高迁移率In0.6Ga0.4As沟道MOSHEMT与MOSFET器件特性的研究

从模拟和实验两个方面对高迁移率In_0.6Ga_0.4As沟道金属氧化物半导体高电子迁移率晶体管（MOSHEMT）和金属氧化物半导体场效应晶体管（MOSFET）器件开展研究工作.研宄发现InAlAs势垒层对Ino_0.6Ga_0.4AsMOSHEMT的特性具有重要影响.与Ino_0.6Ga_0.4As MOSFET相比,Ino_0.6Ga_0.4As MOSHEMT表现出优异的电学特性.实验结果表明,In_0.6Ga_0.4As MOSHEMT的有效沟道迁移率达到2812 cm²/V.s^-1,是In_0.6Ga_0.4As MOSFET的3.2倍.0.02 mm栅长的MOSHEMT器件较相同栅长的MOSFET器件具有更高的驱动电流、更大的跨导峰值、更大的开关比、更高的击穿电压和更小的亚阈值摆幅.     

一种新的磷化铟复合沟道高电子迁移率晶体管小信号物理模型

针对磷化铟(InP)复合沟道高电子迁移率晶体管(HEMT)的特点，对常规单沟道HEMT的小信号物理模型进行了修正，提出了一种新的用于复合沟道HEMT的小信号物理模型，用商用器件模拟软件ISE(integrated systems engineering)对其进行了仿真验证，对比了实测和仿真的I-V特性及转移特性曲线，重点研究了在InGaAs/InP双层沟道中考虑量子效应后的电场和电流密度随着不同栅电压的变化趋势，研究结果表明，由于在沟道中存在量子效应，在栅下靠源端低电场区域，电流主要分布在InGaAs沟道 关键词： 高电子迁移率晶体管 复合沟道 物理模型 磷化铟     

磷化铟高电子迁移率晶体管外延结构材料抗电子辐照加固设计

为研究磷化铟高电子迁移率晶体管(InP HEMT)外延结构材料的抗电子辐照加固设计的效果,本文采用气态源分子束外延法制备了系列InP HEMT外延结构材料.针对不同外延结构材料开展了1.5 MeV电子束辐照试验,在辐照注量为2×10¹⁵ cm^-2条件下,并测试了InP HEMT外延结构材料二维电子气辐照前后的电学特性,获得了辐照前后不同外延结构InP HEMT材料二维电子气归一化浓度和电子迁移率随外延参数的变化规律,分析了InP HEMT二维电子气辐射损伤与Si-δ掺杂浓度、InGaAs沟道厚度和沟道In组分以及隔离层厚度等结构参数的关系.结果表明:Si-δ掺杂浓度越大,隔离层厚度较薄,InGaAs沟道厚度较大,沟道In组分低的InP HEMT外延结构二维电子气辐射损伤相对较低,具有更强的抗电子辐照能力.经分析原因如下:1)电子束与材料晶格发生能量传递,破坏晶格完整性,且在沟道异质界面引入辐射诱导缺陷,增加复合中心密度,散射增强导致二维电子气迁移率和浓度降低;2)高浓度Si-δ掺杂和薄隔离层有利于提高量子阱二维电子气浓度,降低二维电子气受辐射...     

不同散射机理对 Al2O3/InxGa1-xAs nMOSFET 反型沟道电子迁移率的影响

通过考虑体散射、界面电荷的库仑散射以及 Al₂O₃/In_xGa_1-xAs 界面粗糙散射等主要散射机理, 建立了以 Al₂O₃为栅介质In_xGa_1-xAs n 沟金属-氧化物-半导体场效应晶体管 (nMOSFETs) 反型沟道电子迁移率模型, 模拟结果与实验数据有好的符合. 利用该模型分析表明, 在低至中等有效电场下, 电子迁移率主要受界面电荷库仑散射的影响; 而在强场下, 电子迁移率则取决于界面粗糙度散射. 降低界面态密度, 减小 Al₂O₃/In_xGa_1-xAs 界面粗糙度, 适当提高In含量并控制沟道掺杂在合适值是提高 InGaAs nMOSFETs 反型沟道电子迁移率的主要途径. 关键词： InGaAs MOSFET 反型沟道电子迁移率 散射机理     

应力导致InAs/In0.15Ga0.85As量子点结构中In0.15Ga0.85As阱层的合金分解效应研究

利用固源分子束外延技术，在In_0.15Ga_0.85As/GaAs量子阱生长了两个InAs/In_0.15Ga_0.85As量子点(DWELL)样品.通过改变其中一个InAs DWELL样品中的In_0.15Ga_0.85As阱层的厚度和生长温度，获得了量子点尺寸增大而且尺寸分布更均匀的结果.结合光致发光光谱(PL)和压电调制光谱(PzR)实验结果，发现该样品量子点的光学性质也同时得到 关键词： 合金分解效应 0.15Ga_0.85As量子点')" href="#">InAs/In_0.15Ga_0.85As量子点 光致发光光谱 压电调制光谱     

氮化物抛物量子阱中类氢杂质态能量

采用变分方法研究氮化物抛物量子阱(GaN/Al_xGa_1-xN)材料中类氢杂质态的能级,给出基态能量、第一激发态能量、结合能和跃迁能量等物理量随抛物量子阱宽度变化的函数关系.研究结果表明,基态能量、第一激发态能量、基态结合能和1s→2p±跃迁能量随着阱宽L的增大而减小,最后接近于GaN中3D值.GaN/Al_0.3Ga_0.7N抛物量子阱对杂质态的束缚程度比GaAs/Al_0.3Ga_0.7As抛物量子阱强,因此,在GaN/Al_0.3-Ga_0.7N抛物量子阱中束缚于杂质中心处的电子比在GaAs/Al_0.3Ga_0.7As抛物量子阱中束缚于杂质中心处的电子稳定.     

双δ掺杂In0.65Ga0.35As/In0.52Al0.48As赝型高迁移率晶体管材料子带电子特性研究

研究了基于InP基的In_0.65Ga_0.35As/In_0.52Al_0.48As赝型高迁移率晶体管材料中纵向磁电阻的Shubnikov-de Haas(SdH)振荡效应和霍耳效应，通过对纵向磁电阻SdH振荡的快速傅里叶变换分析，获得了各子带电子的浓度，并因此求得了各子带能级相对于费米能级的位置.联立求解Schrdinger方程和Poisson方程，自洽计算了样品的导带形状、载流子浓度分布以及各子带能级和费米能级位置.理论计算和实验结果很好符合.实验和理论计算均表明，势垒层的掺杂电子几乎全部转移到了量子阱中，转移率在95%以上. 关键词： SdH振荡 二维电子气 FFT分析 自洽计算     

In0.83Al0.17As倍增层对In0.83Ga0.17As/GaAs雪崩光电探测器的特性影响

倍增层对雪崩光电探测器内部载流子的碰撞电离至关重要,因此,采用三元化合物In_0.83Al_0.17As作为倍增层材料,借助器件仿真工具Silvaco-TCAD,详细探究了In_0.83Ga_0.17As/GaAs雪崩光电探测器的倍增层厚度及掺杂浓度对其内部电场强度、电流特性和电容特性的影响规律。研究表明,随着倍增层厚度的增加,器件的电场强度和电容呈减小趋势。同时,倍增层掺杂浓度的增大会引起电容和倍增层内的电场强度峰值增加。进一步研究发现,随着倍增层厚度的增加,器件的穿通电压线性增大,击穿电压先减小后增大,但倍增层掺杂浓度的增加会引起器件击穿电压的减小。此外,用电场分布和倍增因子的结合解释了器件穿通电压与击穿电压的变化。     

赝形InxGa1-xAs/In0.52Al0.48As异质结构中二维电子气的回旋共振光谱研究

采用回旋共振光谱方法，同时获得了具有较高电子气浓度的赝形In_0.80Ga_0.20As/In_0.53Ga_0.47As/In_0.52Al_0.48AsHEMT结构中最低两个子能带的费密面附近电子有效质量、 散射时间和迁移率.观察到该系统中能带非抛物性和波函数穿透所导致的电子回旋有效质量的显著增大效应，以及合金无序势和电离杂质散射所引起的电子散射时间和迁移率明显的子带依赖性. 关键词：     

AlxGa1-xAs(100)表面性质的研究

用紫外光电子能谱研究了Al_0.7Ga_0.3As的表面态结构,观察到Al_0.7Ga_0.3As在价带中的两个表面态结构。在1500L原子氢吸附后消失。研究了这两个表面态结构在热退火消除表面损伤过程中的变化。结合LEED和XPS的实验结果,确定在450℃左右的热退火可以有效地消除损伤,获得一个完整的Al_0.7Ga_0.3As(100)表面。 关键词：     

Study of single event effect for the InP-based HEMT with In0.53Ga0.47As/In0.3Ga0.7As/In0.7Ga0.3As composite channel

In this study, the single event effects in In_0.53Ga_0.47As/In_0.3Ga_0.7As/In_0.7Ga_0.3As composite channel InP-based HEMT are investigated using TCAD simulation for the first time. Due to the higher conduction band difference between bottom In_0.7Ga_0.3As channel and InAlAs buffer, the electrons in the buffer layer induced by ions strike cannot enter the channel, led to reduce the peak concentration in the composite channel and significantly weakened the drain current for composite channel device. Meanwhile, higher barrier height under the gate for composite channel InP-based HEMT is formed after particle strike, and further attenuate the drain current. Therefore, the single event effects can be effectively reduced by designing channel structure. In addition, drain voltage and incident position also show significant impact drain current. With the increase in the drain voltage, the drain current increase and the most sensitive incident position is the gate electrode for the device.     

Materials and device properties of pseudomorphic In x Ga1−x As/Al0.3Ga0.7As/GaAs high electron mobility transistors (0<x<0.5)

Modulation doped Al_0.3Ga_0.7As/In _x Ga_1–x As/GaAs high electron mobility transistor structures for device application have been grown using molecular beam epitaxy. Initially the critical layer thickness for InAs mole fractions up to 0.5 was investigated. For InAs mole fractions up to 0.35 good agreement with theoretical considerations was observed. For higher InAs mole fractions disagreement occurred due to a strong decrease of the critical layer thickness. The carrier concentration for Al_0.3Ga_0.7As/In _x Ga_1–x As/GaAs high electron mobility transistor structures with a constant In _x Ga_1–x As quantum well width was investigated as a function of InAs mole fraction. If the In _x Ga_1–x As quantum well width is grown at the critical layer thickness the maximum carrier concentration is obtained for an InAs mole fraction of 0.37. A considerable higher carrier concentration in comparison to single-sided -doped structures was obtained for the structures with -doping on both sides of the In _x Ga_1–x As quantum well. Al_0.3Ga_0.7As/In _x Ga_1–x As/GaAs high electron mobility transistor structures with InAs mole fractions in the range 0–0.35 were fabricated for device application. For the presented field effect transistors best device performance was obtained for InAs mole fractions in the range 0.25–0.3. For the field effect transistors with an InAs mole fraction of 0.25 and a gate length of 0.15 m a f _T of 115 GHz was measured.Dedicated to H.-J. Queisser on the occasion of his 60th birthday     

The effect of a HfO2 insulator on the improvement of breakdown voltage in field-plated GaN-based HEMT

A GaN/Al_0.3Ga_0.7N/AlN/GaN high-electron mobility transistor utilizing a field plate (with a 0.3 μm overhang towards the drain and a 0.2 μm overhang towards the source) over a 165-nm sputtered HfO₂ insulator (HfO₂-FP-HEMT) is fabricated on a sapphire substrate. Compared with the conventional field-plated HEMT, which has the same geometric structure but uses a 60-nm SiN insulator beneath the field plate (SiN-FP-HEMT), the HfO₂-FP-HEMT exhibits a significant improvement of the breakdown voltage (up to 181 V) as well as a record field-plate efficiency (up to 276 V/μm). This is because the HfO₂ insulator can further improve the modulation of the field plate on the electric field distribution in the device channel, which is proved by the numerical simulation results. Based on the simulation results, a novel approach named the proportional design is proposed to predict the optimal dielectric thickness beneath the field plate. It can simplify the field-plated HEMT design significantly.     

Confinement-enhanced dots-in-a-well QDIPs with operating temperature over 200 K

LWIR InAs/Al_0.3Ga_0.7As/In_0.15Ga_0.85As confinement-enhanced DWELL (CE-DWELL) QDIPs with operation temperatures higher than 200 K are reported. A thin Al_0.3Ga_0.7As barrier layer was inserted above the InAs QDs to improve the confinement of QD states in the In_0.15Ga_0.85As DWELL structure and the device performance. The better confinement of the electronic states increases the oscillator strength of the infrared absorption. The higher excited state energy also improves the escape probability of the photoelectrons. Compared with the conventional DWELL QDIPs, the quantum efficiency increases for more than 20 times and the detectivity is an order of magnitude higher at 77 K. With better device parameters of CE-DWELL, it is possible to achieve high quantum efficiency, high operating temperature and long wavelength detection at the same time.     

Photoresponse of the In0.3Ga0.7N metal-insulator-semiconductor photodetectors

In0.3Ga0.7N metal-insulator-semiconductor （MIS） and metal-semiconductor （MS） surface barrier photodetectors have been fabricated. The In0.3Ga0.7N epilayers were grown on sapphire by metalorganic chemical vapour deposition （MOCVD）. The photoresponse and reverse current-voltage characteristics of the In0.3Ga0.7N MIS and MS photodetectors were measured. A best zero bias responsivity of 0.18 A/W at 450 nm is obtained for the In0.3Ga0.7N MIS photodetector with 10 nm Si3N4 insulator layer, which is more than ten times higher than the In0.3Ga0.7N MS photodetector. The reason is attributed to the decrease of the interface states and increase of surface barrier height by the inserted insulator. The influence of the thickness of the Si3N4 insulator layer on the photoresponsivity of the MIS photodetector is also discussed.     

Influence of Ga(Al)As substrates on surface morphology and critical thickness of InGaAs quantum dots

Influence of Ga(Al)As substrates on surface morphology of InGaAs quantum dots and critical thickness of In_0.5Ga_0.5As film grown by molecular beam epitaxy is investigated. The In_0.5Ga_0.5As quantum dots are grown on (001) surfaces of GaAs and Al_0.25Ga_0.75 A at 450 °C, scanning tunneling microscope images show that the size of quantum dots varied slightly for 10 ML of In_0.5Ga_0.5As grown on GaAs and Al_0.25Ga_0.75As surfaces. Reflection high energy electron diffraction (RHEED) is used to monitor the growth of 4 monolayers (ML) In_0.5Ga_0.5As on Al_0.25Ga_0.75As and GaAs surfaces during deposition. The critical thickness is theoretically calculated by adding energy caused by surface roughness and heat from substrate. The calculations show that the critical thickness of In_0.5Ga_0.5As grown on GaAs and Al_0.25Ga_0.75As are 3.2 ML and 3.8 ML, respectively. The theoretical calculation agrees with the experimental results.     

InAs/AlAs quantum dots with InGaAs insertion layer: dependence of the indium composition and the thickness

We have systematically studied the effect of an In_xGa_1−xAs insertion layer (IL) on the optical and structural properties of InAs quantum dot (QD) structures. A high density of 9.6×10¹⁰ cm⁻² of InAs QDs with an In_0.3Ga_0.7As IL has been achieved on a GaAs (1 0 0) substrate by metal organic chemical vapor deposition. A photoluminescence line width of 25 meV from these QDs has been obtained. We attribute the high density and high uniformity of these QDs to the use of the IL. Our results show that the InGaAs IL is useful for obtaining high-quality InAs QD structures for devices with a 1.3 μm operation.     

InP-based InGaAs/InAlGaAs digital alloy quantum well laser structure at 2 μm

The structural and optical characteristics of InP-based compressively strained InGaAs quantum wells have been significantly improved by using gas source molecular beam epitaxy grown InAs/In 0.53 Ga 0.47 As digital alloy triangular well layers and tensile In 0.53 Ga 0.47 As/InAlGaAs digital alloy barrier layers.The x-ray diffraction and transmission electron microscope characterisations indicate that the digital alloy structures present favourable lattice quality.Photoluminescence (PL) and electroluminescence (EL) measurements show that the use of digital alloy barriers offers better optical characteristics than that of conventional random alloy barriers.A significantly improved PL signal of around 2.1 μm at 300 K and an EL signal of around 1.95 μm at 100 K have been obtained.     

Magnetooptical investigations of single self assembled In0.3Ga0.7As quantum dots

We present results from magnetooptical investigations of large elongated single self assembled In_0.3Ga_0.7As quantum dots with a low surface density of . Compared to conventional In_0.6Ga_0.4As quantum dots the dimension of the investigated dots is enlarged by nearly one order of magnitude using a low strain In_0.3Ga_0.7As nucleation layer. In addition, the exciton exhibits a smaller g-factor of 0–0.4 and a larger diamagnetic coefficient of 20– in Faraday geometry, reflecting the increased extension of the exciton wavefunction, with respect to In_0.6Ga_0.4As quantum dots. From power dependent investigations we observe biexciton binding energies ranging from 1.7 to 1.9 meV. Excited state emission appears typically 2–5 meV above the ground state which is consistent with the increased dimensions of the structure. Furthermore we find linear polarization degrees of up to 0.6 from exciton emission of the elongated quantum dot structure.     

Classical and quantum hall effect measurements in GaInNAs/GaAs quantum wells

We have performed magneto-transport experiments in modulation-doped Ga_0.7In_0.3N_yAs_1−y/GaAs quantum wells with nitrogen mole fractions 0.4%, 1.0% and 1.5%. Classical magnetotransport (resistivity and low-field Hall effect) measurements have been performed in the temperatures between 1.8 and 275 K, while quantum Hall effect measurements in the temperatures between 1.8 and 47 K and magnetic fields up to 11 T.The variations of Hall mobility and Hall carrier density with nitrogen mole fractions and temperature have been obtained from the classical magnetotransport measurements. The results are used to investigate the scattering mechanisms of electrons in the modulation-doped Ga_0.7In_0.3N_yAs_1−y/GaAs quantum wells. It is shown that the alloy disorder scattering is the major scattering mechanism at investigated temperatures.The quantum oscillations in Hall resistance have been used to determine the carrier density, effective mass, transport mobility, quantum mobility and Fermi energy of two-dimensional (2D) electrons in the modulation-doped Ga_0.7In_0.3N_yAs_1−y/GaAs quantum wells. The carrier density, in-plane effective mass and Fermi energy of the 2D electrons increases when the nitrogen mole fraction is increased from y=0.004 to 0.015. The results found for these parameters are in good agreement with those determined from the Shubnikov-de Haas effect in magnetoresistance.