双材料界面裂纹应力强度因子的边界元分析

采用双材料基本解建立边界元法基本方程,计算双材料界面裂纹尖端附近的应用力和位移场。不离散界面,并设置面力奇异四分之一点裂尖单元以提高计算精度。数值结果表明,本文的方法具有较高的精度和效率。     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

Interface crack problems for mode II of double dissimilar orthotropic composite materials

The fracture problems near the similar orthotropic composite materials are interface crack tip for mode Ⅱ of double disstudied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized hi-harmonic equations, the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions, a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about bimaterial engineering parameters. According to the uniqueness theorem of limit, both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same, the stress singularity exponents, stress intensity factors and stresses for mode II crack of the orthotropic single material are obtained.     

黏弹性界面断裂分析的增量“加料”有限元法

提出了一种适用于黏弹性界面裂纹问题的增量“加料” 有限元方法. 利用弹性界面裂纹尖端位移场的解答,通过对应原理和拉普拉斯逆变换近似方法,得到了黏弹性界面裂纹的尖端位移场. 用该位移场构造了黏弹性界面裂纹“加料” 单元和过渡单元位移模式,推导了增量“加料” 有限元方程,求解有限元方程可获得应力强度因子和应变能释放率等断裂参量. 建立了典型黏弹性界面裂纹平面问题“加料” 有限元模型,计算结果表明,对于弹性/黏弹性界面裂纹和黏弹性/黏弹性界面裂纹,该方法都能得到相当精确地断裂参量,并能很好地反映蠕变和松弛特性,可推广应用于黏弹性界面断裂问题的计算分析.      

瓷修复体界面断裂行为的模拟实验研究

本文利用云纹干涉法和云纹干涉－－有限元混合法，对瓷修复体的模拟双材料模型界面断裂问题进行了实验研究。用云纹干涉和数字错位云纹干涉法测量带边裂纹的双材料四点简支梁在剪切作用下界面表面的剪应变分布及界面两侧局部表面的位移场，实验表明，由于界面两两侧材料力学性质不同，表现出界面剪切断裂问题的非称性和裂尖附近复合型断裂的特点；用云纹干涉法和有限元法相结合的混合法对粘接界面角点应力奇异性进行研究，并对角点附近应力应变场作了分析，得到了应力奇异指数与边界楔角，载荷的关系，证明了用界面应力强度因子Kf来描述界面端部区域应力分布的公式，并得到了双材料界面端部区域的应力应变分布情况。本文的实验结果为进一步研究口腔金瓷修复体界面的优化设计提供了基础，同时也说明云纹干涉法对于双材料界面断裂行为的研究是有效的。     

双材料界面裂纹的改进广义有限差分法

采用数值方法进行断裂力学分析时,裂纹尖端奇异区域处理的好坏直接关系到最终断裂力学参数的求解精度。与传统均匀介质不同,复合材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性,许多用于表征经典的平方根和负平方根物理场渐近性的传统方法也因此失效。论文提出了一种改进的广义有限差分法,该方法基于多元函数泰勒级数展开和移动最小二乘法的思想,将节点变量的各阶导数由相邻点集函数的加权线性累加来近似,具有无网格、无数值积分、数据准备简单、稀疏矩阵快速求解等优点。为提高该方法求解断裂力学问题的计算精度和数值稳定性,论文引入了裂尖奇异区域局部点簇的自动创建技术和一种基于局部点簇几何尺寸的矩阵正则化算法。数值算例表明,所提算法稳定,效率高,在不增加计算量的前提下,显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性。     

Asymptotic fields in the finite element analysis of electrically permeable interface cracks in piezoelectric bimaterials

Summary The interface crack problem for a piezoelectric bimaterial based on permeable conditions is studied numerically. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical and electrical loads, the complex stress intensity factor for an interface crack is obtained. The influence of the applied loads on the electromechanical fields near the crack tip is also studied. For a particular case of a short crack with respect to the bimaterial size, the numerical results are compared with the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.One author (V.G.) gratefully acknowledges the support provided by the Alexander von Humboldt Foundation of Germany.accepted for publication 7 June 2004     

Analysis on non-oscillatory singularity behaviors of mode Ⅱ interface crack tip in orthotropic bimaterial

The fracture behaviors near the mode Ⅱ interface crack tip for orthotropic bimaterial are studied. The non-oscillatory field, where the stress singularity exponent is a real number, is discussed by the complex function method and the undetermined coefficient method. From the research fracture problems, the stress functions with ten undetermined coefficients and an unknown singularity exponent are introduced when?_1 0 and ?_2 0. By the existence theorem of non-trival solutions for the system of eight homogeneous linear equations, the characteristic equation, the stress singularity exponent, and the discriminating condition of the non-oscillatory singularity are found.By the uniqueness theorem of the solutions for the system of twelve non-homogeneous linear equations with ten unknowns, the ten undermined coefficients in the stress functions are uniquely determined. The definitions of the stress intensity factors are given with the help of one-sided limit, and their theoretical formulae are deduced. The analytic solutions of the stresses near the mode Ⅱ interface crack tip are derived. The classical results for orthotropic material are obtained.     

A technique for studying interaction between a screw dislocation dipole or a concentrated load and a mode III crack crossing an interface

A method of potentially wide application is developed for deriving analytical expressions of the elastic interaction between a screw dislocation dipole or a concentrated force and a crack cutting perpendicularly across the interface of a bimaterial. The cross line composed of the interface and the crack is mapped into a line, and then the complex potentials are educed. The Muskhelishvili method is extended by creating a Plemelj function that matches the singularity of the real crack tips, and eliminates the pseudo tips’ singularity induced by the conformal mapping. The stress field is obtained after solving the Riemann–Hilbert boundary value problem. Based on the stress field expressions, crack tip stress intensity factors, dislocation dipole image forces and image torque are formulated. Numerical curves show that both the translation and rotation must be considered in the static equilibrium of the dipole system. The crack tip stress intensity factor induced by the dipole may rise or drop and the crack may attract or reject the dipole. These trends depend not only on the crack length, but also on the dipole location, the length and the angle of the dipole span. Generally, the horizontal image force exerted at the center of the dislocation dipole is much smaller than the vertical one. Whether the dipole subjected to clockwise torque or anticlockwise torque is determined by whether the Burgers vector of the crack-nearby dislocation of the dipole is positive or negative. A concentrated load induces no singularity to crack tip stress fields as the load is located at the crack line. However, as the concentrated force is not located on the crack line but approaches the crack tip, the nearby crack tip stress intensity factor K_IIIu increases steeply to infinity.     

双材料界面裂纹复应力强度因子的正则化边界元法

双材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性,许多用于表征经典平方根(r1/2)和负平方根(r?1/2)渐近物理场的传统数值方法失效,给界面裂纹复应力强度因子(K1+iK2)的精确求解增加了难度.引入一种含有复振荡因子的新型"特殊裂尖单元",可精确表征裂纹尖端渐近位移和应力场的振荡特性,在避免裂尖区域高密度网格剖...     

基于哈密顿原理的两种材料界面裂纹奇性研究

研究了两种材料组成的弹性体在交界面上含裂纹时的裂纹尖端奇异场。通过变量代换及变分原理，将平面弹性扇形域的方程导向哈密体系，从而可通过分离变量及共轭辛本征函数展开法解析法求解扇形域方程，得到求解双材料界面裂纹尖点奇性的一般表达式，由此为该类问题的求解开辟了一条新途径。     

An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound

An interface crack with an artificial contact zone at the right-hand side crack tip between two dissimilar finite-sized piezoelectric materials is considered under remote mixed-mode loading. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical loads, the stress intensity factors at the singular points are obtained. As a particular case of this solution, the contact zone model (in Comninou’s sense) is derived. A simple transcendental equation and an asymptotic formula for the determination of the real contact zone length are derived. The dependencies of the contact zone lengths on external load coefficients are illustrated in graphical form. For a particular case of a short crack with respect to the dimensions of the bimaterial compound, the numerical results are compared to the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.     

ASYMPTOTIC ANALYSIS OF MODE Ⅱ STATIONARY GROWTH CRACK ON ELASTIC-ELASTIC POWER LAW CREEPING BIMATERIAL INTERFACE

A mechanical model was established for mode Ⅱ interfacial crack static growing along an elastic-elastic power law creeping bimaterial interface. For two kinds of boundary conditions on crack faces, traction free and frictional contact, asymptotic solutions of the stress and strain near tip-crack were given. Results derived indicate that the stress and strain have the same singularity, there is not the oscillatory singularity in the field; the creep power-hardening index n and the ratio of Young' s module notably influence the cracktip field in region of elastic power law creeping material and n only influences distribution of stresses and strains in region of elastic material. When n is bigger, the creeping deformation is dominant and stress fields become steady, which does not change with n.Poisson ' s ratio does not affect the distributing of the crack- tip field.     

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the interface crack tip for mode Ⅱ of double dissimilar orthotropic composite materials are studied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized bi-harmonic equations,the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions,a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about himaterial engineering parameters. According to the uniqueness theorem of limit,both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same,the stress singularity exponents,stress intensity factors and stresses for mode Ⅱ crack of the orthotropic single material are obtained.     

Stress singularity at a crack tip for various intermediate zones in bimaterial structures (mode III)

The influence of the geometry of a thin intermediate zone on the stress distribution has been investigated in the vicinity of a crack tip in a bimaterial structure. Corresponding modelling boundary value problems are reduced to functional-difference equations by the Mellin transform technique, and later to singular integral equations with fixed point singularities. It has been observed that the order of the stress singularity is essentially dependent on the model parameters. Numerical results concerning the stress singularity exponents and generalized stress intensity factors are presented.     

Stress intensity factor for a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation

The asymptotic problem of a kinked interfacial crack in dissimilar anisotropic materials under antiplane deformation is investigated. The linear transformation method for the problem of the anisotropic bimaterial with a straight interface is proposed. The stress intensity factor for the kinked interfacial crack in the anisotropic composite is obtained from the solution of the transformed problem of the kinked interfacial crack in the isotropic bimaterial based on the linear transformation method. The effects of the material parameters as well as the kink angle on the stress intensity factor are discussed from numerical results of the stress intensity factor. The finite element analysis is carried out to verify the stress intensity factor obtained by using the linear transformation. The influence of the material orientations on the stress intensity factor is investigated for the kinked crack in the bimaterial consisting of dissimilar inclined orthotropic materials.     

Computing bounds to mixed-mode stress intensity factors in elasticity

A bounding procedure combined with an effective error bound method for linear functionals of the displacements and a simple two points displacement extrapolation method is presented to compute the lower and upper bounds to the stress intensity factors in elastic fracture problems. First, the displacements of two nodes (or node pairs) on the crack edges are used to construct the linear extrapolation to obtain the stress intensity factors at the crack tip, so that stress intensity factors are explicitly expressed as linear functionals of the displacements. Then, a posteriori bounding method is utilized to compute the bounds to the stress intensity factors. Finally, the bounding procedure is verified by a mixed-mode homogenous elastic fracture problem and a bimaterial interface crack problem.     

垂直于界面V型缺口尖端的应力奇异性及其应用

基于双材料垂直于界面V型缺口理论,给出了单一材料和双材料裂纹问题、V型缺口问题应力强度因子的统一定义,得到了应力外推法计算双材料K_I的公式,数值算例验证了本文方法的有效性.以双材料单向拉伸和三点弯曲模型为对象,深入研究了双材料中弹性模量、泊松比、缺口深度、缺口张角对缺口尖端奇异应力场的影响,获得了一定范围内各种参数变化对缺口尖端奇异应力场的影响规律,为异体材料形成的V型缺口在应力断料中的应用提供了必要的参考依据.     

Singular behaviour and asymptotic stress field of a crack terminating at a bimaterial interface

A crack terminating at an interface of two dissimilar elastic materials is investigated. It is found that the asymptotic stress field near the crack tip is in general composed of two parts with each part being characterized by one singularity. The detailed relation of the two singularities with the bimaterial properties is given for some special cases of the crack.     

A crack perpendicular to the bimaterial interface in finite solid

The dislocation simulation method is used in this paper to derive the basic equations for a crack perpendicular to the bimaterial interface in a finite solid. The complete solutions to the problem, including the T stress and the stress intensity factors are obtained. The stress field characteristics are investigated in detail. It is found that when the crack is within a weaker material, the stress intensity factor is smaller than that in a homogeneous material and it decreases when the distance between the crack tip and interface decreases. When the crack is within a stiffer material, the stress intensity factor is larger than that in a homogeneous material and it increases when the distance between the crack tip and interface decreases. In both cases, the stress intensity factor will increase when the ratio of the size of a sample to the crack length decreases. A comparison of stress intensity factors between a finite problem and an infinite problem has been given also. The stress distribution ahead of the crack tip, which is near the interface, is shown in details and the T stress effect is considered.