Diffusion of silicon in Fe-based amorphous and crystalline alloys

The segregation rate of silicon was measured in three different Fe-based amorphous and crystallized alloys with different silicon contents: 3.5, 5 and 9 at%. Analysis of the segregation kinetics yielded the diffusion activation energies E, as well as the frequency factors D₀. A linear dependence was found between In D₀ and E. In general, the D₀ and E values were lower for the amorphous specimens than for the crystalline ones, were independent of silicon content and are explained in terms of an oversaturated concentration of structural defects. In the crystalline specimens, diffusion behaviour was influenced by silicon content near the solubility limit of silicon in iron.     

多元半导体光伏材料中晶格缺陷的计算预测

半导体光伏材料的发展在过去60多年中表现出了清晰的多元化趋势. 从20世纪50年代的一元Si太阳能电池, 到20世纪60年代的GaAs和CdTe电池、70年代的CuInSe₂电池、80年代的Cu(In, Ga) Se₂、90年代的Cu₂ZnSnS₄电池, 再到最近的Cu₂ZnSn(S, Se)₄和CH₃NH₃PbI₃电池, 组成光伏半导体的元素种类从一元逐渐增多到五元. 元素种类的增多使得半导体物性调控的自由度增多, 物性更加丰富, 因而能满足光伏等器件应用的需要. 但是, 组分元素种类的增多也导致半导体中晶格点缺陷的种类大幅增加, 可能对其光学、电学性质和光伏性能产生显著影响. 近20年来, 第一性原理计算被广泛应用于半导体中晶格点缺陷的理论预测, 相对于间接的实验手段, 第一性原理计算具有更加直接的、明确的优势, 并且能对各种点缺陷进行快速的研究. 对于缺陷种类众多的多元半导体体系, 第一性原理计算能预测各种点缺陷的微观构型、浓度和跃迁(离化)能级位置, 从而揭示其对光电性质的影响, 发现影响器件性能的关键缺陷. 因而, 相关的计算结果对于实验研究有直接、重要的指导意义. 本文将首先介绍半导体点缺陷研究的第一性原理计算模型和计算流程; 然后, 总结近5年来两类新型光伏半导体材料, 类似闪锌矿结构的Cu₂ZnSn(S, Se)₄半导体和有机-无机杂化的钙钛矿结构CH₃NH₃PbI₃半导体的点缺陷性质; 以这两类体系为例, 介绍多元半导体缺陷性质的独特特征及其对太阳能电池器件性能的影响.     

第一性原理研究Zr的掺杂对Xe在UO_2中溶解能力的影响

Zr既是反应堆中核燃料组件的包壳材料,也是核燃料UO_2的一种裂变产物,不可避免地会掺杂到UO_2中,对其性质等产生一定的影响.本文通过第一性原理密度泛函理论计算,研究了Zr掺杂所引起的Xe在UO_2中溶解能力的变化.首先应用引入Hubbard U修正的广义梯度近似密度泛函计算了U,O间隙和空位缺陷的形成能,结果与文献值符合,验证了计算方法的可靠性.在此基础上对Zr掺杂后空位缺陷的形成能及Xe吸附到空位缺陷所需的结合能的变化情况进行了研究.结果表明,Zr的掺杂会增加空位缺陷的形成能,减小大部分Xe吸附的结合能,且空位缺陷形成能的变化量普遍更大,从而在整体上增加了Xe在UO_2中的溶解能.说明在UO_2中,Zr掺杂主要是通过增加缺陷的形成难度而减弱了Xe在其中的溶解能力.     

Quantitative determination of anti-structured defects applied to alloys of a wide chemical range

Anti-structured defects bridge atom migration among heterogeneous sublattices facilitating diffusion but could also result in the collapse of ordered structure.Component distribution Ni_(75)Al_xV_(25-x) alloys are investigated using a microscopic phase field model to illuminate relations between anti-structured defects and composition,precipitate order,precipitate type,and phase stability.The Ni_(75)Al_xV_(25-x) alloys undergo single Ni_3V(stage Ⅰ),dual Ni_3Al and Ni_3V(stage Ⅱ with Ni_3V prior;and stage Ⅲ with Ni_3Al prior),and single Ni_3Al(stage Ⅳ) with enhanced aluminum level.For Ni_3V phase,anti-structured defects(V_(Ni1),Niy,except V_(Ni2)) and substitution defects(Al_(Ni1),Al_(Ni2),Al_v) exhibit a positive correlation to aluminum in stage I,the positive trend becomes to negative correlation or smooth during stage Ⅱ.For Ni_3 Al phase,anti-structured defects(Al_(Ni),Ni_(Al)) and substitution defects(V_(Ni),V_(Al)) have a positive correlation to aluminum in stage Ⅱ,but Ni_(Al) goes down since stage Ⅲ and lasts to stage Ⅳ.V_(Ni) and V_(Al) fluctuate when Ni_3Al precipitates prior,but go down drastically in stageⅣ.Precipitate type conversion of single Ni_3V/dual(Ni_3V+Ni_3Al) affects Ni_3V defects,while dual(Ni_3V+Ni_3Al)/single Ni_3 Al has little effect on Ni_3Al defects.Precipitate order swap occurred in the dual phase region affects on Ni_3Al defects but not on Ni_3V.     

Mo,Ta, W在NixAl1-x(x=0.25,0.5,0.75) 中的择优占位

用多体势结合分子动力学计算了L1₂型NiAl₃, L1₂型Ni₃Al, L1₀型NiAl和B₂ 型NiAl的晶格常数, 结合能以及合金形成热; 分析了结构性点缺陷在上述四种合金中的存在形式; 在此基础上研究了合金化元素Mo, Ta, W在Ni_xAl_1-x(x=0.25,0.5,0.75)中的择优占位行为. 计算结果表明: 对于四种结构的Ni-Al合金, 偏离理想化学配比时,主要的结构缺陷形式是反位置; 根据占位能最小化, 第三组元元素Mo, Ta, W在上述四种Ni-Al中都显著优先占据Al格位. 关键词： 多体势 Ni-Al合金 占位     

聚合物分子与官能化纳米管相互作用及扩散特性的分子动力学模拟

用全原子分子动力学方法研究典型聚合物分子（PE,PEO和PP）与碳纳米管（CNT）及官能化碳纳米管（FCNT）界面的相互作用及扩散特性.动力学模拟显示：—CH₃官能团具有减弱CNT与PE和PP的相互作用,但是,—CH₃官能化后的CNT与PEO之间确有增强作用.分析含氧官能团（—OH和—COOH）官能化的CNT与PE,PEO和PP的相互作用,可知含氧官能团的确具有增强表面相互作用的功能,而且含氧原子越多,相互作用就越强.此外,—CH₃,—OH,—COOH官能化后的CNT与PE,PP和PEO体系的总能量均减少,而且能量满足—COOH < —OH < —CH₃.分析非键相互作用势（库仑能和范德瓦尔斯能）,可知库伦相互作用是增强界面相互作用的主要作用能.官能化后的CNT/PE,CNT/PEO,CNT/PP体系的扩散系数都明显减小,且扩散系数大小满足—COOH < —OH < —CH₃.     

On the modeling of hydrogen diffusion processes and complex formation in p-type crystalline silicon

Deuterium diffusion profiles in p-type silicon doped with boron (10¹⁷–10¹⁹ cm^-3) and aluminum (10¹⁸ cm^-3) are simulated with an improved version of a previously reported model. The new approach, based on the observation of experimental profiles, excludes H₂ molecule formation and leads to a reduced fit parameters model. The different diffusion coefficients and activation energies of H⁰ and H⁺ species are determined and discussed in the light of available data. The dissociation energies of BH and AlH complexes are also calculated and found to be in good agreement with the corresponding reported values in the literature.     

Be,Mg,Mn掺杂CuInO_2形成能的第一性原理研究

研制开发新型的光电材料对促进社会经济发展具有重要的科学意义和实用价值.利用宽禁带CuInO_2铟基材料实现全透明光电材料是目前深入研究的热点.通过基于密度泛函的第一性原理计算方法,本文计算出掺杂元素Mg, Be, Mn在CuInO_2的形成能.计算结果表明,施主类缺陷(如掺杂元素替代Cu原子或进入间隙位置)由于较高的形成能和较深的跃迁能级,很难在CuInO_2材料中出现N型导电;而受主缺陷中,在氧原子化学势极大的情况下, Mg原子替代In能成为CuInO_2理想的受主缺陷.计算结果可为制备性能优异的CuInO_2材料提供指导.     

MoO_3/Si界面区钼掺杂非晶氧化硅层形成的第一性原理研究

采用基于密度泛函理论的第一性原理计算方法,通过模拟MoO_3/Si界面反应,研究了MoO_x薄膜沉积中原子、分子的吸附、扩散和成核过程,从原子尺度阐明了缓冲层钼掺杂非晶氧化硅(a-SiO_x(Mo))物质的形成和机理.结果表明,在1500 K温度下, MoO_3/Si界面区由Mo, O, Si三种原子混合,可形成新的稳定的物相.热蒸发沉积初始时, MoO_3中的两个O原子和Si成键更加稳定,同时伴随着电子从Si到O的转移,钝化了硅表面的悬挂键. MoO_3中氧空位的形成能小于SiO_2中氧空位的形成能,使得O原子容易从MoO_3中迁移至Si衬底一侧,从而形成氧化硅层;替位缺陷中, Si替位MoO_3中的Mo的形成能远远大于Mo替位SiO_2中的Si的形成能,使得Mo容易掺杂进入氧化硅中.因此,在晶硅(100)面上沉积MoO_3薄膜时, MoO_3中的O原子先与Si成键,形成氧化硅层,随后部分Mo原子替位氧化硅中的Si原子,最终形成含有钼掺杂的非晶氧化硅层.     

Molecular dynamics study of anisotropic growth of silicon

Based on the Tersoff potential, molecular dynamics simulations have been performed to investigate the kinetic coefficients and growth velocities of Si(100),(110),(111), and(112) planes. The sequences of the kinetic coefficients and growth velocities are μ_((100)) μ_((110)) μ_((112)) μ_((111))and v_((100)) v_((110)) v_((112)) v_((111)), respectively, which are not consistent with the sequences of the interface energies, interplanar spacings, and melting points of the four planes. However,they agree well with the sequences of the distributions and diffusion coefficients of the melting atoms near the solid–liquid interfaces. It indicates that the atomic distributions and diffusion coefficients affected by the crystal orientations determine the anisotropic growth of silicon. The formation of stacking fault structure will further decrease the growth velocity of the Si(111) plane.     

Effect of metal catalyst on the mechanism of hydrogen spillover in three-dimensional covalent-organic frameworks

Hydrogen spillover mechanism of metal-supported covalent-organic frameworks COF-105 is investigated by means of the density functional theory, and the effects of metal catalysts M_4(Pt_4, Pd_4, and Ni_4) on the whole spillover process are systematically analyzed. These three metal catalysts exhibit several similar phenomena:(i) they prefer to deposit on the tetra(_4-dihydroxyborylphenyl) silane(TBPS) cluster with surface-contacted configuration;(ii) only the H atoms at the bridge site can migrate to 2,3,6,7,10,11-hexahydroxy triphenylene(HHTP) and TBPS surfaces, and the migration process is an endothermic reaction and not stable;(iii) the introduction of M_4 catalyst can greatly reduce the diffusion energy barrier of H atoms, which makes it easier for the H atoms to diffuse on the substrate surface. Differently, all of the H2 molecules spontaneously dissociate into H atoms onto Pt_4 and Pd_4clusters. However, the adsorbed H2 molecules on Ni_4 cluster show two types of adsorption states: one activated state with stretched H–H bond length of 0.88 ?A via the Kubas interaction and five dissociated states with separated hydrogen atoms. Among all the M_4 catalysts, the orders of the binding energy of M_4 deposited on the substrate and average chemisorption energy per H2 molecule are Pt_4Ni_4Pd_4. On the contrary, the orders of the migration and diffusion barriers of H atoms are Pt_4Ni_4Pd_4, which indicates that Pt_4 is the most promising catalyst for the hydrogen spillover with the lowest migration and diffusion energy barriers. However, the migration of H atoms from Pt_4 toward the substrate is still endothermic. Thus direct migration of H atom from metal catalyst toward the substrate is thermodynamically unfavorable.     

Al掺杂对HfO2俘获层可靠性影响第一性原理研究

采用基于MS(Materials Studio)软件和密度泛函理论的第一性原理方法, 研究了HfO₂ 俘获层的电荷俘获式存储器(Charge Trapping Memory, CTM)中电荷的保持特性以及耐擦写性. 在对单斜晶HfO₂中四配位氧空位(V_O4) 缺陷和V_O4 与Al替位Hf掺杂的共存缺陷体(Al+V_O4)两种超晶胞模型进行优化之后, 分别计算了其相互作用能、形成能、Bader电荷、态密度以及缺陷俘获能. 相互作用能和形成能的计算结果表明共存缺陷体中当两种缺陷之间的距离为2.216 Å时, 结构最稳定、缺陷最容易形成; 俘获能计算结果表明, 共存缺陷体为双性俘获, 且与V_O4缺陷相比, 俘获能显著增大; Bader电荷分析表明共存缺陷体更有利于电荷保持; 态密度的结果说明共存缺陷体对空穴的局域能影响较强; 计算两种模型擦写电子前后的能量变化表明共存缺陷体的耐擦写性明显得到了改善. 因此在HfO₂俘获层中可以通过加入Al杂质来改善存储器的保持特性和耐擦写性. 本文的研究可为改善CTM数据保持特性和耐擦写性提供一定的理论指导.     

空位缺陷对β-AgVO_3电子结构和光吸收性能的影响

基于密度泛函的第一性原理研究了Ag空位、O空位和Ag-O双空位对β-AgVO_3的电子结构及光学性质的影响.采用广义梯度近似平面波超软赝势GGA+U方法,对不同缺陷体系的形成能、能带结构、电子态密度、差分电荷密度和吸收光谱进行了计算和分析.通过比较不同Ag空位和O空位的形成能,确定了β-AgVO_3中主要形成Ag3空位和O1空位,并且Ag空位较O空位更容易形成.Ag3空位和O1空位的存在都使得β-AgVO_3带隙有一定程度的减小;Ag3空位使β-AgVO_3呈现p-型半导体性质,而O1空位和Ag3-O1双空位使β-AgVO_3呈现n-型半导体性质.Ag3和O1空位对晶体在可见光范围内的光吸收影响较小.     

The dissolution kinetics of free iron in Nd-Fe-B permanent magnet alloys

Three kinds of NdFeB alloys, near the Nd₂Fe₁₄B ( φ phase ) composition of the Fe-(Nd₂B) pseudobinary phase diagram, were used to study the kinetics of free iron dissolution in the matrix, which is extremely important for the attainment of high coercivity. The dissolution equations together with the time exponent, n( , ) and activation energies of rate constants, Q(34–40.9 kcal/mol) were derived. These indicate that the quantity of Nd-rich liquid phase plays an important role in the dissolution kinetics. For the ‘hypo-φ’ composition (Fe-rich), grain boundary diffusion dominates. For φ and ‘hyper-φ’ (Nd-rich) composition, interface reaction dominates. The low activation energies of this system are attributed to the activated effect of φ phase formation and liquid phase assisted grain boundary diffusion, it is found that there will be no free iron left after powder pulverizing and sintering of the commercial Nd₁₅Fe₇₇B₈ alloy.     

Decay kinetics of the green emission in tungstates and molybdates

Luminescence characteristics of a number of undoped and variously doped PbWO₄ crystals were studied at 0.4–400 K by the time-resolved spectroscopy and compared with those of ZnWO₄,CdWO₄ and PbMoO₄ crystals. Two types of green emission centres are detected in PbWO₄ crystals. The centres of the first type are responsible for the low-temperature 2.3–2.4 eV emission observed under excitation around 3.90–3.95 eV. The structure and parameters of their relaxed excited states were determined. It was concluded that the origin of defects responsible for the green emission of the first type could vary for different crystals. The centres of the second type with the emission around 2.5 eV appear in crystals containing oxygen vacancies after the thermal destruction of Pb⁺-WO₃ centres at T>180 K. Decomposition of the exciton and various defect-related states was also studied, and activation energies of this process were calculated.     

Kinetic Simulation of Fractal Aggregation on Liquid Surfaces

A modified fractal growth model based on the deposition, diffusion, and aggregation (DDA) with cluster rotation is presented to simulate two-dimensional fractal aggregation on liquid surfaces. The mobility (including diffusion and rotation) of clusters is related to its mass, which is given by D_m=D₀ s^-γ_D and θ_m=θ₀s^-γ_θ, respectively. We concentrate on revealing the details of the influence of deposition flux F, cluster diffusion factor γ_D and cluster rotation factor γ_θ on the dynamics of fractal aggregation on liquid surfaces. It is shown that the morphologies of clusters and values of cluster density and fractal dimension depend dramatically on the deposition flux and migration factors of clusters.     

锐钛矿相和金红石相Nb:TiO_2电学性质的GGA(+U)法研究

采用基于密度泛函理论第一性原理GGA和GGA+U相结合的方法研究了不同掺杂浓度下锐钛矿相和金红石相Nb:TiO2的晶体结构、电子结构以及稳定性.结果表明:锐钛矿相Nb:TiO2能带结构与简并半导体类似,呈类金属导电机理.金红石相Nb:TiO2呈半导体导电机理.Nb原子比Ti原子电离产生出更多的电子.锐钛矿相Nb:TiO2中Nb原子的电离率比金红石相Nb:TiO2的大.以上结果说明锐钛矿相Nb:TiO2比金红石相Nb:TiO2更适宜用作TCO材料;掺杂浓度对其杂质能级,费米能级和有效质量都有影响.Nb原子掺杂浓度越高,材料电离率呈降低趋势;形成能计算结果显示:在富钛条件下不利于Nb原子的掺杂,而在富氧条件下有利于Nb原子的掺杂.对于金红石相和锐钛矿相Nb:TiO2,不论是在贫氧或富氧条件下,随着Nb原子掺杂浓度的提高,形成能均增大.     

Na+替位掺杂对Li2MnSiO4的电子结构以及Li+迁移过程的影响

在锂二次电池中, 硅酸锰锂作为正极材料得到广泛研究, 但其固有的电子和离子电导率较低, 直接影响着电池的功率密度和充放电速率. 本文建立了不同浓度的Na⁺离子替位掺杂Li⁺离子形成的Li_1-xNa_xMnSiO₄(x=0, 0.125, 0.25, 0.5)结构, 采用第一性原理的方法, 研究了掺杂前后硅酸锰锂的电子结构以及Li⁺离子的跃迁势垒. 发现在Li⁺位替代掺杂Na⁺, 导带底的能级向低能方向发生移动, 降低了Li₂MnSiO₄ 材料的禁带宽度, 有利于提升材料的电子导电性能. 随着掺杂浓度的升高, 禁带宽度逐渐变窄. CI-NEB结果表明, 在Li₂MnSiO₄体系中具有两条有效的Li⁺离子迁移通道, 掺杂Na⁺以后扩大了Li⁺ 离子在[100]晶向上的迁移通道, Li⁺离子的跃迁势垒由0.64 eV降低为0.48, 0.52和0.55 eV. 掺杂浓度为 x=0.125时, 离子迁移效果最佳. 研究表明Na⁺掺杂有利于提高Li₂MnSiO₄材料的离子和电子电导率.     

杂质对Nb2GeC性质影响的第一性原理研究

为进一步研究Nb₂GeC在辐照环境中的稳定性, 本文研究了O, H和He杂质在Nb₂GeC中的稳定情况. 所有杂质的研究都是从替代和间隙两个方面来进行的, 计算得到了替代和间隙的形成能, 存在替代和间隙时Nb₂GeC的晶格常数, 以及单胞体积, 并且与完美的晶胞进行了比较. 此外, 通过电荷密度分布和Mulliken 布居, 分析了O, H, He杂质对Nb₂GeC 的电子性质的影响.     

Ionic diffusion and local hopping in copper chalcohalide glasses measured using Cu tracer and I-Mössbauer spectroscopy

For the first time, ⁶⁴Cu tracer measurements of ionic diffusion were performed for several copper-rich glass compositions in the CuI---As₂Se₃, CuI---SbI₃---As₂Se₃, CuI---PbI₂---As₂Se₃, CuI---PbI₂---SbI₃---As₂Se₃ and Cu₂Se---As₂Se₃ systems. In accordance with previous a.c. impedance results and Wagner d.c. polarization measurements, it was found that pure Cu⁺ ion-conducting glasses (50CuI---17PbI₂---33As₂Se₃ and 50CuI---20PbI₂---10SbI₃---20As₂Se₃) exhibit the highest copper tracer diffusion coefficients, D_Cu, and the lowest diffusion activation energies. The values of D_Cu at room temperature are higher by 4.5–5.5 orders of magnitude than those in an As₂Se₃ glass. The Haven ratio, H_R, is found to be 0.52–0.61 (ternary glass) and 0.93–1.00 (quaternary glass). Short-range diffusional displacements of the iodide ions induced by the hopping Cu⁺ ions are also detected in the CuI---PbI₂---SbI₃---As₂Se₃ glassy system using ¹²⁹I-Mössbauer spectroscopy in the temperature range of 4.2 to 305 K. The activation energy of local hopping, E_h ≈ 0.31 eV, is very similar to that of bulk ionic conductivity (0.37 eV) and copper diffusion (≈ 0.33 eV). In contrast to CuI-based vitreous alloys, 50Cu₂Se---50As₂Se₃ glass exhibits D_Cu that are two to five orders of magnitude lower, and the copper ion transport number, t_Cu⁺, is between 10⁻³ and 10⁻⁴ in the temperature range 140–170 °C.