磁控溅射淀积掺Er富Si氧化硅膜中Er3+ 1.54μm光致发光

用磁控溅射淀积不同富Si程度的掺Er富Si氧化硅薄膜.室温下测量其光致发光谱,观察到各谱中都含有1.54和1.38μm两个发光峰,其中1.54和1.38μm的光致发光峰分别来自Er³⁺和氧化硅中某种缺陷.系统研究了Er³⁺1.54μm光致发光峰强度对富Si程度及退火温度的依赖关系.还发现1.54μm发光峰强度与1.38μm发光峰强度相互关联,对此进行了讨论 关键词： Er 富Si氧化硅 光致发光 纳米硅     

磁控溅射淀积掺Er富Si氧化硅膜中Er~(3 ) 1.54μm光致发光

用磁控溅射淀积不同富Si程度的掺Er富Si氧化硅薄膜 .室温下测量其光致发光谱 ,观察到各谱中都含有 1.5 4和 1.38μm两个发光峰 ,其中 1.5 4和 1.38μm的光致发光峰分别来自Er3 和氧化硅中某种缺陷 .系统研究了Er3 1.5 4μm光致发光峰强度对富Si程度及退火温度的依赖关系 .还发现 1.5 4μm发光峰强度与 1.38μm发光峰强度相互关联 ,对此进行了讨论     

掺铒纳米晶硅和掺铒非晶纳米硅薄膜的发光性质

采用等离子体增强化学气相沉积（PECVD）方法制备含有纳米晶硅的SiO2（NCSO）和含有非晶纳米硅颗粒的氢化非晶氧化硅（a—SiOx：H）薄膜。采用离子注入和高温退火方法将稀土Er掺入含有纳米晶硅（ncSi）和非晶纳米硅（a—n—Si）颗粒的基体中。利用IFS／20HR傅里叶变换红外光谱仪和微区拉曼散射光谱仪研究含有纳米晶硅和非晶纳米硅颗粒的薄膜掺稀土前后的发光特性。结果表明来自Be-Si在800nm的发光强度比来自a—SiOx：H基体中非晶纳米硅的发光强度高近一个数量级,而来自a-SiOx：H在1．54μm的发光强度比NCSO高4倍。还研究了掺铒a-SiOx：H薄膜中Si颗粒和Er^3＋的发光强度随退火温度的变化,结合掺铒纳米晶硅和非晶纳米硅薄膜发光强度随Er掺杂浓度变化和Raman散射等的测量结果,进一步明确指出a-Si颗粒在Er^3＋的激发中可以起到和nc-Si同样的作用,即作为光吸收介质和敏化剂的作用。     

退火温度对富硅氮化硅薄膜发光特性和结构的影响

采用直流等离子体增强化学气相沉积(PECVD)法在(100)单晶硅片表面生长富硅氮化硅薄膜,研究了不同的退火温度对氮化硅薄膜发光性质和结构的影响。研究发现,随着退火温度的升高,氮化硅薄膜的发光强度逐渐减弱,发光是由缺陷能级引起的,在900 ℃时荧光基本消失。XPS测试表明,在N₂氛围900 ℃下退火,氮化硅薄膜中未有硅相析出,故未表现出硅量子点的发光。FTIR测试也为PL结论提供了一定的证据。     

包埋于氮化硅薄膜中的硅团簇的光致发光特性

采用等离子体增强化学气相沉积(PECVD)技术,在低温下制备了富硅氢化氮化硅薄膜。利用红外吸收(IR)谱,光电子能谱(XPS)和光致发光(PL)谱,研究了在不同温度下退火的薄膜样品的结构和发光特性。在经过低温退火的薄膜中观测到一个强的可见发光峰。当退火温度较高时,随着与硅悬键有关的发光峰消失,可见发光峰位发生了蓝移。讨论了退火对薄膜中硅团簇的形成及其对发光的影响。根据Raman谱,计算了氮化硅薄膜中硅团簇的尺寸大小。通过实验结果和分析,我们认为PL谱中较强的室温可见发光峰来自于包埋于氮化硅中的硅团簇。     

快速热退火和氢等离子体处理对富硅氧化硅薄膜微结构与发光的影响

采用microRaman散射、傅里叶变换红外吸收谱和光致发光谱研究了快速热退火及氢等离子体处理对等离子体增强化学气相沉积法200℃衬底温度下生长的富硅氧化硅(SRSO)薄膜微结构和发光的影响.研究发现,在300—600℃范围内退火,SRSO薄膜中非晶硅和SiOx∶H两相之间的相分离程度随退火温度升高趋于减小;而在600—900℃范围内退火,其相分离程度随退火温度升高又趋于增大;同时发现SRSO薄膜发光先是随退火温度的升高显著加强,然后在退火温度达到和超过600℃后迅速减弱;发光峰位在300℃退火后蓝移,此后随退火温度升高逐渐红移.对不同温度退火后的薄膜进行氢等离子体处理,发光强度不同程度有所增强,发光峰位有所移动,但不同温度退火样品发光增强的幅度和峰位移动的趋势不同.分析认为退火能够引起薄膜中非晶硅颗粒尺度、颗粒表面结构状态以及氢的存在和分布等方面的变化.结果表明不仅颗粒的尺度大小,而且颗粒表面的结构状态都对非晶硅颗粒能带结构和光生载流子复合机理发挥重要影响 关键词： 富硅氧化硅 微结构 发光 快速热退火     

富硅氮化硅薄膜的制备及其光学带隙研究

采用双极脉冲磁控反应溅射法在不同参数条件下制备了一系列氮化硅薄膜。利用数字式显微镜和紫外-可见光光谱仪研究了沉积薄膜的表面形貌及其光学带隙,利用共焦显微拉曼光谱仪比较了硅衬底、氮化硅薄膜退火前后的拉曼光谱。结果表明,氮气流量对薄膜的光学带隙影响较大,制备的薄膜主要为富硅氮化硅薄膜。原沉积薄膜的拉曼光谱存在明显的非晶硅和单晶硅峰,退火处理后非晶硅峰减弱或消失,表明薄膜出现明显的结晶化;单晶硅峰出现频移现象,表明薄膜中出现硅纳米颗粒,平均尺寸约为6.6 nm。     

包含硅量子点的富硅SiNx 薄膜结构与发光特性

采用等离子体增强化学气相沉积法, 以NH₃与SiH₄为反应气体, n型单晶硅为衬底, 低温(220 ℃)沉积了富硅氮化硅(SiN_x)薄膜. 在N₂氛围中, 于500–1100 ℃ 范围内对样品进行了热退火处理. 采用Raman 光谱技术分析了薄膜内硅量子点的结晶情况, 结果表明, 当退火温度低于950 ℃时, 样品的晶化率低于18%, 而当退火温度升为1100 ℃, 晶化率增加至53%, 说明大部分硅量子点都由非晶态转变为晶态. 实验通过Fourier 变换红外吸收(FTIR)光谱检测了样品中各键的键合结构演变, 发现Si–N键和Si–H键随退火温度升高向高波数方向移动, 说明了薄膜内近化学计量比的氮化硅逐渐形成. 实验还通过光致发光(PL)光谱分析了各样品的发光特性, 发现各样品中均有5个发光峰, 讨论了它们的发光来源, 结合Raman光谱与FTIR光谱表明波长位于500–560 nm的绿光来源于硅量子点, 其他峰则来源于薄膜内的缺陷态. 研究了硅量子点的分布和尺寸对发光带移动的影响, 并根据PL峰位计算了硅量子点的尺寸, 其大小为1.6–3 nm, 具有良好的限域效应. 这些结果有助于制备尺寸不同的硅量子点和基于硅量子点光电器件的实现. 关键词： 硅量子点 氮化硅薄膜 光致发光 Fourier 变换红外吸收     

高浓度Er/Yb共掺ZnO薄膜的结构及室温光致发光特性

采用射频磁控溅射方法制备了Er/Yb共掺ZnO薄膜,研究了退火处理对高浓度Er/Yb共掺ZnO薄膜的结构演化和光致发光(PL)特性的影响。X射线衍射分析结果表明:Er/Yb掺杂导致ZnO薄膜的晶粒细化及择优取向性消失,ZnO晶粒随退火温度的增加而逐渐长大。900℃退火时,出现Er3 、Yb3 偏析,退火温度高于1000℃时,薄膜与基体间发生了界面反应,1200℃时,ZnO完全转变为Zn2SiO4相。光致发光测量结果表明:高于900℃退火处理后,Er/Yb共掺ZnO薄膜在1540 nm附近具有明显的光致发光,发光强度在退火温度为1050℃时达到最大值;光致发光光谱呈现典型的晶体基质中Er3 离子发光光谱所具有的明锐多峰结构特征。此外,探讨了薄膜结构演化及其对光致发光光谱的影响。     

退火温度对Er/Yb共掺Al2O3薄膜的光致荧光光谱的影响

通过对不同退火条件下Er/Yb共掺Al2O3薄膜光致荧光(PL)光谱的系统分析,研究了高Er/Yb掺杂浓度所导致的晶体场变化对薄膜PL光谱的影响,并结合薄膜结构分析,探讨了Al2O3薄膜的结晶状态在Er3+激活、PL光谱宽化中的作用及可能的物理机理.研究结果表明:退火处理所导致的Er3+ PL光谱的变化与薄膜的微观状态之间有着密切的联系.在600-750℃范围内,薄膜呈非晶态结构,薄膜荧光强度的增加主要是薄膜内缺陷减少所致;在800-900℃范围内,γ-Al2O3相的出现是导致荧光强度明显增加的主要原因;当退火温度为1000℃时,Er,Yb的大量析出致使荧光强度的急剧下降.此外,对PL光谱线形分析表明,各子能级跃迁的相对强度变化是导致荧光光谱宽化的主要因素.     

退火及溅射气氛对氮化硅薄膜光致发光的影响

利用射频磁控反应溅射方法制备富硅的氮化硅薄膜。衬底材料为抛光的硅片,靶材为硅靶,在Ar-N₂气环境下,通过改变两种气体的组分比来改变样品成分,并在高纯N₂气氛下对其进行高温退火处理。用X射线光电子能谱(XPS)和X射线衍射(XRD)对样品进行了表征,并测试了样品的光致发光谱 (PL)。实验结果表明：X射线光电子能谱中出现了Si—N键合结构,同时还有少量的Si—O键生成,通过计算得出Si/N比值约为1.51,制备出了富硅的氮化硅薄膜;薄膜未经退火前,在可见光区域没有观察到明显的光致发光峰,经过高温退火后,XRD中新出现的衍射峰证实了纳米硅团簇的生成,PL图谱中在可见光区域出现了光致发光峰的蓝移现象,结合XRD结果,用纳米晶的量子限域效应对上述现象进行了合理解释。     

Photoluminescence from Er-doped silicon rich oxide thin films

 Photoluminescence (PL) properties of Er-doped silicon rich oxide thin films deposited on Si substrate by co-evaporation of silicon monoxide and Er under different atmospheres are investigated. The samples exhibit luminescence peak at 1.54 μm which could be assigned to the recombination in intra-4f Er³⁺ transition. PL shows that this transition is highest when ammonia atmosphere is used during deposition followed by an annealing temperature at 850 °C in 95% N₂+5% H₂ gas (forming gas). In fact, we believe that the presence of the N atoms around Er ions increases the intensity of the 1.54 μm luminescence.     

Effect of excimer laser annealing on the silicon nanocrystals embedded in silicon-rich silicon nitride film

The investigations of silicon-rich silicon nitride film grown by plasma-enhanced chemical vapor deposition and then annealed by excimer laser have been carried out systematically. The surface roughness and the crystallization of the films have significantly been improved after the excimer laser annealing. The samples demonstrate visible photoluminescence emission under optical excitation at room temperature. It is found that the emission peak energy as well as emission intensity changes with laser annealing conditions, and the relevant mechanism is discussed in detail. Our investigation exhibits the size controllability of silicon nanocrystals embedded in the silicon nitride film, which implies promising applications in optoelectronic devices such as light-emitting diodes and solar cells.     

Comparative study between silicon-rich oxide films obtained by LPCVD and PECVD

A comparative study of compositional and optical properties of silicon-rich oxide (SRO) films deposited by low-pressure chemical vapor deposition (LPCVD) and plasma-enhanced chemical vapor deposition (PECVD) is presented. Infrared spectra revealed the presence of hydrogen bonded to silicon atoms in the SRO–PECVD films, whereas in SRO–LPCVD films the IR spectra looked like the stoichiometric thermal silicon oxide. Moreover, X-ray photoelectron spectroscopy (XPS) studies showed that the SRO–PECVD films contain a higher content of nitrogen than SRO–LPCVD films. In spite of differences, the SRO films obtained by both methods show a strong room-temperature photoluminescence (PL). However, the highest PL intensity was emitted by SRO films obtained by LPCVD.     

不同退火条件对纳米多孔氧化铝薄膜光致发光的影响

以草酸为电解液,采用二次阳极氧化法制备出了纳米多孔氧化铝薄膜,经不同退火温度和退火气氛处理氧化铝薄膜后,通过分析其光致发光光谱得出：相同的退火气氛中, 退火温度T≤600 ℃ 时,T=500 ℃具有最大的光致发光强度;退火温度T≥700 ℃时,随着退火温度的升高,样品的发光强度增大。在不同的退火气氛中,多孔氧化铝薄膜随着退火温度的升高,发光峰位改变不同,即在空气中退火处理后,随着退火温度的升高,发光峰位蓝移,而在真空中退火处理后,发光峰位并不随退火温度的升高而变化;通过对1 100 ℃高温退火处理后的氧化铝薄膜的光致发光曲线的高斯拟合,可以看出,经退火处理后的多孔氧化铝,主要存在三个发光中心,发光曲线在350～600 nm范围内对应三个发射峰, 发射波长分别为387,410,439 nm。相同的退火温度下,空气中退火得到的氧化铝薄膜的光致发光强度大于真空中退火处理后的氧化铝薄膜。基于实验结果,结合X射线色散能谱(EDS)、红外反射光谱等表征手段,探讨了多孔氧化铝薄膜的发光机制,并对经过不同退火条件得到的多孔氧化铝薄膜的光致发光特性的改变做出了合理的解释。     

Influence of the temperature on the photoluminescence of silicon clusters embedded in a silicon oxide matrix

Amorphous silicon oxide thin films were prepared by co-evaporation of Si and SiO in ultra-high vacuum. Different compositions were obtained by changing the evaporation rate of silicon. After thermal annealing treatments, the dissociation of the silicon oxide in pure silicon and silicon dioxide leads to the formation of silicon clusters embedded in a silicon oxide matrix. Thus the samples were annealed to different temperatures up to 950°C. Depending on the annealing temperature and on the composition, different cluster sizes were obtained. The photoluminescence (PL) energy depends on the cluster size and a large range of wavelengths is obtained from 500 to 750 nm. The PL, attributed to a confinement effect of the electron–hole pairs in the silicon particles, is studied as a function of the temperature. It is demonstrated that the continuous decrease of PL intensity with the temperature from 77 to 500 K depends on the structure of the samples. For samples with well-separated clusters, the PL decreases rapidly with the temperature. For samples containing clusters separated by a small distance, the PL weakly depends on the temperature. No shift of the energy is observed. The results are discussed by taking into account the competition between the radiative recombination in the silicon clusters and the non-radiative escape of the carriers via a hopping mechanism.     

The effects of ambient oxygen pressure on the 1.54 μm photoluminescence of Er-doped silicon-rich silicon oxide films grown by laser ablation of a Si+Er target

We fabricated Er-doped silicon-rich silicon oxide (SRSO:Er) films by pulsed laser deposition. A Si+Er target consisting of an Er metallic strip and a silicon disk was adopted with a goal to achieve a convenient control of the Er and oxygen density in the film. We found that the photoluminescence (PL) at 1.54 m is highly dependent on the ambient oxygen pressure, which determines the relative ratio of Si-Si, SiO_x, and SiO₂ phase in the film. The PL intensity increased drastically with increase in the annealing temperature and reached the maximum intensity at 500 °C. PACS 81.15.Fg; 81.07.-b     

1.54 μm room temperature emission from Er-doped Si nanocrystals deposited by ECR-PECVD

In this work, silicon nanocrystals (Si-nc) embedded in a silicon-rich silicon oxide (SRSO) matrix doped with Er³⁺ ions for different erbium and silicon concentrations have been deposited by electron-cyclotron resonance plasma-enhanced chemical-vapor-deposition (ECR-PECVD) technique. Their optical properties have been investigated by photoluminescence (PL) and reflectance spectroscopy.Room temperature emission bands centered at ∼1.54 and at 0.75 μm have been obtained for all samples. The most intense emission band at ∼1.54 μm was obtained for samples with concentrations of 0.45% and 39% for erbium and silicon, respectively. Moreover, it has been found that the broad emission band centered at ∼0.75 μm for all samples shows a very strong interference pattern related to the a specific sample structure and a high sample quality.