Propane-1,2,3-triyl tris(hydrogen sulfate): A mild and effcient recyclable catalyst for the synthesis of biscoumarin derivatives in water and solvent-free conditions简

A simple, efficient, and ecofriendly procedure has been developed using propane-l,2,3-triyl tris（hydrogen sulfate） as a catalyst for the synthesis of biscoumarin derivatives in water and solvent-free conditions. The significant features of the present protocol are simplicity, environmentally benign, high yields, no chromatographic separation, and recyclability of the catalyst.     

Development of novel phosphorus‐containing epoxy resins from renewable resources

Novel biobased epoxy resins were prepared from two fatty acid derivatives; epoxidized 10‐undecenoyl triglyceride and epoxidized methyl 3,4,5‐tris(10‐undecenoyloxy)benzoate, with 4,4′‐diaminodiphenylmethane as a crosslinking agent. The flame retardancy of these epoxy resins was improved by the addition of 10‐[2′, 5′‐bis(9‐oxiranyl‐nonayloxy)phenyl]‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and by crosslinking with a phosphorus‐containing curing agent, bis(m‐aminophenyl)methylphosphine oxide. The thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured with differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, and the limiting oxygen index. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6717–6727, 2006     

Influence of the Curing Temperature in the Mechanical and Thermal Properties of Nanosilica Filled Epoxy Resin Coating

0.5–3 wt% nanosilica was added to an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) and cured at 25, 40 or 60 °C using isophoronediamine (IPDA) as hardener. Aggregates of nanosilica were properly dispersed into the DGEBA-IPDA resin and agglomerates formation was avoided. Addition of nanosilica increased the storage modulus E′ and the area and height of the tan δ curve of DGEBA-IPDA resin cured at 25 °C, but no significant differences were found by curing at higher temperature. Gel time measurements and the results obtained by applying the Kamal model to isotherm DSC curing of DGEBA-IPDA-nanosilica revealed that nanosilica catalysed the curing reaction between DGEBA and IPDA, in less extent by increasing the curing temperature.     

In situ real-time monitoring of a diglycidyl ether of bisphenol a epoxy resin modified with poly(etherimide)/polysulphone blends by simultaneous dielectric/near-infrared spectroscopy

Simultaneous dielectric and near infrared measurements were performed in “real-time” to follow polymerisation reactions on blends of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin with 4,4′-diaminodiphenylmethane (DDM) hardener and a mixture of polysulphone (PSU) and polyetherimide (PEI) as modifier. All the blends had a 10 wt% of PSU/PEI mixture. The effect of the PEI/PSU ratio in the mixture was studied. Monitoring of the α-relaxation (related to vitrification) was performed by dielectric measurements, while epoxy conversion was followed by near infrared spectroscopy. The effect of the PEI/PSU ratio on this behaviour was studied, as well as that of the curing temperature. Obtained results were compared with that of the blends with neat PSU and PEI as modifiers.     

Novel urethane/epoxy resin hybrid materials using a moisture‐curing system

Novel curing systems of a urethane/epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] alloy using the moisture‐latent hardener ketimine (K‐systems) were investigated on the DGEBA‐rich side and were compared with aromatic diamine curing systems (A‐systems). Almost all the added DGEBA was separated from the polyurethane matrix and dispersed as 2–10‐μm‐diameter particles after curing in the A‐systems. Therefore, DGEBA did not act as a reinforcing agent for the polyurethane matrix. However, 50% of the added DGEBA was dispersed as particles with a diameter of 1–4 μm, and the other 50% was incorporated into the polyurethane matrix in the novel K‐systems. Therefore, the polyurethane matrix in the K‐systems should be reinforced effectively by both incorporated and finely dispersed DGEBA and should result in significant improvements in the stress–strain properties. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1137–1144, 2004     

Evaluation of physico-chemical properties and antimicrobial synergic effect of ceftazidime-modified chitosan

The aim of this work was to study the effect of tris(3-nitrophenyl) phosphine (NPPh3), which showed a good thermal stability and carbon-forming ability, on the flame retardancy and thermal degradation mechanism of epoxy resins. A series of diglycidyl ether of bisphenol A (DGEBA) loaded with tris(3-nitrophenyl) phosphine (NPPh3) were prepared. It was found that NPPh3 can effectively improve the flame retardancy and thermal stability of the composites. When the loading amount of NPPh3 was 14%, the LOI value of the DGEBA composites was 29.2% (about 1.53 times the corresponding value of the original DGEBA resin). Thermal stability was studied by thermogravimetric analysis, and the results showed that the addition of NPPh3 can improve char formation of this system both in nitrogen and in air atmosphere. Specifically, its combustion residue at 800 °C in nitrogen atmosphere was about 4.26 times of the original resin. Differential scanning calorimetry indicated that NPPh3 slightly decreased the glass transition temperature of epoxy resins. Additionally, the gaseous degradation products were analyzed by thermogravimetric analysis/infrared spectrometry, providing insight into the thermal degradation mechanism. Scanning electron microscopy and Fourier transform infrared were brought together to evaluate the morphology and structure of the residual char obtained after combustion.     

Synthesis and characterization of liquid‐crystalline epoxy and its blend with conventional epoxy

Terephthaloyl chloride was reacted with 4‐hydroxy benzoic acid to get terephthaloylbis(4‐oxybenzoic) acid, which was characterized and further reacted with epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] to get a liquid‐crystalline epoxy resin (LCEP). This LCEP was characterized by Fourier transform infrared spectrometry, ¹H and ¹³C NMR spectroscopy, differential scanning calorimetry (DSC), and polarized optical microscopy (POM). LCEP was then blended in various compositions with DGEBA and cured with a room temperature curing hardener. The cured blends were characterized by DSC and dynamic mechanical analysis (DMA) for their thermal and viscoelastic properties. The cured blends exhibited higher storage moduli and lower glass‐transition temperatures (tan δ_max, from DMA) as compared with that of the pure DGEBA network. The formation of a smectic liquid‐crystalline phase was observed by POM during the curing of LCEP and DGEBA/LCEP blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3375–3383, 2003     

Adhesives and coatings based on phenolic/epoxy resins

Low molecular weight epoxy resin based on bis (4‐hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol–, cresol–, resorcinol–and salicylic acid–formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol–or cresol–formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol–or salicylic acid–formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints. Copyright © 1999 John Wiley & Sons, Ltd.     

Study of the reaction mechanism of the copper chelate with DGEBA using DSC

The reaction mechanism of metal-containing and complex compound with epoxy oligomer of diglycidyl ether of bisphenol A (DGEBA) was studied using dynamic DSC technique. It is shown that cure reaction of the epoxy oligomers with copper acetate proceeds at two stages: through coordination of cation with the epoxy group, and through ionic polymerization at high temperatures. Mechanism of curing of DGEBA with copper chelate depends on equilibrium process of dissociation of the chelate which, in turn, depends not only on temperature of curing but also on concentration of the hardener. At the dissociation temperature of the hardener, polymerization proceeds according to ionic mechanism. Hardening of the epoxy oligomers due to interaction of epoxy groups with unconnected amine groups predominate at higher temperatures or at higher concentrations of the hardener. At low temperatures and small concentrations of the hardener, polymerization proceeds according to catalytic ionic mechanism. This revised version was published online in July 2006 with corrections to the Cover Date.     

Epoxy resins and epoxy blends studied by near infra-red spectroscopy

The cure and the final network of epoxy resins have been investigated by numerous techniques, nevertheless a clear understanding of this network structure has not yet been achieved. FTIR analysis of polymeric materials provides highly precise measurements that are widely interpretable in terms of chemical structure. Yet the high absorption of fundamental bands requires careful sample preparation to reduce the thickness of the sample or special reflection techniques are needed. Furthermore, the occurrence of overlapping bands for epoxy resin (N-H and O-H vibrations in the 3000 cm⁻¹ region) renders the quantitative analysis in the region mid IR particularly difficult. However, the overtone and combination bands are 10–100 times weaker than the fundamental ones and are observed in near infrared (NIR) region. Longer pathlengths than Mid IR ones can be used allowing transmission analysis of thick samples (1-20 mm) without special preparation. NIR absorption bands have different intensities depending on the anharmonicity of vibrations. The strongest absorption bands are due to protons connected to carbon, nitrogen, oxygen. Hydrogen bonding due to inter- and intramolecular interactions can cause band broadening, peak position shifts and intensity variations. NIR spectroscopy is therefore a useful technique to investigate polymeric materials and was used to study the cure reactions of various epoxy resins cured with amine hardener. Using different NIR techniques (reflectance, transmission and microscopy) we will briefly present some results concerning hydrogen bonding between epoxy and amine hardener before curing, epoxy resins, glass/epoxy composites and epoxy/PES (polyethersulfone) blends.     

Thermal decomposition of fire retardant brominated epoxy resins cured with different nitrogen containing hardeners

Epoxy resins frequently have to meet a flame retardancy grade which can be accomplished by incorporating brominated reactive compounds, like tetrabromobisphenol A (TBBA) cured by a number of hardeners. A few brominated epoxy resins (BERs) have been prepared by curing a mixture of diglycidyl ethers of bisphenol A (DGEBA)/diglycidyl ethers of tertabromobisphenol A (DGETBBA) and different hardeners: dicyandiamide (DICY), 4,4′-diaminodiphenyl sulphone (DDS) and polyethylene polyamine (PEPA). The use of different hardeners strongly affects the thermal degradation behaviour of the BER.The main volatile products of pyrolysis, characterized by Pyrolysis-Gas Chromatography-Mass Spectroscopy (PY-GC-MS) at 423 °C were phenol, isopropyl- and isopropenylphenol, mono- and di-brominated phenols, bisphenol A, mono-, di-, tri- and tetra-brominated bisphenol A. No nitrogen containing volatile products or HBr were evolved whereas SO₂ is formed from BER cured with DDS (BER-DDS) and bromoethylene from BER cured with PEPA (BER-PEPA). Differences of 30-60 °C in thermal stability of epoxy network have been found, depending on the hardener. The experimental evidence suggests a cooperative action of bromine and nitrogen in chain scission of epoxy resins. In particular the ability of the hardener in fixing HBr, evolved from TBBA units, seems to depend on the basicity of the N atom of the hardener: the lower the basicity, the lower the scavenging effectiveness and consequently the higher the thermal stability.     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Biobased epoxy/carbon fiber composites: Effect on mechanical,thermo-mechanical and morphological properties

Biobased epoxy was synthesized from diglycidyl ether of bisphenol A (DGEBA) and epoxidized castor oil (ECO) at a ratio of 80:20. Carbon fiber (CF) was used as a reinforcing agent to fabricate composites using biobased epoxy as matrix. Mechanical, Thermal and morphological properties of neat epoxy and biobased epoxy composites were investigated. Mechanical test results revealed that the composites prepared using five plies were higher than those with three plies and one ply respectively. This phenomenon revealed the effective reinforcing effect of carbon fiber due to its higher strength and higher crosslinking density. The composites also demonstrate high damping behavior as compared with neat epoxy and biobased epoxy blend. With increasing number of plies the composites thermal properties also shows an improvement. The SEM micrographs of the composites depicted that the biobased epoxy was fully adhered to the carbon fiber, thus representing a strong interface between CF/epoxy matrix.     

Synthesis and thermal properties of epoxy resins from ester-carboxylic acid derivative of alcoholysis lignin

Alcoholysis lignin (AL) was dissolved in ethylene glycol and the obtained mixture was reacted with succinic anhydride to form a mixture of ester-carboxylic acid derivatives (AL-polyacid, ALPA). Ethylene glycol-polyacid (EGPA) was also prepared from ethylene glycol. The obtained mixture of ester carboxylic acid derivatives was treated with ethylene glycol diglycidyl ether in the presence of catalytic amount of dimethylbenzylamine to form ester-epoxy resins. The curing reaction was analyzed by Ozawa's method using differential scanning calorimetry. The activation energy of curing reaction in the initial step was found to be ca. 84 kJ mol⁻¹. The molar ratios of epoxy groups to carboxylic acid groups ([EPOXY]/[AA] ratios) were varied from 0.8 to 1.3. The contents of ALPA in the mixture of ALPA and EGPA were also varied from 0 to 100%. Thermal properties of epoxy resins were studied by DSC and thermogravimetry. Glass transition temperatures of epoxy resins showed a maximum value of −11.5 °C when [EPOXY]/[AA] ratio was 1.1. T_g increased with increasing ALPA contents suggesting that lignin acts as a hard segment in epoxy resin networks. Thermal degradation temperatures of epoxy resins slightly decreased with increasing ALPA contents.     

Organic/inorganic hybrid epoxy nanocomposites based on octa(aminophenyl)silsesquioxane

Octa(aminophenyl)silsesquioxane (OAPS) was used as the curing agent of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin. A study on comparison of DGEBA/OAPS with DGEBA/4,4′-diaminodiphenyl sulfone (DDS) epoxy resins was achieved. Differential scanning calorimetry was used to investigate the curing reaction and its kinetics, and the glass transition of DGEBA/OAPS. Thermogravimetric analysis was used to investigate thermal decomposition of the two kinds of epoxy resins. The reactions between amino groups and epoxy groups were investigated using Fourier transform infrared spectroscopy. Scanning electron microscopy was used to observe morphology of the two epoxy resins. The results indicated that OAPS had very good compatibility with DGEBA in molecular level, and could form a transparent DGEBA/OAPS resin. The curing reaction of the DGEBA/OAPS prepolymer could occur under low temperatures compared with DGEBA/DDS. The DGEBA/OAPS resin didn’t exhibit glass transition, but the DGEBA/DDS did, which meant that the large cage structure of OAPS limited the motion of chains between the cross-linking points. Measurements of the contact angle indicated that the DGEBA/OAPS showed larger angles with water than the DGEBA/DDS resin. Thermogravimetric analysis indicated that the incorporation of OAPS into epoxy system resulted in low mass loss rate and high char yield, but its initial decomposition temperature seemed to be lowered.     

Miscibility,morphology and fracture toughness of epoxy resin/poly(vinyl acetate) blends

Diglycidylether of bisphenol A (DGEBA)/poly(vinyl acetate) (PVAc) blends cured with 4,4-diaminodiphenylmethane (DDM) were prepared. The miscibility and phase behavior were investigated by means of differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and scanning electron microscopy (SEM). The study results indicate that the epoxy precursor (DGEBA)/PVAc blends are clearly miscible at the entire composition and theTg values experimentally obtained are in a good agreement with those predicted by Fox equation. Cured at elevated temperature, all the DDM-cured blends underwent phase separation and display two-phase morphology. When PVAc content is more than 10 wt%, the thermoplastics-modified resins began to show a co-continuous phase structure. It is the cocontinuous structure that leads to a significantly-improved toughness inK _ic. Morphologic investigation of the surfaces of fracture mechanic measurement specimens indicates that the toughening effect of the thermoplastics-modified epoxy resins may arise mainly from the ductile yielding of PVAc.     

Studies on the curing behaviour of bismaleimides and epoxy-resin blends

This paper describes the effect of diglycidyl ether of bisphenol A (DGEBA) on the curing behaviour of a chain-extended bismaleimide resin. 4,4'-Bismaleimidophenyl sulfone (BS) resin was treated with 4,4'-diaminodiphenyl ether or 4,4'-diaminodiphenyl methane to yield BS-M and BS-E resins which were then solution-blended with DGEBA containing stoichiometric amounts of amine as hardener. A decrease in the curing temperature of BS-M or BS-E was observed on blending with DGEBA. The thermal stability of the cured resin was reduced on blending.     

化学结构变化对刚棒状环氧树脂相行为和热力学性能的影响

用线性酚醛树脂(PN)和4-氨基苯基氨基砜(SAA)作为固化剂, 与刚性棒状环氧树脂联苯环氧(DGEBP)、四甲基联苯环氧(DGETMBP)和传统双酚A环氧树脂(DGEBA)分别进行固化. 研究了固化剂和环氧树脂化学结构的改变对热固网络相行为和热力学性能的影响. 结果表明, 刚性环氧网络比传统的DGEBA具有更好的热力学性能. DGEBP可形成不同类型的取向网络, 而取向态的类型也直接影响了热固网络的热力学性能. 用扫描电镜(SEM)观察不同网络体系的断裂面结构, 发现取向的刚性棒状环氧网络的断裂面呈韧性断裂, 而其它无定形环氧网络则呈典型的脆性断裂.     

Studies on heterocyclic polyurea–epoxy resin condensation products

Polyureas having different heterocyclic groups were reacted, respectively, with commercial epoxy resins, i.e., diglicidyle ether of bisphenol A and brominated DGEBA. The resultant polyurea–epoxy systems were designated as I_(a–f) and II_(a–f), respectively. All the polyurea–epoxy systems were characterized by FTIR spectral studies, thermogravimetric analysis and number average molecular weight, estimated by non-aqueous conductometric titration. The polyurea–epoxy systems were then mixed with appropriate amounts of DGEBA epoxy resin, monitored for differential scanning calorimetry, and, based on this, glass fiber-reinforced composites were prepared. All the resultant laminates were characterized by physical and mechanical properties.     

AFM approach toward understanding morphologies in toughened thermosetting matrices

Atomic force microscopy, AFM, has been used for determining the microstructure of thermosetting matrices toughened by incorporation of core-shell particles and high-performance thermoplastics. A variety of systems has been considered in this work: one group is based on diglycidyl ether of bisphenol-A (DGEBA) epoxy matrix, and the other group is based on bisphenol-A dicyanate (DCBA) matrix. The studied epoxy systems were: DGEBA cured with an aromatic hardener, diamino diphenyl sulfone (DDS), and modified with polymethylmethacrylate (PMMA), or cured with a cycloaliphatic hardener, diamino dimethyl cyclohexylmethane (3DCM), and modified with core-shell particles of polystyrene-co-butylacrylate (PS-co-Bu). The DCBA-based matrices have been modified with polysulfone of bisphenol-A (PSU) or with polyetherimide (PEI). The influence of the modifiers and the curing conditions on the generated morphologies is reported as analysed by AFM in contact and tapping modes.