Partial crystallization of silicon by high intensity laser irradiation

Commercial single crystal silicon wafers and amorphous silicon films piled on single crystal silicon wafers were irradiated with a femtosecond pulsed laser and a nanosecond pulsed laser at irradiation intensities between 10¹⁷ W/cm² and 10⁹ W/cm². In the single crystal silicon substrate, the irradiated area was changed to polycrystalline silicon and the piled silicon around the irradiated area has spindly column structures constructed of polycrystalline and amorphous silicon. In particular, in the case of the higher irradiation intensity of 10¹⁶ W/cm², the irradiated area was oriented to the same crystal direction as the substrate. In the case of the lower irradiation intensity of 10⁸ W/cm², only amorphous silicon was observed around the irradiated area, even when the target was single crystal silicon. In contrast, only amorphous silicon particles were found to be piled on the amorphous silicon film, irrespective of the intensity and pulse duration.Three-dimensional thermal diffusion equation for the piled particles on the substrate was solved by using the finite difference methods. The results of our heat-flow simulation of the piled particles almost agree with the experimental results.     

Pulsed laser induced damage in SOI material

Laser-induced damage in silicon-on-insulator (SOI) material is investigated with 1064 nm laser pulses. As the laser pulse duration is increased from 190 ps to 1.14 s, the damage threshold of SOI material decreases from 1.3×10¹⁰ to 7.7×10³ W/cm² in laser flux. It is found that the damage threshold varies inversely as the pulse duration for a short irradiation time, and is independent of pulse duration for a long irradiation time. The time dependence is in good agreement with a thermal model which well describes the thermal-induced damage in a semi-finite material irradiated by a Gaussian laser beam. The values of absorption coefficient and thermal conductivity under laser irradiation are calculated as 1.1×10³ cm^?1 and 0.18 Wcm^?1 K^?1, respectively, by fitting the model to the experimental results. These results on material damage can be used to predict the damage thresholds of SOI-based devices.     

Plasma formation by high-repetition rate pulsed periodic laser irradiation of metals in air at atmospheric and reduced pressures

High-speed spectroscopy with spatial and temporal resolution is used to determine the basic plasma parameters and to examine the shift from an air plasma to an erosion plasma during multipulse laser irradiation of various metals at repetition rates ranging from 5 to 50 kHz with irradiances q > 2∙10⁸ W/cm². The formation of a distinctive surface plasma structure is observed which (a) facilitates the expulsion of the shielding layer of "air" plasma produced during the first of a series of laser pulses by vapor from the target and (b) inhibits the propagation of a metal vapor plasma front into the air during the subsequent pulses.     

488 nm连续激光晶化本征非晶硅薄膜的喇曼光谱研究

利用等离子增强化学气相沉积系统制备了本征非晶硅薄膜,并选用488 nm波长的连续激光进行晶化.采用喇曼测试技术对本征非晶硅薄膜在不同激光功率密度和扫描时间下的晶化状态进行了表征,并用514 nm波长与488 nm波长对样品的晶化效果进行了比较.测试结果显示:激光照射时间60 s, 激光功率密度在1.57×10⁵ W/cm²时,能实现非晶硅向多晶硅的转变,在功率密度达到2.7 56×10⁵ W/cm²时,有非晶开始向单晶转变,随着激光功率密度的继续增加,晶化结果仍为单晶;在功率密度为2.362×10⁵ W/cm²下,60 s照射时间晶化效果较好;在功率密度为2.756×10⁵ W/cm²和照射时间为60 s的条件下,用488 nm波长比514 nm波长的激光晶化本征非晶硅薄膜效果较好,并均为单晶态.     

Picosecond laser ablation of SiO2 layers on silicon substrates

In this work, we report on laser ablation of thermally grown SiO₂ layers from silicon wafer substrates, employing an 8–9 ps laser, at 1064 (IR), 532 (VIS) and 355 nm (UV) wavelengths. High-intensity short-pulse laser radiation allows direct absorption in materials with bandgaps higher than the photon energy. However, our experiments show that in the intensity range of our laser pulses (peak intensities of <2×10¹² W/cm²) the removal of the SiO₂ layer from silicon wafers does not occur by direct absorption in the SiO₂ layer. Instead, we find that the layer is removed by a “lift off” mechanism, actuated by the melting and vaporisation of the absorbing silicon substrate. Furthermore, we find that exceeding the Si melting threshold is not sufficient to remove the SiO₂ layer. A second threshold exists for breaking of the layer caused by sufficient vapour pressure. For SiO₂ layer ablation, we determine layer thickness dependent minimum fluences of 0.7–1.2 J/cm² for IR, 0.1–0.35 J/cm² for VIS and 0.2–0.4 J/cm² for UV wavelength. After correcting the fluences by the reflected laser power, we show that, in contrast to the melting threshold, the threshold for breaking the layer depends on the SiO₂ thickness.     

Pulsed laser ablation and deposition of silicon

A KrF laser was used to ablate a polycrystalline Si target for deposition of Si on MgO and GaAs substrates at room temperature. The deposition was performed in 10⁻⁸ mbar, with two types of laser beams: a homogeneous beam being imaged onto the target (2.9 J/cm²), and a non-homogeneous which is nearly focused (2 J/cm², 6.5 J/cm²). In both cases, the beam was scanned over an area of 1 cm². For the homogenous beam, we observed only a limited number of droplets (<0.1 μm). A high number of micron-sized (<5 μm) droplets were observed on the film by the higher fluence nonhomogeneous laser beam. Raman spectroscopy showed that the micron-sized droplets are crystalline while the film is amorphous. The generation of the large droplets is most likely related to the cone structures formed on the ablated target. We also compared cone formation on a polycrystalline Si target and a single crystalline Si wafer, using multiple laser pulses onto a single spot.     

Laser-induced chemical etching of silicon in chlorine atmosphere

Laser-induced chemical etching of single-crystalline (100) Si in Cl₂ atmosphere has been investigated for continuous Ar⁺ and Kr⁺ laser irradiation at around 351 nm, and at 457.9, 488.0, 514.5, and 647.1 nm. For laser irradiances below 10⁵ W/cm² the etching mechanism is non-thermal, and is based on photo-generated electron-hole pairs within the Si surface and Cl atoms produced within the gas phase. The experimental results are compared with model calculations.     

Processing of W/Si and Si/W bilayers and multilayers with single and multiple excimer-laser pulses

Interdiffusion phenomena, thermal damage and ablation of W/Si and Si/W bilayers and multilayers under XeCl-excimer laser (=308 nm) irradiation at fluences of 0.15, 0.3 and 0.6 J/cm² were studied. Samples were prepared by UHV e-beam evaporation onto oxidized Si. The thickness of W and Si layers and the total thickness of the structures were 1–20 nm and 40–100 nm, respectively. 1 to 300 laser pulses were directed to the same irradiation site. At 0.6 J/cm² the samples were damaged even by a single laser pulse. At 0.3 J/cm² WSi₂ silicide formation, surface roughening and ablation were observed. The threshold for significant changes depends on the number of pulses: it was between 3–10 pulses and 10–30 pulses for bilayers with W and Si surfaces, respectively, and more than 100 pulses for multilayers with the same total thickness of tungsten. At 0.15 J/cm² the periodicity of the multilayers was preserved. Temperature profiles in layered structures were obtained by numerical simulations. The observed differences of the resistance of various bilayers and multilayers against UV irradiation are discussed.     

Three-dimensional simulation of laser–plasma-based electron acceleration

A sequential three-dimensional (3D) particle-in-cell simulation code PICPSI-3D with a user friendly graphical user interface (GUI) has been developed and used to study the interaction of plasma with ultrahigh intensity laser radiation. A case study of laser–plasma-based electron acceleration has been carried out to assess the performance of this code. Simulations have been performed for a Gaussian laser beam of peak intensity 5 × 10¹⁹ W/cm² propagating through an underdense plasma of uniform density 1 × 10¹⁹ cm^− 3, and for a Gaussian laser beam of peak intensity 1.5 × 10¹⁹ W/cm² propagating through an underdense plasma of uniform density 3.5 × 10¹⁹ cm^− 3. The electron energy spectrum has been evaluated at different time-steps during the propagation of the laser beam. When the plasma density is 1 × 10¹⁹ cm^− 3, simulations show that the electron energy spectrum forms a monoenergetic peak at ~14 MeV, with an energy spread of ±7 MeV. On the other hand, when the plasma density is 3.5 × 10¹⁹ cm^− 3, simulations show that the electron energy spectrum forms a monoenergetic peak at ~23 MeV, with an energy spread of ±7.5 MeV.     

Comparison of simulated X-ray conversion efficiency of laser produced iron plasma with experimental results

X-ray resonance lines between 11 Å and 17 Å emitted from iron plasmas created by a modest KrF laser have been simulated by modifying the atomic and hydrodynamic code EHYBRID. Free–free and free–bound emission from the Si-, Al-, Mg-, Na-, Ne- and F-like ions is calculated in the simulation. In the original experiments, a KrF laser (249 nm wavelength) with focused irradiances between 1×10¹² W/cm² and 1×10¹⁵ W/cm² was focused on iron targets. The laser pulse duration was varied between 10 ps and 20 ns. We have calculated X-ray conversion efficiencies to be, for example, 0.5% over 2 sr for 2×10¹³ W/cm² and 20 ns pulse duration, in good agreement with experimental measurements. The simulation of X-ray emission is also presented for an experiment where a train of eight 7 ps KrF laser pulses is incident onto an iron target. PACS 52.50.Jm; 52.38.Ph; 52.65.Kj; 52.30.Ex; 32.30.Rj     

Removal of nanoparticles on silicon wafer using a self-channeled plasma filament

The effective removal of nanoparticles from a silicon wafer surface was demonstrated using the self-channeled plasma filament excited by a femtosecond (130?fs) Ti:sapphire laser (?? _p=790?nm). The photoinduced self-channeled plasma filament in air reached a length of approximately 110?C130?mm from the first focal spot with diameters ranging from 40 to 50???m at input intensities of more than 1.0×10¹⁴?W/cm². By the scan of wafer using the X?CY?CZ stage during self-channeled plasma filament, the removal variation of nanoparticles on surface was observed in situ before and after the plasma filament occurred. The cleaning efficiency was strongly dependent on the gap distance between the plasma filament and the surface. The removal efficiency of nanoparticles reached 96?% with no damage to the surface when the gap was 150???m.     

Periodic surface structures on crystalline silicon created by 532 nm picosecond Nd:YAG laser pulses

Creation of laser-induced morphology features, particularly laser-induced periodic surface structures (LIPSS), by a 532 nm picosecond Nd:YAG laser on crystalline silicon is reported. The LIPSS, often termed ripples, were produced at average laser irradiation fluences of 0.7, 1.6, and 7.9 J cm⁻². Two types of ripples were registered: micro-ripples (at micrometer scale) in the form of straight parallel lines extending over the entire irradiated spot, and nano-ripples (at nanometer scale), apparently concentric, registered only at the rim of the spot, with the periodicity dependent on laser fluence. There are indications that the parallel ripples are a consequence of the partial periodicity contained in the diffraction modulated laser beam, and the nano-ripples are very likely frozen capillary waves. The damage threshold fluence was estimated at 0.6 J cm⁻².     

Irradiation of amorphous Ta<Subscript>42</Subscript>Si<Subscript>13</Subscript>N<Subscript>45</Subscript> film with a femtosecond laser pulse

Films of 260 nm thickness, with atomic composition Ta₄₂Si₁₃N₄₅, on 4″ silicon wafers, have been irradiated in air with single laser pulses of 200 femtoseconds duration and 800 nm wave length. As sputter-deposited, the films are structurally amorphous. A laterally truncated Gaussian beam with a near-uniform fluence of ∼0.6 J/cm² incident normally on such a film ablates 23 nm of the film. Cross-sectional transmission electron micrographs show that the surface of the remaining film is smooth and flat on a long-range scale, but contains densely distributed sharp nanoprotrusions that sometimes surpass the height of the original surface. Dark field micrographs of the remaining material show no nanograins. Neither does glancing angle X-ray diffraction with a beam illuminating many diffraction spots. By all evidence, the remaining film remains amorphous after the pulsed femtosecond irradiation.     

Material removal effect of microchannel processing by femtosecond laser

Material processing using ultra-short-pulse laser is widely used in the field of micromachining, especially for the precision processing of hard and brittle materials. This paper reports a theoretical and experimental study of the ablation characteristics of a silicon wafer under micromachining using a femtosecond laser. The ablation morphology of the silicon wafer surface is surveyed by a detection test with an optical microscope. First, according to the relationship between the diameter of the ablation holes and the incident laser power, the ablation threshold of the silicon wafer is found to be 0.227 J/cm². Second, the influence of various laser parameters on the size of the ablation microstructure is studied and the ablation morphology is analyzed. Furthermore, a mathematical model is proposed that can calculate the ablation depth per time for a given laser fluence and scanning velocity. Finally, a microchannel milling test is carried out on the micromachining center. The effectiveness and accuracy of the proposed models are verified by comparing the estimated depth to the actual measured results.     

STEM (scanning transmission electron microscopy) analysis of femtosecond laser pulse induced damage to bulk silicon

This work reports on the structural changes that take place in wafer grade silicon when it is micro-machined with ultra-short laser pulses of 150 fs duration. A Chirped Pulse Amplification (CPA) Ti:Sapphire laser was used, with an operating wavelength centered on 775 nm and a maximum repetition rate of 1 KHz. The laser induced damage was characterized over the fluence range 0.43–14 Jcm^-2, and for each fluence a progressively increasing number of pulses was used. The analytical tools used to characterize the samples were all based upon electron microscopy. A 30 KeV scanning transmission electron microscope (STEM) imaging technique was developed to observe defects in the crystal lattice and the thermal-mechanical damage in the area surrounding the laser machined region. Mechanical cross sectioning (in conjunction with Scanning Electron Microscope (SEM) surface imaging) was also used to reveal the internal structure, composition, and dimensions of the laser machined structures. Based on this analysis, it will be shown that laser machining of silicon with femtosecond pulses can produce features with minimal thermal damage, although lattice damage created by mechanical stresses and the deposition of ablated material both limit the extent to which this can be achieved, particularly with high aspect ratios. A key feature of the work presented here is the high-resolution STEM images of the laser-machined structures. PACS  42.65.Re; 42.62.Cf; 61.80.Ba; 61.82.Fk; 68.37.Hk; 68.37.Lp     

Tantalum ion acceleration in laser‐generated plasma and dependence on the pulse duration

The laser irradiation of tantalum targets is presented for different pulsed laser intensities ranging from 10¹⁰ up to about 10¹⁸ W/cm² and pulse durations from 9 ns up to 40 fs. The results show that the produced non‐equilibrium plasma accelerates Ta ions in the backward direction from values of the order of keV up to values of about 5 MeV. In thin foils, the forward plasma, developed behind the target along the direction of incoming laser, at intensities of about 10¹⁶ W/cm² and 300 ps pulse duration, accelerates Ta ions at energies of the order of 4.6 MeV and produces charge states up to about 40+. For fs lasers at intensities of the order of 10¹⁸ W/cm², only proton acceleration occurs up to 2.1 MeV while no Ta ions are accelerated, due to the reduced duration of the electric field and to the too high inertial mass of the Ta ions.     

Silicon substrate temperature effects on surface roughness induced by ultrafast laser processing

We report the effect of substrate temperature (T_sub) in the range 300-900 K on the surface roughness of silicon wafer resulted from femtosecond laser ablation. The surface roughness observed at the laser fluences less then 0.3 J/cm² increases with increasing T_sub. However, the surface roughness decreases with increasing T_sub for the laser fluences between 0.5 and 1.0 J/cm². If the laser fluence is higher than 2.0 J/cm², the surface roughness is independent of T_sub. The effect of T_sub on the surface roughness can be understood in terms of the temperature dependence of optical absorption coefficient of silicon substrate, which eventually alters a mechanism underlying the fs-laser-material ablation process between optical penetration and thermal diffusion processes.     

The study on the nonlinear optical response of Sudan I

The nonlinear optical properties of Sudan I were investigated by a single beam Z-scan technique. The Sudan I ethanol solution exhibited large nonlinear refractive indices under both CW and pulse laser excitations. The nonlinear refractive indices of Sudan I were in the order of ?10^?8 cm²/W under CW 633 nm excitation and ?10^?6 cm²/W under CW 488 nm excitation, respectively. Under the excitation of a pulse 532 nm laser, the nonlinear refractive index n₂ was calculated to be 1.19 × 10^?14 cm²/W. It was discussed that the mechanism accounting for the process of nonlinear refraction was attributed to the laser heating for the CW laser excitation and the electronic effect for the pulse excitation. Moreover, the second hyperpolarizability of Sudan I was also estimated in this paper.     

Formation of highly organised,periodic microstructures on steel surfaces upon pulsed laser irradiation

We present results on the growth of highly organised, reproducible, periodic microstructure arrays on a stainless steel substrate using multi-pulsed Nd:YAG (wavelength of 1064 nm, pulse duration of 7 ns, repetition rate of 25 kHz, beam quality factor of M ²∼1.5) laser irradiation in standard atmospheric environment (room temperature and normal pressure) with laser spot diameter of the target being ∼50 μm. The target surface was irradiated at laser fluence of ∼2.2 J/cm² and intensity of ∼0.31×10⁹ W/cm², resulting in the controllable generation of arrays of microstructures with average periods ranging from ∼30 to ∼70 μm, depending on the hatching overlap between the consecutive scans. The received tips of the structures were either below or at the level of the original substrate surface, depending on the experimental conditions. The peculiarity of our work is on the utilised approach for scanning the laser beam over the surface. A possible mechanism for the formation of the structures is proposed.     

Homogeneous focusing with a transient soft X-ray laser for irradiation experiments

We report the work done on a transient soft X-ray laser (SXRL) beam to deliver a proper extreme UV irradiation source for applications. The same optical tool was first demonstrated on a quasi stationnary state (QSS) soft X-Ray laser at the PALS Institute in Prague. The problem set by the transient soft X-Ray laser developed by the LIXAM at the LULI installation in Palaiseau is more crucial, first because the beam spatial profile is more irregular secondly because high repetition rate soft X-ray laser facilities in the future are based on this SXRL type. The spots obtained show a 20 micron average diameter and a rather homogeneous and smooth profile that make them a realistic irradiation source to interact with targets requiring relatively high fluence (near 1 J/cm²) or intensity (near 10¹¹ W/cm²) in the extreme UV domain.