Magnetoresistance study and interlayer coupling of CoFe/Os/CoFe thin films

The CoFe/Os/CoFe thin films were deposited on natural oxidized Si(1 0 0) substrates at room temperature by an ultra-high vacuum DC-magnetron sputtering system with a base pressure less than 1×10⁻⁸ Torr. The thickness of the ferromagnetic layers was 100 Å in all cases and a series of trilayers with Os spacer ranging from 3 to 20 Å was made. Effects of the Os layer thickness on the magnetoresistance (MR) and magnetic properties were investigated. The results showed that the magnetism switched from ferromagnetic (Os thickness=3, 5 Å) to antiferromagnetic (Os thickness=7–13 Å) and then ferromagnetic (Os thickness=20 Å) again. From the MR study, we see that the AMR ratio decreased from 4.64% to the minimum value 0.69% at 9 Å and then increased; GMR ratio increased from 0.01% to the maximum value 0.43% at 9 Å and then decreased. From the hysteresis loops, the results exhibited that coercivity increased from 16 Oe to the maximum value 92 Oe at 9 Å and then decreased, and squareness value decreased from 0.97 to the minimum value 0.17 at 9 Å and then increased. Dependence of saturation field on Os spacer-layer thickness for CoFe trilayers showed a maximum value 216 Oe at 9 Å. This suggests that the small GMR effect may be related to the small exchange coupling strength in CoFe/Os/CoFe thin films.     

Antiferromagnet IrMn thickness dependence in exchange-biased perpendicular magnetic anisotropy based on CoFe/Pt/CoFe/[IrMn(tIrMn)] multilayers

The effect of the antiferromagnetic IrMn thickness upon the magnetic properties of CoFe/Pt/CoFe/[IrMn(t_IrMn)] multilayers is studied. An oscillatory interlayer coupling (IEC) has been shown in pinned CoFe/Pt(t_Pt)/CoFe/IrMn multilayers with perpendicular anisotropy. The period of oscillation corresponds to about 2 monolayers of Pt. The oscillatory behavior of IEC depends on the nonmagnetic metallic Pt thickness and is thought to be related to the antiferromagnetic ordering induced by the IrMn layer. From the extraordinary Hall voltage amplitude (EHA) curves as function of IrMn thickness, we report that the oscillation dependence of IEC for the [CoFe/Pt/CoFe] multilayer system induced by IrMn with spacer-layer thickness is a important features of perpendicular exchange biased system.     

Performance Analyses of Planar Schottky Barrier MOSFETs with Dual Silicide Layers at Source/Drain on Bulk Substrates and Material Studies of ErSi_x/CoSi_2/Si Stack Interface

A dual silicide layer structure is proposed for Schottky barrier metal-oxide-semiconductor held effect transistors(MOSFETs) on bulk substrates.The source/drain regions are designed to be composed with dual stacked silicide layers,forming different barrier heights to silicon channel.Performance comparisons between the dual barrier structure and the single barrier structure are carried out with numerical simulations.It is found that the dual barrier structure has significant advantages over the single barrier structure because the drive current and leakage current of the dual barrier structure can be modulated.Furthermore,the dual barrier structure's performance is nearly insensitive to the total silicide thickness,which can relax the fabrication requirements and even make an SOI substrate unnecessary for planar device design.The formation of ErSi_x/CoSi_2 stacked multilayers has been proved by experiments.     

Correlation between barrier heights and ideality factors of Cd/n-Si and Cd/p-Si Schottky barrier diodes

Our goal is to experimentally investigate whether or not the effective Schottky barrier heights (SBHs) and ideality factors obtained from the current-voltage (I-V) and capacitance-voltage (C-V) characteristics differ from diode to diode even if the samples were identically prepared. For this purpose, we prepared Cd/n-Si (33 dots) and Cd/p-Si (15 dots) diodes. The SBH for the Cd/n-Si diodes ranged from 0.701 to 0.605 eV, and ideality factor n from 1.913 to 1.213. Φ_b value for the Cd/p-Si diodes ranged from 0.688 to 0.730 eV, and ideality factor n value from 1.473 to 1.040. The experimental SBH distributions obtained from the C⁻²-V and I-V characteristics were fitted by a Gaussian function and their mean SBH values were calculated. Furthermore, the laterally homogeneous barrier heights were also computed from the extrapolation of the linear plot of experimental barrier heights versus ideality factors.     

引入纳米氧化层的CoFe/Pd双层膜结构中增强的垂直磁各向异性研究

制备了CoFe/Pd双层结构的界面处或CoFe层 内部引入纳米氧化层后的系列薄膜. 研究结果显示, 引入纳米氧化层后, 可以使薄膜的磁各向异性在退火后从面内转到垂直膜面方向. 并且对于在CoFe层内部引入纳米氧化层的这类样品, 其强烈的垂直磁性可以在相当宽的有效磁性层厚度范围内(1.2-2 nm)维持. 在保持垂直磁性的前提下, 这种特殊的双层膜结构中CoFe磁性层厚度比常规CoFe/Pd 多层膜中的CoFe层厚度至少多出1.4 nm. 本文的研究有助于制备出具有较高热稳定性的垂直磁性器件电极.     

Schottky metal library for ZNO-based UV photodiode fabricated by the combinatorial ion beam-assisted deposition

A binary alloy Schottky barrier diode on zinc oxide (ZnO) was developed using the combinatorial ion beam-assisted deposition system. The compositional fraction of the binary alloy was continuously varied using the composition-spread technique, to control the Schottky barrier height. After metal deposition, patterned Schottky diodes were fabricated on a ZnO single-crystal substrate. Pt-Ru alloy was selected from the work function viewpoint. Our experiments showed that the compositional fraction of the Schottky binary alloys changed continuously as designed and the Schottky barrier heights measured by current-voltage (I-V) measurements increased with increasing Pt content. Maximum barrier height difference for ZnO was 137 meV. Using ion beam deposition in parallel with the combinatorial system showed that the Schottky barrier heights for ZnO can be controlled by binary metal alloying.     

Effect of CO on Characteristics of AlGaN/GaN Schottky Diode

Pt Schottky diode gas sensors for CO are fabricated using A1GaN/GaN high electron mobility transistor（HEMTs）structure. The diodes show a remarkable sensor signal （3 mA, in N2, 2mA in air ambient） biased 2 V after 1% CO is introduced at 50℃. The Schottky barrier heights decrease for 36meV and 27meV in the two cases respectively. The devices exhibit a slow recovery characteristic in air ambient but almost none in the background of pure N2, which reveals that oxygen molecules could accelerate the desorption of CO and offer restrictions to CO detection.     

Analysis of thin thermal silicon nitride films on silicon

We have investigated the chemical and electrical properties of very thin (<32 Å thick) silicon nitride films grown by rapid thermal nitridation of silicon. These films were of interest as a possible means of tailoring the barrier heights of silicon Schottky barrier diodes. Auger and XPS analysis showed that the level of oxygen contamination in the films was very low ([N]/[N]+[O]) =0.85 to 0.95). The oxygen is located primarily at the surface and interface of the films. Metal-nitride-silicon devices were characterized by I-V and C-V techniques. These measurements indicated an increase in barrier heights to p-type substrates and a decrease in barrier heights to n-type substrates compared to values measured in the absence of the nitride layers. The magnitude of the change in barrier height increases with increasing nitride thickness. The barrier height can be varied reproducibly over a wide range. For molybdenum on p-type, this range is greater than half the bandgap. For titanium and molybdenum on p-type diodes, barrier heights higher than 1.0 V can be achieved. These measurements could be explained by a reduction in the density of silicon interface states with increasing nitride thickness or by the presence of positive fixed charge in the nitride layer.     

Quantum compact model for thin-body double-gate Schottky barrier MOSFETs

Nanoscale Schottky barrier metal oxide semiconductor field-effect transistors （MOSFETs） are explored by using quantum mechanism effects for thin-body devices. The results suggest that for small nonnegative Schottky barrier heights, even for zero barrier height, the tunnelling current also plays a role in the total on-state current. Owing to the thin body of device, quantum confinement raises the electron energy levels in the silicon, and the tradeoff takes place between the quantum confinement energy and Schottky barrier lowering （SBL）. It is concluded that the inclusion of the quantum mechanism effect in this model, which considers an infinite rectangular well with a first-order perturbation in the channel, can lead to the good agreement with numerical result for thin silicon film. The error increases with silicon thickness increasing.     

Electric-field-induced changes in magnetization in PZT/Insulator/CoFe nanometer multilayer

The PZT/Insulator/CoFe nanometer multilayer has been proposed for applications of the spin-dependent devices in this paper. With the strains as a response of PZT layer to an applied electric field in the structure, the magnetization in CoFe layer can be significantly altered, leading to a significance change in magnetoresistance. Our numerical results have demonstrated that the magnetization states in CoFe layer can be tuned by an electric field without a magnetic field being present.     

Synthetic Co50Pt50/Ru/CoFe hard–soft trilayer in spin valves

The influence of deposition power and seedlayer on the properties of hard magnet Co₅₀Pt₅₀ was studied. Co₅₀Pt₅₀(/Co₉₀Fe₁₀)/Ru/Co₉₀Fe₁₀ trilayer was used as pining/pinned layer in spin valves. The influences of different hard layer, soft layer and free layer on exchange bias, interlayer coupling, and magnetoresistance (MR) ratio were studied. Weak antiferromagnetic interlayer coupling was obtained by adjusting the thickness of hard and soft layers. MR of a spin valve with structure Cr2/CoFe0.5/CoPt4/CoFe0.5/Ru0.8/CoFe2.2/Cu2.05/CoFe2.6/Cu1.1/Ta1 reached 10.68% (unit in nm), which is comparable to those of IrMn-based synthetic spin valves. The increment of the coercivity of the free layer is mainly due to the static magnetic interaction between the hard layer and the free layer.     

Tuning exchange coupling by replacing CoFe with amorphous CoFeB in the CoFe/Ru/CoFe synthetic antiferromagnetic structure

We studied exchange coupling in the CoFe/Ru/CoFe synthetic antiferromagnetic structure with systematical replacement of the crystalline CoFe with amorphous CoFeB. Antiferromagnetic exchange coupling intensity decreases with an increase in the replacement in the bottom magnetic layer, which indicates that exchange coupling intensity could be tuned by the replacement. The origin of weakening antiferromagnetic exchange coupling is attributed to the amorphous CoFeB replacement inducing incomplete crystallization and disordered orientation in the Ru layer.     

Modification of Al/Si interface and Schottky barrier height with chemical treatment

The influence of different chemical treatments on the electrical behaviour of n- and p-type Al/Si Schottky junctions was studied. A Schottky barrier height of 0.91 eV was achieved on p-type Si probably due to the unpinning of the Fermi-level at the Al/Si interface. This is one of the highest barrier height values reported so far for a solid-state Schottky junction prepared to p-Si. A doping level reduction was observed in the vicinity of the Si surface for wafers with native oxide and for those boiled in acetone or annealed in forming gas. It was observed unexpectedly that the reactive plasma etch used for the formation of mesa structures decreases the apparent Schottky barrier height. The relation between the sum of n- and p-type Schottky barrier heights and forbidden gap is discussed.     

AlGaN/GaN高电子迁移率晶体管肖特基高温退火机理研究

在不同应力条件下,研究了AlGaN/GaN高电子迁移率晶体管高温退火前后的电流崩塌、栅泄漏电流以及击穿电压的变化.结果表明,AlGaN/GaN高电子迁移率晶体管通过肖特基高温退火以后,器件的特性得到很大的改善.利用电镜扫描(SEM)和X射线光电子能谱(XPS)对高温退火前、后的肖特基接触界面进行深入分析,发现器件经过高温退火后,Ni和AlGaN层之间介质的去除,并且AlGaN材料表面附近的陷阱减少,使得肖特基有效势垒提高,从而提高器件的电学特性. 关键词： AlGaN/GaN高电子迁移率晶体管 肖特基接触 界面陷阱     

Schottky barrier properties of various metal (Zr, Ti, Cr, Pt) contact on p-GaN revealed from I-V-T measurement

Schottky barrier contact using three different metal (Zr, Ti, Cr and Pt) and Ohmic contact using Ni were made on same epitaxial growth layer of p-GaN. Measurements were carried out using current-voltage-temperature (I-V-T) in the range of 27-100°C. Under forward bias and room-temperature (RT), the ideality factors (η) were determined to be 2.38, 1.82, 1.51 and 2.63, respectively, for Zr, Ti, Cr and Pt. The Schottky barrier height (SBH) and effective Richardson coefficient A^** were measured through modified Norde plot as one of the analysis tools. Barrier heights of 0.84, 0.82, 0.77 and 0.41 eV for Zr, Ti, Cr and Pt, respectively, were obtained from the modified Norde plot. Schottky barrier heights of Zr, Ti, or Cr/p-GaN were also measured through activation energy plot, and determined to be in the same range (∼0.87 eV) and Pt at 0.49 eV. These results indicate that the Fermi level seems to be pinned due to the value of slope parameter (S) was very low (S = −0.25).     

6H-SiC肖特基源漏MOSFET的模拟仿真研究

给出了一种新型SiC MOSFET——6H-SiC肖特基源漏MOSFET.这种器件结构制备工艺简单，避 免了长期困扰常规SiC MOSFET的离子注入工艺难度大、退火温度高、晶格损伤大，注入激活 率低等问题.分析了该器件的电流输运机理，并通过MEDICI模拟，给出了SiC肖特基源漏MOSF ET伏安特性以及其和金属功函数、栅氧化层厚度和栅长关系. 关键词： 碳化硅 肖特基接触 MOSFET 势垒高度     

零偏退火与反偏退火对含氢的Au／n—Si肖特基势垒的控制

＜１１１＞晶向的掺磷的ｎ型硅外延片经等离子进氢后连同未经等离子氢处理的对比片一起淀积金，制得Ａｕ／ｎ－Ｓｉ肖特基势垒，实验结果表明：氢能使Ａｕ／ｎ－Ｓｉ的肖特基势垒高度下降０．１３ｅＶ；含氢的肖特基势垒的高度可以被零偏退火与反偏退火所控制，即零偏退火使含氢的肖特基势垒的高度降低，而反偏退火使含氢的肖特基势垒的高度升高；而且零偏退火与反偏退火对肖特基势垒高的这种控制作用至少在三个循环过程中是可逆的。     

零偏退火与反偏退火对含氢的Au/n-Si肖特基势垒的控制

〈１１１〉晶向的掺磷的ｎ型硅外延片经等离子进氢后连同未经等离子氢处理的对比片一起淀积金，制得Ａｕ／ｎ－Ｓｉ肖特基势垒。实验结果表明：氢能使Ａｕ／ｎ－Ｓｉ的肖特基势垒高度下降０．１３ｅＶ；含氢的肖特基势垒的高度可以被零偏退火与反偏退火所控制，即零偏退火使含氢的肖特基势垒的高度降低，而反偏退火使含氢的肖特基势垒的高度升高；而且零偏退火与反偏退火对肖特基势垒高的这种控制作用至少在三个循环过程中是可逆的。在反偏退火以后，含氢的肖特基势垒的高度升高的数值不仅与退火时所应用的偏置电压有关，而且与退火温度也有关。     

Influence of Ga+ ion irradiation on thermal relaxation of exchange bias field in exchange-coupled CoFe/IrMn bilayers

This paper reports that the CoFe/IrMn bilayers are deposited by magnetron sputtering on the surfaces of thermallyoxidized Si substrates.It investigates the thermal relaxations of both non-irradiated and Ga + ion irradiated CoFe/IrMn bilayers by means of holding the bilayers in a negative saturation field.The results show that exchange bias field decreases with the increase of holding time period for both non-irradiated and Ga + ion irradiated CoFe/IrMn bilayers.Exchange bias field is also found to be smaller upon irradiation at higher ion dose.This reduction of exchange bias field is attributed to the change of energy barrier induced by ion-radiation.     

The modulation of Schottky barrier height of NiSi/n-Si Schottky diodes by silicide as diffusion source technique

This paper reports that the Schottky barrier height modulation of NiSi/n-Si is experimentally investigated by adopting a novel silicide-as-diffusion-source technique, which avoids the damage to the NiSi/Si interface induced from the conventional dopant segregation method. In addition, the impact of post-BF₂ implantation after silicidation on the surface morphology of Ni silicides is also illustrated. The thermal stability of Ni silicides can be improved by silicide-as-diffusion-source technique. Besides, the electron Schottky barrier height is successfully modulated by 0.11~eV at a boron dose of 10¹⁵~cm^-2 in comparison with the non-implanted samples. The change of barrier height is not attributed to the phase change of silicide films but due to the boron pile-up at the interface of NiSi and Si substrate which causes the upward bending of conducting band. The results demonstrate the feasibility of novel silicide-as-diffusion-source technique for the fabrication of Schottky source/drain Si MOS devices.