Selection of post-growth treatment parameters for atomic layer deposition of structurally disordered TiO2 thin films

Routes to atomic layer-deposited TiO₂ films with decreased leakage have been studied by using electrical characterization techniques. The combination of post-deposition annealing parameters, time and temperature, which provides measurable aluminum–titanium oxide–silicon structures – i.e., having capacitance–voltage curves which show accumulation behavior – are 625 °C, 10 min for p-type substrates, and 550 °C, 10 min for n-type substrates. The best annealing conditions for p-type substrates are 625 °C with the length extended to 30 min, which produces an interfacial state density of about 5–6 × 10¹¹ cm^?2 eV^?1, and disordered-induced gap state density below our experimental limits. We have also proved that a post-deposition annealing must be applied to TiO₂/HfO₂ and HfO₂/TiO₂/HfO₂ stacked structures to obtain adequate measurability conditions.     

Heat treatment of amorphous silicon p-i-n solar cells with high-pressure H2O vapor

We report improvement in characteristics of hydrogenated amorphous silicon (a-Si:H ) p-i-n structured solar cells by high-pressure H₂O vapor heat treatment. a-Si:H p-i-n solar cells were formed on glass substrates coated with textured SnO₂ layer. P-, i-, and n-type a-Si:H layers were subsequently formed by plasma enhanced chemical vapor deposition. Finally an indium-tin-oxide layer was coated on the n-type a-Si:H surface. Heat treatment at 210 °C with 2 × 10⁵ Pa H₂O vapor for 1 h was applied to the a-Si:H p-i-n solar cells. Electrical characteristics were measured when samples were kept in dark and illuminated with light of AM 1.5 at 100 mW/cm². The heat treatment with H₂O vapor increased fill factor (FF) and the conversion efficiency from 0.54 and 7.7% (initial) to 0.57 and 8.4%, respectively. Marked improvement in solar cell characteristics was also observed in the case of a poor a-Si:H p-i-n solar cell. FF and the conversion efficiency were increased from 0.29 and 3.2% (initial) to 0.56 and 7.7%, respectively.     

Cross-sectional TEM study on Ni-mediated crystallization of amorphous silicon

Structural characteristics of polycrystalline silicon (poly-Si) made by Ni-mediated crystallization of amorphous silicon (a-Si) were investigated by cross-sectional transmission electron transmission (XTEM) according to various a-Si thickness. The Ni area density of ∼10¹⁴ cm⁻² was deposited onto a-Si and it was annealed at 500 °C in the presence of an electric field of 10 V/cm. It is found that NiSi₂ precipitates form at the top and bottom interfaces of a-Si during annealing. After reaching its critical size the crystallization proceeds from the top and bottom interfaces. The growth of needle-like Si crystallites has been seen, showing a migration of NiSi₂ precipitates through the a-Si network. 1700 nm thick a-Si can be crystallized within 30 min which is longer than that (10 min) of 50 nm thick a-Si. However, the quality of 50 nm thick poly-Si is better than that of 300 nm or 1700 nm thick poly-Si.     

Comparison of growth methods for Si/SiO2 nanostructures as nanodot hetero-emitters for photovoltaic applications

Two different growth mechanisms are compared for the fabrication of Si/SiO₂ nanostructures on crystalline silicon (c-Si) to be used as hetero-emitter in high-efficiency solar cells: (1) The decomposition of substoichiometric amorphous SiO_x (a-SiO_x) films with 0 < x < 1.3 and (2) the dewetting of thin amorphous silicon (a-Si) layers.The grown layers are investigated with regard to their structural properties, their passivation quality for c-Si wafer substrates and their electrical properties in order to evaluate their suitability as a nanodot hetero-emitter. While by layer decomposition, no passivating nanodots could be formed, the dewetting process allows fabricating nanodot passivation layers at temperatures as low as 600 °C. The series resistance through Ag/[Si-nanodots in SiO₂]/c-Si/Al structures for dewetting is similar to nanostructured silicon rich SiO_x films. Still, a nanodot hetero-emitter which exhibits both a satisfying passivation of the substrate and induces a high band bending by doping at the same time could not be fabricated yet.     

Characterization of chromium silicide thin layer formed on amorphous silicon films

A detailed investigation of the compositional, optical and electrical properties of a chromium silicide layer grown at room temperature on top of doped amorphous silicon films is presented. The formation of the layer is promoted only when phosphorous atoms are present in the film. The deposition of a very thin n-type doped layer (around 5 nm) on top of a p-type doped film has allowed us to achieve the chromium silicide formation also on p-type material without changing its doping properties. Angle resolved X-ray photoelectron spectroscopy measurements demonstrate the presence of chromium-oxide, chromium silicide and metallic chromium in similar percentages for both p- and n-type doped layers. From the ellipsometric analysis, the refractive index spectra have been extracted, and the layer thickness has been estimated to be 5 nm for both p- and n-type doped layers. From planar conductivity measurements, we have found that the chromium silicide promotes an activation energy reduction from 0.24 eV down to 0.017 eV for the n-type layer and from 0.36 eV down to 0.14 eV for the p-type film.     

Structure and photoelectrical properties of SiO2/Si/SiO2 single quantum wells prepared under ultrahigh vacuum conditions

SiO₂/Si/SiO₂ single quantum wells (QWs) were prepared under ultrahigh vacuum conditions in order to study their structural, chemical and photoelectrical properties with respect to a possible application in photovoltaic devices. Amorphous silicon (a-Si) layers (thickness <10 nm) were deposited onto quartz glass (SiO₂) substrates and subsequently oxidized with neutral atomic oxygen at moderate temperatures of 600 °C. Under these conditions, the formation of suboxides is mostly suppressed and abrupt Si/SiO₂ interfaces are obtained. Crystallization of a-Si QWs requires temperatures as high as 1000 °C resulting in a nanocrystalline structure with a small amorphous fraction. The spectral dependence of the internal quantum efficiency of photoconductivity correlates well with the nanocrystalline structure and yields mobility lifetime products of <10^?7 cm² V^?1. This rather low value points towards a strong influence of Si/SiO₂ interface states on the carrier mobility and the carrier lifetime in Si QWs. Electronic passivation of interface states by subsequent hydrogen treatment in forming gas enhances the internal quantum efficiency by nearly one order of magnitude.     

Deposition of phosphorus doped a-Si:H and μc-Si:H using a novel linear RF source

A roll-to-roll PECVD system for thin film silicon solar cells on steel foil has been developed by ECN in collaboration with Roth and Rau AG. It combines MW–PECVD for fast deposition of intrinsic Si and novel linear RF sources, which apply very mild deposition conditions, for the growth of doped Si layers. The RF and MW sources can be easily scaled up to deposition widths of up to 150 cm. Here, we report on n-type doping, achieved by RF–PECVD from a H₂/SiH₄/PH₃ mixture in the reaction chamber. The best n-type a-Si:H layers showed E_act = 0.27 eV and σ_d = 2.7 × 10^?3 S/cm. Also thin layers down to 20 nm were of device quality and were deposited at a rate of 0.4 Å/s. Furthermore, n-type μc-Si:H layers with thicknesses of 150 nm, with E_act = 0.034 eV and σ_d = 2 S/cm were grown. Good quality n-type μc-Si:H layers can be made for layer thicknesses down to 50 nm at a rate of 0.15 Å/s. To conclude, the novel RF source is well-suited for the growth of n-doped a-Si:H and μc-Si:H layers for roll-to-roll solar cell production.     

Electronic states in a-Si:H/c-Si heterostructures

We have investigated PECVD-deposited ultrathin intrinsic a-Si:H layers on c-Si substrates using UV-excited photoemission spectroscopy (hν = 4–8 eV) and surface photovoltage measurements. For samples deposited at 230 °C, the Urbach energy is minimal, the Fermi level closest to midgap and the interface recombination velocity has a minimum. The a-Si:H/c-Si interface density of states is comparable to that of thermally oxidized silicon interfaces. However, the measured a-Si:H dangling bond densities are generally higher than in thick films and not correlated with the Urbach energy. This is ascribed to additional disorder induced by the proximity of the a-Si:H/c-Si interface and H-rich growth in the film/substrate interface region.     

Voids in hydrogenated amorphous silicon materials

Effusion measurements of hydrogen and of implanted helium are used to characterize the presence of voids in hydrogenated amorphous silicon (a-Si:H) materials as a function of substrate temperature, hydrogen content, etc. For undoped plasma-grown a-Si:H, interconnected voids are found to prevail at hydrogen concentrations exceeding 15–20 at.%, while isolated voids which act as helium traps appear at hydrogen concentrations ≤ 15 at.%. The concentration of such isolated voids is estimated to some 10¹⁸/cm³ for device-grade undoped a-Si:H deposited at a substrate temperature near 200 °C. Higher values are found for, e.g., doped material, hot wire grown a-Si:H and hydrogen-implanted crystalline Si. The results do not support recent suggestions of predominant incorporation of hydrogen in a-Si:H in (crystalline silicon type) divacancies, since such models predict a concentration of voids (which act as helium traps) in the range of 10²¹/cm³ and a correlation between void and hydrogen concentrations which is not observed.     

Amorphous silicon diamond based heterojunctions with high rectification ratio

We have fabricated and characterized diamond based heterojunctions composed of homoepitaxial diamond (B-doped film: p type) and hydrogenated amorphous silicon (a-Si:H film: n-type). All devices include an intrinsic amorphous silicon interface (i-a-Si:H). (J–V) characteristics of a-Si:H heterojunctions measured from 300 K to 460 K present a very high rectification ratio (in the range 10⁸–10⁹) and a current density of 10 mA/cm² under 2 V of forward bias. The reverse current up to ? 4 V is below the detection limit in the whole temperature range. The devices present two regimes of operation indicating that more than one mechanism governs the carrier transport. These characteristics are compared with a Schottky barrier diode (SBD) using a tungsten carbide metal on top of the p-type diamond as a Schottky contact. The SBD device exhibits J–V characteristic with an ideality factor n close to one and the heterojunction follows this trend for low bias voltages whereas for bias voltage above 1 V a second regime with larger ideality factors n ~ 3.6 is observed. These results point out the prominent role of transport mechanisms at heterointerface between the a-Si:H layers and the p-type doped diamond which degrades the current injection. The breakdown voltage reached ? 160 V indicating the good quality of the deposited layers.     

Fabrication and characterization of nanorod solar cells with an ultrathin a-Si:H absorber layer

In this paper, we present a three-dimensional nanorod solar cell design. As the backbone of the nanorod device, density-controlled zinc oxide (ZnO) nanorods were synthesized by a simple aqueous solution growth technique at 80 °C on ZnO thin film pre-coated glass substrate. The as-prepared ZnO nanorods were coated by an amorphous hydrogenated silicon (a-Si:H) light absorber layer to form a nanorod solar cell. The light management, current–voltage characteristics and corresponding external quantum efficiency of the solar cells were investigated. An energy conversion efficiency of 3.9% was achieved for the nanorod solar cells with an a-Si:H absorber layer thickness of 75 nm, which is significantly higher than the 2.6% and the 3.0% obtained for cells with the same a-Si:H absorber layer thickness on planar ZnO and on textured SnO₂:F counterparts, respectively. A short-circuit current density of 11.6 mA/cm² and correspondingly, a broad external quantum efficiency profile were achieved for the nanorod device. An absorbed light fraction higher than 80% in the wavelength range of 375–675 nm was also demonstrated for the nanorod solar cells, including a peak value of ~ 90% at 520–530 nm.     

Properties of n-type hydrogenated nanocrystalline cubic silicon carbide films deposited by VHF-PECVD at a low substrate temperature

n-Type hydrogenated nanocrystalline cubic silicon carbide (nc-3C–SiC:H) films have been deposited by very high-frequency plasma-enhanced chemical vapor deposition at a low substrate temperature of about 360 °C to apply this material to the window layer of heterojunction crystalline silicon (HJ-c-Si) solar cells. We investigated the effect of in situ doping on deposition rate, crystalline volume fraction and dark conductivity to optimize properties of the material. We also fabricated HJ-c-Si solar cells with a n-type nc-3C–SiC:H window layer. The solar cells shows high internal quantum efficiency of 0.90 at a wavelength of 400 nm, indicating that n-type nc-3C–SiC:H deposited by VHF-PECVD is a promising candidate of the window layer of HJ-c-Si solar cells.     

Variation of the defect density in a-Si:H and μc-Si:H based solar cells with 2 MeV electron bombardment

Improvement of the performance of solar cells based on amorphous (a-Si:H) and microcrystalline (μc-Si:H) silicon requires understanding of the role of the deep defects – dangling bonds – in the bulk of the intrinsic a-Si:H or μc-Si:H absorber layers. A straightforward way to understand how these defects may affect the performance of the cells is to investigate changes in the device performance upon variation in the defect density.In the present work solar cells with a-Si:H and μc-Si:H absorber layers were exposed to 2 MeV electron bombardment. The performance of the cells after various bombardment doses and annealing steps was evaluated in view of the changes in the defect density of intrinsic layers, measured with ESR on nominally identical absorber layers irradiated in parallel with the cells.The defect density was varied over a range of 2 orders of magnitude. In the solar cells a strong degradation of performance is observed upon irradiation with the biggest effect on the short circuit current density J_SC for both types of absorber layers. In most cases both V_OC and J_SC recover after the final annealing step (at 160 °C) for both types of cells.     

Superior structural and electronic properties for amorphous silicon–germanium alloys deposited by a low temperature hot wire chemical vapor deposition process

Very good electronic properties of hot-wire CVD a-Si,Ge:H alloys have been established by junction capacitance methods. The samples were deposited using a tantalum filament maintained at about 1800 °C instead of the usual 2000 °C tungsten filament process. Urbach energies below 45 meV were found, as well as annealed defect densities below 10¹⁶ cm⁻³, for Ge fractions up to 30 at.%. However, samples with 10¹⁹ cm⁻³ levels of oxygen exhibited much broader Urbach energies and higher defect densities. Light induced degradation was examined in detail for one a-Si,Ge:H alloy sample and compared to the behavior of PECVD grown a-Si:H alloys of similar optical gap.     

Ambipolar a-SiGe:H thin-film transistors fabricated at 200 °C

In this paper, we study the ambipolar behavior of a-SiGe:H thin-film transistors fabricated at 200 °C. A subthreshold slope and an on/off current ratio of 0.34 V/DEC and 10⁵, respectively, were measured for the n-type region, whereas values of 0.15 V/DEC and 10⁴ for were measured for the p-type region. We also obtained the characteristic energies for the deep localized states of the a-SiGe:H film, the flat-band voltages, and threshold voltages among other device parameters for the ambipolar thin-film transistors.     

Impurities in thin-film silicon: Influence on material properties and solar cell performance

The influence of oxygen and nitrogen impurities on the material properties of a-Si:H and μc-Si:H films and on the corresponding solar cell performances was studied. For intentional contamination of the i-layer the impurities were inserted by two contamination sources: (i) directly into the plasma through a leak at the chamber wall or (ii) into the gas supply line. The critical oxygen and nitrogen concentrations for silicon solar cells were determined as the lowest concentration of these impurities in the i-layer causing a deterioration of the cell performance. Similar critical concentrations for a-Si:H and μc-Si:H cells in the range of 4–6 × 10¹⁸ cm^? 3 for nitrogen and 1–5 × 10¹⁹ cm^? 3 for oxygen by applying a chamber leak are observed. Similar increase of conductivity with increasing impurity concentration in the a-Si:H and μc-Si:H films is found. A more detailed study shows that the critical oxygen concentration depends on the contamination source and the deposition parameters. For a-Si:H cells, the application of the gas pipe leak leads to an increased critical oxygen concentration to 2 × 10²⁰ cm^? 3. Such an effect was not observed for nitrogen. For μc-Si:H, a new deposition regime with reduced discharge power was found where the application of the gas pipe leak can also result in an increase of the oxygen concentration to 1 × 10²⁰ cm^? 3.     

Correlation between the method of preparation and the properties of the sol–gel HfO2 thin films

This work describes the preparation of HfO₂ thin films by the sol–gel method, starting with different precursors such as hafnium ethoxide, hafnium 2,4-pentadionate and hafnium chloride. From the solution prepared as mentioned above, thin films on silicon wafer substrates have been realized by ‘dip-coating’ with a pulling out speed of 5 cm min^?1. The films densification was achieved by thermal treatment for 10 min at 100 °C and 30 min at 450 °C or 600 °C, with a heating rate of 1 °C min^?1. The structural and optical properties of the films are determined employing spectroellipsometric (SE) measurements in the visible range (0.4–0.7 μm), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The main objective of this paper was to establish a correlation between the method of preparation (precursor, annealing temperature) and the properties of the obtained films. The samples prepared from pentadionate and ethoxide precursors are homogenous and uniform in thickness. The samples prepared starting from chloride precursor are thicker and proved to be less uniform in thickness. Higher non-uniformity develops in multi-deposition films or in crystallized films. A nano-porosity is present in the quasi-amorphous films as well in the crystallized one. For the samples deposited on silicon wafer, the thermal treatment induced the formation of a SiO₂ layer at the coating–substrate interface.     

Enhanced luminescence from Si quantum dots/SiO2 multilayers by hydrogen annealing

Si quantum dots/SiO₂ multilayers were prepared by annealing a-Si:H/SiO₂ stacked structures at 1100 °C . Photo- and electro-luminescence band around 750 nm can be observed from Si QDs/SiO₂ multilayers due to the recombination of electron-hole pairs in Si QDs/SiO₂ interfaces. The electro-luminescence intensity was obviously enhanced after post hydrogen annealing at 400 °C. Electron spin resonance measurements were used to characterize the change of the defect states after hydrogen annealing. It is found that there exists a-centers (g value = 2.006), which is related to the Si dangling bonds in Si QDs in our samples. Hydrogen annealing can significantly reduce non-luminescent a-centers and enhance the electro-luminescence intensity consequently.     

Thermal annealing of a-Si/Au superlattice thin films

The superlattice films, which consist of amorphous silicon (a-Si) and amorphous gold (Au), were prepared by ultra-high vacuum evaporation system. The first layer was grown a-Si with a thickness of 4.2 nm and the second layer was grown Au with a thickness of 0.8 nm. Thermal annealing was performed at 473, 673, and 873 K, respectively. The structural properties of the films were investigated using transmission electron microscope (TEM), X-ray diffraction (XRD), and Raman scattering spectroscopy. The electrical property was assessed by the temperature dependence of electrical conductivity. A crystallization of Si and a forming of Au nanoparticles were observed in all of the annealing films. The crystalline volume fraction reached 70% by annealing time for 15 min. An average diameter of the Au nanoparticles embedded in Si matrix also increased with increasing the annealing temperature. At annealing temperature above 873 K, Au atoms migrated toward the film surface. It was observed that the electrical conductivity changed in several temperatures.     

Investigation of surface treatment effect of catalyst on the lifetime for Cat-CVD method

In case of amorphous silicon (a-Si) film deposition by catalytic chemical vapor deposition (Cat-CVD) method, a metal catalyzing wire is converted to silicide and this silicidation causes shortening lifetime of the catalyzing wire. In the present work, the effect of surface carbonization of catalyzing wire against silicide formation is investigated to obtain long-life catalyzer. Characteristics of a-Si film deposited by carbonized tungsten (W) catalyzer are also investigated. Silicide layer thickness formed on carbonized catalyzing wires after 60 min a-Si film deposition decreases to half of that on uncarbonized wires. Device quality a-Si films having defect density less than 4 × 10¹⁵ cm^?3 are obtained by using carbonized W, indicating that surface carbonization of W catalyzer is effective process for industrial application of Cat-CVD method.