高功率808nm InGaAsP—GaAs分别限制结构的半导体激光器

介绍了研究分别限制结构ＩｎＧａＡｓＰ－ＧａＡｓ半导体激光器所得到的最新成果。利用引进的俄国技术，基于量子阱结构的ＩｎＧａＡｓＰ－ＧａＡｓ激光器，可用短时间液相外延技术制造。在ＧａＡｓ衬底上制成的ＩｎＧａＡｓＰ－ＧａＡｓ分别限制结构的激光器，主要参数如下：发射波入λ＝８０８ｎｍ，阈值电流密度Ｊ＝３００Ａ／ｃｍ＾２，对于条宽ω＝１００μｍ的激光器，连续功率为１－２Ｗ。     

液相外延生长超薄有源层Al_xGa_（1－x）As／GaAs分别限制双异质结构激光器

报道超薄有源层ＡｌｘＧａ１－ｘＡＳ／ＧａＡｓ分别限制双异质结构半导体激光器的液相外延的过程。讨论了过冷度、生长温度和降温速率等对生长速率的影响。扫描电镜测得生长温度为６８０℃时，ＧａＡｓ有源层厚度可低至２５～３５ｎｍ。宽接触分别限制双异质结构ＬＤｓ的室温连续阈值电流密度多在７００～８００Ａ／ｃｍ２。     

Modeling and experimental study of 780–808-nm AlGaAs/GaAs injection lasers with electron superlattice barriers

Electron superlattice barriers (ESBs) were used in AlGaAs/GaAs injection lasers to improve the electron confinement of the active layer by Bragg reflection of electron waves. The design of a separate-confinement heterostructure (SCH) laser with ESBs operating at 780–808 nm was optimized. Conventional SCH and SCH-ESB were prepared by low-pressure MOCVD epitaxy. Oxide stripe lasers with stripe widths of 100 and 200µm were prepared. The threshold current density of 0.3 kA/cm² and the characteristic temperature constantT ₀=220 K were measured at a wavelength of 808 nm for SCH-ESB lasers with an active-layer thickness of 40 nm and a resonator length of 0.4–0.5 mm. For conventional SCH lasers with the same geometry, a threshold current density of 0.42 kA/cm² andT ₀=160 K were obtained. Experimental results on the low-temperature photoluminescence characterizing ESB regions are presented and are compared with the calculated miniband energy spectrum of the superlattice structure. The leakage currents for ordinary SCH and SCH-ESB lasers were analyzed. Experimental verification of a reduction in the leakage current for SCH-ESB lasers was obtained.     

高功率InGaAs量子阱垂直腔面发射激光器的研制

采用AlAs氧化物限制工艺实验制备了衬底出光的高功率大出光窗口（直径为300 μm）InGaAs/GaAs量子阱垂直腔面发射半导体激光器,实现了器件室温准连续工作（脉冲宽度为50 μs,重复频率为1000 Hz）,并对器件的伏安特性、光输出特性、发射光谱,以及器件的远场发射特性等进行了实验测试.器件阈值电流为460mA,器件的最大光输出功率为100mW,发射波长为978.6nm, 光谱半功率全宽度为1.0 nm,远场发散角小于10°,垂直方向的发散角θ_⊥为8°,水平方向的发散角θ_∥为9°,基本为圆形对称光束.     

InGaAs/GaAs应变量子阱结构在1 054 nm激光器中的应用

采用金属有机物化学气相淀积（MOCVD）方法生长了InGaAs/GaAs应变量子阱,通过优化生长条件和采用应变缓冲层结构获得量子阱,将该量子阱结构应用于1 054 nm激光器的制备。经测试该器件具有9 mA低阈值电流和0.4 W/A较高的单面斜率效率,在驱动电流为50 mA时测得该应变量子阱光谱半宽为1.6 nm,发射波长为1 054 nm。实验表明:通过优化工艺条件和采用应变缓冲层等手段,改善了应变量子阱质量,该结果应用于1 054 nm激光器的制备,取得了较好的结果。     

InGaAs/GaAs应变量子阱结构在1054nm激光器中的应用

采用金属有机物化学气相淀积(MOCVD)方法生长了InGaAs/GaAs应变量子阱,通过优化生长条件和采用应变缓冲层结构获得量子阱,将该量子阱结构应用于1 054 nm激光器的制备。经测试该器件具有9 mA低阈值电流和0.4 W/A较高的单面斜率效率,在驱动电流为50 mA时测得该应变量子阱光谱半宽为1.6nm,发射波长为1 054 nm。实验表明:通过优化工艺条件和采用应变缓冲层等手段,改善了应变量子阱质量,该结果应用于1 054 nm激光器的制备,取得了较好的结果。     

非对称结构大功率940 nm量子阱激光器

为改善940 nm大功率InGaAs/GaAs半导体激光器输出特性,通过模拟计算了非对称波导层及限制层结构的光场分布,并参照模拟制作了非对称结构半导体激光器器件。采用低压金属有机物气相沉积（LP-MOCVD）生长技术,获得了低内吸收系数的高质量外延材料,通过实验数据计算得到激光器材料内吸收系数仅为0.44 mm-1。进而通过管芯工艺制作了条宽100 m、腔长2000 m的940 nm半导体激光器器件。25 ℃室温10 A直流连续（CW）测试镀膜后器件阈值电流251 mA,斜率效率1.22 W/A,最大输出功率达到9.6 W,最大光电转化效率超过70%。     

非对称结构大功率940nm量子阱激光器

为改善940 nm大功率InGaAs/GaAs半导体激光器输出特性,通过模拟计算了非对称波导层及限制层结构的光场分布,并参照模拟制作了非对称结构半导体激光器器件。采用低压金属有机物气相沉积(LP-MOCVD)生长技术,获得了低内吸收系数的高质量外延材料,通过实验数据计算得到激光器材料内吸收系数仅为0.44mm~(-1)。进而通过管芯工艺制作了条宽100μm、腔长2000μm的940 nm半导体激光器器件。25℃室温10 A直流连续(CW)测试镀膜后器件阈值电流251 mA,斜率效率1.22 W/A,最大输出功率达到9.6 W,最大光电转化效率超过70%。     

Growth of GaAs/AlGaAs hexagonal pillars on GaAs (1 1 1)B surfaces by selective-area MOVPE

We report on the growth of GaAs and GaAs/AlGaAs heterostructured hexagonal pillar structures using selective area (SA) metalorganic vapor phase epitaxy (MOVPE). By performing growth on SiO₂-masked (1 1 1)B GaAs substrates with circular or hexagonal hole openings, extremely uniform array of hexagonal GaAs/AlGaAs pillars consisting {1 1 0} vertical facets with their diameter of order of 100 nm were obtained. Unexpectedly, strong intense light emission was observed for the room temperature photoluminescence measurement of the pillar arrays in triangular lattice, which is promising for the application to the photonic crystals to enhance the light extraction efficiency from the materials with high refractive index. Furthermore, it was also found that hexagonal pillars with size 60 nm and large aspect ratio (>100) by reducing the size of initial hole size of mask, opening a possibility to grow nanowires using epitaxial growth.     

Electrical,optical and spectral characteristics of type-II ZnSe/ZnTe/GaAs superlattice and MSM-photodetector on their base

We report on growth, fabrication and characterization of the metal–semiconductor–metal (MSM) photodiode based on type-II ZnSe/ZnTe heterostructure. Heterostructure was grown on semi-insulating GaAs substrates by MOVPE. For the first time we present the results of experimental investigations of the MSM photodetector on the base of type-II ZnSe/ZnTe superlattice. The MSM-photodetector demonstrates very low dark current, high current sensitivity and external quantum efficiency. The maximum photoresponse of the MSM-detector at the wavelength 620 nm corresponds to current sensitivity 0.22 A/W and external quantum efficiency 44%. Photoresponse of the MSM-detector shows two peaks of response located at 620 nm and 870 nm. ZnSe/ZnTe type-II superlattice structure reduces the MSM-diode dark current significantly. For the MSM-diode with finger width and gap of 3 µm and 100?×?100 µm² photosensitive area we have obtained dark current density 10^?8 A/cm² at room temperature.     

InGaN/GaN量子阱垒层和阱层厚度对GaN基激光器性能的影响及机理

采用LASTIP软件研究了InGaN/GaN(In组分为15%)量子阱垒层和阱层厚度对GaN基蓝紫光激光器性能的影响及机理. 模拟计算结果表明, 当阱层太薄或太厚时, GaN基激光器的阈值电流增加、输出功率下降, 最优的阱层厚度为4.0 nm左右; 当阱层厚度太薄时, 载流子很容易泄漏, 而当阱层厚度太厚时, 极化效应导致发光效率降低, 研究还发现, 与垒层厚度为7 nm 相比, 垒层厚度为15 nm时激光器的阈值电流更低、输出功率更高, 因此适当地增加垒层厚度能显著抑制载流子泄漏, 从而改善激光器性能.     

High-Efficiency ZnCdSe/ZnSSe/ZnMgSSe Green Light-Emitting Diodes

Green light-emitting diodes (LEDs) were fabricated employing a ZnCdSe/ZnSSe triple quantum-well (TQW) active region surrounded by ZnMgSSe cladding layers grown on an n-type (100) GaAs substrate by molecular beam epitaxy (MBE). A 3.5 mW pure green emission was observed for the surface-emitting LED device at a peak wavelength of 513.3 nm (2.415 eV) with a spectral half-width of 11.7 nm (55 meV) under a 20 mA (4.6 V) direct current at room temperature (25°C). These correspond to an external quantum efficiency of 7.2%, a power conversion efficiency of 3.8%, a luminous current efficiency of 66 lm/A, and a luminous efficiency of 14 lm/W.     

Temperature Dependence of the Threshold Current and the Lasing Wavelength in 1.3-μm GalnNAs/GaAs Single Quantum Well Laser Diode

Temperature stability of the threshold current and the lasing wavelength is investigated in a 1.3-μm GaInNAs/ GaAs single quantum-well laser. The measured characteristic-temperature was 88 K. The small wavelength shift per change in temperature of 0.35 nm/°C was obtained, indicating the superior lasing-wavelength stability. Therefore, it is shown experimentally that GaInNAs is very promising material for the fabrication of light source with excellent high-temperature performance for optical fiber communications.     

GaAsN/GaAs量子阱在1 MeV电子束辐照下的退化规律

为研究GaAsN/GaAs量子阱在电子束辐照下的退化规律与机制,对GaAsN/GaAs量子阱进行了不同注量(1×10¹⁵,1×10¹⁶ e/cm²)1 MeV电子束辐照和辐照后不同温度退火(650,750,850℃)试验,并结合Mulassis仿真和GaAs能带模型图对其分析讨论。结果表明,随着电子注量的增加,GaAsN/GaAs量子阱光学性能急剧降低,注量为1×10¹⁵ e/cm²和1×10¹⁶ e/cm²的电子束辐照后,GaAsN/GaAs量子阱PL强度分别衰减为初始值的85%和29%。GaAsN/GaAs量子阱电子辐照后650℃退火5 min,样品PL强度恢复到初始值,材料带隙没有发生变化。GaAsN/GaAs量子阱辐照后750℃和850℃各退火5 min后,样品PL强度随退火温度的升高不断减小,同时N原子外扩散使得样品带隙发生约4 nm蓝移。退火温度升高没有造成带隙更大的蓝移,这是由于进一步的温度升高产生了新的N—As间隙缺陷...     

Long wavelength strain-engineered InAs multi-layer stacks quantum dots laser diode on GaAs substrate

The growth of GaAs based 1.5 ??m multi-layer stacked InAs quantum dots (QDs) has been investigated by solid-source molecular beam epitaxy (SSMBE), which was very important devices for transmission window. Owing to a strong electronic coupling between the QDs layers and the quantum wells (QWs), and antimony (Sb) introduced by for long-wavelength semiconductor lasers were obtained. The device structure for QDs laser diodes (LDs) with a cavity length of 1000 ??m and stripe width of 100 ??m as well as the device fabrication results will also be presented. The output performance was achieved with continuous wave (CW) operation, the measurement were from 20 to 60°C with a temperature step of 10°C. The threshold current density was 168 A/cm², and the CW operating up to 20 mW at room temperature (RT) was achieved.     

Below-band-gap waveguiding behaviors of a weakly index-guided GaAs/AlGaAs quantum well laser

We report the reduced waveguiding efficiency for the signals around 1560 nm as the injection current of an GaAs/AlGaAs multiple quantum well laser diode (lasing wavelength at 840 nm) with a ridge-loading waveguide configuration increased. This reduction trend stopped when the injection current reached the threshold condition of the laser diode. The decreased waveguide transmission and the more expanded mode profile indicated the variation of the effective refractive index gradient in the lateral dimension with injection current. This variation was due to the refractive index decrease with increasing carrier density even below band gap. A slab waveguide model was used to simulate the lateral mode profile variation with injection current. The refractive index differences between the guiding layer and claddings in the slab waveguide model provided estimates of refractive index contrasts of the laser diode at a concerned wavelength under various injection conditions.     

Annealing effects on structure and laser-induced damage threshold of Ta2O5/SiO2 dielectric mirrors

The effects of annealing on structure and laser-induced damage threshold (LIDT) of Ta₂O₅/SiO₂ dielectric mirrors were investigated. Ta₂O₅/SiO₂ multilayer was prepared by ion beam sputtering (IBS), then annealed in air under the temperature from 100 to 400 °C. Microstructure of the samples was characterized by X-ray diffraction (XRD). Absorption of the multilayer was measured by surface thermal lensing (STL) technique. The laser-induced damage threshold was assessed using 1064 nm free pulsed laser at a pulse length of 220 μs.

It was found that the center wavelength shifted to long wavelength gradually as the annealing temperature increased, and kept its non-crystalline structure even after annealing. The absorbance of the reflectors decreased after annealing. A remarkable increase of the laser-induced damage threshold was found when the annealing temperature was above 250 °C.     

近红外波段InAs量子点结构与光学特性

采用分子束外延技术,分别在480,520℃的生长温度下,制备了淀积厚度2.7ML的InAs/GaAs量子点。用原子力显微镜对样品进行形貌测试和统计分布。结果表明,在相应的生长温度下,量子点密度分别为8.0×10¹⁰,5.0×10⁹cm^-2,提高生长温度有利于获得大尺寸的量子点,并且量子点按高度呈双模分布。结合光致发光谱的分析,在480℃的生长条件下,最近邻量子点之间的合并导致了量子点尺寸的双模分布;而在525℃的生长温度下,In偏析和InAs解析是形成双模分布的主要原因。     

基于MOCVD三步生长的GaAs/Si外延技术EI北大核心CSCD

在硅(Si)上外延生长高质量的砷化镓(GaAs)薄膜是实现硅基光源单片集成的关键因素。但是,Si材料与GaAs材料之间较大的晶格失配、热失配等问题对获得高质量的GaAs薄膜造成了严重影响。本文利用金属有机化学气相沉积(MOCVD)技术开展Si基GaAs生长研究。通过采用三步生长法,运用低温成核层、高温GaAs层与循环热退火等结合的方式,进一步降低Si基GaAs材料的表面粗糙度和穿透位错密度。并利用X射线衍射(XRD)ω-2θ扫描追踪采用不同方法生长的样品中残余应力的变化。最终,在GaAs低温成核层生长时间62 min(生长厚度约25 nm)时,采用三步生长、循环热退火等结合的方式获得GaAs(004)XRD摇摆曲线峰值半高宽(FWHM)为401″、缺陷密度为6.8×10^(7) cm^(-2)、5μm×5μm区域表面粗糙度为6.71 nm的GaAs外延材料,在材料中表现出张应力。     

Enhanced photoluminescence intensity of 1.3-μm multi-layer InAs/InGaAs dots-in-well structure using the high growth temperature spacer layer step

The effects of growth temperature of the GaAs spacer layers (SPLs) on the photoluminescence (PL) efficiency of multi-layer GaAs-based 1.3-μm InAs/InGaAs dots-in-well (DWELL) structures have been investigated. It is found that the PL intensity of DWELLs is enhanced by incorporating a high growth temperature step for GaAs SPLs. This improved PL efficiency could be understood in term of reducing the non-radiative recombination centers. An extremely low continuous-wave room-temperature threshold current density of 35 A/cm² is achieved for an as-cleaved 5-layer device with emission at 1.31 μm by using this growth technique.