Plasma-mediated ablation of biofilm contamination

Ultra-short pulsed laser removal of thin biofilm contamination on different substrates has been conducted via the use of plasma-mediated ablation. The biofilms were formed using sheep whole blood. The ablation was generated using a 1.2 ps ultra-short pulsed laser with wavelength centered at 1552 nm. The blood contamination was transformed into plasma and collected with a vacuum system. The single line ablation features have been measured. The ablation thresholds of blood contamination and bare substrates were determined. It is found that the ablation threshold of the blood contamination is lower than those of the beneath substrates including the glass slide, PDMS, and human dermal tissues. The ablation effects of different laser parameters (pulse overlap rate and pulse energy) were studied and ablation efficiency was measured. Proper ablation parameters were found to efficiently remove contamination with maximum efficiency and without damage to the substrate surface for the current laser system. Complete removal of blood contaminant from the glass substrate surface and freeze-dried dermis tissue surface was demonstrated by the USP laser ablation with repeated area scanning. No obvious thermal damage was found in the decontaminated glass and tissue samples.     

超短激光脉冲对宽带光学物质的微加工

通过讨论超快飞秒激光脉冲和长脉冲宽度的激光脉冲紧导致宽能隙透明电介质的损伤机理和比较超短激光脉冲与长激光脉冲对宽能隙透明电介质的损伤程度，得出超短激光脉冲是一种可对透明宽带电介质进行加工的有效工具的结论。当波长为800nm，脉冲宽度为150fs的激光脉冲紧聚焦到不同的宽能隙透明电介质（K9玻璃和ZK6玻璃）体内时，可制作不同光栅常数的光栅，并在波长为635nm的He-Ne连续激光的垂直照射下，对光栅的远场相对衍射效率和光栅的衍射效率进行了测量。     

A simple model for high fluence ultra-short pulsed laser metal ablation

The ultra-short laser metal ablation is a very complex process, the complete simulation of which requires applications of complicated hydrodynamics or molecular dynamics models, which, however, are often time-consuming and difficult to apply. For many practical applications, where the laser ablation depth is the main concern, a simplified model that is easy to apply but at the same time can also provide reasonably accurate predictions of ablation depth is very desirable. Such a model has been developed and presented in this paper, which has been found to be applicable for laser pulse duration up to 10 ps based on comparisons of model predictions with experimental measurements.     

Ultra-short laser ablation of dielectrics: Theoretical analysis of threshold damage fluence and ablation depth

A coupled theoretical model based on Fokker–Planck equation for ultra-short laser ablation of dielectrics is proposed. Multiphoton ionization and avalanche ionization are considered as the sources during the generation of free electrons. The impact of the electron distribution in thermodynamic nonequilibrium on relaxation time is taken into account. The calculation formula of ablation depth is deduced based on the law of energy conservation. Numerical calculations are performed for the femtosecond laser ablation of fused silica at 526 and 1053 nm. It shows that the threshold damage fluences and ablation depths resulted from the coupled model are in good agreement with the experimental results; while the damage thresholds resulted from the approximate model significantly differ from the experimental results for lasers of long pulse width. It is concluded that the coupled model can better describe the micro-process of ultra-short laser ablation of dielectrics.     

Femtosecond and nanosecond laser damage thresholds of doped and undoped triazenepolymer thin films

The influence of pulse duration on the laser-induced damage in undoped or infrared-absorbing-dye doped thin triazenepolymer films on glass substrates has been investigated for single, near-infrared (800 nm) Ti:sapphire laser pulses with durations ranging from 130 fs up to 540 fs and complementarily for infrared (1064 nm) Nd:YAG ns-laser single-pulse irradiation. The triazenepolymer material has been developed for high resolution ablation with irradiation at 308 nm. Post-irradiation optical microscopy observations have been used to determine quantitatively the threshold fluence for permanent laser damage. In contrast to our previous studies on a triazenepolymer with different composition [J. Bonse, S.M. Wiggins, J. Solis, T. Lippert, Appl. Surf. Sci. 247 (2005) 440], a significant dependence of the damage threshold on the pulse duration is found in the sub-picosecond regime with values ranging from ∼500 mJ/cm² (130 fs) up to ∼1500 mJ/cm² (540 fs). Other parameters such as the film thickness (50 nm and 1.1 μm samples) or the doping level show no significant influence on the material behavior upon irradiation. The results for fs- and ns-laser pulse irradiation are compared and analyzed in terms of existent ablation models.     

超短脉冲激光辐照金属薄膜温升效应的模拟研究

 考虑到材料的质量热容、热导率、驰豫时间等热力学参数随温度非线性变化因素的影响,利用具有人工粘性的、自适应时间步长的前向差分算法,数值求解了电子-晶格双温双曲两步热传导模型,讨论了厚度为50 nm的金膜在0.1 ps脉冲激光辐照下的温升规律。数值结果表明：薄膜前表面自由电子的温度在大约0.27 ps时达到最大值,不同厚度上自由电子达到温度平衡所需的时间大约为1.6 ps,而薄膜温度在整个厚度上达到平衡所需时间为60 ps左右。由电子温度及其温度梯度引起的热电子崩力很可能是造成材料破坏的一个主要因素。     

Picosecond pulsed laser ablation and micromachining of 4H-SiC wafers

Ultra-short pulsed laser ablation and micromachining of n-type, 4H-SiC wafer was performed using a 1552 nm wavelength, 2 ps pulse, 5 μJ pulse energy erbium-doped fiber laser with an objective of rapid etching of diaphragms for pressure sensors. Ablation rate, studied as a function of energy fluence, reached a maximum of 20 nm per pulse at 10 mJ/cm², which is much higher than that achievable by the femtosecond laser for the equivalent energy fluence. Ablation threshold was determined as 2 mJ/cm². Scanning electron microscope images supported the Coulomb explosion (CE) mechanism by revealing very fine particulates, smooth surfaces and absence of thermal effects including melt layer formation. It is hypothesized that defect-activated absorption and multiphoton absorption mechanisms gave rise to a charge density in the surface layers required for CE and enabled material expulsion in the form of nanoparticles. Trenches and holes micromachined by the picosecond laser exhibited clean and smooth edges and non-thermal ablation mode for pulse repetition rates less than 250 kHz. However carbonaceous material and recast layer were noted in the machined region when the pulse repetition rate was increased 500 kHz that could be attributed to the interaction between air plasma and micro/nanoparticles. A comparison with femtosecond pulsed lasers shows the promise that picosecond lasers are more efficient and cost effective tools for creating sensor diaphragms and via holes in 4H-SiC.     

飞秒激光精密微纳加工的研究进展

飞秒激光由于其超快时间特性和超高峰值功率特性在精密微纳加工领域引起了人们广泛的重视.在与物质的相互作用中它能快速、准确地将能量作用在特定的区域内,从而可以获得极高的分辨率和加工精度.文章综述了飞秒激光精密微纳加工的最新研究进展,分别就飞秒激光烧蚀微加工和飞秒激光双光子聚合产生三维微纳结构进行了介绍,阐述了各自的物理机制.最后对飞秒激光微纳加工的研究前景做了初步探讨.     

A simplified predictive model for high-fluence ultra-short pulsed laser ablation of semiconductors and dielectrics

Ultra-short pulsed laser ablation is a very complicated process and a predictive model is very desirable for process design and optimization in practical applications. However, the molecular dynamics or hydrodynamic models, although they are powerful and necessary tools for the study of the fundamental physics, are time-consuming and difficult to apply for practical applications. In this paper, a predictive, simplified and easy to apply model has been developed for high-fluence ultra-short laser ablation of semiconductors and dielectrics. Unlike many other simplified models, this model does not involve any free adjustable variables. The model predictions agree well with experimental measurements for femtosecond laser ablation, while the model is not very applicable for pulse durations more than ∼10 ps.     

Sub-micron ablation of metallic thin film by femtosecond pulse laser

The ability to machine very small features in a material has a wide range of applications in industry. We ablated holes into thin film of 100 nm thickness made from various metals by femtosecond pulsed laser ablation. Using a Ti:Sapphire laser which supplies a laser pulse of 150 fs duration at central spectrum wavelength of 400 nm, we have produced a series sub-micron holes, whose diameters are less than 200 nm with a focused laser spot of 1.7 μm. We found that the material damage threshold has a great influence on the quality of the produced features. Experimental results shows that the heat-affected zone and the degree of being affected reduce with the increase of threshold value.     

激光钝化对熔石英修复后损伤性能影响的实验研究

采用10.6 μupm 的 CO₂激光, 对单次激光脉冲辐照修复熔石英存在的烧蚀采用大光斑钝化去除. 经过辐照修复的区域置于前表面测试初始损伤阈值, 结果表明调制造成的损伤得到了一定程度的抑制; 辐照区域置于后表面修复后 熔石英的初始损伤阈值超过了基底的初始损伤阈值. 实验观察到了应力分布外扩, 同时明显减弱. 对损伤增长的测试说明, 经过激光熔融辐照后的损伤点, 当应力释放以后, 损伤扩展初期表现出指数增长趋势, 后期随着辐照次数的增加, 损伤增长不再明显, 并且趋于恒定值.     

全光纤多种子激光脉冲产生系统

报道一种可精确同步输出宽带啁啾脉冲、纳秒级整形脉冲以及窄带光参量啁啾放大抽运脉冲的全光纤多种子激光脉冲产生系统.采用掺镱光纤锁模激光器和掺镱单纵模光纤振荡器作为系统的光源,将掺镱光纤锁模激光器输出的超短脉冲分束啁啾展宽至0.9ns后,一路进行放大产生10μJ量级的宽带啁啾脉冲为高能拍瓦激光器系统提供种子光脉冲,另一路通过1.2nm滤波产生140ps的基元脉冲,通过光纤堆积器产生可编程整形的2.3ns脉冲,再经过放大达到10μJ量级,提供任意整形的压缩脉冲.同时,将部分掺镱光纤锁模激光器输出的超短脉冲进行光电转换并锁相后,产生与锁模超短脉冲高精度同步的电脉冲用于触发幅度调制器,将掺镱单纵模光纤振荡器输出的连续光削波放大,产生光参量啁啾放大抽运脉冲.该系统能够根据物理实验的需要,非常灵活地在输出各种脉冲之间做出选择.     

532nm皮秒脉冲激光对单晶硅的损伤特性研究

随着光电对抗和超短脉冲激光技术的发展,研究超短脉冲激光与单晶硅相互作用具有非常重要的理论和实际意义.为了进一步明确532 nm皮秒脉冲激光对单晶硅的损伤机理,本文开展了532 nm皮秒脉冲激光辐照单晶硅的损伤效应实验研究,测定了损伤阈值,明确了损伤机理,探讨了低通量下的脉冲累积效应.首先,利用波长为532 nm、脉冲宽...     

KrF laser ablation of a polyethersulfone film: Effect of pulse duration on structure formation

Polyethersulfone (PES) films were processed with KrF laser irradiation of different pulse durations (τ). Scanning electron microscopy (SEM) and Raman spectroscopy were employed for the examination of the morphology and chemical composition of the irradiated surfaces, respectively. During ablation with 500 fs and 5 ps pulses, localized deformations (beads), micro-ripple and conical structures were observed on the surface depending on the irradiation fluence (F) and the number of pulses (N). In addition, the number density of the structures is affected by the irradiation parameters (τ, F, N). Furthermore, at longer pulse durations (τ = 30 ns), conical structures appear at lower laser fluence values, which are converted into columnar structures upon irradiation at higher fluences. The Raman spectra collected from the top of the structures following irradiation at different pulse durations revealed graphitization of the ns laser treated areas, in contrast to those processed with ultra-short laser pulses.     

Laser fluence, repetition rate and pulse duration effects on paint ablation

The efficiency (mm³/(J pulse)) of laser ablation of paint was investigated with nanosecond pulsed Nd:YAG lasers (λ = 532 nm) as a function of the following laser beam parameters: pulse repetition rate (1-10,000 Hz), laser fluence (0.1-5 J/cm²) and pulse duration (5 ns and 100 ns). In our study, the best ablation efficiency (η ≅ 0.3 mm³/J) was obtained with the highest repetition rate (10 kHz) at the fluence F = 1.5 J/cm². This ablation efficiency can be associated with heat accumulation at high repetition rate, which leads to the ablation threshold decrease. Despite the low thermal diffusivity and the low optical absorption of the paint (thermal confinement regime), the ablation threshold fluence was found to depend on the pulse duration. At high laser fluence, the ablation efficiency was lower for 5 ns pulse duration than for the one of 100 ns. This difference in efficiency is probably due to a high absorption of the laser beam by the ejected matter or the plasma at high laser intensity. Accumulation of particles at high repetition rate laser ablation and surface shielding was studied by high speed imaging.     

Morphology of ablation craters generated by ultra-short laser pulses in dentin surfaces: AFM and ESEM evaluation

In this study, the surface morphology and structure of dentin after ablation by ultra-short pulses were evaluated using environmental scanning electron microscopy (ESEM) and atomic force microscopy (AFM). The dentin specimens examined were irradiated by a chirped-pulse-amplification (CPA) Ti:sapphire laser (800 nm) and the optimal conditions for producing various nanostructures were determined. Based on the ESEM results, it was possible to identify an energy density range as the ablation threshold for dentin. The laser-induced damage was characterized over the fluence range 1.3-2.1 J/cm². The results demonstrate that by selecting suitable parameters one can obtain efficient dentin surface preparation without evidence of thermal damage, i.e., with minimized heat affected zones and reduced collateral damage, the latter being normally characterized by formation of microcracks, grain growth and recrystallization in the heat affected zones.     

超短脉冲激光照射下氧化铝的烧蚀机理

利用烧蚀面积与激光脉冲能量的线性关系，确定了氧化铝的破坏阈值，同时采用散射光探测法，研究了800和400nm超短脉冲激光作用下氧化铝的破坏阈值对激光脉宽的依赖关系，并探讨了氧化铝的烧蚀规律. 利用雪崩击穿模型，解释了实验结果，并讨论了导带电子光吸收机理. 关键词： 飞秒激光 氧化铝 破坏阈值 雪崩模型     

Non-Thermal Laser Ablation Model for Micro-Surgical Applications

We have developed a non-thermal laser ablation model which may reduce thermal damage to neighboring structures. Based on this model, the three critical parameters for a well controlled non-thermal microsurgery are (1) the laser wavelength with its photon energy matching closely the bond dissociation energy, (2) the energy fluence must be above threshold to avoid thermal process due to non-radiative relaxation from the excited electronic states to vibrational, (3) ultra short laser pulses (few fs) to completely eliminate thermal and direct biomolecular reactions. In this model the UV laser photon dissociates the molecular bonds which leads to the splitting of longer polymer chains into small fragments. The excess energy if any may appear as kinetic energy in the polymer-fragments. The extreme rapidity of the bond breaking process reduces heat conduction. The model establishes a relationship between ablation depth per pulse, the absorption coefficient, the incident laser energy fluence, and the threshold energy fluence. The ablation depths per pulse were calculated for the polymers Polymethyl methacrylate (PMMA) and polyimide for various commercially available UV lasers. It has been found that the minimum ablations depth occurs at 193 nm for both PMMA and polyimide. This assures a well defined incision with minimal thermal damage to the surrounding structures at this wavelength. There exists a definite threshold energy fluence for non-thermal ablation for any given biomolecule and below the threshold the non-radiative relaxation process may cause thermal ablation. New ultra fast lasers (few femtoseconds) (fs) will completely eliminate thermal diffusion as well as direct biomolecular reactions.     

Surface modifications of AISI 1045 steel created by high intensity 1064 and 532 nm picosecond Nd:YAG laser pulses

Interaction of Nd:YAG laser, operating at 1064 or 532 nm wavelength and a pulse duration of 40 ps, with AISI 1045 steel was studied. Surface damage thresholds were estimated to be 0.30 and 0.16 J/cm² at the wavelengths of 1064 and 532 nm, respectively. The steel surface modification was studied at the laser energy density of 10.3 J/cm² (at 1064 nm) and 5.4 J/cm² (at 532 nm). The energy absorbed from Nd:YAG laser beam is partially converted to thermal energy, which generates a series of effects, such as melting, vaporization of the molten material, shock waves, etc. The following AISI 1045 steel surface morphological changes and processes were observed: (i) both laser wavelengths cause damage of the steel in the central zone of irradiated area; (ii) appearance of a hydrodynamic feature in the form of resolidified droplets of the material in the surrounding outer zone with 1064 nm laser wavelength; (iii) appearance of periodic surface structures, at micro- and nano-level, with the 532 nm wavelength and, (iv) development of plasma in front of the target. Generally, interaction of laser beam with the AISI 1045 steel (at 1064 and 532 nm) results in a near-instantaneous creation of damage, meaning that large steel surfaces can be processed in short time.     

甘油的黏度对激光等离子体推进的影响

以液体甘油为烧蚀靶材,研究了不同环境温度下超短脉冲激光烧蚀后产生的等离子体的推进特性.实验结果表明:甘油产生的动量和烧蚀压力与环境温度密切相关,其原因是甘油的黏度受温度影响较大.