Structural,electrical and optical properties of in-situ phosphorous-doped Ge layers

We have studied the impact of temperature and pressure on the structural and electronic properties of Ge:P layers grown with GeH₄+PH₃ on thick Ge buffers, themselves on Si(0 0 1). The maximum phosphorous atomic concentration [P] exponentially decreased as the growth temperature increased, irrespective of pressure (20 Torr, 100 Torr or 250 Torr). The highest values were however achieved at 100 Torr (3.6×10²⁰ cm^?3 at 400 °C, 2.5×10¹⁹ cm^?3 at 600 °C and 10¹⁹ cm^?3 at 750 °C). P atomic depth profiles, “box-like” at 400 °C, became trapezoidal at 600 °C and 750 °C, most likely because of surface segregation. The increase at 100 Torr of [P] with the PH₃ mass-flow, almost linear at 400 °C, saturated quite rapidly at much lower values at 600 °C and 750 °C. Adding PH₃ had however almost no impact on the Ge growth rate (be it at 400 °C or 750 °C). A growth temperature of 400 °C yielded Ge:P layers tensily-strained on the Ge buffers underneath, with a very high concentration of substitutional P atoms (5.4×10²⁰ cm^?3). Such layers were however rough and of rather low crystalline quality in X-ray Diffraction. Ge:P layers grown at 600 °C and 750 °C had the same lattice parameter and smooth surface morphology as the Ge:B buffers underneath, most likely because of lower P atomic concentrations (2.5×10¹⁹ cm^?3 and 10¹⁹ cm^?3, respectively). Four point probe measurements showed that almost all P atoms were electrically active at 600 °C and 750 °C (1/4th at 400 °C). Finally, room temperature photoluminescence measurements confirmed that high temperature Ge:P layers were of high optical quality, with a direct bandgap peak either slightly less intense (750 °C) or more intense (600 °C) than similar thickness intrinsic Ge layers. In contrast, highly phosphorous-doped Ge layers grown at 400 °C were of poor optical quality, in line with structural and electrical results.     

Crystallization of polymer-derived SiC/BN/C composites investigated by TEM

The crystallization behavior of two polymer-derived Si/B/C/N ceramics with similar compositions lying close to the three-phase field BN + SiC + C was investigated by (high-resolution) transmission electron microscopy. The materials were high-temperature mass stable up to T = 2000 °C. During thermolysis at 1050 °C a homogeneous amorphous solid formed. SiC crystallization started at about 1400 °C. Further annealing to higher temperatures up to 2000 °C led to formation of microstructures composed of SiC crystals embedded into a structured BNC_x matrix phase. With increasing temperature, both the size of the crystallites and the ordering of the matrix phase increased.     

Reaction mechanism of silicon Cat-CVD

Reaction kinetics for the silicon catalytic chemical vapor deposition (Cat-CVD) has been investigated. SiH₃ and Si₂H₂ are expected to be important precursors in the Si film growth. However, the reactivity of Si₂H₂ to the film surface was not well understood. Quantum chemical calculations have been performed for the adsorption of Si₂H₂ and H₂SiSiH₂ on the Si(1 0 0)-2 × 1 surface with and without the hydrogen termination. It was found that there was no activation barrier for the Si₂H₂ adsorption on the bare Si(1 0 0) surface. The chemical kinetic model for the Si Cat-CVD process was modified according to these quantum chemical calculations. Results of kinetic simulations were compared to the experimental results. It is suggested that there is a correlation between the film quality and the concentration of Si₂H₂.     

Growth kinetics and boron doping of very high Ge content SiGe for source/drain engineering

We have studied the in-situ boron doping of high Ge content Si_1?xGe_x layers (x=0.3, 0.4 and 0.5). These layers have been grown at low pressure (20 Torr) and low temperature (600–650 °C) with a heavily chlorinated chemistry on blanket Si(0 0 1) substrates. Such a chemistry yields a full selectivity versus SiO₂ (isolation) and Si₃N₄ (sidewall spacers) on patterned wafers with gate stacks. We have quantified the impact of the diborane flow on the SiGe layer crystalline quality, its resistivity, the SiGe:B growth rate and the apparent Ge concentration. Resistivity values lower than 1 mΩ cm are easily achieved, all the more so for high Ge content layers. The SiGe growth rate increases and the apparent Ge concentration (from X-ray diffraction) decreases as the diborane flow increases. B atoms (much smaller than Si or Ge) indeed partially compensate the compressive strain in the SiGe:B layers. We have also probed the in-situ boron and phosphorus doping of Si at 750 °C, 20 Torr with a heavily chlorinated chemistry. The B ions concentration increases linearly with the diborane flow, then saturates at a value close to 4×10¹⁹ cm^?3. By contrast, the P ions concentration increases sub-linearly with the phosphine flow, with a maximum value close to 9×10¹⁸ cm^?3. Adding diborane (phosphine) to the gaseous mixture leads to a sharp increase (decrease) of the Si:B (the Si:P) growth rates, which has to be taken into account in device layers. All the know-how acquired will be most handy for the formation of in-situ doped recessed or raised sources and drains in metal-oxide semiconductor devices.     

Pyrolytic conversion studies of blended polycarbosilane and polyaluminasilazane

Multinuclear solid-state NMR spectroscopy, FTIR and Raman experiments are employed to investigate the pyrolytic conversion of blended polycarbosilane and polyaluminasilazane (denoted CA) up to 800 °C, with the aim of studying structural evolutions and interactions between polycarbosilane and polyaluminasilazane during the pyrolysis process. Vinyl and SiCH₃ units can react with Si–H, SiCH₃ and Si–CH₂–Si groups below 400 °C. These crosslinking reactions can increase the ceramic yield of the blended precursors. At 500 °C aromatic carbon is formed, and N–H and Si–H groups vanish at 600 °C and 700 °C, respectively. At 600 °C, SiCH₃ and Si–H units can further react with SiCN₃, SiC₂N₂, N–H and C–H units. An amount of amorphous carbon and CSi₄ and CSi₃H groups are detectable at 800 °C. Even at this temperature there are still many aromatic protons. In addition, there are also SiC₄, SiC₃N, SiCN₃ and SiN₄ units. Silicon forms SiN₄ more readily than SiC₄. Many AlN₅ groups transform into AlN₆ groups. The D and G bands of graphite are observed in CA pyrolyzed at 1400 °C. According to the XRD patterns, the reflection of crystalline β-Si₃N₄ vanishes at 1700 °C, and the residue pyrolyzed at 1800 °C mainly contains a large number of 2H-SiC/AlN solid solution crystals and a few β-SiC crystals.     

Nanostructural and optical features of amorphous AlxSi0.45−xO0.55 (0 ⩽ x ⩽ 0.05) thin films prepared by RF-magnetron sputter techniques

The nanostructural, chemical, and optical features of Al_xSi_0.45−xO_0.55 (0 ⩽ x ⩽ 0.05) thin films were investigated in terms of Al concentration and post-deposition annealing conditions; the films were prepared by co-sputtering a Si main target and Al-chips, and the annealing was carried out at temperatures of 400–1100 °C. The a-Si_0.45O_0.55 films prepared without Al-chips and annealed at 800 °C contain ∼3.5 nm-sized Si nanocrystallites. The photoluminescence (PL) intensity as well as the volume fraction of Si nanocrystallites increased with increasing the concentration of Al to a certain level. In particular, the intensity of the PL spectra of the Al_0.025Si_0.425O_0.550 films which were annealed at 800 °C increased significantly at wavelengths of ∼580 nm. It is highly likely that the observed increase in the PL intensity is caused by the raise in the total volume of the ∼3.5 nm-sized nanocrystallites in the films. The addition of Al as well as the post-deposition annealing allow adjustment and control of the nanostructural and light-emission features of the a-SiO_x films.     

Phase evolution on heat treatment of sodium silicate water glass

Heat treatment of sodium silicate water glass of the nominal composition Na₂O/SiO₂ = 1:3 was carried out from 100 °C up to 800 °C and the advancement of the resulting phases was followed up by powder X-ray diffraction, scanning electron microscopy and thermogravimetry along with differential thermal analysis. The water glass, initially being an amorphous solid, starts to form crystals of β-Na₂Si₂O₅ at about 400 °C and crystallizes the SiO₂ modification cristobalite at about 600 °C that coexists along with β-Na₂Si₂O₅ up to 700 °C. At 750 °C Na₆Si₈O₁₉ appears as a separate phase and beyond 800 °C, the system turns into a liquid.     

Atomic diffusion of boron and other constituents in amorphous Si–B–C–N

The self-diffusion of boron is studied between 1550 and 1700 °C in polymer-derived amorphous solids of composition Si₃BC_4.3N₂. Ion implanted stable ¹⁰B isotopes are used as tracers and secondary ion mass spectrometry for depth profiling. The experimentally determined diffusivities obey an Arrhenius behavior with a high activation enthalpy of ΔH = (7.3 ± 1.3) eV and a high pre-exponential factor of D₀ = 1.6 m²/s. The results are discussed in relation to the diffusivities of the other constituents (Si, C, N) and possible diffusion mechanism are suggested.     

Structure and photoelectrical properties of SiO2/Si/SiO2 single quantum wells prepared under ultrahigh vacuum conditions

SiO₂/Si/SiO₂ single quantum wells (QWs) were prepared under ultrahigh vacuum conditions in order to study their structural, chemical and photoelectrical properties with respect to a possible application in photovoltaic devices. Amorphous silicon (a-Si) layers (thickness <10 nm) were deposited onto quartz glass (SiO₂) substrates and subsequently oxidized with neutral atomic oxygen at moderate temperatures of 600 °C. Under these conditions, the formation of suboxides is mostly suppressed and abrupt Si/SiO₂ interfaces are obtained. Crystallization of a-Si QWs requires temperatures as high as 1000 °C resulting in a nanocrystalline structure with a small amorphous fraction. The spectral dependence of the internal quantum efficiency of photoconductivity correlates well with the nanocrystalline structure and yields mobility lifetime products of <10^?7 cm² V^?1. This rather low value points towards a strong influence of Si/SiO₂ interface states on the carrier mobility and the carrier lifetime in Si QWs. Electronic passivation of interface states by subsequent hydrogen treatment in forming gas enhances the internal quantum efficiency by nearly one order of magnitude.     

Ex situ XRD,TEM, IR,Raman and NMR spectroscopy of crystallization of lithium disilicate glass at high pressure

The structure of Li₂O · 2SiO₂ (LS₂) glass was investigated as a function of pressure and temperature up to 6 GPa and 750 °C, respectively, using XRD, TEM, IR, Raman and NMR spectroscopy. Glass densified at 6 GPa has an average Si–O–Si bond angle ∼7° lower than that found in glass processed at 4.5 GPa. At 4.5 GPa, lithium disilicate crystallizes from the glass, while at 6 GPa new high pressure form of lithium metasilicate crystallizes. This new phase, while having lithium metasilicate crystal symmetry, contains at least four different Si sites. NMR results for 6 GPa indicate the presence of Q⁴ species with (Q⁴)Si–O–Si(Q⁴) bond angles of ∼157°. This is the first reported occurrence of Q⁴ species with such large bond angles in alumina free alkali silicate glass. No five- or six-coordinated Si are found.     

Effect of OH-content on thermal and chemical properties of SnOP2O5 glasses

Glasses with 55–60 mol% SnO and 40–45 mol% P₂O₅ have shown extremely large differences in the chemical and thermal properties depending on the temperature at which they were melted. Glasses prepared at low melting temperature, 450–550 °C, had low T_g, 150–200 °C, and low chemical stability. Glasses prepared at high melting temperature, 800–1200 °C, had much higher T_g, 250–300 °C, and much higher chemical stability. No significant differences were found by ¹¹⁹Sn Mössbauer and ³¹P Nuclear Magnetic Resonance spectroscopy. Large differences in the OH-content could be detected as the reason by infrared absorption spectroscopy, thermal analyses, and ¹H Nuclear Magnetic Resonance spectroscopy. In samples with low T_g, a broad OH – vibration band around 3000 nm with an absorption intensity >20 cm^?1, bands at 2140 nm with intensity ～5 cm^?1, at 2038 nm with intensity ～2.7 cm^?1, and at 1564 nm with intensity ～0.4 cm^?1 were measured. These samples have shown a mass loss of 3–4 wt% by thermal gravimetric analyses under argon in the temperature range 400–1000 °C. No mass loss and only one broad OH-band with a maximum at 3150 nm and low absorption intensity <4 cm^?1 could be detected in samples melted at high temperature, 1000–1200 °C, which have much higher T_g, ～300 °C, and much higher chemical stability.     

MOCVD and characterization of Hf-silicate thin films using HTB and TEMAS

Hafnium silicate (HfSi_xO_y) films were deposited by metal-organic chemical vapor deposition (MOCVD) using a combination of precursors: hafnium tetra-tert-butoxide [Hf(OC(CH₃)₃)₄, HTB] and tetrakis-ethylmethylamino silane [Si(N(C₂H₅)(CH₃))₄, TEMAS]. The activation energy was independent on the ratio of precursor amounts in the surface reaction regime. The grown films showed Hf-rich characteristics and the impurity concentrations were less than 1 at.% (below detection limits). Hafnium silicate films were amorphous up to 700 °C annealing. Hf/(Hf + Si) composition ratio and dielectric constant (k) of the Hf-silicate films decreased by increasing the growth temperature above 270 °C.     

Plastic deformation behavior of amorphous Fe78Si9B13 alloy at elevated temperature

The plastic deformation behavior of amorphous Fe₇₈Si₉B₁₃ alloy was investigated under uniaxial tension and gas pressure bulging. The deformed specimens were studied by means of XRD and SEM. It is shown that amorphous Fe₇₈Si₉B₁₃ ribbon has good deformation ability in the temperature range from 450 °C to 500 °C. The elongation of 36.3% and the relative bulging height (RBH) of 0.45 were obtained at 500 °C. In the uniaxial tension test, the amount of the crystalline α-Fe phase increases with deformation temperature below the crystallization temperature, which also suggests that the tensile stress promotes the crystallization of amorphous Fe₇₈Si₉B₁₃ ribbon. The suitable gas pressure bulging conditions for the specimens are 500 °C, 3.4 MPa and 30 min.     

Network structure of multi-component sodium borosilicate glasses by neutron diffraction

Neutron diffraction structure study has been performed on multi-component sodium borosilicate based waste glasses with the composition of (65 − x)SiO_2. · xB₂O₃ · 25Na₂O · 5BaO · 5ZrO₂, x = 5–15 mol%. The maximum momentum transfer of the experimental structure factor was 30 Å⁻¹, which made available to determine the distribution function with high r-space resolution. Reverse Monte Carlo modelling was applied to calculate several partial atomic pair correlation functions, nearest neighbor distances and coordination numbers have been revealed. The characteristic features of Si–O and Si–Si distributions are similar for all glassy samples, suggesting that the Si–O network consisting of tetrahedral SiO₄ units is highly stable even in the multi-component glasses. The B–O correlations proved to be fairly complex, two distinct first neighbor distances are present at 1.40 Å and 1.60 Å, the latter equals the Si–O distance. Coordination number distribution analyzes has revealed 3 and four-coordinated boron atoms. The O–O distribution suggests a network configuration consisting of boron rich and silicon rich regions. Our findings are consistent with a structure model where the boron rich network contains mostly trigonal BO₃ units, and the silicon rich network is formed by a mixed continuous network of ^[4]Si–O–Si^[4] with several different ^[4]B–O–Si^[4] and ^[3]B–O–Si^[4] linkages.     

Characterizations of pulsed laser deposited SiC thin films

Thin films of silicon carbide (SiC) were prepared using pulsed laser deposition (PLD) on Si(1 0 0) substrates at a temperature of 370 °C. Various structural characterizations showed the development of short-range SiC precipitates in the films. These films were annealed isochronally at temperatures of 800 °C, 1000 °C and 1200 °C for 2 h under an inert environment. Thermally induced crystalline ordering of SiC into β-SiC phase was investigated by X-ray diffraction (XRD), Raman spectroscopy and Fourier transforms infrared (FTIR) spectroscopic measurements. In addition to the crystallization of SiC films, high temperature annealing resulted in the dissolution of carbon clusters found in the as-grown films.     

About diffusion mechanism in silica liquid under pressure

We perform a molecular dynamic simulation to study the diffusion mechanism in silica liquid under pressure up to 25 GPa and at temperature of 3000 K. We find that total O―Si―O angle distribution can be expressed by a simple relation between partial O―Si―O angle distribution and fractions of units SiO_x. Specifically, we demonstrate that these liquids consist of identical units SiO₄, SiO₅ and SiO₆ and have common partial O―Si―O angle distribution. We also show that each particle undergoes a series of stages where the particle locates in unchanged unit SiO_x, x = 3, 4, … 7 or OSi_y, y = 1, 2, 3, 4. The diffusivity strongly depends on the rate of transitions Si^ξ → Si^ξ ± 1 and O^ζ → O^ζ ± 1 which is significantly different between low- and high-pressure samples. For low-pressure sample the transitions Si⁴ → Si⁵, Si⁵ → Si⁴, O² → O³ and O³ → O² are dominant, meanwhile for high-pressure sample there are transitions Si^ξ → Si^ξ ± 1 with ξ = 4, 5, 6 and O^ζ → O^ζ ± 1 with ζ = 2, 3, 4. This finding may be common for diffusion in all network-forming liquids. The simulation also reveals the spatially heterogeneous dynamics in low-pressure liquid where a large cluster of immobile particle exists for the time that a number of particles move over several inter-particle distances.     

Dilithium dialuminium trisilicate phase obtained using coal bottom ash

The Li₂Al₂Si₃O₁₀ glass-ceramics well crystallized and with a regular morphology was produced starting from a mixture of Li₂CO₃, TiO₂, Al₂O₃ and coal bottom ash, after reducing the magnetite phase content. Its measured thermal expansion coefficient in the temperatures range from 25 °C to 300 °C is α_(25–300) = −23.4 × 10⁻⁷ °C⁻¹. This value is ≈18% smaller than that for the commercial lithium glass-ceramics (−23.4 × 10⁻⁷ °C⁻¹ to 50 × 10⁻⁷ °C⁻¹).     

Effect of illumination on hydrogenated amorphous silicon thin films doped with chalcogens

Hydrogenated amorphous silicon thin films doped with chalcogens (Se or S) were prepared by the decomposition of silane (SiH₄) and H₂Se/H₂S gas mixtures in an RF plasma glow discharge on 7059 corning glass at a substrate temperature 230 °C. The illumination measurements were performed on these samples as a function of doping concentration, temperature and optical density. The activation energy varied with doping concentration and is higher in Se-doped than S-doped a-Si:H thin films due to a low defect density. From intensity versus photoconductivity data, it is observed that the addition of Se and S changes the recombination mechanism from monomolecular at low doping concentration films to bimolecular at higher doping levels. The photosensitivity (σ_ph/σ_d) of a-Si, Se:H thin films decreases as the gas ratio H₂Se/SiH₄ increased from 10^?4 to 10^?1, while the photosensitivity of a-Si, S:H thin films increases as the gas ratio H₂S/SiH₄ increased from 6.8 × 10^?7 to 1.0×10^?4.     

Properties of sodium-based ternary phosphate glasses produced from readily available phosphate salts

Three series of phosphate glasses were produced by melting together sodium phosphate salt (NaH₂PO₄) and the phosphate salts of either calcium (CaHPO₄), magnesium (MgHPO₄ · 3H₂O) or iron (FePO₄ · 2H₂O) in a 5% gold/95% platinum crucible at 1200 °C. The glass compositions were confirmed by EDX and XRD analysis. Glass transition temperature (T_g), density and durability in water were determined for all the compositions. Maximum metal oxide contents before devitrification were between 55% and 59% for CaO + Na₂O and 59% and 62% for MgO + Na₂O. The normalized equivalent for Fe₂O₃ + Na₂O was between 55% and 61%. Density values for the glasses lay between 2.49 and 2.75 g cm⁻³. T_gs lay between 295 °C and 470 °C. Degradation rates in deionized water at 37 °C lay between 0.03 g cm⁻² h⁻¹ for Na phosphate glasses and 9 × 10⁻⁶ g cm⁻² h⁻¹ for Ca phosphate glasses, 3 × 10⁻⁶ g cm⁻² h⁻¹ for Mg phosphate glasses and <3 × 10⁻⁶ g cm⁻² h⁻¹ for Fe phosphate glasses. The effect of metal addition on properties goes as Fe > Mg > Ca for degradation rates and T_g and Fe > Mg ≈ Ca for density. The change in properties with metal addition was seen to be linear for Fe and Ca additions but not with Mg addition. This is in agreement with the anomalous behavior of magnesium phosphate glasses.     

Nanocrystalline silicon TFT process using silane diluted in argon–hydrogen mixtures

We have investigated the effect of Ar dilution on the deposition process of intrinsic nc-Si:H (hydrogenated nanocrystalline silicon) thin films used as active layers of top-gate TFTs, in order to improve the TFTs performances. The nc-Si:H films were deposited by plasma enhanced chemical vapor deposition (PECVD) at low temperature (165 °C) and the related TFTs were fabricated with a maximum process temperature of 200 °C. During the nc-Si:H films deposition, the SiH₄ fraction and the total flow of the diluting gases Ar + H₂ mixture was kept constant, H₂ being substituted by Ar. We have pointed out the active role played by the metastable states of excited Ar atoms in both the dissociation of SiH₄ and H₂ by quenching reactions in the plasma. The role of the atomic hydrogen during the film deposition seems to be promoted by the addition of argon into the discharge, leading to an increase of the deposition rate by a factor of about three and an enhancement of the crystalline quality of the nc-Si:H films. This effect is maximized when the Ar fraction in the Ar + H₂ gases mixture reaches 50%. The evolution with Ar addition of the carriers mobility of the related TFTs is closely connected to the evolution of the crystalline fraction of the intrinsic nc-Si:H film. Mobilities values as high as 8 cm² V^?1 s^?1 are obtained at the Ar fraction of 50%. For higher Ar fractions, the fall of the mobility comes with a degradation of the I_D–V_G transfer characteristics of the processed TFTs due to a degradation of the nc-Si:H films quality. OES measurements show that the evolution of the H_α intensity is closely connected to the evolution of the deposition rate, intrinsic films crystalline fraction and TFTs mobility, providing an interesting tool to monitor the TFTs performances.