Accuracy and sensitivity of a hole drilling and digital speckle pattern interferometry combined technique to measure residual stresses

This paper reports on the accuracy and sensitivity of digital speckle pattern interferometry (DSPI) when it is combined with the hole drilling technique for measuring residual stresses. The in-plane displacement field generated by the introduction of a small hole is determined using an automated data analysis approach. This method is based on the calculation of the optical phase distribution through a phase-shifting method and the application of a robust iterative phase unwrapping algorithm. It is experimentally demonstrated that residual stresses can be measured with a relative uncertainty of 7.5%. It is also shown that the minimum value of residual stress that can be determined with the DSPI and hole drilling combined technique is about 10% of the yield stress of the material.     

Combined implementing the hole-drilling method and reflection hologram interferometry for residual stresses determination in cylindrical shells and tubes

Main features inherent in simplified approach to residual stresses determination in cylindrical shells and tubes, external diameter of which is not less than 60 mm, by combing the hole-drilling method and reflection hologram interferometry are discussed in detail. Initial experimental information in a form of hole diameter increments in principal stress directions is derived from high-quality reflection holograms recorded near cylindrical objects of intermediate curvature value. Converting measured parameters into required stress values is based on the transition model that corresponds to plane stress conditions of pure membrane type. The technique developed is capable of determining residual stress component values within 5% accuracy in an absence of stress gradients over the probe hole diameter when a type of residual stress field corresponds to the transition model adopted. The accuracy analysis involved is based on matrix formulation of conventionally direct problem and an assumption on a pure membrane character of residual stress field under study for thin-walled shell. Required error estimations in a case of inspecting thick-walled cylindrical tube are obtained by combining the above-mentioned approach and an analogy of reconstructed fringe patterns with actual and artificial interferograms, which follow from drilling blind hole of the same geometrical parameters in thick-walled plates. Experimental verification of the developed approach is founded upon a determination of actual stresses in thin-walled cylindrical shell and obtaining residual stress distributions at the proximity of welded joint in thick-walled cylindrical tube.     

A least-squares method to cancel rigid body displacements in a hole drilling and DSPI system for measuring residual stresses

This paper presents the evaluation of a method to cancel rigid body displacements that can be introduced when a hole drilling and digital speckle pattern interferometry (DSPI) combined system is used to measure residual stresses. The proposed method is based on a least-square calculation of three correction parameters determined from two evaluation lines located near the edge of the phase map where the displacement field generated by the drilling process is supposed to be negligible. The errors introduced by the method for different residual stress levels and rigid body displacements are analysed using a numerical simulation. An application of the method to experimental data is also presented.     

The holographic-hole drilling method for residual stress determination

Holographic-hole drilling is a method developed for the rapid determination of residual stresses from an optical interference fringe pattern. A small diameter blind hole is drilled into a part containing residual stresses, and the displacements caused by localized stress relief are registered by real-time holographic interferometry. The resulting fringe pattern is evaluated to calculate residual stresses, using a simple ‘fringe counting’ method described here. Results of applying the method in laboratory tests to a variety of uniform biaxial states-of-stress from equibiaxial compression to pure shear are shown. Two sample applications of the method, the evaluation of residual stresses at a cold-worked hole and at a weld bead, are also given. Extensions of the method to evaluate stresses non-uniform in depth and/or along the surface are discussed.     

Classification of holographic fringe patterns inherent in through hole drilling in residual stress field

Comparative analysis of actual fringe patterns, which are induced by combined implementing the hole drilling method and reflection hologram interferometry for residual stresses determination, is presented. Involved considerations are related to plane thin-walled structural elements. A set of interferograms of perfect (ideal) form is selected proceeding from one-side measurements. A base for recognising each specific ideal configuration is a fine coincidence between actual interferograms and analogous reference fringe patterns constructed for the same stress state. Perfect (ideal) both actual and reference fringe patterns are defined as a response of pure membrane 2D stress field on through hole drilling between exposures. Main principles of creating the regular catalogue of reference fringe patterns inherent in through hole drilling in thin-walled components are formulated. Emphasis is made on a careful collecting and classifying actual interferograms with clear indications of bending stress presence in total residual stress field. Evidences needed for a reliable classification of the type of residual stresses field of interest are established and verified. A response of superimposed residual stress field, which consists of both membrane and bending components, is characterised by various deviations of each specific fringe pattern from an ideal form. More deep analysis of fringe patterns related to superimposed residual stress field is based on specially designed technique. The main essence of the approach developed is simultaneous measurements of through hole distortions in two principal strain directions on opposite sides of thin plane specimen. These sides are faces of the drill entrance and exit. Sophisticated optical set-up that is capable of obtaining high-quality fringe patterns in the course of two-side measurements is developed and implemented. Typical set of fringe patterns obtained for single probe hole on opposite specimen faces is presented.     

Residual stresses deriving from holographic interferometry data on a base of inverse problem solution

A transition model, which is capable of obtaining both membrane and bending residual stress components from initial experimental information, is developed for thin-walled plane structures. The determination of residual stresses is based on the combined implementing of the hole-drilling method and reflection hologram interferometry. Required input data are obtained by simultaneous measurements on through hole distortions in two principal strain directions on opposite sides of thin plane specimen. These sides are faces of the drill entrance and exit. Superimposed residual stresses field, which consists of both membrane and bending components, is a reason for the various deviations of each specific fringe pattern from an ideal form. This fact is a clear experimental indication of the bending stress contribution in a total stress field. Two ways of decomposition of superimposed residual stresses field are proposed and analysed in detail. Emphasis is laid on a careful quantitative formulation of the inverse problem needed for an accurate deriving both membrane and bending residual stress components. It is shown that an availability of two-side initial data is both an essential and necessary condition of such a formulation. Detailed analysis of an accuracy of the results obtained is performed. This analysis is based on a wide set of both actual interferograms and analogous reference fringe patterns related to superimposed residual stress field under study. Comparing residual stress values obtained proceeding from one-side and two-side data are presented for different types of superimposed field of interest.     

Degradation of Ultra-Thin Gate Oxide NMOSFETs under CVDT and SHE Stresses

Degradation of device under substrate hot-electron (SHE) and constant voltage direct-tunnelling (CVDT)stresses are studied using NMOSFET with 1.4- nm gate oxides. The degradation of device parameters and the degradation of the stress induced leakage current (SILC) under these two stresses are reported. The emphasis of this paper is on SILC and breakdown of ultra-thin-gate-oxide under these two stresses. SILC increases with stress time and several soft breakdown events occur during direct-tunnelling (DT) stress. During SHE stress, SILC firstly decreases with stress time and suddenly jumps to a high level, and no soft breakdown event is observed. For DT injection, the positive hole trapped in the oxide and hole direct-tunnelling play important roles in the breakdown. For SHE injection, it is because injected hot electrons accelerate the formation of defects and these defects formed by hot electrons induce breakdown.     

Determination of residual stress by use of phase shifting moiré interferometry and hole-drilling method

A phase-shifting moiré interferometry and hole-drilling combined system was developed to determine residual stresses. The relationship between the 2D displacement data of three points around the drilled hole and the residual stresses relieved by hole-drilling was established. The experimental setup consisted of a four-beam moiré interferometer and a computer-controlled hole-drilling system. Two phase shifters controlled by computer were fixed in two of the four optic paths to directly get the displacement data. With special residual stresses calculation software, the phase distributions of the u and v field obtained by moiré interferometry were quickly converted into values of residual stresses. To analyze the accuracy of this experimental system, an aluminum specimen with a blind hole in the center was real-time tensioned in this system. The displacement field obtained by phase shifting moiré interferometry was compared with the finite element method solution. Good agreement was found with respect to each other. As an application, the in-depth residual stresses of a shot-peened aluminum plate were measured by this method, and possible error sources were discussed.     

激光冲击强化“残余应力洞”的形成机制

利用ABAQUS有限元软件进行了单个圆形高斯光斑的激光冲击强化数值模拟,分析材料表面光斑中心区域形成的"残余应力洞"现象,并通过分析材料的动态力学响应特征揭示了"残余应力洞"的形成机制。结果表明:在冲击波加载时,光斑边界处会产生很强的剪切应力,形成向四周传播的表面稀疏波和向材料内部传播的剪切波。当稀疏波同时传播到光斑中心,发生相遇、汇聚,使材料产生急剧的上下位移过程,造成冲击波加载塑性变形后的二次塑性变形。二次塑性变形中形成了较大的剪切塑性应变,并降低了冲击波加载阶段产生的轴向和径向塑性应变,使残余压应力降低,从而形成"残余应力洞"。     

An analysis of residual stress patterns resulting from hole expansion in an infinite plate, a thick cylinder, and an asymmetric lug

Residual stresses were induced in three specimen geometries: a quasiinfinite plate, a thick cylinder and an asymmetric lug. In each case, a hole expansion process was used, whereby the bore was expanded into the plastic regime; this in effect left residual compression at the bore and residual tension in the far field. In view of the symmetry, the stress patterns in the quasi-infinite plate were measured by a hole drilling method, using an interferometric moiré method to measure the resulting strain patterns. In the case of the thick cylinder and the asymmetric lug, the residual stresses were evidenced by a dissection method. A comparison with theoretical treatments shows that the theory predicts an approximate upper bound to the actual stress levels in the quasi-infinite plate. In the lug geometry, there was a similar systematic difference between theory and experiment.     

Determination of residual stresses using hole drilling and digital speckle pattern interferometry with automated data analysis

A digital speckle pattern interferometry and hole drilling combined system is developed to determine the magnitude of the residual stress in a aluminum thin plate subjected to an uniform uniaxial tensile load. Performing automated fringe analysis, the optical data contained in the speckle interferograms are quickly converted into values of residual stress. The evaluation is carried out through the measurement of the in-plane displacement field generated by the introduction of the small hole. The displacement field is determined from the calculation of the optical phase distribution by means of a phase shifting method. The magnitude of the residual stress is finally evaluated through a least-squares calculation and compared with the stress value applied to the specimen.     

Effects of processing parameters on fatigue properties of LY2 Al alloy subjected to laser shock processing

We address the effects of processing parameters on residual stresses and fatigue properties of LY2 Al alloy by laser shock processing (LSP). Results show that compressive residual stresses are generated near the surface of samples due to LSP. The maximum compressive residual stress at the surface by two LSP impacts on one side is higher than that by one LSP impact. The maximum value of tensile residual stress is found at the mid-plane of samples subjected to two-sided LSP. Compared with fatigue lives of samples treated by single-sided LSP, lives of those treated by two-sided LSP are lower. However, these are higher than untreated ones.     

残余应力对光弹实验中超声图像的干扰分析

动态光弹成像技术是观测固体内部超声应力场的重要手段,然而样品在制作过程中会产生残余应力,给观测带来一定干扰,特别是缺陷附近的应力集中效应,使得缺陷散射声场的研究更为困难。本文利用线性应力理论分析了超声应力与残余应力的相互关系,并推导出该叠加应力场在光弹系统中的光强表达式,通过实验验证,证明了该理论的可行性。本文结果可为应力集中区域的散射声场分析提供借鉴。     

Laser cutting of holes in thick sheet metals: Development of stress field

Laser cutting of hole in a mild steel thick sheet metal is investigated. Temperature and stress fields developed around the cutting section are simulated using the finite element method. An experimental is carried out accommodating the simulation parameters. The residual stress developed in the cutting section is measured using the XRD technique and findings are compared with the predictions. Optical microscopy and SEM are carried out to examine the morphological changes in the cutting sections. It is found that temperature decays sharply in the region of the laser heat source, which results in high temperature gradient in this region. This causes the development of high stress levels around the cut edges. The residual stresses predicted are in agreement with the measured results.     

A role of fringe pattern catalogue in the course of interferometrically based determination of residual stresses by the hole-drilling method

A further development of the technique for residual stresses determination in thick-walled structures, which is based on a combination of the hole-drilling method and reflection hologram interferometry, is presented. A plane specimen welded from two equal parts of dimensions 130×80 mm² in plane and thickness 12 mm is the object of investigation. Weld seam is performed along the shortest side of the specimen. Residual stress field of interest is formed by a superposition of initial welding-induced field and secondary stress field caused by plastic deformation of the specimen. A set of actual fringe patterns, which corresponds to a wide variety of residual stress components both ratio and sign, are reconstructed and presented as illustrations. A series of reference fringe patterns is simulated for the most typical cases inherent in residual stress field under study. It is shown that actual interferograms obtained belong to three main groups depending on a typical form of fringes configuration. On this base the main principles of creating the general catalogue of fringe patterns are established and the first version of this catalogue, which is related to reflection hologram interferometry, is developed. A structure of the catalogue that consists of both actual interferograms and reference fringe patterns is described. Possible ways of further catalogue completing and its direct implementing in the course of quantitative determination of residual stresses are discussed. It is shown that both experimental and numerical data aggregated into the first version of the catalogue can be effectively used for a verification of various coherent optics techniques with respect to a determination of residual stress components by means of hole drilling. An analysis of capabilities of reflection hologram interferometry in the field of residual stresses determination comparing with dual-beam speckle-interferometric techniques is presented. Superimposed residual stress field is quantitatively described in detail for both specimen sides of dimensions 260×80 mm². It is shown that fine nuances inherent in residual stress distributions over different specimen faces can be reliably derived from recorded fringe patterns of any type. This study serves as an example of residual stress components determination in real structure with a type of residual stress field to be investigated is unknown before the experiment.     

Application of interferometric strain rosette to residual stress measurements

An interferometric strain rosette (ISR) technique is extended to residual stress measurements. The ISR technique is based on diffraction and interference of laser light reflected from three micro-indentations depressed in a specimen surface. Three in-plane strain components between the three micro-indentations can be measured simultaneously. Therefore the ISR enables a determination of two normal and one shear strain components. For many applications, the ISR is superior to a resistance strain rosette due to its short gage length and non-contacting nature. By applying an ISR to a material surface, residual stresses at the location of the ISR can be obtained through measurement of residual strains relieved via hole-drilling. Since the gage length can be as short as 50 μm, the ISR is capable of recording high strain gradients and it allows the strains close to the hole to be measured. The size of the hole can be small and precise location is not required. Since the ISR technique is non-contacting, it may be used to measure residual stresses in hostile environments.     

Hot-Carrier Stress Effects on GIDL and SILC in 90nm LDD-MOSFET with Ultra-Thin Gate Oxide

Hot-carrier degradation for 90 nm gate length lightly-doped drain （LDD） NMOSFET with ultra-thin （1.4 nm） gate oxide is investigated under the low gate voltage stress （LGVS） and peak substrate current （Isub max） stress. It is found that the degradation of device parameters exhibits saturating time dependence under the two stresses. We concentrate on the effect of these two stresses on gate-induced-drain leakage （GIDL） current and stress induced leakage current （SILC）. The characteristics of the GIDL current are used to analyse the damage generated in the gate-to-LDD region during the two stresses. However, the damage generated during the LGVS shows different characteristics from that during Isub stress. SILC is also investigated under the two stresses. It is found experimentally that there is a linear correlation between the degradation of SILC and that of threshold voltage during the two stresses. It is concluded that the mechanism of SILC is due to the combined effect of oxide charge trapping and interface traps for the ultra-short gate length and ultra-thin gate oxide LDD NMOSFETs under the two stresses.     

连续梯度的功能层对燃料电池在初始还原过程中曲率及残余应力的影响

连续梯度的电极由于其相对于多层梯度电极能更加有效地缓解电极和电解质的热失配及改善界面黏接而受到特别的关注. 本文通过建立含连续梯度的阳极功能层的阳极支撑固体氧化物燃料电池的力学模型, 研究了连续梯度的阳极功能层对阳极支撑固体氧化物燃料电池半电池在初始还原过程中曲率及残余应力的影响. 结果表明电池的曲率在初始还原过程中随还原程度的增大而逐渐增大. 连续梯度的阳极功能层的引入不能同时改善电池的曲率和残余应力, 即连续梯度的阳极功能层在缓解应力的同时会导致曲率的增大, 反之亦然. 含有连续梯度的阳极功能层的电池在部分还原状态下, 梯度层/阳极支撑界面处具有最大的拉应力容易导致电池受损, 实际中应保证电池被完全还原.