was also studied. Moreover, thermal mechanism and curing mechanism were proposed in this work.     

Preparation and properties of epoxy resins cured with silyl esters of phenol novolak and cresol novolak

The curing agents of epoxy resin, trimethylsilyl ethers of phenol novolak (TMSPN) and cresol novolak (TMSCN) were prepared by refluxing phenol novolak and cresol novolak respectively, with the mixture of hexamethyldisilazane and chlorotrimethylsilane in THF. The curing reaction of epoxy resin with these curing agents and the thermal properties of cured resins were examined. The Tg values of epoxy resins cured with TMSPN were a little higher than those cured with TMSCN. The maximum of Tg is 118°C for TMSPN-cured epoxy resin against 112°C for TMSPN-cured epoxy resin. The water absorption of hydrophobic epoxy resins cured with TMSPN was a little lower than those cured with TMSCN. The clear decrease of water absorption is attributed to the difficulty of the micro-void formation caused by the more tight primary structures of TMSPN. The water absorption at 25°C containing trimethylsilyl groups is about one-tenth of that of epoxy resins cured with conventional curing agents and even one-half of that of the epoxy resins cured with active esters. The low water absorption is attributed to the presence of trimethylsilyl groups, which are more hydrophobic than ester groups, and to the absence of hydroxyl groups of the cured resins. This revised version was published online in July 2006 with corrections to the Cover Date.     

3-(Triethoxysilyl)propionitrile sol-gel coating

3-(Triethoxysilyl)propionitrile (TESPN) sol-gel has been prepared under different conditions. It was employed for coating the surfaces of quartz and aluminum. Infrared (IR) and Raman spectra of TESPN and TESPN sol-gels have been recorded in the study of the sol-gel process. Transmission and reflection absorption IR (RAIR) spectra of TESPN sol-gel coated quartz and aluminum have also been collected for better understanding the film formation on the substrate surfaces. Spectra collected at different temperatures indicated that the silane film on quartz decomposes at 700 degrees C. Results from thermal gravimetric analysis (TGA) supported this result. Based on the group frequencies and the spectral behavior in different states, some vibrational modes were assigned to the observed bands. The anticorrosion behavior of the sol-gel coated aluminum in comparison with the uncoated metal was evaluated by measuring the potentiodynamic polarization and electrochemical impedance spectra (EIS).