Dislocation slip behaviors in high-quality bulk GaN investigated by nanoindentation

The dislocation slip behaviors in GaN bulk crystal are investigated by nanoindentation, the dislocation distribution patterns formed around an impress are observed by cathodoluminescence (CL) and cross-sectional transmission electron microscope (TEM). Dislocation loops, vacancy luminescence, and cross-slips show hexagonal symmetry around the <11-20> and <1-100> direction on c-plane. It is found that the slip planes of dislocation in GaN crystal are dominated in {0001} basal plane and {10-11} pyramid plane. According to the dislocation intersection theory, we come up with the dislocation formation process and the related mechanisms are discussed.     

Effect of gate length on breakdown voltage in AlGaN/GaN high-electron-mobility transistor

The effects of gate length L_G on breakdown voltage VBRare investigated in AlGaN/GaN high-electron-mobility transistors(HEMTs) with L_G= 1 μm~20 μm. With the increase of L_G, VBRis first increased, and then saturated at LG= 3 μm. For the HEMT with L_G= 1 μm, breakdown voltage VBRis 117 V, and it can be enhanced to 148 V for the HEMT with L-_G= 3 μm. The gate length of 3 μm can alleviate the buffer-leakage-induced impact ionization compared with the gate length of 1 μm, and the suppression of the impact ionization is the reason for improving the breakdown voltage.A similar suppression of the impact ionization exists in the HEMTs with LG 3 μm. As a result, there is no obvious difference in breakdown voltage among the HEMTs with LG= 3 μm~20 μm, and their breakdown voltages are in a range of 140 V–156 V.     

开态应力下电压和电流对AlGaN/GaN高电子迁移率晶体管的退化作用研究

通过采集等功率的两种不同开态直流应力作用下AlGaN/GaN高电子迁移率晶体管(HEMTs)漏源电流输出特性、源区和漏区大信号寄生电阻、转移特性、阈值电压随应力时间的变化, 并使用光发射显微镜观察器件漏电流情况, 研究了开态应力下电压和电流对AlGaN/GaN高电子迁移率晶体管的退化作用. 结果表明, 低电压大电流应力下器件退化很少, 高电压大电流下器件退化较明显. 高电压是HEMTs退化的主要因素, 栅漏之间高电场引起的逆压电效应对参数的永久性退化起决定性作用. 除此之外, 器件表面损坏部位的显微图像表明低电压大电流下器件失效是由于局部电流密度过高, 出现热斑导致器件损伤引起的.     

Mechanism of improving forward and reverse blocking voltages in AlGaN/GaN HEMTs by using Schottky drain

In this paper, we demonstrate that a Schottky drain can improve the forward and reverse blocking voltages(BVs)simultaneously in AlGaN/GaN high-electron mobility transistors(HEMTs). The mechanism of improving the two BVs is investigated by analysing the leakage current components and by software simulation. The forward BV increases from72 V to 149 V due to the good Schottky contact morphology. During the reverse bias, the buffer leakage in the Ohmicdrain HEMT increases significantly with the increase of the negative drain bias. For the Schottky-drain HEMT, the buffer leakage is suppressed effectively by the formation of the depletion region at the drain terminal. As a result, the reverse BV is enhanced from-5 V to-49 V by using a Schottky drain. Experiments and the simulation indicate that a Schottky drain is desirable for power electronic applications.     

Failure behavior of ITO diffusion barrier between electroplating Cu and Si substrate annealed in a low vacuum

A structure of Cu/ITO(10 nm)/Si was first formed and then annealed at various temperatures for 5 min in a rapid thermal annealing furnace under 10⁻² Torr pressure. In Cu/ITO(10 nm)/Si structure, the ITO(10 nm) film was coated on Si substrate by sputtering process and the Cu film was deposited on ITO film by electroplating technique. The various Cu/ITO(10 nm)/Si samples were characterized by a four-point probe, a scanning electron microscope, an X-ray diffractometer, and a transmission electron microscope. The results showed that when the annealing temperature increases near 600 °C the interface between Cu and ITO becomes unstable, and the Cu₃Si particles begin to form; and when the annealing temperature increases to 650 °C, a good many of Cu₃Si particles about 1 μm in size form and the sheet resistance of Cu/ITO(10 nm)/Si structure largely increases.     

Investigation of diffusion and crystallization processes in thin ITO films by temperature and time resolved grazing incidence X-ray diffractometry

Oxygen diffusion into metallic In/Sn films and crystallite growth of thin indium tin oxide (ITO) films were investigated by in situ high temperature grazing incidence X-ray diffractometry (HT-GIXRD) at temperatures ranging from 100 to 300 °C. The investigated films were deposited by dc magnetron sputtering from a metallic target at different oxygen flows and bias voltages. The deposition process influences not only the film properties but also the film reactions during the post-deposition annealing process.

The ITO formation is determined by two processes: the diffusion of oxygen into the metallic grains and a fast crystallization process. Kinetic parameters for both processes were derived. A model was developed which allows the determination of the diffusion coefficient D from the time dependence of the integral intensity of the ITO X-ray reflection. Diffusion coefficients as well as the activation energies are influenced by the bias voltage but not by the oxygen flow.

According to the Johnson–Mehl–Avrami theory, the crystallization can be described as a two-dimensional process.     

Formation of p-cresol:piperazine complex in solution monitored by spin-lattice relaxation times and pulsed field gradient NMR diffusion measurements

A study of the nature of the anthelmintic p-cresol:piperazine complex in chloroform solution has been conducted using different NMR techniques: self-diffusion coefficients using DOSY; NOE, NULL, and double-selective T1 measurements to determine inter-molecular distances; and selective and non-selective T1 measurements to determine correlation times. The experimental results in solution and CP-MAS were compared to literature X-ray diffraction data using molecular modeling. It was shown that the p-cresol:piperazine complex exists in solution in a very similar manner as it does in the solid state, with one p-cresol molecule hydrogen bonded through the hydroxyl hydrogen to each nitrogen atom of piperazine. The close correspondence between the X-ray diffraction data and the inter-proton distances obtained by NULL and double selective excitation techniques indicate that those methodologies can be used to determine inter-molecular distances in solution.