3D laser scanner system using high dynamic range imaging

Because of its high measuring speed, moderate accuracy, low cost and robustness in the industrial field, 3D laser scanning has been widely used in a variety of applications. However, the measurement of a 3D profile of a high dynamic range (HDR) brightness surface such as a partially highlighted object or a partial specular reflection remains one of the most challenging problems. This difficulty has limited the adoption of such scanner systems. In this paper, an optical imaging system based on a high-resolution liquid crystal on silicon (LCoS) device and an image sensor (CCD or CMOS) was built to adjust the image's brightness pixel by pixel as required. The radiance value of the image captured by the image sensor is constrained to lie within the dynamic range of the sensor after an adaptive algorithm of pixel mapping between the LCoS mask plane and image plane through the HDR imaging system is added. Thus, an HDR image was reconstructed by the LCoS mask and the CCD image on this system. The significant difference between the proposed system and a traditional 3D laser scanner system is that the HDR image was used to calibrate and calculate the 3D profile coordinate. Experimental results show that HDR imaging can enhance 3D laser scanner system environmental adaptability and improve the accuracy of 3D profile measurement.     

Microfocus X-ray printed circuit board inspection system

In order to solve the problem of digital radiography for printed circuit board (PCB) defect inspection, a new inspection system for PCB defect inspection with high resolution X-ray is proposed and implemented in this paper. The influence of the focus size of X-ray source on imaging formation is analyzed to get the best geometrical magnification. Moreover, the relationship between the resolution of intensifier and geometrical magnification is presented by analyzing the performance of MCP-X intensifier, which results in calculating the comprehensive resolution of this system. The experiment result indicates that the measurements on defect character is achieved by inspection software, and the defect analysis accuracy on ball grid array (BGA) solder joint of circuit board achieves minimum resolution of 0.03 mm. As a result, this system succeeds in implementing invisible solder joint defect inspection on BGA.     

谱域OCT的印刷电路板三防漆厚度测量

三防漆是一种广泛应用在印刷电路板（PCB）的保护性涂层,可以有效保护PCB使其免受恶劣环境的损害。三防漆的厚度是评价三防漆涂层质量的关键指标,因此需要对三防漆涂层进行厚度检测。提出了将谱域光学相干断层扫描成像技术（spectral domain optical coherence tomography,SD-OCT）与图像分割算法相结合,实现对三防漆涂层厚度快速无损测量。为了提高测量精度,选用了宽带SLD光源（带宽：180 nm）来设计SD-OCT系统,系统轴向分辨率达到1.72 μm。同时设计了基于边缘跟踪的涂层分割算法来实现三防漆涂层的快速准确分割。为了评估所设计方法的准确性,利用传统的金相切片方法进行了三防漆的厚度测量,将测量结果与该方法测量结果进行比较,分析了两种方法检测到的涂层上下边界吻合程度以及厚度差异。此外,还将所提出的涂层分割算法与我们组之前研究的基于图像梯度的边缘检测算法进行对比,分析了两种方法在测量结果的准确性和运行效率方面的差异,以此来评估该方法的优劣势。结果表明,所设计的三防漆厚度测量方法与传统的金相切片方法的测量结果具有很好的一致性,可以准确地实现三防漆的厚度测量;基于SD-OCT系统的三维成像能力可以直观地看到三防漆厚度地形图,克服了传统的金相切片方法无法进行区域性的三防漆厚度测量的缺陷;相比之前提出的基于图像梯度的边缘检测算法,此方法测量结果更加准确,效率显著提升,具备实时测量的潜力。     

Quantitative characterization of holographic displays based on liquid-crystal-on-silicon spatial light modulator

This report discusses the effect of speckle size on the quality of holographic images based on a liquid-crystal-on-silicon (LCoS) spatial light modulator (SLM). Further, it proposes methods of quantifying the average speckle size and holographic image resolution. These methods enable both characteristics to be compared using the same unit (the number of pixels in the holographic image), providing an intuitive and effective comparative analysis method. In particular, by varying the LCoS resolution ratio, the change in the resolvable minimum pixels of the holographic image is interpreted in conjunction with the average speckle size; moreover, an analysis of the correlation between the latter two is presented. This approach, based on LCoS resolution division, could provide useful insights into single-SLM-based, full-color holographic displays using space division. Furthermore, it could be extended to other components, including more advanced LCoS SLMs, and used to identify the relative effects on image quality with speckles.     

基于线阵CCD的图像采集系统设计

介绍了一种快速提取边缘特征信息的图像采集系统设计方法。该方法以C8051f060单片机为控制核心, 结合外围环形硬件电路实现对线阵CCD图像传感器的驱动,采用简单的预处理电路将两路CCD输出信号转变为一路可利用的视频信号,再利用单片机的A/D转换模块对视频信号进行模数转换和串口通信将数字图像数据发送到上位机等待后续处理。该系统电路设计较简单,集成度高,成本低,避免了以往设计方法的不足,通过实验结果表明：该系统具有较好的抗干扰性和稳定性,产生的驱动信号符合CCD工作需求,可以快速、高效完成对含有边缘特征信号的采集并实现高精度测量。     

基于彩色图像分割技术的SMT焊点质量检测

图像分割的策略和方法是SMT焊点图像处理的一项关键技术,也一直是SMT焊点计算机质量检测的瓶颈;以SMT焊点的颜色和几何特征作为分析对象,在灰度图像分割所用二维阈值化的分割方法的基础上,提出一种从颜色直方图的量化级数和二维直方图概率密度不均匀化两个方面改进后的适用于HSV彩色空间图像分割技术,并将其应用于SMT焊点的质量检测;通过其得到SMT片式元器件焊点的图像,对其进行形态学处理后,利用Matlab软件将SMT焊点成功地从PCB板上分离出来,为三维重建提供良好的基础。     

Laser prototyping of printed circuit boards

This paper describes the application of laser micromachining to rapid prototyping of printed circuit boards (PCB) using nano-second lasers: the solid-state Nd:YAG (532/1064 nm) laser and the Yb:glass fiber laser (1060 nm). Our investigations included tests for various mask types (synthetic lacquer, light-sensitive emulsion and tin). The purpose of these tests was to determine some of the basic parameters such as the resolution of PCB prototyping, speed of processing and quality of PCB mapping with commonly available laser systems. Optimization of process parameters and the proposed conversion algorithm have allowed us to produce circuit boards with a resolution similar to that of the Laser Direct Imaging (LDI) technology.     

一种快速检测圆心的抗噪声亚像素算法

在印刷电路板的自动光学检测中，被检对象的空间对准是一个关键步骤，而传统的图像匹配技术由于其只能在像素级定位，而无法适应印刷电路板精确对准的要求。本文利用圆的几何对称性，提出一种在亚像素精度快速定位圆心的算法。     

A novel method of fast dynamic optical image stabilization precision measurement based on CCD

Dynamic image stabilization precision is a key technical indicator in optical image-stable device, however, the fast dynamic test is difficult to implement. A novel fast dynamic image stabilization precision testing system for optical image-stable instrument is developed. The large-aperture collimator with the designed cross divisional board is used to simulate the infinity goal. A motion simulator with six-degree of freedom is adopted to simulate the moving state of the installed image-stable instrument. Combined with the optical lens designed in accordance with the analysis of the whole optical system in detail, the high speed camera installed behind the eyepiece lens of the measured device acquires images rapidly and real-timely. The local energy maxima center of the cross light spot can be obtained accurately through the proposed fast image stabilization precision test algorithm on the basis of Hessian matrix. The actual test results show that the test error of dynamic image stabilization in the proposed method of this paper is less than 0.7″, and the time of the frame image acquisition and processing is not more than 10 ms, which demonstrates the effectiveness of the test equipment and algorithm.     

加速器束流测量中的数字系统设计

加速器束流测量系统中的数字技术主要是处理安装在真空管道里的探测器感应出的束流电信号, 这个电信号包含丰富的束流信息, 如束流位置, 工作点, 束团长度等, 所以采用一套数字化平台, 经过不同的软件分析, 就可得到许多的加速器束流参数. 本论文为建立这样一套数字化平台做了一些尝试, 设计了高速高精度采样处理系统, 它采用软件无线技术, 包含独立的四通道高速中频采样处理电路. 本系统已经在HLS上采用频率谐波法测量了束团长度, 另外在实验室配以RF前端模块模拟了BPM测量. 达到了预先的设计目标. 最后提出了对系统的改进, 可以采用Ethernet代替VME总线, 在500MHz直接采样, 及使用FPGA来实现DDC, DSP, FIFO, Ethernet等功能, 这些将是下一步设计目标, 最终实现商业化产品的目的.     

基于变换矩阵的BGA X-ray图像倾斜识别

针对基于X-Ray的焊球阵列封装(BGA)焊接缺陷检测中,现有的图像处理算法无法有效处理PCB意外倾斜的问题,提出了一种自动判断BGA焊点X射线图像倾斜程度并进行校正的方法。首先根据BGA焊点阵列排布的特性恢复出原始图像中的结构信息,然后使用广义逆矩阵求解出理想正视图像与实际倾斜图像之间的变换矩阵,最后对倾斜图像进行逆变换以得到理想正视图像,并使用变换矩阵估计出PCB的倾斜程度。实验针对正视与倾斜的BGA焊点的X射线图像,运用所提方法,准确判别出图像的倾斜程度,并进行了校正。此方法既可以作为一种图像质量评价算法,在BGA X-Ray缺陷检测中判断图像是否为需要的正视图像;也可以作为一种图像自动校正算法,提升基于X射线的自动检测系统的适应性。     

Laser soldering of flip-chips

A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer of additional solder paste. The aligned samples (solder pad—solder paste—chip bump) were illuminated through the glass substrate using an Ar⁺ laser beam (, , at 1/e) to heat the printed pad and melt the solder paste, thus forming a joint between the printed pad and the chip bump. The heat-affected zone was modeled using computer-assisted finite element method. The solder joint cross-sections were analyzed using optical and electron microscopy as well as energy dispersive X-ray element analyses. The laser-soldered joints were of good mechanical and electrical quality and the process proved to be suitable for manufacturing customized circuit prototypes.     

基于PID控制器的HDRI系统的研究

HDRI系统是指进行高动态范围图像采集的成像系统。在使用空间光调制器进行反馈调制从而获取宽动态范围图像的系统中,由于未知景物光强范围很大,会导致反馈耗时或振荡。提出了一种将控制理论中的PID技术应用于反馈调制系统的调整方法。从PID的原理出发,根据工程应用的具体情况,简化了PID控制器的参数,得到了简单的PID控制器参数。通过数值仿真对PID控制器参数进行了充分的讨论,明确了这一参数的最优取值范围及取值原则。通过成像实验验证了这种PID控制参数的正确性。     

具有复杂背景的全息干涉图的自动处理

本文对全息焊点检测的原理作了简要的介绍,针对检测中遇到的具有复杂背景的干涉图,提出了计算机自动处理与判别方法;完成了图像的背景抑制、噪声去除、平滑、细化及条纹的自动识别,获得了较好的结果.     

用于线路板检测的高分辨率X射线像增强器的研制

鉴于传统的检测方法无法看到封装后芯片内部的线路虚焊和桥接等问题,而且随着封装的小型化和组装的高密度化以及各种新型封装技术的不断涌现,对于检测装置的分辨率要求越来越高,而高分辨率的X射线检测装置是解决这一问题的关键。提出一种新型高分辨率X射线像增强器,它是线路板检测和芯片封装检测装置中的核心器件之一,其极限分辨率制约着X射线检测装置的发展。通过对其制作工艺的改进和采用新型窗口材料进行真空封接,使其分辨率达到了20lp/mm。     

一种用于计算三维视觉测量中线结构光平面的新型算法

介绍了一种基于线结构光的机器视觉测量系统的光平面计算方法.该方法采用图像减影来获取光条图像,利用Steger算法提取图像中的亚像素光条中心点,再用正交直线拟合法计算图像坐标系下的光条直线方程.通过靶标特征点的世界坐标和交比不变性,计算线结构光在靶标平面上的世界坐标点,并将这些坐标点用正交平面拟合法计算得到光平面方程.为了提高整体准确度,本文对算法进行了细节优化,给出了标定系统的设计方案和实验过程.实验结果表明,该方法具有较好的鲁棒性和较高的准确度.     

Multi-objective optimization of laser cutting for flash memory modules with special shapes using grey relational analysis

This paper presents a novel effective method for optimizing laser cutting of specially shaped electronic printed circuit board (PCB) carrier substrates of advanced integrated circuit (IC) back-end packages that have multiple performance characteristics identified using grey relational analysis (GRA). Laser cutting parameters, including laser beam parameters (average laser power and Q-switch frequency), focusing parameters (laser beam focusing spot size), and machine parameters (laser cutting speed), were optimized based on multiple performance characteristics. Some characteristics of the specially shaped flash memory module for IC packages, such as smart disk (SD) cards are verified. The characteristics of interest are the average surface roughness on a PCB substrate cross-section, and the maximum width of the heat-affected zone (HAZ). Eight experiments were conducted using GRA to optimize the settings for laser beam cutting parameters to generate various quality characteristics. Analysis of the grey relational grade indicates that parameter significance and the optimal parameter combination for the laser cutting process are identified. The analytical results from two confirmation experiments using the optimal parameters confirm that laser cutting technology can be effectively applied to cut substrates into special shapes.     

Optical interconnection in embedded-fiber printer circuit boards

Optical interconnection between vertical cavity surface emitting laser (VCSEL) and PIN on fiber-embedded printed circuit board (PCB) was studied in this paper. The whole project was introduced, and the technics by traditional manufacture machine of PCB was described in detail. Model of direct coupling structure between optical transceiver and fiber was analyzed by geometrical optics, and alignment tolerances were given. Performance parameters were tested. It was shown that the advantages of this method were low insertion loss, small size, big throughput, and compatible with traditional technics. It also could have a great application in fabrication of fiber interconnection backplane.     

355 nm DPSS UV laser cutting of FR4 and BT/epoxy-based PCB substrates

The 355 nm DPSS UV laser cutting of electronics printed circuit board (PCB) substrates including FR4, and BT/epoxy-based PCB substrates was investigated. The effects of various laser conditions such as scanning speed, assisting gas, repetition rate, and interval between scans on the heat affected zone (HAZ) and charring were studied. The quality and morphology of laser cut PCB substrates were evaluated with optical microscope, and scanning electron microscope (SEM). It was found that multi-pass cutting at high scanning speed can achieve high quality cutting with little charring. It was also found that with O₂ assist gas, a certain amount of interval time between scans and higher repetition rate led to less HAZ and less charring. High quality laser cutting of PCB substrates with no delamination, very little charring and minimum HAZ was demonstrated. The developed process has important potential applications in the electronics industry.     

一种基于信息理论的高动态范围图像评价方法

高动态范围图像(high dynamic range image)指的是扩大了景物可分辨的光照范围的图像。在HDRI成像中动态范围是难以量化测量的,必须将对动态范围的计算转化为其它易于计算的像质评价函数。HDRI图像的像质评价和普通图像的像质评价存在着较大不同。比较了几种像质评价的方法后,提出了利用图像的熵作为标准进行高动态范围成像评价的方法。利用一种自然图像的概率模型对图像的熵与成像动态范围之间的关系进行了数值模拟,得到了具有普遍意义上的理想成像动态范围的计算公式,公式指出了对自然景物完善成像所需的最大动态范围;给出了图像熵与动态范围之间的关系。利用这种关系可以经由计算图像的熵来对系统的动态范围特性做出评价。这种评价方法在指导高动态范围成像系统的设计,以及高动态范围成像系统的测试中将发挥重要的作用。