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1.
Organic polymer (PES: PolyEther Sulphone and PEEK: PolyEther Ether Ketone) ablation with oscillation-line selected TEA CO2 lasers is successfully demonstrated. With different irradiation conditions the ablative etch-rate slopes were varied, which means that the ablation process is dependent on the ablation conditions such as incident laser intensity and ambient gas. In perforation processing of the PEEK film, the TEA CO2 laser had a higher etch rate of 42 m/pulse at a fluence of 70 J/cm2 in vacuum than the XeCl laser.  相似文献   

2.
Picosecond carrier dynamics of deep bandtail states (3.1 eV) in an unintentionally n-doped GaN epilayer at room temperature under high excitation densities (i.e., N 0 = 1.0× 1019– 1.1× 1020 cm–3) have been investigated with nondegenerate femtosecond pump–probe (267/400 nm) reflectance ( R/R 0). All R/R 0 traces possess a 2 ps buildup time that represents an overall time for the initial non-thermal carrier population to relax towards the continuum extremes and then into the probed tail states. We observe a saturation of R/R 0 initial (first 10 ps) recovery rate i at a density of 5– 6×1019 cm–3 close to the Mott transition threshold obtained from time-integrated PL measurements. Such a saturation phenomenon has been identified as the trap-bottleneck due to the bandtail states and deep traps. As N 0 is further increased, i accelerates due to the onset of Auger recombination as the trap-bottleneck becomes effective. The best fit by the Auger model for N 0 in the range of the mid-1019–1020 cm–3 yields an Auger coefficient of C a 5.0× 10–30 cm6 s–1.  相似文献   

3.
The post-growth modification of diamond-like amorphous hydrogenated carbon a-C:H films by laser treatment has been studied by transmission electron microscopy and Raman spectroscopy. a-C:H films grown on Si substrates by benzene decomposition in a rf glow discharge were irradiated with 15 ns pulses of a KrF-excimer laser with fluences in the range of E=50–700 mJ/cm2. At fluences below 100 mJ/cm2 an increase in the number of graphitic clusters and in their ordering was evidenced from Raman spectra, while the film structure remained amorphous according to electron microscopy and electron diffraction observations. At higher fluences the appearance of diamond particles of 2–7 nm size, embedded into the lower crystallized graphitic matrix, was observed and simultaneously a progressive growth of graphite nanocrystals with dimensions from 2 nm to 4 nm was deduced from Raman measurements. The maximum thickness of the crystallized surface layer (400 nm) and the degree of laser annealing are limited by the film ablation which starts at E>250 mJ/cm2. The laser-treated areas lose their chemical inertness. In particular, chemical etching in chromium acid becomes possible, which may be used for patterning the highly inert carbon films.  相似文献   

4.
Magnetic properties of rf sputtered (0.5–x) Bi2O3-x CaO-0.5 Fe2O3 (x=0–0.5) have been studied through magnetization and ferromagnetic resonance (FMR) measurements. Films prepared in a mixed oxygen-argon atmosphere are amorphous and paramagnetic. Samples annealed in air at temperatures of 700–1000 K show a ferrimagnetic behavior even though X-ray diffraction data for the films do not indicate the precipitation of any crystalline ferrimagnetic compounds. The room-temperature saturation magnetization 4M and the uniaxial anisotropy field H u , decrease with increasing x. The Curie temperature and the gyromagnetic ratio increase with increase in the concentration of CaO. Studies on the effects of sputtering atmospheres on magnetic parameters show that films sputtered in oxygen-rich atmospheres have a large 4M and H u , and a relatively small and FMR line-width. Ordered amorphous clusters are suggested to give rise to the observed ferrimagnetic character in the annealed films.  相似文献   

5.
Excimer laser doping of GaAs using sulphur adsorbate as a dopant source is demonstrated. Box-like n-type layers of depths of about 100 nm with carrier concentration as high as (23)×1019 cm–3 are formed. Passivation of GaAs using a (NH4)2Sx solution for 40 min followed by sublimation of the excess sulphur atoms in high vacuum result in an effective dopant for controllable n-type doping. The samples are irradiated using a KrF excimer laser in a N2 gaseous environment. Secondary ion mass spectrometry (SIMS) measurements show that sulphur is successfully incorporated in the GaAs. The sheet resistance is controlled by adjusting the laser energy fluence and number of laser pulses. Rutherford backscattering spectrometry with channeling (RBS/C) alignment measurement indicates that lattice damage is undetectable for N2 gas pressures of 760 Torr.  相似文献   

6.
XeCl laser ablation of yttria stabilized zirconia (YSZ) in air and in vacuum (1.3×10–4 Pa) is studied by means of etch depth measurements, scanning electron microscopy, and X-ray photoelectron spectroscopy of ablated surfaces. Results on ablation rate, surface morphology, and surface chemical composition are discussed in terms of the influence of ambient atmosphere on the ablation process, rapid melting and solidification of ablated surfaces, and preferential removal of oxygen atoms from the YSZ surface.  相似文献   

7.
We report a theoretical and experimental investigation of the effects of collisional quenching on resonant degenerate four-wave mixing (DFWM). Using single-mode laser radiation, peak signal intensity measurements were performed on an isolated line in the A – X transition of NO. By using appropriate mixtures of N2 and CO2 as buffer gases, we varied the collisional quenching rate over several orders of magnitude while maintaining a fixed total collisional dephasing rate. The mixtures had approximately 100 Torr total pressure and were at room temperature. For I/I sat approximately equal to 0.02, DFWM intensities were found to be less affected by variations in quench rate than were laser-induced fluorescence (LIF) intensities (I and I sat are the pump laser and one-photon saturation intensities, respectively). Moreover, for I/I sat roughly equal to 0.5, DFWM intensities were observed to be nearly independent of quench rate. The results are compared to two theoretical predictions, with good agreement observed. Both theories indicate that the minimum sensitivity of DFWM to quenching occurs near I/I sat1.  相似文献   

8.
The formation of (TixW1–x)Si2/(TixW1–x)N, by rapid thermal processing of TixW1–x on Si in an N2 ambient is investigated. An activation energy of 1.7 eV is obtained for silicide formation. A distinct snow-ploughing of As atoms is observed during silicide formation whereas the interfacial B concentration decreases with increasing silicide formation temperature. The diffusion barrier properties of the (TixW1–x)Si2/(TixWi1–x)N stack in contact with Al is investigated upon post-metal annealing. No interaction between the layers is found for temperatures as high as 475°C after 60 min. The improved thermal stability of the (TixW1–x)N layer in contact with Al is attributed to nitrogen blocking of the grain boundaries.  相似文献   

9.
Intensity-induced nonlinear effects in optical window materials have been investigated at 308 nm. The absolute two-photon absorption coefficients for fused silica, CaF2, BaF2, Al2O3 and ADP crystals have been measured by using a single 120 ps, transform-limited pulse from the second harmonic of a distributed feedback (DFB) dye laser. The nonlinear refractive index coefficient has been obtained from measurements of far-field intensity distributions.  相似文献   

10.
Lateral growth rates of Ni spots deposited on absorbing substrates by decomposition of Ni(CO)4 with visible Kr+ laser light have been measured. The experimental data are consistent with the calculated temperature distributions. The mechanism of decomposition is thermal with an apparent chemical activation energy of 22±3 kcal/mole for the temperature range 350 KT500 K.  相似文献   

11.
Ar ion laser assisted chemical etching of 150 m thick annealed tungsten sheets in air is reported. The material removal mechanism involves local heating by the laser to temperatures in the range of 1000–1500 °C that causes rapid oxidation of the W to WO3 which volatilizes readily. Holes with straight walls and slightly enlarged entrances near the surface were drilled with etch rates as high as 11.5 m/s at 13.8 W, and a minimum hole diameter of 21 m at 8.1 W. The diameters of the holes and the etch rates were measured and found to increase as a function of the laser power. It was found that by increasing the laser power above 11–12 W, no change was observed in the hole diameters which remained constant at about 31 m, whereas the etch rates continued to increase even faster than at low powers. Distinct adjacent holes of 25 m diameter could be drilled with their centers separated by as little as 60 m. This is therefore also the etching resolution in the present study.  相似文献   

12.
The solubility and diffusion of Au in -Ti have been studied in a 823–1023 K temperature range using the Rutherford backscattering technique. For this purpose we have implanted Au into -Ti samples. Our results show that the solubility of Au varies between 0.2 and 0.35 at.%. In addition, we found that the diffusion coefficients follow a normal Arrhenius behavior with Q=260 kJ/mol and D o=1.9×10–5 m2/s1. These values are typical for a substitutional diffusion mechanism.  相似文献   

13.
14.
We have successfully constructed and tested a superconductor-insulator-superconductor (SIS) receiver for operation at 265–280 GHz using 1 m2 area Nb–AlO x –Nb tunnel junctions fabricated at Stony Brook. The best performance to date is a double sideband (DSB) receiver noise temperature of 129 K at 278 GHz. We find that suppression of the Josephson pair currents with a magnetic field is essential for good performance and a stable DC bias point. Fields as high as 280 gauss have been used with no degradation of mixing performance. We illustrate the improvement in the intermediate frequency (IF) output stability with progressively increasing magnetic fields.  相似文献   

15.
The maskless photoassisted etching of n-type Ga0.47In0.53As is examined for basic KOH solutions in comparison with GaAs and InP material. The etch rate increases with laser intensity and with carrier concentration up to a saturation value. The best etch rate is obtained with molar KOH in ethyl alcohol (7 ms–1 for laser intensity 104 W cm–2). Selective etching have been realized on heterojunction in order to isolate p-n junctions without the help of masks.  相似文献   

16.
The probability for delayed muon induced fission of209Bi has been determined from a ( ,f 1 f 2) measurement. The measured fission probability P f =(4.2±0.7)×10–5 is compared with theoretical predictions. The high fission threshold reaction seems well suited for studying the influence of two-body meson-exchange currents in nuclear muon capture.We are indebted to the following institutes or organizations for financial support: Bundesministerium für Forschung und Technologie der Bundesrepublik Deutschland contract number 06 BN 271 (HP, PD, HH, FR, CR), Foundation for Fundamental Research on Matter (FOM) and the Netherlands Organization of the Advancement of Pure Research (NWO) (JK, CTAMdL, WL, AT) and the Schweizer Nationalfonds (LS).  相似文献   

17.
A quartz crystal microbalance (QCM) has been used to study the KrF* excimer laser-induced etching of titanium by bromine-containing compounds. The experiment consists of focusing the pulsed UV laser beam at normal incidence onto the surface of a quartz crystal coated with 1 m of polycrystalline titanium. The removal of titanium from the surface is monitored in real time by measuring the change in the frequency of the quartz crystal. The dependence of the etch rate on etchant pressure and laser fluence was measured and found to be consistent with a two-step etching mechanism. The initial step in the etching of titanium is reaction between the etchant and the surface to form the etch product between laser pulses. The etch product is subsequently removed from the surface during the laser pulse via a laser-induced thermal desorption process. The maximum etch rate obtained in this work was 6.2 Å-pulse–1, indicating that between two and three atomic layers of Ti can be removed per laser pulse. The energy required for desorption of the etch product is calculated to be 172 kJ-mole–1, which is consistent with the sublimation enthalpy of TiBr2 (168 kJ-mole–1). The proposed product in the etching of titanium by Br2 and CCl3Br is thus TiBr2. In the etching of Ti by Br2, formation of TiBr2 proceeds predominantly through the dissociative chemisorption of Br2. In the case of etching with CCl3Br, TiBr2 is formed via chemisorption of Br atoms produced in the gas-phase photodissociation of CCl3Br.  相似文献   

18.
Two kinds of reactively evaporated titanium nitride films with columnar (B 0 films) and fine-grained film structure (B + films) have been examined as diffusion barriers, preventing the silicon diffusion in silicon devices. The silicon diffusion profiles have been investigated by 2 MeV 4He+ Rutherford backscattering spectrometry (RBS) after annealing at temperatures up to 900° C, in view of application of high-temperature processes. The diffusivity from 400 to 900° C: D (m2 s–1)=2.5×10–18 exp[–31 kJ/mol/(RT)] in B 0 layers and D (m2 s–1)=3×10–19 exp[–26 kJ/mol/(RT) in B + TiN layers. The diffusivities determined correspond to grain boundary diffusion, the difference being due to the different microstructure. The very low diffusivity of silicon in B + TiN layer makes it an excellent high-temperature barrier preventing silicon diffusion.  相似文献   

19.
Mössbauer spectra of LiNbO3: Fe(III)-monocrystals in external magnetic fields of 0.3–7T with various configurations of the -direction, c-axis of the crystal, and the magnetic field direction are interpreted by means of a spin Hamiltonian. A consistent set of hyperfine and crystal-field parameters could be least squares fitted for all spectra. Arguments that Fe(III) substitutes Nb(V) are given.Work partly performed in ICEx/UFMG, Depto. de Fisica, Belo Horizonte, Brasil  相似文献   

20.
Chemically assisted ion beam etching (CAIBE) involving an Ar ion beam and a halogen ambient gas (Cl2, IBr3) has been used to etch high-quality laser facets for InGaAsP/InP bulk lasers (1.55 m). We achieved eich rates of 40.0–75.0 nm min–1 at substrate temperatures between-5 and +10°C. These low temperatures have allowed us to utilize UV-baked photoresists as well as PMMA as etch masks, facilitating very simple process development. Higher substrate temperatures (50 to 120°C) yield still higher etch rates, but at the expense of severely degraded surface morphologies. Angle resolved x-ray photoelectron spectroscopy (XPS) was investigated for observing etched InP surfaces. A disproportioned surface has been detected after etching in the higher temperature range; low temperatures yield stoichiometric surfaces.  相似文献   

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