包覆型纳米铜-银双金属粉研究

目前,导电胶或者电磁波屏蔽涂料用的导电性填料主要有三类,一是铜粉,二是银粉,三是铜-银双金属粉。铜粉具有来源广、价格低廉、导电性好等优点,但其抗氧化性能弱;银粉导电性与抗氧化性好,但其资源日益匮乏。大量的研究试图通过对铜粉进行表面改性来提高其性能。表面改性有两种方法,一是包膜处理,用SiO2溶胶处理铜粉,铜粉抗氧化性能提高,但其表面导电性能大大降低犤1犦;另一类方法是在铜粉表面覆盖一层导电性能与抗氧化性能均佳的银或金而制成双金属粉末犤2～5犦。制取高性能的铜-银双金属粉是该领域的研究重点。目前获得铜-银双金属粉的方…     

直接还原法制备超细铜银双金属粉及性能研究

超细铜粉、银粉由于其自身特性已被人们广泛应用于导电胶犤１，２犦、导电涂料、电极材料及抗菌材料犤３，４犦的制备等。但是铜粉、银粉都有一定的缺点，例如：超细铜粉很容易氧化，容易产生电迁移现象。超细银粉的成本又很高。如果将铜银结合起来制成铜银双金属粉，则在很大的程度上克服了铜粉的缺点犤５犦，又降低了银粉的成本。而双金属粉末还可以改变单一金属粉末的结构和性能，因此会表现出一些新的性能。如抗菌性，Cu－Ag粉既具有Cu的抗真菌性，又有Ag的抗细菌性等，具有广泛的应用前景。超细铜粉和超细银粉的制备已有许多相关的报…     

硅烷改性纳米ZrO2对镁锂合金表面环氧树脂涂层耐蚀性能的影响

采用涂覆法在镁锂合金表面制备了含双-[3-(三乙氧基硅)丙基]四硫化物(KH-69硅烷)改性纳米ZrO₂的环氧树脂涂层. 通过傅里叶变换红外光谱(FTIR)、 扫描电子显微镜(SEM)和电化学阻抗谱(EIS)等手段表征了该涂层. 考察了KH-69硅烷改性纳米ZrO₂浓度对环氧树脂涂层耐蚀性能的影响. 结果表明, KH-69硅烷改性纳米ZrO₂能显著提高镁锂合金表面环氧树脂涂层的耐腐蚀性能, 其中1.0%(质量分数) KH-69硅烷改性纳米ZrO₂环氧树脂涂层具有较好的耐蚀性能. 在NaCl溶液中浸渍528 h后的低频阻抗值为1.6×10⁹ Ω·cm², 相比在NaCl溶液中浸渍240 h的纯环氧树脂涂层提高约5个数量级.     

硅烷偶联剂制备及对磷灰石-硅灰石生物玻璃陶瓷的表面改性

采用谷氨酸与硅烷偶联剂(KH-792)缩合反应,制备出一种含酰胺基的硅烷偶联剂,利用其与材料之间的化学结合,将谷氨酸共价固定至磷灰石-硅灰石生物玻璃陶瓷表面,实现表面改性。将改性后的磷灰石-硅灰石生物玻璃陶瓷与人骨肉瘤细胞MG63共培养,评价其体外细胞生物相容性。应用FTIR、SEM、XPS等测试技术分别对合成的偶联剂、改性后的陶瓷材料进行结构、表面形貌及细胞生长情况的表征,结果表明:谷氨酸与KH-792的反应产物有酰胺基生成;含酰胺基的硅烷偶联剂能对磷灰石-硅灰石生物玻璃陶瓷表面进行有效改性;共培养3 d后细胞在材料材料表面大量贴附,MTT实验也证明增殖良好,即含酰胺基的硅烷偶联剂能改善磷灰石-硅灰石生物玻璃陶瓷的体外细胞生物相容性。     

磁性Fe_3O_4微粒表面有机改性

在分散聚合法制备复合磁性微球过程中 ,采用硅烷偶联剂 KH- 570对磁性 Fe_3O_4微粒进行表面改性 .红外光谱 (FTIR)、光电子能谱 (XPS)分析结果表明 ,偶联剂与磁性微粒表面以化学键形式结合 .改性后 ,Fe_3O_4微粒与单体及其聚合物之间具有良好的亲和性 ,采用改性后的磁性微粒可以显著改善磁性微球的性能指标 .     

硅烷偶联剂改性的二氧化钛光催化降解气相苯

 用硅烷偶联剂KH-570对二氧化钛光催化剂进行了改性,制备了一种新型光催化剂. 以苯作为 模拟气体,在静态反应装置中考察了该催化剂的光催化性能. 结果表明,KH-570能显著提高 二氧化钛对气相苯的光催化降解性能,其转化率是纯二氧化钛的2.5倍. 采用红外光谱和X射线光电子能谱对催化剂进行了表征.     

纳米TiO2有机表面改性的研究

利用硅烷偶联剂(KH-550)对表面包覆氧化硅的金红石相纳米TiO₂进行了有机表面改性。采用红外光谱(IR)、X射线光电子能谱(XPS)、热分析(TG-DTA)、BET、透射电镜(TEM)、润湿性和分散性实验等对表面改性前后的纳米TiO₂进行了表征。红外光谱和X射线光电子能谱表明，KH-550以化学键合的方式结合在纳米TiO₂的表面，并形成了有机包覆层。经测量，纳米TiO₂表面的KH-550的质量分数约为2.0%。讨论了产生KH-550理论包覆量与实际包覆量差异的原因。TEM、TG和BET得出的结果显示，在纳米TiO₂有机表面改性过程中存在明显的团聚现象，改进分散纳米TiO₂的方法是提高有机改性效果的关键。润湿性实验和分散性实验表明，经KH-550表面改性的纳米TiO₂同时具有亲水性和亲油性。     

一种可分散性石墨烯的制备

先通过γ-氨丙基三乙氧基硅烷(KH-550)与氧化石墨反应得到改性氧化石墨, 再经水合肼还原制备了改性石墨烯. 未烘干的改性石墨烯经超声处理后, 可稳定分散于体积比为9∶1的N,N-二甲基甲酰胺/水或丙酮/水的混合溶液中, 而且在N,N-二甲基甲酰胺/水体系中超声得到的改性石墨烯分散液可在乙醇、丙酮中稳定存在. 采用红外光谱、X光电子能谱及X射线衍射分析等手段研究了KH-550改性氧化石墨及石墨烯的结构. 结果表明, KH-550上的氨基与氧化石墨的羧基反应生成了酰胺键, 与环氧基发生了加成反应, 干燥的改性石墨烯层间通过Si-O-Si键连接在一起.     

新型纳米氮化铝/不饱和聚酯导热复合材料的制备与表征

用硅烷偶联剂( Ⅰ , KH-570)或大分子偶联剂( Ⅱ , 马来酸酐-丙烯酸丁酯-苯乙烯三元共聚物)对纳米氮化铝(AlN)粉体表面进行改性制得改性纳米氮化铝(AlNn, n= ⅠorⅡ ).通过原位聚合法合成了掺杂AlNn的纳米氮化铝/不饱和聚酯导热复合材料(1).对1的形貌、导热系数和力学性能等进行了表征,结果表明,AlNⅡ在聚合物基体中分散较均匀,且有效提高了1的导热性能;AlNⅡ掺杂量为8%时1的力学性能达到最佳状态.     

聚合物/淀粉复合材料的制备与性能研究进展

淀粉是一种天然高分子材料,具有来源广泛、价格低廉、可再生、可降解等优点,在生物降解高分子材料领域中具有重要地位。淀粉塑化后较为柔软,类似于弹性体,如果能够用于聚合物的增韧改性,将对降低成本、保护环境有重要意义。目前,淀粉在聚合物共混改性中主要起填充、降低成本的作用,而作为弹性体增韧聚合物制备高抗冲聚合物复合材料还比较少。为了改善聚合物/淀粉复合材料的性能,可以采用淀粉塑化改性、淀粉化学改性、添加相容剂、添加弹性体协同淀粉增韧等方法。本文从以上4个方面总结了聚合物/淀粉复合材料的研究进展,讨论了目前聚合物/淀粉复合材料存在的问题,并对未来的发展方向进行展望。     

Electrically conductive epoxy‐based nanocomposite adhesives loaded with silver‐coated copper and silver‐coated reduced graphene oxide nanoparticles

In this research, a conductive adhesive based on epoxy resin as the polymer matrix and silver‐coated copper powder and silver‐coated reduced graphene oxide as conductive fillers was synthesized. Graphene oxide was synthesized by modified Hummer's method. It was reduced and modified by silver powder. Copper particles were coated with silver using the electroless plating method. Finally, conductive nanocomposite adhesives were prepared using conductive fillers with different weight fractions. The structural properties of fillers were identified by Fourier‐transform infrared (FTIR) and induced coupled plasma (ICP) analysis and the morphology of the samples by scanning electron microscopy (SEM). Finally, conductive properties, lap shear strength, and thermal stability of adhesive were evaluated. The conductive adhesive prepared with optimized properties have 70% weight percentage silver‐coated copper powder and 1% weight percentage silver‐coated reduced graphene oxide. The bulk resistivity of the optimum sample was 1.6 × 10^‐2 Ω.cm, and the lap shear strength was 7.10 MPa. Also, thermogravimetric analysis showed that the weight loss of adhesive decreased from 88.72% to 30.55% during heating, which showed the addition of fillers improves the thermal stability of adhesive.     

Design and build an elastic crosslinked network to strengthen and toughen soybean-meal based bioadhesive using organo-sepiolite and greener crosslinker triglycidylamine

Poor water resistance and curing layer brittleness are significant challenges of greener soybean meal (SM) adhesive promotion and application. In this study an elastic network was built to crosslink the SM adhesive and improve the cured layer toughness of the resultant adhesive. Long-chain organo-sepiolite (OSEP) was first prepared by compound modification using KH-560 and KH-602 silane coupling agents. Triglycidylamine (TGA), a greener crosslinking agent with a large number of effective epoxy functional groups, was then synthesized. SM-based adhesives were fabricated using SM, OSEP and TGA. Results indicated that an elastic network was fabricated by the cross-linked reaction of SM, OSEP, and TGA. The elastic network effectively improved the toughness of the resultant adhesive. The wet shear strength of the plywood (PlyW) bonded by SM with 1% OSEP (SM/TGA/OSEP-1 adhesive) increased by 60% to 1.25 MPa relative to that of the SM/TGA adhesive. This study provided a greener, simple and cheap method improving the toughness and wet shear strength of SM-based adhesive, which contributes to the industrialized application of the product.     

Polyaniline‐tailored electromechanical responses of the silver/epoxy conductive adhesive composites

In this article, the electromechanical properties of silver‐in‐epoxy conductive adhesives with the polyaniline (PANI) micron particles as cofillers have been investigated. PANI is a conductive polymer and has a moderate conductivity in between those of silver and epoxy. It was found that PANI can be used to tailor both the adhesive's electrical contact resistance and its relaxation behavior; however, the effects of adding PANI were complex. The addition of small amount of PANI (2 wt %) dramatically increased the contact resistance; it might block the electrical contacts among silver flakes and was not able to form a continuous path among themselves. The addition of more PANI showed a moderate increase in contact resistance, which increased with the weight fraction of PANI from 6 to 15 wt %. Interdependent behavior of compressive strain and relaxation in electrical contact resistance is characterized to evaluate the origin of this relaxation. The addition of PANI made the relaxation in electrical contact resistance more sensitive to the compressive strain and the electromechanical coupling to deviate from the linear relationship. These research findings provide insights into the way to use PANI to tailor the electromechanical properties of the adhesive bonds or joints in the development of advanced functional devices. © 2013 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2013, 51, 1448–1455     

加成型液体硅橡胶的研究进展

结合加成型液体硅橡胶的硫化原理,综述了加成型液体硅橡胶导热性能、耐高温性能及粘结性能的最新研究进展,发现加入金属氮化物导热填料是提高加成型液体硅橡胶导热性能的有效途径;改善分子结构是提高加成型液体硅橡胶耐高温性能的主要途径;共混粘结促进剂是提高加成型液体硅橡胶粘结性能的重要途径。介绍了加成型液体硅橡胶的最新应用领域,提出功能化加成型液体硅橡胶,如3D个性化打印硅橡胶、人体器官硅橡胶、高折光封装硅橡胶等功能材料是未来加成型液体硅橡胶的发展方向。     

A simple solid-state pH glass electrode

A modernized version of the thompson electrode is described. A copper wire is connected to the inner surface of the membrane of a glass electrode with a conductive adhesive resin.     

基于原位体积加成制备导电线路的研究

本文提出一种制备导电电路的方法。以纳米铜为导电填料，以光固化树脂为连接剂，制备含铜光固化油墨，利用丝网印刷方法获得含有纳米铜的图案，利用铜与银盐间的置换反应，将铜纳米粒子图案通过原位体积加成转化为导电银图案。研究结果表明，铜图案不具有导电性，而置换反应生成的银图案具有导电性，且导电能力受铜含量、银盐浓度、光照时间、浸泡反应时间等因素影响，本实验中获得的最高电导率为1.25×10⁵ S/m，导电线路具有良好的耐弯曲、耐疲劳性能，同时兼具优异的可修复性能，为导电线路的制备提供了常温下简单有效、成本低廉的实现方法，具有重要的参考价值。     

银包玻珠核壳复合粒子的表面处理及环氧导电胶的电性能

以化学还原法合成的银包玻珠核壳复合粒子(Ag/GM)为原料, 乙二胺为表面处理剂, 制备了表面吸附有乙二胺的Ag/GM, 并用它作为导电填料组成了导电胶. 与化学还原法直接合成或沸水处理的Ag/GM相比, 乙二胺处理的Ag/GM能更有效地分散在环氧树脂胶黏剂中, 且能与环氧树脂基体产生化学键合, 降低Ag/GM和环氧树脂基体间的界面能, 用其制备的导电胶的导电率较高, 导电渗滤阈值较低. 同时, 结合导电网络理论和等效电路图, 阐明了用乙二胺处理的Ag/GM作填料制备的导电胶具有较低体积电阻率的原因.     

Role of surface roughness and lubricant film thickness in nanolubrication of sliding components in adaptive optics

Silver-coated copper particles with various silver loading were prepared by a direct liquid-to-particle conversion process in spray pyrolysis reactor system. The prepared particles were completely densified at 900°C within a residence time of 2.1 s and had core-shell structure, of which formation mechanism was proposed. The mean diameter of particles was 0.45 μm. Copper particles of 20 wt.% of silver loading were stable under air and 95% of copper remained as metallic copper even after 1 month of exposure to air. This enhanced air-stability contributed to the enhanced electrical property of conductive film obtained from the coated particles. The conductive film obtained from 15 wt.% of silver-coated copper particles had a sheet resistance of 1.2 mΩ square(-1). This low resistance resulted from the lack of oxide layer and low sintering temperature of silver layer.     

Silicate-based adhesives

The possibility of improving the properties of adhesives based on PVA dispersions by the addition of a fairly cheap and accessible component (liquid glass) is studied. This modification is shown to yield an increase in the adhesive viscosity and improve its technological characteristics and the water resistance of an adhesive joint. A scientific interpretation of the effects observed during modification is given.