δ掺杂对Si衬底GaN蓝光LED外延膜性能的影响研究

用X射线衍射方法通过不同晶面的ω扫描测试,分析了Si衬底GaN蓝光LED外延膜中n-型层δ掺杂Si处理对外延膜结晶性能的影响。报道了Si衬底GaN外延膜系列晶面的半峰全宽(FWHM)值。通过使用晶格旋转(Lattice-rotation)模型拟合,计算出样品的螺位错密度和刃位错密度。结果表明,δ掺杂Si处理后生长出的样品螺位错密度增大、刃位错密度减小,总位错密度有所减小。通过对未经δ掺杂处理和δ掺杂处理的GaN外延膜相应ω-2θ扫描半峰全宽值的比较,发现δ掺杂Si处理后生长出的样品非均匀应变较大;相应样品的LED电致发光光谱I、-V特性曲线显示δ掺杂后样品性能变好。     

硅基GaN微腔制作及其激射特性(特邀)

提出了一种新的Si衬底上GaN微盘谐振腔的制备方式,避免了传统Si基GaN器件中晶体质量较差以及外延层较厚对器件性能的影响.本工作中GaN的外延生长使用蓝宝石衬底,随后将外延层转移至硅衬底上进行微盘谐振腔的制备.外延生长时靠近衬底侧的GaN富缺陷层可使用减薄抛光的方式去除,并且通过简单湿法刻蚀二氧化硅牺牲层即可实现Ga...     

Si基GaN外延层光致发光光谱与二次离子质谱的研究

报道了在Si基上用简便的真空反应法制备出GaN外延层．光致发光光谱测试结果表明不同的生长温度和退火工艺会对GaN外延层的发光特性产生影响,在1050℃下生长的GaN外延层的发光强度高于其他温度下生长的发光强度,退火可以使GaN外延层的发光强度增强．二次离子质谱(SIMS)测试结果表明外延层中Ga和N分布均匀,在表面处Ga发生了偏聚,同时外延层中还存在Si,O等杂质,这使得外延层中背景电子浓度高达1.7×10¹⁸/cm³. SIMS测试结果还表明,在外延生长前采用 关键词：     

MOVPE低温生长的n型GaN电学特性研究

系统研究了采用金属有机物化学气相外延方法在740℃和900℃条件下生长的n型GaN的电学特性. 电化学电容-电压测试表明,在低温条件下采用三乙基镓作为Ga源生长有利于降低非故意掺杂n型GaN的背景杂质浓度. 另外,对重掺Si的n型GaN的霍耳效应测试表明,随着Si掺杂浓度增大,电子浓度相应线性增大,表现出杂质带导电特性,而迁移率则相应减小. 同时,原子力显微镜测试和X射线衍射测试均表明生长温度和掺杂浓度对外延材料的表面形貌和晶体质量有影响,特别是在高掺杂浓度的情况下,样品的表面形貌恶化更严重. 在所研究的 关键词： n型GaN 电子浓度 迁移率     

制膜技术与装置

O484.12007010582δ掺杂对Si衬底GaN蓝光LED外延膜性能的影响研究=Effect ofδ-doping on performance of GaN blue LED epi-taxial fil ms on Si substrates[刊,中]/程海英(南昌大学教育部发光材料与器件工程研究中心.江西,南昌(330047)),方文卿…//光学学报.—2006,26(8).—1269-1273用X射线衍射方法通过不同晶面的ω扫描测试,分析了Si衬底GaN蓝光LED外延膜中n-型层δ掺杂Si处理对外延膜结晶性能的影响。报道了Si衬底GaN外延膜系列晶面的半峰全宽(FWHM)值。通过使用晶格-旋转(Lattice-rotation)模型拟合,计算出样品的螺位错密…     

AlN插入层对硅衬底GaN薄膜生长的影响

利用金属有机化合物气相外延沉积技术在2inch(5.08cm)Si(111)图形衬底上生长了GaN外延薄膜,在Al组分渐变AlGaN缓冲层与GaN成核层之间引入了AlN插入层,研究了AlN插入层对GaN薄膜生长的影响。结果表明,随着AlN插入层厚度的增加,GaN外延膜(002)面与(102)面X射线衍射摇摆曲线半峰全宽明显变小,晶体质量变好,同时外延膜在放置过程中所产生的裂纹密度逐渐减小直至不产生裂纹。原因在于AlN插入层的厚度对GaN成核层的生长模式有明显影响,较厚的AlN插入层使GaN成核层倾向于岛状生长,造成后续生长的nGaN外延膜具有更多的侧向外延成分,从而降低了GaN外延膜中的位错密度,减少了GaN外延膜中的残余张应力。同时还提出了一种利用荧光显微镜观察黄带发光形貌来表征GaN成核层形貌和生长模式的新方法。     

掺杂对多层Ge/Si(001)量子点光致发光的影响

利用超高真空化学气相沉积设备, 在Si (001) 衬底上外延生长了多个四层Ge/Si量子点样品. 通过原位掺杂的方法, 对不同样品中的Ge/Si量子点分别进行了未掺杂、磷掺杂和硼掺杂. 相比未掺杂的样品, 磷掺杂不影响Ge/Si量子点的表面形貌, 但可以有效增强其室温光致发光; 而硼掺杂会增强Ge/Si量子点的合并, 降低小尺寸Ge/Si量子点的密度, 但其光致发光会减弱. 磷掺杂增强Ge/Si量子点光致发光的原因是, 磷掺杂为Ge/Si量子点提供了更多参与辐射复合的电子. 关键词： Ge/Si量子点 磷掺杂 光致发光     

硅衬底生长的InGaN/GaN多层量子阱中δ型硅掺杂n-GaN层对载流子复合过程的调节作用

为了解决在单晶硅衬底上生长的InGaN/GaN多层量子阱发光二极管器件发光效率显著降低的问题,使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为n型层释放多层界面间的张应力。采用稳态荧光谱及时间分辨荧光谱测量,提取并分析了使用该方案前后的多层量子阱中辐射/非辐射复合速率随温度（10~300 K）的变化规律。实验结果表明引入δ-Si掺杂的n-GaN层后,非辐射复合平均激活能由（18±3）meV升高到（38±10）meV,对应非辐射复合速率随温度升高而上升的趋势变缓,室温下非辐射复合速率下降,体系中与阱宽涨落有关的浅能级复合中心浓度减小,PL峰位由531 nm左右红移至579 nm左右,样品PL效率随温度的衰减受到抑制。使用周期性δ型Si掺杂的GaN取代Si均匀掺杂的GaN作为生长在Si衬底上的InGaN/GaN多层量子阱LED器件n型层,由于应力释放,降低了多层量子阱与n-GaN界面、InGaN/GaN界面的缺陷密度,使得器件性能得到了改善。     

金属有机物化学气相沉积同质外延GaN薄膜表面形貌的改善

为了获得高质量的GaN薄膜材料,研究了金属有机物气相沉积系统中GaN插入层对GaN衬底同质外延层表面宏观缺陷和晶体质量的影响.研究发现,插入层生长温度是影响GaN同质外延膜表面形貌和晶体质量的关键因素.由于生长模式与插入层生长温度相关,随着插入层生长温度的降低,外延膜生长模式由准台阶流模式转变为层状模式,GaN同质外延膜表面丘壑状宏观缺陷逐渐减少,但微观位错密度逐渐增大.通过对插入层温度和厚度的优化,进一步调控外延层的生长模式,最终有效降低了外延层表面的宏观缺陷,获得了表面原子级光滑平整、位错密度极低的GaN同质外延膜,其X射线衍射摇摆曲线(002),(102)晶面半峰宽分别为125arcsec和85arcsec,表面粗糙度均方根大小为0.23nm.     

Si掺杂对AlGaInP/GaInP多量子阱性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP／GaInP多量子阱红光LED外延片。以X射线双晶衍射技术和光致发光技术对外延片进行了表征,研究了Si掺杂对AlGaInP／GaInP多量子阱性能的影响。研究表明：掺Si能大大提高(Al0．3Ga0.7)0.5In0.5P／Ga0.5In0.5P多量子阱的发光强度。相对于未故意掺杂的样品,多量子阱垒层掺Si使多量子阱的发光强度提高了13倍,阱层和垒层均掺Si使多量子阱的发光强度提高了28倍。外延片的X射线双晶衍射测试表明,Si掺杂并没有使多量子阱的界面质量变差。     

Role of Ga vacancies in enhancing the leakage current of GaN Schottky barrier ultraviolet photodetectors

The leakage current of GaN Schottky barrier ultraviolet photodetectors is investigated. It is found that the photodetectors adopting undoped GaN instead of lightly Si-doped GaN as an active layer show a much lower leakage current even when they have a higher dislocation density. It is also found that the density of Ga vacancies in undoped GaN is much lower than in Si-doped GaN. The Ga vacancies may enhance tunneling and reduce effective Schottky barrier height, leading to an increase of leakage current. It suggests that when undoped GaN is used as the active layer, it is necessary to reduce the leakage current of GaN Schottky barrier ultraviolet photodetector.     

Stress in polycrystalline GaN films prepared by r.f sputtering

Undoped, Be-doped and Si-doped polycrystalline GaN films were deposited by R.F. sputtering onto fused silica substrates. The films were deposited at various deposition temperatures ranging from 300 K to 623 K and characterized by optical measurements while the microstructural information was obtained from SEM and XRD studies. The compositional study for the GaN film was carried out using SIMS. Residual stresses in these films were evaluated from the band tail of the absorption spectra as well as from direct measurements of hardness by commercially available depth sensing indentometer. It was observed that undoped GaN films had the highest hardness followed by that for Be-doped and Si-doped films. The values of hardness obtained form the above optical measurement tallied quite well with those obtained from direct indentation measurement.     

Electrochemical liftoff of freestanding GaN by a thick highly conductive sacrificial layer grown by HVPE

Separation technology is an indispensable step in the preparation of freestanding GaN substrate. In this paper, a largearea freestanding GaN layer was separated from the substrate by an electrochemical liftoff process on a sandwich structure composed of an Fe-doped GaN substrate, a highly conductive Si-doped sacrificial layer and a top Fe-doped layer grown by hydride vapor phase epitaxy(HVPE). The large difference between the resistivity in the Si-doped layer and Fe-doped layer resulted in a sharp interface between the etched and unetched layer. It was found that the etching rate increased linearly with the applied voltage, while it continuously decreased with the electrochemical etching process as a result of the mass transport limitation. Flaky GaN pieces and nitrogen gas generated from the sacrificial layer by electrochemical etching were recognized as the main factors responsible for the blocking of the etching channel. Hence, a thick Si-doped layer grown by HVPE was used as the sacrificial layer to alleviate this problem. Moreover, high temperature and ultrasonic oscillation were also found to increase the etching rate. Based on the results above, we succeeded in the liftoff of ～ 1.5 inch GaN layer. This work could help reduce the cost of freestanding GaN substrate and identifies a new way for mass production.     

Structural,optical and electrical properties of undoped and Si-doped AlxGa1−xN thin films on Si (1 1 1) substrate grown by PA-MBE

We have studied the structural properties of undoped and Si-doped Al_xGa_1?xN/GaN/AlN on Si (1 1 1) substrate prepared by plasma-assisted molecular beam epitaxy (PA-MBE) using high-resolution X-ray diffraction (HR-XRD) and atomic force microscopy (AFM). In comparison with undoped AlGaN, the roughness and dislocation density on the surface of the AlGaN layer decrease with Si doping. Full width half maximum (FWHM) of the undoped and Si-doped samples were equal to 0.69° and 0.52°, respectively. This indicates that the Si doping improves the crystalline quality of the Al_xGa_1?xN layer compared with the undoped one. Raman scattering measurement reveals that the optical phonon modes of A₁(LO) and E₂(H) of the AlGaN show a one-mode and two-modes behavior, respectively. The Fourier-transform infrared reflectance (FTIR) investigation confirms the one-mode (two-mode) behavior of the LO (TO) phonon in our samples. This is in good agreement with Raman measurement. Finally, the barrier height (Φ_B) of undoped and Si-doped Al_xGa_1?xN samples was found to be 0.86 and 0.74 eV, respectively.     

Growth and doping of bulk GaN by hydride vapor phase epitaxy

Doping is essential in the growth of bulk GaN substrates,which could help control the electrical properties to meet the requirements of various types of GaN-based devices.The progresses in the growth of undoped,Si-doped,Ge-doped,Fedoped,and highly pure GaN by hydride vapor phase epitaxy(HVPE) are reviewed in this article.The growth technology and precursors of each type of doping are introduced.Besides,the influence of doping on the optical and electrical properties of GaN are presented in detail.Furthermore,the problems caused by doping,as well as the methods to solve them are also discussed.At last,highly pure GaN is briefly introduced,which points out a new way to realize high-purity semi-insulating(HPSI) GaN.     

Photoluminescence study of InGaN/GaN multiple-quantum-well with Si-doped InGaN electron-emitting Layer

InGaN/GaN multiple-quantum-well (MQW) structure with Si-doped InGaN electron-emitting layer (EEL) was grown by metal–organic chemical vapor deposition and their characteristics were evaluated by photoluminescence (PL) measurements. In a typical structure, a low indium composition and wide potential well was used to be an EEL, and a six-fold MQW was used to be an active layer where the injected carriers recombine. By comparing the PL spectral characteristics of the MQW samples, the PL intensity of MQW with EEL is about 10 times higher than that of typical MQW. Experimental results indicate that the high electron capture rate of the MQW active region can be achieved by employing EEL.     

GaAs(001)衬底上分子束外延生长立方和六方GaN薄膜

采用分子束外延方法在GaAs(001)衬底上生长出了03微米厚的GaN薄膜,X射线双晶衍射和室温光荧光测试结果表明,采用GaAs氮化表面作为成核层可获得高纯度立方GaN薄膜而采用AlAs氮化表面作为成核层可获得高纯度六方GaN薄膜.这一研究结果表明在GaAs衬底上生长GaN薄膜的相结构可以通过选择不同的成核层来控制. 关键词：     

Optimization of the Doped Ablator Layers for the Plastic Ignition Capsule

The paper investigates theoretically the optimization of the doped ablator layers for the plastic ignition capsule. The high-resolved one-dimensional implosion simulations show that the inner pure CH layer of the Si-doped design is excessively preheated by the hard x-ray, leading to the unstable ablator-fuel interface compared to the Ge-doped capsule. This is because that the Si K-shell absorption edge (1.8 keV) is higher than the Ge L-edge (1.3 keV), and Si dopant makes more hard x-ray penetrate through the doped ablator layers to preheat the inner pure CH layer. So an optimization of the doped ablator layers (called "Si/Ge capsule") is performed: an Si-doped CH layer is placed next to the outer pure CH layer to keep the high implosion velocity; next to the Si-doped layer is a thin Ge-doped layer, in order to absorb the hard x-ray and protect the inner undoped CH-layer from excessively preheating. The simulations show that the Si/Ge capsule can effectively improve hydrodynamic stability at the ablator-fuel interface while keeping the high implosion velocity.     

Optical properties of undoped,Be-doped,and Si-doped wurtzite-rich GaAs nanowires grown on Si substrates by molecular beam epitaxy

The photoluminescence (PL) of undoped, Si-doped, and Be-doped GaAs nanowires (NWs) grown on Si substrates by molecular beam epitaxy was investigated. PL peaks of the undoped and Be-doped NWs were observed at higher energies than the bandgap energy of GaAs bulk. According to X-ray diffraction analysis, the blue-shift is attributed to the wurtzite-rich GaAs NW structure. Impurity-related peaks were observed in the undoped NWs and the impurity was Si that diffused via interaction with the adatoms on the Si surface during the growth. A slight bandgap narrowing of the Be-doped GaAs NWs was observed from their PL spectra. The Si-doped NWs showed a very broad PL peak due to a larger density of Si-related defects originating from the heavy doping level. The dependence of the PL peaks of the NWs on temperature was also investigated.     

Air-gap embedding GaN template for enhanced emission from light-emitting diodes

Selective growth by metal-organic chemical vapor deposition (MOCVD), and electrochemical etching of a heavily Si-doped GaN (n⁺-GaN) interlayer were employed to obtain air-gaps embedded in a u-GaN layer. As confirmed by Raman spectroscopy, the introduction of an n⁺-GaN, which was later etched to obtain air-gaps, also enhanced the strain-compliance of GaN epilayer on sapphire substrate. An enhanced electroluminescence emission was observed from the light-emitting diodes (LEDs) fabricated on the air-gap embedding template. Using theoretical LED simulation, it was discerned that the increase in optical emission from the LED was caused predominantly by the redirection of photons at GaN/air-gap interface. Finite-difference time domain (FDTD) simulation method was employed to understand the mechanism of optical emission enhancement and its spatial variation over the LED surface.