Three-dimensional stress relief displacement resulting from drilling a blind hole in acrylic

Analyses of optically based, hole-drilling stress measurements require accurate knowledge of the three-dimensional relaxation displacements induced by the drilling of a blind hole into the surface of a stressed object. These displacements are calculated using two closed-form solutions proposed earlier and a numerical finite element technique. Double exposure holographic fringe patterns calculated from the analytic displacements are in poor agreement with those observed in a controlled laboratory calibration experiment on a block of acrylic subject to a known uniaxial compressive stress. However, the fringe positions predicted by the finite element modeling match those obtained from the observed fringe pattern using image-processing procedures, although some drilling-related discrepancies remain near the stress-relieving hole. The stressstrain behavior of acrylic is extremely temperature sensitive; the discrepancies near the stress relief hole may result from drilling induced heat. Despite these near hole disagreements between the predicted and observed fringe patterns, the overall correspondence indicates that the finite element method adequately provides the desired three-dimensional relaxation displacements necessary for determination of stress magnitudes in some blind hole drilling measurements employing coherent optical recording.     

Inversion of speckle interferometer fringes for hole-drilling residual stress determinations

Speckle interferometric fringe patterns record stress-relief displacements induced by the drilling of blind-holes into prestressed objects. The quantitative determination of residual stress state from such stress patterns is difficult because of the ambiguity in the order of the observed fringes. The plane stress magnitudes are provided directly from selected fringe positions using a stochastic, iterative least squares minimization approach. The inversion requires prior knowledge of the experimental geometry and an appropriate uniaxial stress-relief displacement basis function derived from three-dimensional finite element calculations. Superpositioning of the rotated and scaled displacement basis functions allows the stress-relief relaxation for any biaxial state of stress to be determined. In this paper, fringe patterns were forward modeled from a large ensemble of calculated biaxial stress-relief displacement fields. Inversion of these noise-free fringe patterns reproduced the biaxial stresses with negligible error. Analysis of more realistic fringe patterns that include speckle noise gave stress magnitude errors that diminished rapidly with the number of selected points to better than 3 percent for 100 points. Sensitivity of the optical method is influenced by a number of factors, but the ensemble of model fringe patterns studied indicates that the stress magnitudes (nomalized with respect to the material's Young's modulus) from 3×10^–4 to 10^–2 can accurately be determined with visible laser radiation. The method is amenable to automation and can easily be extended to study near surface gradients in the residual stresses or applied to other optical recording techniques such as moiré and phase-shifting interferometry.     

Residual-stress determination through combined use of holographic interferometry and blind-hole drilling

Holographic interferometry is used to determine in-plane radial displacements due to release of residual stresses by hole drilling. A method is derived for relating radial displacements measured in three directions of illumination to the state of residual stress, analogous to relations used in the conventional strain-rosette technique. Residual stress is produced by an interference fit of two circular tubes. Agreement between stress determined holographically with a computed value and with that determined by the conventional technique is good. Advantages of the holographic technique in overcoming various shortcomings of the conventional technique are discussed. A modification of the holographic technique involving data collection in only two directions of illumination is described.     

Two holographic blind-hole methods for measuring residual stresses

The relationship between the displacements and stresses relieved from blind-hole drilling is introduced via an easily understandable concept in this paper. Combining this concept with holographic interferometry, two holographic blind-hole methods for measuring residual stresses are established. The first is a new technique which requires measuring three out-of plane displacements; and the second is a modification of another technique which requires measuring two out-of plane displacements. Each of the two methods needs only one interference fringe pattern and is demonstrated by using it to measure a known residual stress in an aluminum specimen.     

Residual Stress Determination Using Hole Drilling and 3D Image Correlation

In recent years, the hole drilling method for determining residual stresses has been implemented with optical methods such as holographic interferometry and ESPI to overcome certain limitations of the strain rosette version of hole drilling. Although offering advantages, the interferometric methods require vibration isolation, a significant drawback to their use outside of the laboratory. In this study, a 3D image correlation approach was used to measure micron-sized surface displacements caused by the localized stress relief associated with hole drilling. Residual stresses were then found from the displacements using non-dimensional relations previously derived by finite element analysis. A major advantage of image correlation is that it does not require interferometric vibration isolation. Experiments were performed to check the ability of this new approach for uniaxial and equi-biaxial states of stress. Stresses determined by the approach were in good agreement with computed values and those determined by hole drilling using holographic interferometry.     

On the stress-optic law for orthotropic-model materials in biaxial-stress fields

The stress-optic law for othotropic-model materials, proposed by Sampson on the basis of a simple analogy to the isotropic-model materials, is examined for biaxial-stress fields. The stress-optic law is reduced to a simple form for special cases. It is also shown that the zero-order isochromatic fringe corresponds to an isotropic state of stress only in the case of balanced laminates. A glass-fiber-reinforced plastic disk with the glass fibers in only one direction is examined under diametral compression photoelastically and by means of strain-gage rosettes, with the loading direction perpendicular and at 45 deg to the reinforcement direction. The fringe order along the horizontal diameter is computed from the simplified stress-optic law making use of stress values from strain-gage readings and compared with the observed fringe order. Based on a fairly good agreement of the fringe orders, it is shown that a circular-disk specimen can be used to calibrate an orthotropic-model material. The three independent material-fringe values,f _L ,f _T ,f _LT , can be found from measurements of the fringe order and the strains at the center of the disk for the three cases of loading perpendicular, parallel and at 45 deg to the reinforcement direction.     

Residual stress by blind-hole method with off-center hole

Application of the blind-hole drilling technique to measurement of residual stresses in areas too restricted for drilling guides is now possible by using a set of equations derived to account for off-center drilled holes. Prior technique required the hole to be drilled concentric with the gage center within ±0.001 in (0.0254 mm), thus requiring the use of a precision locating and drilling guide. The equations apply to commercially available 0-, 90- and 225-deg strain-gage rosettes, but can be easily modified or scaled for different arrays. Details of a hand-drilling procedure are presented, along with examples. Potential errors and data interpretation are discussed.     

Blind-hole residual stress determination using optical interferometry

The in-plane method and the out-of-plane method are used to analyze blind-hole residual stress as measured by optical interferometry. The in-plane method, which constructs a relation between the in-plane displacement field and the residual stress released from blind-hole drilling, is applicable when the sensitivity vector of the interferometer used in the measuring system is parallel to the object surface. Three in-plane displacements obtained from one interference pattern are sufficient to determine the residual stress. The out-of-plane method, which establishes a new relation between the out-of-plane displacement field and the released residual stress, is suggested when the sensitivity vector is perpendicular to the object surface. Two relative out-of-plane displacements extracted from one interference pattern are sufficient to determine the residual stress. With the adoption of these two methods, interpolating calculation is not needed to determine the fringe order of each data point, since the selections of the required data points are flexible using these two methods. Two experiments, one for the in-plane method and the other for the out-of-plane method, were carried out to illustrate the applicability and usefulness of these two methods.     

Displacement Determination by Holographic Interferometry for Residual Stress Analysis in Elastic Bodies

A method is developed for determining the three displacement components by the method of holographic interferometry from two interferograms used to measure residual stresses by hole drilling. The displacements are determined at the intersection points of the principal axes and the hole boundary. The method is experimentally validated by measuring the stress state of a plate under uniaxial tension __________ Translated from Prikladnaya Mekhanika, Vol. 41, No. 8, pp. 111–117, August 2005.     

Solution of the moiré hole drilling method using a finite-element-method-based approach

The moiré hole drilling method in a biaxially loaded infinite plate in plane stress is an inverse problem that exhibits a dual nature: the first problem results from first drilling the circular hole and then applying the biaxial loads, while the other problem arises from doing the opposite, i.e., first applying the biaxial load and then drilling the circular hole. The first problem is hardly ever addressed in the literature but implies that either separation of stresses or material property identification may be achieved from interpreting the moiré signature around the hole. The second is the well-known problem of determination of residual stresses from interpreting the moiré fringe orders around the hole. This paper addresses these inverse problem solutions using the finite element method as the means to model the plate with a hole, rather than the typical approach using the Kirsch solution, and a least-squares optimization approach to resolve for the quantities of interest. To test the viability of the proposed method three numerical simulations and one experimental result in a finite width plate are used to illustrate the techniques. The results are found to be in excellent agreement. The simulations employ noisy data to test the robustness of this approach. The finite-element-method-based inverse problem approach employed in this paper has the potential for use in applications where the specimen shape and boundary conditions do not conform to symmetric or well-used shapes. Also, it is a first step in testing similar procedures in three-dimensional samples to assess the residual stresses in materials.     

An investigation of the hole-drilling technique for measuring planar residual stress in rectangularly orthotropic materials

The applicability of the semidestructive holedrilling technique to the experimental determination of residual stresses in relatively thin rectangularly orthotropic materials was investigated. From the exploratory work, it was determined that the similitudes, for measurements at a particular ratio of hole depth to diameter, which exist for thick materials are not present in relatively thin materials. This implies that calibration tests must be made for each combination of strain-gage size and plate thickness. As a consolation, however, it was found that there is no need to drill to an optimum depth for thin materials. That is, one may simply drill a small hole completely through the material to obtain the desired strain change.     

Investigation of shrinkage-induced stresses in stereolithography photo-curable resins

An experimental study has been undertaken to investigate the shrinkage characteristics of acrylic-based and epoxy-based stereolithography (SL) photopolymer resin systems after they have been laser cured and post-cured under ultraviolet (UV), and thermal exposure. The induced residual stresses and strains were determined by the shadow moiré and the hole-drilling strain-gage methods. Out-of-plane displacements (warpage) of acrylic-based post-cured resin plates were recorded by means of the shadow moiré method and correlated to the shrinkage strains by theoretical analysis. The induced residual stresses in the epoxy-based cylindrical resin specimens were determined from strains of three-element strain-gage rosettes of the blind-hole drilling method. Results are presented for the shrinkage stresses and strains for both material systems as a function of the post-curing process (UV, thermal). It was found that the shrinkage strains in the acrylic-based photopolymer resin were of considerable magnitude, while thermal post-curing resulted in higher shrinkage stresses for both material systems. The values of the shrinkage stresses compare well with those of the existing literature.     

A multilayer-reflection technique for three-dimensional photoelastic studies of perforated plates in bending

A photoelastic investigation was conducted to determine the stress-concentration factors around a large, symmetrically reinforced central hole in a square plate under 1∶1 and 2∶1 biaxial bending. Tapered-edge rings served as the reinforcement, and a major objective was to determine the ring proportions such that the maximum stress at the hole would be equal to the value which would be present in an unperforated plate under the same nominal stress. Because the stress distribution at the periphery of a hole in such a plate structure varies in the radial, tangential and thickness direction, it was necessary to employ a three-dimensional photoelastic technique. There were a number of serious disadvantages in the use of any of the standard procedures and a new three-dimensional technique for room-temperature use was developed which is particularly suitable for the determination of boundary stresses around holes in bending experiments. With the technique in its present state of development, the three-dimensional isochromatic distribution in the plate can be determined from a single model and, from this, the boundary value of stress. The new technique utilized a laminated-plate model. Selective aluminizing of the laminations allowed for the determination of fringe-order distributions in the thickness direction as well as in the radial and circumferential directions at the boundary of the hole in flat models. Uniaxial maximum fringe orders were determined and, from these, the biaxial values were obtained by superposition.     

Photoelastic Stress Analysis by Use of Hybrid Technique and Fringe Phase Shifting Method

0Introduction Photoelasticityisanopticalmeasurementmethodforstressanalysis.Itcanperformwhole field measurementduetotwo dimensionalsignalprocessingoflight.Alsoitcanperformnon contact measurementbecauseoftransmissionorreflectionoflightonaspecimen.Photoelast…     

Evaluation of the High-Speed Drilling Technique for the Incremental Hole-Drilling Method

The incremental hole-drilling method is frequently used for residual stress depth distribution analyses, due to its fast and economical experimental execution. Depending on the planned use of the component, the drilled hole that is made to measure the residual stress can often be repaired or ignored if it does not affect the intended use of the part. Nevertheless an important experimental issue and assumption is the introduction of an ideal cylindrical hole into the component without additional plastic deformation. Although high-speed drilling is well established the consequences of the resulting hole geometries compared to ideal assumptions are not well known. Therefore, a detailed comparison between different bits and drilling techniques was carried out and is discussed in this paper in order to detect the best experimental conditions and to find out reasons especially for the lack of accuracy of the hole-drilling method for the first increments close to the specimens surface. It comes out that the orbital drilling with common used six-blade bits results in the best compromise of an ideal cylindrical hole and centricity to the center of the strain gage rosette. In the case of conventional drilling the hole geometry differs from the ideal one if six-blade bits were used due to the influence of chamfers at the cutting edges and a non 180° plane end face and also in the case of a two-blade bit due to a non 180° plane end face and the tendency to more eccentric holes. Diamond bits cannot be recommended under all tested conditions due to their geometrical undefined shape.     

Stress Concentration Factor in Functionally Graded Plates with Circular Holes Subjected to Anti-plane Shear Loading

Stress concentration factors due to the presence of geometrical discontinuities (circular holes) in functionally graded plates are derived. The material property inhomogeneity is assumed to be in the radial direction originating at the center of the plate. Variable separable closed-form solutions are obtained for the stresses and displacements in functionally graded plates (without and with holes) subjected to anti-plane shear loading. The stresses in functionally graded plates without a hole are not homogeneous as it is in the case of homogeneous plates. Either a stress concentration (more than the applied stress) or dilution (less than the applied stress) occurs depending on whether the modulus increases (hardening graded material) or decreases (softening graded material) away from the center of the graded plate without a hole. A novel definition of the stress concentration factor due to the geometrical discontinuity in functionally graded plates is derived. The effect of the circular hole in functionally graded plates is to magnify (compared to homogeneous plates) the stress concentration when the modulus decreases away from the center of the hole (softening material). Beneficial reduction of the stress concentration factor is achieved in hardening functionally graded materials.     

Determination of residual-stress variation with depth by the hole-drilling method

The hole-drilling method is a residual-stress measurement technique in which a blind hole (usually 1.6 mm or 3.2 mm in diameter) is drilled into a material and the strain perturbances around the hole are measured by surfacemounted strain gages. The conventional hole-drilling-method procedure is to analyze the net strain changes due to the drilling of the full-depth hole (usually about 100 percent of hole diameter) and to interpret the resulting stress calculations insofar as they represent the average stresses through the hole depth. It has been determined that this procedure may lead to significant errors, particularly where there are large stress variations through the hole depth. Such errors may be difficult to detect simply by observing the strain data. This paper describes a finite-element procedure which was used to develop calibration constants to allow measurements of residual-stress variation with depth to be routinely performed by the hole-drilling method.     

Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain Gauges

Experimental Mechanics - Commonly, polymer foil-based strain gauges are used for the incremental hole drilling method to obtain residual stress depth profiles. These polymer foil-based strain...     

Measurement of residual-stress distribution by the incremental hole-drilling method

The hole-drilling method is widely used to measure residual stresses in mechanical components. Recent developments have shown that strains measured on the surface during an incremental drilling can be related to residual-stress distribution. Researchers throughout the world have proposed different calibration methods which lead to more or less accurate results.The present paper discusses different approaches used. A new calibration method is proposed. We also show how finite-element analysis can be used to determine the correlation coefficients. The variation of the strains measured on the surface for each increment is due to, first, the residual stresses in the layer and, second, the change of the hole geometry. Most authors do not consider the latter aspect. Our results show that this causes a significant error in the experimental data. The finite-element method has been used to compute the coefficients for all types of strain-gage rosettes when the hole diameter is predetermined.Another problem of the hole-drilling method is the selection of the drilling tool. Two systems have been studied: ultra-high-speed air turbine and conventional milling machine. The method has been applied on both shot-peened and water-quenched test specimens. The results are successfully compared with the bending-deflection and the X-ray method.     

DETERMINATION OF CRACK SURFACE DISPLACEMENTS FOR A RADIAL CRACK EMANATING FROM A SEMI-CIRCULAR NOTCH USING WEIGHT FUNCTION METHOD

A radial crack emanating from a semi-circular notch is of significant engineering importance. Accurate determination of key fracture mechanics parameters is essential for damage tolerance design and fatigue crack growth life predictions. The purpose of this paper is to provide an efficient and accurate closed-form weight function approach to the calculation of crack surface displacements for a radial crack emanating from a semi-circular notch in a semi-infinite plate.Results are presented for two load conditions: remote applied stress and uniform stress segment applied to crack surfaces. Based on a correction of stress intensity factor ratio, highly accurate analytical equations of crack surface displacements under the two load conditions are developed by fitting the data obtained with the weight function method. It is demonstrated that the WuCarlsson closed-form weight functions are very efficient, accurate and easy-to-use for calculating crack surface displacements for arbitrary load conditions. The method will facilitate fatigue crack closure and other fracture mechanics analyses where accurate crack surface displacements are required.