Correlation between photographic and electrical properties of the polymer–semiconductor–salt of metal photosensitive composition

In the current paper experimental data about changes in the electrical properties (relative permittivity) of the PVA–ZnO–BiCl₃ photosensitive composition under UV radiation are presented. Also the correlation between dielectric constant and density of optical blackening are investigated.     

Effects of gamma irradiation on electrical parameters of metal–insulator–semiconductor structure with silicon nitride interfacial insulator layer

The effects of gamma irradiation on electrical parameters of Au/Si₃N₄/n-Si (MIS) structure were investigated by using the capacitance–voltage (C–V) and conductance–voltage (G/ω–V) measurements. The MIS structure was irradiated using gamma-radiation source at a dose rate of 0.69?kGy/h. The C–V and G/ω–V measurements were carried out at a total dose range of 0–100?kGy for five different frequencies (1, 10, 100, 500 and 1000?kHz). The obtained results showed that the C and G/ω values decrease with the increasing radiation dose due to the irradiation-induced defects at the interface. Also, the observed decrease in the C and G/ω values with the increasing frequency was explained on the basis of interface states (N_ss). The values of series resistance (R_s) increase with the increasing radiation dose. To obtain the real capacitance and conductance of the capacitor, the measured values of C and G/ω were corrected to eliminate the effect of series resistance. The values of N_ss were determined by using the conductance method and were decreased with the increasing radiation dose.     

Improved interfacial and electrical properties of GaSb metal oxide semiconductor devices passivated with acidic （NH4）2S solution

Surface passivation with acidic(NH4)2S solution is shown to be effective in improving the interfacial and electrical properties of HfO2/GaSb metal oxide semiconductor devices. Compared with control samples, the samples treated with acidic(NH4)2S solution show great improvements in gate leakage current, frequency dispersion, border trap density, and interface trap density. These improvements are attributed to the enhancing passivation of the substrates, according to analysis from the perspective of chemical mechanism, X-ray photoelectron spectroscopy, and high-resolution cross-sectional transmission electron microscopy.     

Spectral properties of a metal–dielectric sensor structure

Numerical analysis of the spectral characteristics of a two-layer structure is performed in the processes of fabrication, measurement, and application of this structure as a sensor of the refractive index of the external medium. The effect of environmental conditions and parameters of the metal and dielectric layers on the sensor sensitivity is discussed. The results of model calculations are confirmed by experimental studies.     

Toward superlensing with metal–dielectric composites and multilayers

We report on the fabrication of two types of adjustable, near-field superlens designs: metal–dielectric composites and metal–dielectric multilayer films. We fabricated a variety of films with different materials, thicknesses and compositions. These samples were characterized physically and optically to determine their film composition, quality, and optical responses. Our results on metal–dielectric composites indicate that although the real part of the effective permittivity generally follows effective medium theory predictions, the imaginary part does not and substantially higher losses are observed. Going forward, it appears that multilayer metal–dielectric designs are more suitable for sub-diffraction imaging applications because they could provide both tunability and low loss.     

Improved electrical properties of HfTiO/GeO x N y gate dielectric Ge MOS capacitors by using wet–NO Ge-surface pretreatment

Reactive cosputtering is employed to prepare high-permittivity HfTiO gate dielectric on n-Ge substrate. Effects of Ge-surface pretreatment on the interface and gate leakage properties of the dielectric are investigated. Excellent performances of Al/HfTiO/GeO _x N _y /n-Ge MOS capacitor with wet–NO surface pretreatment have been achieved with a interface-state density of 2.1×10¹¹ eV⁻¹ cm⁻², equivalent oxide charge of −7.67×10¹¹ cm⁻² and gate leakage current density of 4.97×10⁻⁵ A/cm² at V _g =1 V.     

Effect of Ge doping on the electrical properties of amorphous Zn–Sn–O thin films

We report the effect of germanium doping on the active layer of amorphous Zinc–Tin-Oxide (a-ZTO) thin film transistor (TFT). Amorphous thin film samples were prepared by RF magnetron sputtering using single targets composed of Zn₂Ge_0.05Sn_0.95O₄ and Zn₂SnO₄ with variable oxygen contents in the sputtering gases. In comparison with undoped, Ge-doped a-ZTO films exhibited five order of magnitude lower carrier density with a significantly higher Hall-mobility, which might be due to suppressed oxygen vacancies in the a-ZTO lattice since the Ge substituent for the Sn site has relatively higher oxygen affinity. Thus, the bulk and interface trap densities of Ge-doped a-ZTO film were decreased one order of magnitude to 7.047 × 10¹⁸ eV⁻¹cm⁻³ and 3.52 × 10¹¹ eV⁻¹cm⁻², respectively. A bottom-gate TFT with the Ge-doped a-ZTO active layer showed considerably improved performance with a reduced SS, positively shifted V_th, and two orders of magnitude increased I_on/I_off ratio, attributable to the doped Ge ions.     

Investigation of electrical properties of HfO2 metal–insulator–metal (MIM) devices

This paper is devoted to the study of the electrical properties of Au/HfO₂/TiN metal–insulator–metal (MIM) capacitors in three distinctive modes: (1) alternative mode (C–f), (2) dynamic regime [thermally stimulated currents, TSCs I(T)] and (3) static mode [I(V)]. The electrical parameters are investigated for different temperatures. It is found that capacitance frequency C–f characteristic possesses a low-frequency dispersion that arises for high temperature (T > 300 °C). Accordingly, the loss factor exhibits a dielectric relaxation (with an activation energy E _a ~ 1.13 eV) which is intrinsically related to the diffusion of oxygen vacancies. The relaxation mechanisms of electrical defects in a dynamic regime (TSCs) analysis show that defect related to the TSC peak observed at 148.5 °C (E _a ~ 1 eV) is in agreement with impedance spectroscopy (C–f). On the other hand, when the MIM structures are analyzed in static mode, the I–V plots are governed by Schottky emission. The extrapolation of the curve at zero field gives a barrier height of 1.7 eV.     

Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack＊

A physical model for mobility degradation by interface-roughness scattering and Coulomb scattering is proposed for SiGe p-MOSFET with a high-k dielectric/SiO2 gate stack. Impacts of the two kinds of scatterings on mobility degradation are investigated. Effects of interlayer （SiO2） thickness and permittivities of the high-k dielectric and interlayer on carrier mobility are also discussed. It is shown that a smooth interface between high-k dielectric and interlayer, as well as moderate permittivities of high-k dielectrics, is highly desired to improve carriers mobility while keeping alow equivalent oxide thickness. Simulated results agree reasonably with experimental data.     

Effect of NO annealing on charge traps in oxide insulator and transition layer for 4H-SiC metal–oxide–semiconductor devices

The effect of nitric oxide(NO) annealing on charge traps in the oxide insulator and transition layer in n-type4H–Si C metal–oxide–semiconductor(MOS) devices has been investigated using the time-dependent bias stress(TDBS),capacitance–voltage(C–V),and secondary ion mass spectroscopy(SIMS).It is revealed that two main categories of charge traps,near interface oxide traps(Nniot) and oxide traps(Not),have different responses to the TDBS and C–V characteristics in NO-annealed and Ar-annealed samples.The Nniotare mainly responsible for the hysteresis occurring in the bidirectional C–V characteristics,which are very close to the semiconductor interface and can readily exchange charges with the inner semiconductor.However,Not is mainly responsible for the TDBS induced C–V shifts.Electrons tunneling into the Not are hardly released quickly when suffering TDBS,resulting in the problem of the threshold voltage stability.Compared with the Ar-annealed sample,Nniotcan be significantly suppressed by the NO annealing,but there is little improvement of Not.SIMS results demonstrate that the Nniotare distributed within the transition layer,which correlated with the existence of the excess silicon.During the NO annealing process,the excess Si atoms incorporate into nitrogen in the transition layer,allowing better relaxation of the interface strain and effectively reducing the width of the transition layer and the density of Nniot.     

Effect of annealing temperature on the electrical properties of Au/Ta2O5/n-GaN metal–insulator–semiconductor (MIS) structure

We report on the effect of an annealing temperature on the electrical properties of Au/Ta₂O₅/n-GaN metal–insulator–semiconductor (MIS) structure by current–voltage (I–V) and capacitance–voltage (C–V) measurements. The measured Schottky barrier height (Φ _bo) and ideality factor n values of the as-deposited Au/Ta₂O₅/n-GaN MIS structure are 0.93 eV (I–V) and 1.19. The barrier height (BH) increases to 1.03 eV and ideality factor decreases to 1.13 upon annealing at 500 ^°C for 1 min under nitrogen ambient. When the contact is annealed at 600 ^°C, the barrier height decreases and the ideality factor increases to 0.99 eV and 1.15. The barrier heights obtained from the C–V measurements are higher than those obtained from I–V measurements, and this indicates the existence of spatial inhomogeneity at the interface. Cheung’s functions are also used to calculate the barrier height (Φ _bo), ideality factor (n), and series resistance (R _s ) of the Au/Ta₂O₅/n-GaN MIS structure. Investigations reveal that the Schottky emission is the dominant mechanism and the Poole–Frenkel emission occurs only in the high voltage region. The energy distribution of interface states is determined from the forward bias I–V characteristics by taking into account the bias dependence of the effective barrier height. It is observed that the density value of interface states for the annealed samples with interfacial layer is lower than that of the density value of interface states of the as-deposited sample.     

Optical switch effect of metal–dielectric–metal plasmonic waveguide coupled with stub structure

The transmission line theory (TLT) and the finite difference time domain (FDTD) method are applied to investigate the optical transmission characteristics of the metal–dielectric–metal (MDM) plasmonic waveguide coupled with a stub structure. The transmission rate of the FDTD simulation results demonstrates periodically variation from less than 1% to more than 92% as a function of the length of the stub, which fits well with the results of TLT. Furthermore, the transmission also performs a periodically switch distribution with the change of the refractive index of the stub from 1.0 to 2.0 gradually. Both methods are adopted for modulating the superposition phase of the interference between the reflected surface plasmon polaritons (SPPs) wave from the end of the stub and the passing SPPs wave in the waveguide, which can be interpreted as the principle mechanism for the optical switch effect of the MDM waveguide with a stub structure.     

Investigation on latch-up susceptibility induced by high-power microwave in complementary metal–oxide–semiconductor inverter

The latch-up effect induced by high-power microwave(HPM) in complementary metal–oxide–semiconductor(CMOS) inverter is investigated in simulation and theory in this paper. The physical mechanisms of excess carrier injection and HPM-induced latch-up are proposed. Analysis on upset characteristic under pulsed wave reveals increasing susceptibility under shorter-width pulsed wave which satisfies experimental data, and the dependence of upset threshold on pulse repetitive frequency(PRF) is believed to be due to the accumulation of excess carriers. Moreover, the trend that HPMinduced latch-up is more likely to happen in shallow-well device is proposed.Finally, the process of self-recovery which is ever-reported in experiment with its correlation with supply voltage and power level is elaborated, and the conclusions are consistent with reported experimental results.     

Influence of self-assembled monolayer chain length on modified gate dielectric pentacene thin-film transistors

Self-assembled monolayers are widely used to modify the gate dielectric/semiconductor interface in organic thin-film transistors. By modifying the interaction between the molecular semiconductor and the substrate, thin-film ordering and the electronic properties of the semiconducting channel can be controlled. The modified semiconductor/dielectric properties result in macroscopically observed changes in the charge-carrier mobilities, threshold voltages, subthreshold swing and transfer characteristic hysteresis. The latter two are determined by the density of charge-trapping states at the interface. Here, we investigate the influence of the thickness of the self-assembled monolayer, via the alkyl chain length in n-alkyl phosphonic acid-based monolayers on SiO₂, on the electronic properties of pentacene-based organic thin-film transistors. Rather than a monotonic increase or decrease in performance with increasing chain length, we have found that the optimum performance occurs with chains of 8–10 carbon atoms. Atomic force microscopy shows a correlation between pentacene crystalline grain size and transistor performance.     

Crystallization annealing effects on ferroelectric properties of Al-Doped HfO2 thin film capacitors using indium–tin–oxide electrodes

To investigate the effect of indium-tin-oxide (ITO) electrode on the Al-doped HfO₂ (Al:HfO₂) ferroelectric thin films, we fabricated and characterized the ITO/Al:HfO₂/ITO and ITO/Al:HfO₂/TiN capacitors by changing the annealing conditions. The ferroelectric remnant polarization (2P_r) was obtained to be 13.25 μC/cm² for the ITO/Al:HfO₂/TiN capacitors with the post-deposition annealing, which was termed T1. The 2P_r decreased after the post-metallization annealing due to the interface degradation between the Al:HfO₂ and ITO electrode. Alternatively, the switching time and activation field of the T1 for the ferroelectric polarization switching were 1.25 μs and 1.15 MV/cm. These parameters were sensitively influenced by the interfacial dead layer formation and the amounts of ferroelectric orthorhombic phase. Furthermore, the fatigue endurance of the T1 were improved by preventing the crowding of oxygen vacancies at interfaces between the Al:HfO₂ and top electrodes, in which the polarization values did not experience marked variations even after the fatigue cycles of 10⁸.     

Polarization-preserving anisotropic mirror on the basis of metal–dielectric nanocomposite

The model of a polarization-preserving anisotropic mirror is proposed. The mirror is a plane boundary of a metal–dielectric nanocomposite that consists of silver spheroidal nanoparticles dispersed in a transparent matrix. The dependence of reflection spectra on the shape of the nanoparticles is studied. It is shown that in one region of the spectrum, the mirror preserves the sign of polarization in the reflected light.     

Theoretical analysis of soliton NOR gate with semiconductor optical amplifier-assisted Mach–Zehnder interferometer

Optical and Quantum Electronics - We developed gigawatt laser system on diode-pumped Nd:Cr:YAG microchip sub-nanosecond laser and lamp pumped Nd:YAG multistage amplifier. Pulse energy up to...