采用AlCl_3-EMIC-MgCl_2室温离子液体电沉积制备铝-镁合金（英文）

采用恒电流和恒电位技术,以及路易斯酸氯化铝(III)-1-乙基-3-甲基咪唑氯化物离子液体中添加氯化镁(II),室温下在铂和铜阴极表面电沉积制备了铝-镁合金.合金层中镁的含量随离子液体中氯化镁浓度和所施加的阴极电流密度的增加而增加.采用X-射线衍射谱(XRD)、扫描电子显微镜(SEM)和能量散射X-射线谱(EDAX)技术,研究了不同电沉积实验条件得到的电沉积层的晶体结构及表面形貌.增加沉积电流密度,可以制备出致密、光亮和结合力良好的电沉积层.铝-镁合金电沉积的阴极电流效率可达99%.应用电化学石英晶体微天平(EQCM)技术研究了电沉积合金的组成.根据重声阻抗分析得到的质量-电荷(m-Q)曲线斜率计算了金属共沉积层的化学成分.     

共晶基离子液体的钴电化学沉积

通过恒电流和恒电位方法,研究了不同温度下脲-氯化胆硷（氯仿）基或乙二醇-氯化胆硷（氯仿）基离子液体中氯化钴溶液在铜和钢阴极上的钴电化学沉积行为. 采用扫描电子显微镜和X射线衍射技术,考察了不同试验条件对钴电沉积行为及钴沉积层形貌的影响. 结果表明,当沉积电位达到-0.8 V和沉积电流密度达到-6.0 A·m^-2时,温度范围从30 °C到90 °C,添加0.05 mol·L^-1的五氧化二磷,可以从脲基和乙二醇基离子液体中沉积得到光滑、发亮和良好结合力的金属光泽钴层. 电化学沉积钴的阴极电流效率达到98%.     

氯化胆碱/尿素和氯化胆碱/甘油的性质与应用

作为绿色溶剂,离子液体在化学和物理学科引起广泛关注.低共融溶剂,如氯化胆碱/尿素和氯化胆碱/甘油,不仅被认为是一类新型的离子液体,还具有价格低廉、环境友好及合成简便等优势.为了促进氯化胆碱/尿素和氯化胆碱/甘油这两种低共融溶剂的应用,本文考察了氯化胆碱/尿素和氯化胆碱/甘油的微观结构、物理化学性质及水分对其物性的影响,并将其与传统离子液体进行了比较.此外,还分析了氯化胆碱/尿素和氯化胆碱/甘油在摩擦学及CO2分离中的潜在应用.已有研究结果表明,氯化胆碱/尿素和氯化胆碱/甘油有希望应用于摩擦学及CO2分离中,但是在大规模工业应用之前依然存在很多不确定性和瓶颈,还需要进一步在其纳米结构、实验测定及模型等方面进行研究.     

氯化胆碱离子液体中纳米铜的电化学制备

在氯化胆碱离子液体中,采用牺牲阳极法于80℃下直接从金属铜制备了纳米铜微粒,其结构和性能经IR,XRD,SEM,TEM和TG表征。结果表明:纳米微粒大致呈球形,面心立方结构,粒径约30 nm。     

离子液体AlCl3/Et3NHCl中电沉积法制备金属铝

在AlCl3/Et3NHCl型离子液体中铝电极上通过恒电位电解沉积制备出金属铝. 测定了不同摩尔比的AlCl3/Et3NHCl离子液体在不同温度下的电导率, 考察了离子液体AlCl3/Et3NHCl摩尔比为2/1中Al电极上铝沉积的晶核成核过程, 以及恒电位电解沉积铝的工艺条件对电流效率和沉积铝表面形貌的影响. 结果表明, 不同比例AlCl3/Et3NHCl离子液体的电导率随温度升高而升高, 符合Arrhenius规律; 在Al电极上铝沉积的成核机理为三维瞬时成核过程; 恒电位电解沉积结果表明, 室温下在电位-2.4 V(vs Pt)和电解时间20 min条件下, 沉积铝的表面形貌比较平整致密,电流效率达73%, 沉积铝的纯度达96%(w).     

常温下从离子液体电解液中电沉积金属钴

研究了离子液体镀液中Co、Zn的共沉积行为。ZnCl2-EMIC -CoCl2电解液的循环伏安曲线上出现了三个电流峰,对应的电极电位分别为250mV、50mV、-200mV（vs. Zn2+/Zn）。结合EDS成分分析,可断定这三个电流峰分别对应着Co的电沉积、Co电极上Zn的欠电位沉积和Co-Zn合金的电沉积。恒电位沉积表明,当控制阴极电位在100 mV（vs. Zn2+/Zn）左右时,可得到高纯度的钴镀层;若进行恒电流沉积,则当电流密度为85mA/cm2左右时能够得到高纯度的钴镀层。对Co、Zn的共沉积机理研究表明,Co的电沉积过程和Zn 在Co上的欠电位沉积过程均受扩散过程控制。     

胆碱氧化酶功能化室温磷光量子点的制备及其对氯化胆碱的定量检测

环境友好型纳米生物传感器能够提高传统生物分子传感器的检测性能，在实际应用中具有重要的应用价值。本研究以胆碱氧化酶（ChOx）为模板，在室温（25 ℃）下通过矿化作用制备了一种ChOx功能化的室温磷光（RTP）量子点（QDs）（ChOx RTP QDs）纳米生物传感器，并利用ChOx与氯化胆碱的特异性酶-底物反应和光诱导的电子转移（PIET）实现了对氯化胆碱（Cho）的RTP定量检测。该纳米生物传感器对氯化胆碱检测的线性范围为0.05~20 mmol/L，检出限为0.02 mmol/L。该方法基于QDs的RTP性质，可以有效地避免生物样品背景荧光的干扰，且无需复杂的样品前处理过程，因此该方法较适合于生物样品中氯化胆碱的定量检测。     

从2AlCl3/Et3NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

在含Ni2+的2AlCl3/Et3NHCl离子液体中的铜电极上通过恒电位电沉积制备出金属Ni和Ni-Al合金.采用循环伏安和计时电流方法,揭示铜电极上沉积金属Ni的成核机理,研究了电沉积Ni-Al合金的机理,以及恒电位沉积Ni-Al合金工艺条件对沉积Ni-Al合金表面形貌和电流效率的影响.结果表明:在铜电极上电沉积金属Ni的成核机理为受扩散控制的三维瞬时成核过程.在电量≥3.0 C时,电沉积Ni-Al合金的组成基本不再变化.Ni-Al合金的电沉积机理为,Ni的电沉积受扩散控制,同时进行Al的欠电位沉积,在Ni-Al合金电沉积过程中某些Ni-Al合金相的沉积可能受动力学限制而使Ni-Al合金的组成偏离热力学预测结果.在电沉积Ni-Al合金的沉积电流小且平稳,电沉积速率慢条件下,Ni-Al合金表面形貌致密均一,反之就会出现瘤节.电沉积Ni-Al合金的电流效率＞90％.电沉积物的组成接近于Ni3Al合金.     

氯化胆碱对MgCl_2·6H_2O脱水及电沉积研究

采用单因素法寻找氯化胆碱对六水氯化镁脱水的最佳试验条件,最终确定了温度、质量比、时间3个主要因素以及各自的4个适宜水平;分别采用正交法、响应曲面法确定了脱水的最优水平组合,并且预测了氯化胆碱对六水氯化镁脱水的最佳实验条件。试验结果表明,最佳脱水条件为:m(MgCl_2·6H_2O):m(氯化胆碱质量)=1:3、160℃、真空干燥22 h。利用脱水后的六水氯化镁混合物在氯化胆碱-尿素离子液体中进行恒电位电解,以铜片为电沉积基体,得到Pr-Mg-Ni合金膜,经EDX分析得合金膜中镁的质量分数达15.03%,所得合金膜表面均匀、致密性好。进一步证明,氯化胆碱对六水氯化镁具有一定的脱水作用,且脱水后产物可直接用于电解制备含镁合金膜。     

氯化钽在离子液体1-丁基-3-甲基咪唑六氟磷酸盐中电化学行为

采用循环伏安法,研究了0.25 mol/L TaCl₅在离子液体1-丁基-3-甲基咪唑六氟磷酸盐([Bmim]PF₆)中的电化学行为。 实验结果表明,电沉积钽是受扩散控制、两步骤的不可逆电极反应过程,首先是Ta(Ⅴ)还原为Ta(Ⅲ),其次是Ta(Ⅲ)还原为金属钽和形成其它低价钽氯化物。 Ta(Ⅴ)/Ta(Ⅲ)和Ta(Ⅲ)/Ta在离子液体[Bmim]PF₆中的阴极传递系数分别为0.155和0.406。 Ta(Ⅴ)在离子液体[Bmim]PF₆中的扩散系数为1.629×10^-9 cm²/s。 在100 ℃和-1.25 V条件下,采用恒电势法在铂片上电沉积钽,扫描电子显微镜照片和EDS分析表明,沉积物为钽和钽的低价氯化物。     

离子液体中铜的电沉积行为

在含有氯化铜的氯化1-丁基-3-甲基咪唑(BMIC)和乙二醇(EG)体系中研究金属铜的电沉积。 在BMIC中加入EG,分别研究了EG对离子液体BMIC的粘度和电导率的影响,并通过循环伏安法研究了BMIC-CuCl2-EG溶液中Cu(Ⅱ)的电化学行为,考察了乙二醇浓度、温度和扫描速度对Cu(Ⅱ)电化学行为的影响。 结果表明,Cu(Ⅱ)的电还原过程分为两个过程,其中Cu(Ⅱ)/Cu(Ⅰ)是扩散控制下的不可逆过程,Cu(Ⅰ)/Cu是不可逆过程。 计算得出,在343 K时,Cu(Ⅱ)/Cu(Ⅰ)还原过程中的扩散系数D为7.0×10-7 cm2/s,传递系数为0.24。 在Cu膜表面进行了电沉积,获得金属铜颗粒,经扫描电子显微镜观察Cu的电沉积层的形貌发现,在343 K时沉积30 min后,金属铜晶粒致密,将沉积时间延长至2 h后,晶粒呈球状。     

Electrocatalysis of copper deposition from acid sulphate solutions by sulphite and selenite ions

The effects of traces of chloride, sulphur, selenium and tellurium dioxide and the selenate and tellurate ions on the electrodeposition of copper from acid copper sulphate have been studied. Low concentrations of chloride have little effect on deposition kinetics but concentrations up to 20 ppm significantly affect nodule formation. Sulphur dioxide and selenium dioxide are true electrocatalysts for deposition, with SeO₂ the more effective. Molecules in solution immediately adjacent to the electrode appear to be the active catalyst. The catalytic mechanism may be a reduction oxidation cycle involving the elements in unstable forms. The chloride ion is adsorbed according to a Langmuir type isotherm. Adsorbed chloride inhibits catalysis by SO₂ and SeO₂. The electrocatalysts have been used to demonstrate the effect of overpotential on the structure of copper deposited at constant current density.     

Effect of pulse current on the electrodeposition of copper from choline chloride-ethylene glycol

Deep eutectic solvents (DESs) have been considered as alternatives to classic aqueous deposition baths used at room temperature. This work describes a preliminary study about the copper deposition process from a bath based on choline chloride/ethylene glycol deep eutectic solvents. The physical properties, such as viscosity and conductivity of the bath, are compared before and after the addition of CuCl₂?·?2H₂O. The process kinetics during copper deposition was investigated. By optimizing the concentration of metallic salts and operating temperature, deposits with compact surfaces and small grain size were obtained. However, the process has a very limited current efficiency. Pulse plating was applied to improve the mass transport and refine grain size. In this case, an important improvement was achieved. Current efficiency (CE) increased significantly compared to the results obtained in direct current. This proves that pulse plating can be used as an effective method to reduce deposition time and costs. Surface morphology of deposits was observed by scanning electron microscopy (SEM), and compositional analysis was quantified by energy-dispersive X-ray spectroscopy (EDXS).     

High current density electrodeposition from silver complex ionic liquids

Liquid metal salts are electrolytes with the highest possible metal concentration for electrodeposition, because the metal ion is an integral part of the solvent. This paper introduces the new ionic silver complexes [Ag(MeCN)(4)](2)[Ag(Tf(2)N)(3)], [Ag(MeCN)][Tf(2)N] and [Ag(EtIm)(2)][Tf(2)N], where MeCN stands for acetonitrile, EtIm for 1-ethylimidazole and Tf(2)N is bis(trifluoromethylsulfonyl)imide. These complexes have been characterized by differential scanning calorimetry, single crystal X-ray crystallography, thermogravimetrical analysis, Raman spectroscopy and cyclic voltammetry. [Ag(MeCN)(4)](2)[Ag(Tf(2)N)(3)] is a room temperature ionic liquid. Smooth silver layers of good quality could be deposited from it, at current densities of up to 25 A dm(-2) in unstirred solutions. [Ag(EtIm)(2)][Tf(2)N] melts at 65 °C and can be used as an electrolyte for silver deposition above this temperature. [Ag(MeCN)][Tf(2)N] has a melting point that is too high to be useful in electrodeposition. Addition of thiourea or 1H-benzotriazole to the electrolyte decreased the surface roughness of the silver coatings. The morphology of the metal layers was investigated by atomic force microscopy (AFM). Adsorption of 1H-benzotriazole on the silver metal surface has been proven by Raman spectroscopy. This work shows the usefulness of additives in improving the quality of metal films electrodeposited from ionic liquids.     

离子液体中钴的电沉积行为

在含有氯化钴的室温离子液体氯化1-甲基-3-乙基咪唑(EMIC)和乙二醇(EG)体系中研究了金属钴的电沉积. 循环伏安法测试表明, 在EMIC-CoCl2熔盐中, 乙二醇的加入促进了EMIC的解离, 从而使氧化还原电流增大, 在EMIC-CoCl2-EG体系中钴的电沉积是受扩散控制的非可逆电极过程, 在该电解液体系中, Co(II)在Pt电极上的传递系数α为0.30, 扩散系数D0为4.16×10^-6 cm·s^-1; 计时电流法研究表明, 钴在铂电极上的电结晶过程符合三维连续成核的生长机理; 场发射扫描电子显微镜(FE-SEM)观察镀层的微观形貌显示, 金属钴的结晶细小. XRD分析证实, 镀层为纯钴, 沉积的钴是晶态和微晶态的混合物, 并且晶粒尺寸为纳米级.     

Electrodeposition of silicon from three different ionic liquids: possible influence of the anion on the deposition process

The electrodeposition of silicon was investigated from three different ionic liquids with the cation 1-butyl-1-methylpyrrolidinium ([Py_1,4]⁺) and three different anions, namely, trifluoromethylsulfonate (TfO^?), bis(trifluoromethylsulfonyl)amide (TFSA^?) and tris(pentafluoroethyl)-trifluorophosphate (FAP^?) at room temperature and at 100 °C, respectively. The electrodeposition was performed on gold and on copper substrates. Cyclic voltammetry was used to evaluate the possible influence of anions on the deposition process. In situ STM studies were also carried out to examine the interfacial behaviour of the SiCl₄/[Py_1,4]TFSA and SiCl₄/[Py_1,4]FAP on Au(111) at room temperature. In situ STM measurements revealed that an underpotential deposition of Si in [Py_1,4]FAP occurred on Au (111) at ~ -0.5 V (vs. Fc/Fc⁺). In comparison, only adsorption of ionic liquid and gold surface reconstruction was found to occur in the potential regime between -0.3 and ?1.8 V (vs. Fc/Fc⁺), respectively, in the case of [Py_1,4]TFSA. In situ STM investigations reveal an effect of the anion on the interfacial processes. In situ I/U tunnelling spectroscopy shows that the band gap of the electrodeposits is ~1.1 eV, indicating that semiconducting silicon has been electrodeposited. Potentiostatic electrolysis was performed to deposit Si from the employed electrolytes at room temperature and at 100 °C. The deposits were characterised using scanning electron microscopy and X-ray diffraction. Thin films of Si could be obtained from the employed ionic liquids and the quality of the deposits was significantly improved at 100 °C.     

In situ XPS study of template-free electrodeposition of antimony nanowires from an ionic liquid

Journal of Solid State Electrochemistry - Antimony nanowires have been synthesized by template-free electrodeposition at room temperature from the ionic liquid (IL) 1-butyl-1-methylpyrrolidinium...