Preparation of microcrystalline silicon solar cells on microcrystalline silicon carbide window layers grown with HWCVD at low temperature

N-type microcrystalline silicon carbide layers prepared by hot-wire chemical vapor deposition were used as window layers for microcrystalline silicon n–i–p solar cells. The microcrystalline silicon intrinsic and p-layers of the solar cells were prepared with plasma-enhanced chemical vapor deposition at a very high frequency. Amorphous silicon incubation layers were observed at the initial stages of the growth of the microcrystalline silicon intrinsic layer under conditions close to the transition from microcrystalline to amorphous silicon growth. ‘Seed layers’ were developed to improve the nucleation and growth of microcrystalline silicon on the microcrystalline silicon carbide layers. Raman scattering measurement demonstrates that an incorporation of a ‘seed layer’ can drastically increase the crystalline volume fraction of the total absorber layer. Accordingly, the solar cell performance is improved. The correlation between the cell performance and the structural property of the absorber layer is discussed. By optimizing the deposition process, a high short-circuit current density of 26.7 mA/cm² was achieved with an absorber layer thickness of 1 μm, which led to a cell efficiency of 9.2%.     

Optoelectronic properties of hot-wire silicon layers deposited at 100 °C

Hot-wire chemical vapor deposition is employed for the deposition of amorphous and microcrystalline silicon layers at substrate temperature kept below 100 °C with the aid of active cooling of the substrate holder. The hydrogen dilution is varied in order to investigate films at the amorphous-to-microcrystalline transition. While the amorphous layers can be produced with a reasonably low defect density as deduced from subgap optical absorption spectra and a good photosensitivity, the microcrystalline layers are of a lesser quality, most probably due to a decrease of crystallinity during the film growth. In the amorphous growth regime, the Urbach energy values decrease with increasing hydrogen dilution, reaching a minimum of 67 meV just before the microcrystalline threshold. By varying the total gas pressure, the growth rate of the films is changed. The lowest deposition rate of this study (0.16 nm/s) produced the amorphous sample with the highest photoresponse (1 × 10⁶).     

Deposition of microcrystalline silicon films at ultrafast rate by using a new microwave induced plasma source

Synthesis of microcrystalline silicon (μc-Si) film at an ultrafast deposition rate over 100 nm/s is achieved from SiH₄ + He by using a high density microwave plasma source even without employing H₂ dilution and substrate heating techniques. Systematic deposition studies show that high SiH₄ flow rate and working pressure increase film deposition rate while high He flow rate decreases the rate. On the other hand, crystallinity of deposited Si film decreases with increasing SiH₄ or He flow rate and working pressure. Enhancements of gas phase and surface reactions during film deposition process are responsible for the achievement of high deposition rate and high film crystallinity.     

Properties of thin film silicon,prepared at high growth rate in a wide range of thicknesses

Preparation of thin film silicon at high growth rate is an important target for its application in solar cells. The properties of hydrogenated microcrystalline silicon, prepared with the help of PECVD multi-hole cathode in a high pressure and depletion regime in a wide range of thicknesses are described in detail. We illustrate the surprising result that we can prepare high growth rate microcrystalline silicon from 0.4 up to 30 μm thickness without great peel-off problems. The room temperature dark DC conductivity, as well as the crystallinity, increased up to 5 μm film thickness and then started to decrease again. These results are explained by the initial temperature profiling and a thickness-induced increase of the lateral inhomogeneity.     

Crystallinity of the mixed phase silicon thin films by Raman spectroscopy

Raman spectra of the mixed phase silicon films were studied for a sample with transition from amorphous to fully microcrystalline structure using four excitation wavelengths (325, 514.5, 632.8 and 785 nm). Factor analysis showed the presence of two and only two spectrally independent components in the spectra within the range from 250 to 750 cm^?1 for all four excitation wavelengths. The 785 nm excitation was found optimal for crystallinity evaluation and by comparison with surface crystallinity obtained by atomic force microscopy, we have estimated the ratio of integrated Raman cross-sections of microcrystalline and amorphous silicon at this wavelength as y = 0.88 ± 0.05.     

Undoped and arsenic-doped low temperature (∼165 °C) microcrystalline silicon for electronic devices process

Microcrystalline silicon films are deposited at 165 °C by plasma enhanced chemical vapor deposition (PECVD) from silane, highly diluted in hydrogen–argon mixtures. Ar addition during the deposition allows to increase the crystallinity from 24% to 58% for 20 nm thick films. The final crystallinity for 350 nm thick films reaches 72% with an increase in the grain size. A further increase, still 80%, is provided by substrate pre-treatment using hydrogen plasma before the deposition process. Arsenic doped μc-Si films, deposited on previous optimized (5 W power and 1.33 mbar pressure) undoped films without stopping the plasma between the deposition of both layers, show high electrical conductivity up to 20 S cm⁻¹.     

Determination of Raman emission cross-section ratio in hydrogenated microcrystalline silicon

The determination of the crystalline volume fraction from the Raman spectra of microcrystalline silicon involves the knowledge of a material parameter called the Raman emission cross-section ratio y. This value is still debated in the literature. In the present work, the determination of y has been carried out on the basis of quantitative analysis of medium-resolution transmission electron microscopy (TEM) micrographs performed on one layer deposited by very high frequency plasma enhanced chemical vapor deposition (VHF-PECVD) close to the amorphous/microcrystalline transition. Subsequent comparison of these data with the crystallinity as evaluated from measured Raman spectra yields a surprisingly high value of y = 1.7. This result is discussed in relation to previously published values (that range from 0.1 to 0.9).     

Transport properties of microcrystalline silicon,prepared at high growth rate

Amorphous/microcrystalline transition was studied in the high growth-rate depositions of hydrogenated silicon films at a high pressure (700 Pa) in a depletion regime using a series of samples with the ratio of hydrogen to silane flows from 10 to 32. Results show the characteristic features of the amorphous/microcrystalline transition: abrupt change of dark conductivity and crystallinity accompanied by peaks of roughness and diffusion length, observed previously at standard growth rates.     

Optical and structural proprieties of nc-Si:H prepared by argon diluted silane PECVD

Using argon as a diluent of Silane, hydrogenated amorphous and nanorocrystalline silicon films Si:H were prepared by radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD). The deposition rate and crystallinity varying with the deposition pressure and rf power, were systematically studied. Structural analysis (Raman scattering spectroscopy and X-ray diffraction), combined with optical measurements spectroscopy were used to characterize the films. The argon dilution of silane for all samples studied was 95% by volume, and the substrate temperature was 200 °C. The deposition pressure was varied from 400 mTorr to 1400 mTorr and varying rf power from 50 to 250 W. The structural evolution studies, shows that beyond 200 W of rf power, an amorphous-nanocrystalline transition was observed, with an increase in crystalline fraction by increasing rf power and working pressure. The films were grown at high deposition rates. The deposition rates of the films near the amorphous-nanocrystalline phase transition region were found in the range 6–10 Å/s. A correlation between structural and optical properties has been found and discussed.     

Characterization of mixed phase silicon by Raman spectroscopy

We have examined the common methods for determination of the crystallinity of mixed phase silicon thin films from the TO–LO phonon band in Raman spectra. Spectra are decomposed into contributions of amorphous and crystalline phase and empirical formulas are used to obtain crystallinity either from the integral intensities (peak areas) or from magnitudes (peak maxima). Crystallinity values obtained from Raman spectra excited by Ar⁺ laser green line (514.5 nm) for a special sample with a profile of structure from amorphous to fully microcrystalline were compared with surface crystallinity obtained independently from atomic force microscopy (AFM). Analysis of the Raman collection depth in material composed of grains with absorption depth 1000 nm in an amorphous matrix (absorption depth 100 nm), was used to explain reasons for systematic difference between surface and Raman crystallinities. Recommendations are given for obtaining consistent results.     

Influence of crystalline volume fraction on the performance of high mobility microcrystalline silicon thin-film transistors

The influence of the crystalline volume fraction of hydrogenated microcrystalline silicon on the device performance of thin-film transistors fabricated at temperatures below 200 °C was investigated. Transistors employing microcrystalline silicon channel material prepared close to the transition to amorphous growth regime exhibit the highest charge carrier mobilities exceeding 50 cm²/V s. The device parameters like the charge carrier mobility, the threshold voltage and the subthreshold slope will be discussed with respect to the crystalline volume fraction of the intrinsic microcrystalline silicon material.     

Substrate holder biasing for improvement of microcrystalline silicon deposition process

Application of a dual frequency plasma source for the deposition of microcrystalline silicon thin films from highly diluted SiH₄/H₂ was investigated in this paper. A positively or negatively biased low frequency voltage was applied on the substrate holder while the conventional frequency of 13.56 MHz was used for the powered electrode. The results show a significant increase of the deposition rate and an improvement of the film crystallinity in the case of the positive biasing. Plasma diagnostics and modeling were used to understand the beneficial effect of positive biasing on the deposition process. The results revealed that the observed changes are not only due to the variation of ion flux and ion bombardment but also depend on the changes in the production and distribution of neutral species in the discharge space.     

Effect of ex-situ hydrogen passivation on the structural properties of e-beam evaporated amorphous silicon thin film for solar cell applications

Thin-film photovoltaics greatly reduce the semiconductor material content in the finished product, using 150–200 times less material as compared with conventional Si wafer based cells. Electron beam evaporation (e-beam), a non-ultra-high vacuum technique has the potential for being inexpensive, and simpler process for a-Si deposition. It offers specific advantages such as high Si deposition rate (up to 1 μm/min), excellent Si source material usage, avoidance of toxic gases, and simple sample preparation conditions. In this work, we report the growth of a-Si films using e-beam at a growth rate exceeding 30 Å/s (1–5 Å/s for conventional PECVD process). We report the effect of hydrogen passivation on amorphous silicon network and on silicon-bonded hydrogen configuration under ex-situ hydrogenation in hydrogen plasma. The hydrogen concentration and silicon-hydrogen bonding configuration was evaluated using nuclear reaction analysis (NRA) and Fourier transform infrared spectroscopy (FTIR). Hydrogen plasma treatment shows an increase in the monohydride bond concentration with substrate temperature, and is corroborated by our FTIR investigation, in addition to reducing clustered monohydride bonds or polyhydride bonds in a-Si:H film. Raman analysis indicates reduction in silicon bond angle as well as the bond distance, both leading to significant structural improvement in short-range and medium range order in the amorphous phase. Thus, ex-situ hydrogenation clearly demonstrates the possibility of comparable hydrogen passivation in e‐beam evaporated a-Si films with high growth rate. One can easily extrapolate this result to microcrystalline film growth, assuming the structural improvement of the silicon network preceding the microcrystalline nucleation, where ex-situ passivation is most effective. Thus ex-situ hydrogenation opens up new possibilities in minutely tailoring the a:Si film properties especially for solar cell applications.     

Si/SiGe growth by low-energy plasma-enhanced chemical vapor deposition

Nowadays, microelectronic industry targets (in term of down-scaling and throughput) require some severe reduction of the SiGe epitaxial growth temperature or/and increase of the growth rate. A possible alternative to meet these requirements is low-energy plasma-enhanced chemical vapor deposition (LEPECVD). We have studied the deposition kinetics of silicon, silicon–germanium and germanium using LEPECVD. This new deposition technique offers promising advantages compared to thermally activated CVD such as low deposition temperature and high growth rate. Different regimes are observed depending on the growth temperature. High temperatures can be associated to a mix between thermally and plasma-activated deposition, whereas only plasma-assisted deposition occurs at low temperatures. Crystalline quality of the layers was checked through the mean of photoluminescence, which revealed no defects. A high growth rate (100 nm min⁻¹) that can be achieved very easily with LEPECVD allows to grow quickly very thick layers. We have used this technique to grow step-graded thick SiGe layers which are almost fully relaxed. Those virtual substrates exhibited the well-known cross-hatch pattern, with RMS roughness from 2 to 10 nm for pure Ge layers.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Influence of deposition conditions for bottom cell on micromorph tandem device performance

We have realized micromorph tandem solar cells on Asahi U-type TCO-covered glass substrates. The intrinsic layers of both amorphous top cell and microcrystalline bottom cell are grown by very high frequency plasma enhanced chemical vapour deposition (VHF-PECVD) at 100 MHz at low substrate temperature (150 °C). For the bottom cell different growth regimes have been explored by changing both chamber pressure and plasma power. The effect of the structural composition of the microcrystalline absorber layer on the electrical parameters of the device has been investigated. High short circuit current density and constant FF in a wide silane concentration range are obtained when using large power to pressure ratio (0.5 W/Pa). However, low open circuit voltage is generally found in this regime. The largest V_OC values are found at 67 Pa and power to pressure ratio of 0.3 W/Pa, where the highest efficiency (11.1%) is reached. An evaluation of device stability has been done by exposing the tandem solar cells to white light (AM 1.5-like spectrum) for 200 h.     

The comparisons of growth mechanisms for Si thin films with different deposition rates in CVD process by the description of the roughness evolution

The roughness evolutions of micro-crystalline silicon thin films (μc-Si:H) with different growth rates prepared by chemical vapor depositions have been investigated by atomic force microscopy. The growth exponent β was measured as 0.8 ± 0.03, 1.1 ± 0.07 and 0.75 ± 0.02 for three sets of samples prepared by PECVD with and without hydrogen dilution ratio modulation and by HWCVD, respectively, and does not correlated with the deposition rate in a set. However, the root-mean-square roughness and lateral correlation length decrease with increasing the deposition rate for both PECVD and HWCVD process. We suggested that the nonstationary growth with large β is correlated with the shadowing effect. The influence of the deposition rate on the surface roughness could be related to the diminishing of the shadowing effect by surface species diffusion with higher mobility on an H-covered surface. The initial surface and nucleation condition play an important role in the surface roughness evolution.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

The application of very high frequency inductively coupled plasma to high-rate growth of microcrystalline silicon films

High-rate growth of microcrystalline silicon films (μc-Si:H) from inductively coupled plasma (ICP) of H₂ diluted SiH₄ generated with a very high frequency (VHF: 60 MHz) power source has been studied from the viewpoint of efficient gas dissociation. From the VHF power and gas pressure dependences of the film growth rate and optical emission intensities, we have found that the Si and SiH emission intensities and the intensity ratio of H_α to SiH are good indicators for the film growth rate and crystallinity, respectively. The generation rate of film precursors is reflected by the Si and SiH emission intensities while the flux ratio of atomic hydrogen to film precursors, which plays an important role on the structural relaxation for the crystalline network formation, is characterized by the intensity ratio of H_α to SiH. An increase in SiH emission while keeping the intensity ratio of H_α to SiH at a certain level enables us to enhance the film growth rate without significant deterioration in the crystallinity. In this study, a growth rate as high as 10 nm/s was obtained for highly crystallized films.     

Toward the fast deposition of highly crystallized microcrystalline silicon films with low defect density for Si thin-film solar cells

In this study, employing a high-density, low-temperature SiH₄–H₂ mixture microwave plasma, we investigate the influence of source gas supply configuration on deposition rate and structural properties of microcrystalline silicon (μc-Si) films, and demonstrate the plasma parameters for fast deposition of highly crystallized μc-Si films with low defect density. A fast deposition rate of 65 Å/s has been achieved for a SiH₄ concentration of 67% diluted in H₂ with a high Raman crystallinity of X_c > 65% and a low defect density of (1–2) × 10¹⁶ cm⁻³ by adjusting source gas supply configuration and plasma conditions. A sufficient supply of deposition precursors, such as SiH₃, as well as atomic hydrogen H on film growing surface is effective for the high-rate synthesis of highly crystallized μc-Si films, for the reduction in defect density, and for the improvement in film homogeneity and compactability. A preliminary result of p–i–n structure μc-Si thin-film solar cells using the resulting μc-Si films as an intrinsic absorption layer is presented.