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1.
To prepare thermally stable and high‐performance polymeric films, new solvent‐soluble aromatic polyamides with a carbamoyl pendant group, namely poly(4,4′‐diamino‐3′‐carbamoylbenzanilide terephthalamide) (p‐PDCBTA) and poly(4,4′‐diamino‐3′‐carbamoylbenzanilide isophthalamide) (m‐PDCBTA), were synthesized. The polymers were cyclized at around 200 to 350 °C to form quinazolone and benzoxazinone units along the polymer backbone. The decomposition onset temperatures of the cyclized m‐ and p‐PDCBTAs were 457 and 524 °C, respectively, lower than that of poly(p‐phenylene terephthalamide) (566 °C). For the p‐PDCBTA film drawn by 40% and heat‐treated, the tensile strength and Young's modulus were 421 MPa and 16.4 GPa, respectively. The film cyclized at 350 °C showed a storage modulus (E′) of 1 × 1011 dyne/cm2 (10 GPa) over the temperature range of room temperature to 400 °C. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 775–780, 2000  相似文献   

2.
A novel method was developed to prepare poly(benzoxazinone‐imide) by the dealcoholization of poly(amide‐imide), having pendent ethoxycarbonyl groups, which was prepared from poly(amide acid). The poly(amide acid) was prepared from the reaction of pyromellitic dianhydride and 4,4′‐diamino‐6‐ethoxycarbonyl benzanilide. The curing behavior of the poly(amide acid) was monitored by DSC, which indicated the presence of two broad endotherms, one with maximum at 153 °C due to imide‐ring formation and the other with maximum at 359 °C due to benzoxazinone‐ring formation. The poly(amide acid) was thermally treated at 300 °C/1 h to get poly(amide‐imide) with pendent ester groups, then at 350 °C/2 h to convert into poly(benzoxazinone‐imide) by dealcoholization. Viscoelastic measurements of the poly(amide‐imide) showed that the storage modulus dropped at about 280 °C with glass‐transition temperature (Tg ) at about 340 °C. The storage modulus of poly(benzoxazinone‐imide), however, was almost constant up to 400 °C and no Tg was detected below 400 °C. Also, the tensile modulus and tensile strength of the poly(benzoxazinone‐imide) was much higher than that of the poly(amide‐imide). The 5% decomposition of poly(benzoxazinone‐imide) film was at 535 °C, which reflects its excellent thermal stability. Also, poly(benzoxazinone‐imide) showed more hydrolytic stability against alkali in comparison to polyimides. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 1647–1655, 2000  相似文献   

3.
New phenolic hydroxyl‐pendant aromatic polyimides were synthesized with the N‐silylated diamine method in two steps: the ring‐opening polyaddition of tetrakis(trimethylsilyl)‐substituted 4,4′‐diamino‐3,3′‐dihydroxybiphenyl to various aromatic tetracarboxylic dianhydrides, giving trimethylsiloxy‐pendant poly(amic acid) trimethylsilyl esters, and thermal imidization. The hydroxyl‐bearing polyimides were amorphous but insoluble in organic solvents. They had glass‐transition temperatures greater than 370 °C and temperatures of 10% weight loss greater than 415 °C in nitrogen. The hydroxyl‐pendant polypyromellitimide film had a high tensile strength and a high modulus of 310 MPa and 10 GPa, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1790–1795, 2002  相似文献   

4.
A new diimide‐dicarboxylic acid, 2,2′‐dimethyl‐4,4′‐bis(4‐trimellitimidophenoxy)biphenyl (DBTPB), containing a noncoplanar 2,2′‐dimethyl‐4,4′‐biphenylene unit was synthesized by the condensation reaction of 2,2′‐dimethyl‐4,4′‐bis(4‐minophenoxy)biphenyl (DBAPB) with trimellitic anhydride in glacial acetic acid. A series of new polyamide‐imides were prepared by direct polycondensation of DBAPB and various aromatic diamines in N‐methyl‐2‐pyrrolidinone (NMP), using triphenyl phosphite and pyridine as condensing agents. The polymers were produced with high yield and moderate to high inherent viscosities of 0.86–1.33 dL · g−1. Wide‐angle X‐ray diffractograms revealed that the polymers were amorphous. Most of the polymers exhibited good solubility and could be readily dissolved in various solvents such as NMP, N,N‐dimethylacetamide (DMAc), N,N‐dimethylformamide (DMF), dimethyl sulfoxide, pyridine, cyclohexanone, and tetrahydrofuran. These polyamide‐imides had glass‐transition temperatures between 224–302 °C and 10% weight loss temperatures in the range of 501–563 °C in nitrogen atmosphere. The tough polymer films, obtained by casting from DMAc solution, had a tensile strength range of 93–115 MPa and a tensile modulus range of 2.0–2.3 GPa. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 63–70, 2001  相似文献   

5.
Two series of fluorinated polyimides were prepared from 2,2′‐bis(4‐amino‐2‐trifluoromethylphenoxy)biphenyl ( 2 ) and 2,2′‐bis(4‐amino‐2‐trifluoromethylphenoxy)‐1,1′‐binaphthyl ( 4 ) with various aromatic dianhydrides via a conventional, two‐step procedure that included a ring‐opening polyaddition to give poly(amic acid)s, followed by chemical or thermal cyclodehydration. The inherent viscosities of the polyimides ranged from 0.54 to 0.73 and 0.19 to 0.36 dL/g, respectively. All the fluorinated polyimides were soluble in many polar organic solvents, such as N,N‐dimethylacetamide and N‐methylpyrrolidone, and afforded transparent and light‐colored films via solution‐casting. These polyimides showed glass‐transition temperatures in the ranges of 222–280 and 257–351 °C by DSC, softening temperatures in the range of 264–301 °C by thermomechanical analysis, and a decomposition temperature for 10% weight loss above 520 °C both in nitrogen and air atmospheres. The polyimides had low moisture absorptions of 0.23–0.58%, low dielectric constants of 2.84–3.61 at 10 kHz, and an ultraviolet–visible absorption cutoff wavelength at 351–434 nm. Copolyimides derived from the same dianhydrides with an equimolar mixture of 4,4′‐oxydianiline and diamine 2 or 4 were also prepared and characterized. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2416–2431, 2004  相似文献   

6.
Starting with 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and methyl aminobenzoate, we synthesized a novel rodlike imide‐containing monomer, N,N′‐bis[p‐(methoxy carbonyl) phenyl]‐biphenyl‐3,3′,4,4′‐tetracarboxydiimide (BMBI). The polycondensation of BMBI with dimethyl terephthalate and ethylene glycol yielded a series of copoly(ester imide)s based on the BMBI‐modified poly(ethylene terephthalate) (PET) backbone. Compared with PET, these BMBI‐modified polyesters had higher glass‐transition temperatures and higher stiffness and strength. In particular, the poly(ethylene terephthalate imide) PETI‐5, which contained 5 mol % of the imide moieties, had a glass‐transition temperature of 89.9 °C (11 °C higher than the glass‐transition temperature of PET), a tensile modulus of 869.4 MPa (20.2 % higher than that of PET), and a tensile strength of 80.8 MPa (38.8 % higher than that of PET). Therefore, a significant reinforcing effect was observed in these imide‐modified polyesters, and a new approach to higher property polyesters was suggested. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 852–863, 2002; DOI 10.1002/pola.10169  相似文献   

7.
A novel positive‐working and aqueous‐base‐developable photosensitive poly(imide benzoxazole) precursor based on a poly(amic acid hydroxyamide) bearing phenolic hydroxyl groups and carboxylic acid groups, a diazonaphthoquinone (DNQ) photosensitive compound, and a solvent was developed. Poly(amic acid hydroxyamide) was prepared through the polymerization of 2,2‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane, trimellitic anhydride chloride, and 4,4′‐oxydibenzoyl chloride. Subsequently, the thermal cyclization of the poly(amic acid hydroxyamide) precursor at 350 °C produced the corresponding poly(imide benzoxazole). The inherent viscosity of the precursor polymer was 0.17 dL/g. The cyclized poly(imide benzoxazole) showed a high glass‐transition temperature of 372 °C and 5% weight loss temperatures of 535 °C in nitrogen and 509 °C in air. The structures of the precursor polymer and the fully cyclized polymer were characterized with Fourier transform infrared and 1H NMR. The photosensitive polyimide precursor containing 25 wt % DNQ photoactive compound showed a sensitivity of 256 mJ/cm2 and a contrast of 1.14 in a 3‐μm film with a 0.6 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from this composition. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5990–5998, 2004  相似文献   

8.
A series of fluorinated poly(amide imide)s were prepared from 1,4‐bis(2′‐trifluoromethyl‐4′‐trimellitimidophenoxy)benzene and various aromatic diamines [3,3′,5,5′‐tetramethyl‐4,4′‐diaminediphenylmethane, α,α‐bis(4‐amino‐3,5‐dimethyl phenyl)‐3′‐trifluoromethylphenylmethane, 1,4‐bis(4′‐amino‐2′‐trifluoromethylphenoxy)benzene, 4‐(3′‐trifluoromethylphenyl)‐2,6‐bis(3′‐aminophenyl)pyridine, and 1,1‐bis(4′‐aminophenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane]. The fluorinated poly(amide imide)s, prepared by a one‐step polycondensation procedure, had good solubility both in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, dimethylacetamide, dimethylformamide, dimethyl sulfoxide, and cyclopentanone, and in common organic solvents, such as tetrahydrofuran and m‐cresol. Strong and flexible polymer films with tensile strengths of 84–99 MPa and ultimate elongation values of 6–9% were prepared by the casting of polymer solutions onto glass substrates, followed by thermal baking. The poly(amide imide) films exhibited high thermal stability, with glass‐transition temperatures of 257–266 °C and initial thermal decomposition temperatures of greater than 540 °C. The polymer films also had good dielectric properties, with dielectric constants of 3.26–3.52 and dissipation factors of 3.0–7.7 × 10?3, and acceptable electrical insulating properties. The balance of excellent solubility and thermal stability associated with good mechanical and electrical properties made the poly(amide imide)s potential candidates for practical applications in the microelectronics industry and other related fields. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 1831–1840, 2003  相似文献   

9.
A series of photocrosslinkable, side‐chain, second‐order nonlinear optical (NLO) poly(ester imide)s (PEIs) based on a chromophore‐containing dianhydride, 2,2′‐{4‐[(4‐nitrophenyl)‐azo]phenyl}iminobis(ethyl benzene‐1,2‐dicarboxylic acid anhydride‐4‐carboxylate), benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride, and 4,4′‐diamino‐3,3′‐dimethyl diphenylmethane were prepared. The resulting PEIs exhibited many useful physical characteristics, such as good organosolubility, excellent film‐forming properties, high glass‐transition temperatures (186–229 °C), and high thermal decomposition temperatures. The electrooptic coefficient value of PEI3 at 650 nm was 11.5 pm/V, and high long‐term stability of the NLO chromophore alignment in the poled PEI3 film at 120 °C was observed. The temporal stability of the dipole orientation at 150 °C was further enhanced by ultraviolet irradiation because of photocrosslinking. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 303–312, 2003  相似文献   

10.
Molecular composites were prepared from several types of ionically modified, poly(p‐phenylene terephthalamide) (PPTA) dispersed in a poly(4‐vinylpyridine) matrix. Optical clarity tests indicated that the component polymers of the composite were miscible, at least at low concentrations of the rodlike reinforcement. In composites containing ionic PPTA, where ionic sulfonate groups were attached as side groups either to PPTA chains or to PPTA anion chains, the glass‐transition temperature (Tg) was increased by l0 °C or more, at 5 wt % reinforcement. At concentrations of 10–15 wt % of the ionic polymer, Tg values leveled off or decreased slightly. This suggested that some aggregation of the rigid‐rod molecules occurred. In composites containing ionic PPTA, where the ionic sulfonate groups were directly attached to the phenylene rings of PPTA chains, not only was Tg shifted significantly to higher temperatures, but the rubbery plateau modulus retained high values up to temperatures of 250 °C or above. Observed effects were considered to be the result of strong ionic interactions between the ionic reinforcement polymer and the polar matrix polymer. The possible effects of the counterion on Tg and the storage modulus are discussed. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 1110–1117, 2002  相似文献   

11.
As distinguished from the conventional preparation of poly(aryl ether ketone)s utilizing 4,4′‐difluorobenzophenone, a novel synthetic method of high molecular weight poly(phthalazinone ether ketone) derived from 4,4′‐dichlorobenzophenone was studied. Reaction conditions to get high molecular weight polymer were investigated in details. Experimentally, sulfolane was chosen as the reaction media and high molecular weight polymer could be obtained in 7–8 hr at 210°C. The cyclic oligomers in the polymer product reduced to below 3.0% when the concentration of the reactant is 1.6–1.7 g/ml. Fourier transform infrared (FT‐IR), 1H NMR, and elemental analysis were used to confirm the structure of the obtained polymer. The amorphous polymer showed reasonable solubility in selective solvent, such as chloroform and N‐methyl‐2‐pyrrolidone, and tough, flexible, and transparent thin film can be readily prepared from their N‐methyl‐2‐pyrrolidone solution. The obtained polymer showed high glass transition temperature (Tg) up to 261°C detected by differential scanning calorimetry (DSC), and the temperature of 5% weight loss under nitrogen higher than 500°C detected by thermal gravimetric analysis (TGA), indicating its excellent thermal stability. Copyright © 2011 John Wiley & Sons, Ltd.  相似文献   

12.
A novel aromatic diamine monomer, 3,3′‐diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane (PAFM), was successfully synthesized by coupling of 2‐isopropylaniline and 3,4‐difluorobenzaldehyde. The aromatic diamine was adopted to synthesize a series of fluorinated polyimides by polycondensation with various dianhydrides: pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) via the conventional one‐step method. These polyimides presented excellent solubility in common organic solvents, such as N,N‐dimethylformamide (DMF), N,N‐dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N‐methyl‐2‐pyrrolidone (NMP), chloroform (CHCl3), tetrahydrofuran (THF) and so on. The glass transition temperatures (Tg) of fluorinated polyimides were in the range of 260–306°C and the temperature at 10% weight loss in the range of 474–502°C. Their films showed the cut‐off wavelengths of 330–361 nm and higher than 80% transparency in a wavelength range of 385–463 nm. Moreover, polymer films exhibited low dielectric properties in the range of 2.76–2.96 at 1 MHz, as well as prominent mechanical properties with tensile strengths of 66.7–97.4 MPa, a tensile modulus of 1.7–2.1 GPa and elongation at break of 7.2%–12.9%. The polymer films also showed outstanding hydrophobicity with the contact angle in the range of 91.2°–97.9°.  相似文献   

13.
The phase‐transfer catalyzed polycondensation of α,α′‐dichloro‐p‐xylene with 4,4′‐isopropylidenediphenol was carried out using benzylethylammonium chloride in a two‐phase system of an aqueous alkaline solution and benzene at 60 °C under nitrogen atmosphere. The rate of polycondensation was expressed as the combined terms of quaternary onium cation and 4,4′‐isopropylidenediphenolate anion rather than the feed concentration of catalyst and 4,4′‐isopropylidenediphenol. The measured concentrations of hydroxide and chloride anion in the aqueous solution and α,α′‐dichloro‐p‐xylene in the organic phase were used to obtain the reaction rate constant with the integral method, and to analyze the polycondensation mechanism with a cyclic phase‐transfer initiation step in the heterogeneous liquid–liquid system. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 3059–3066, 2000  相似文献   

14.
A series of poly(amide‐imide)s were prepared using a new monomer, 1,3‐bis(trimellitimido)‐2,4,6‐trimethyl benzene (BTB), with four different diamines: 1,4‐phenylene diamine (PDA), 2,4‐diamino mesitylene (DAM), 2,2′‐dimethyl‐4,4′‐diamino biphenyl (DMDB), and 2,2′‐bis(trifluoromethyl)‐4,4′‐diamino biphenyl (TFDB). They were prepared by the condensation method in N‐methyl‐2‐pyrrolidinone (NMP) solvent using triphenyl phosphate and pyridine as condensing agents. The synthesized poly(amide‐imide)s were characterized by Fourier transform infrared and 1H NMR techniques. Films were prepared and characterized using DSC, thermogravimetric analysis (TGA), a prism coupler, and a film dielectric property analyzer. DSC measurement showed that the glass‐transition temperatures of the polymers were in the range of 259–327 °C. TGA analysis showed 5% weight loss, in the range of 472–514 °C. The refractive index varied from 1.6004 to 1.6586 in the following increasing order: BTB‐TFBM < BTB‐DAM < BTB‐DMDB < BTB‐PDA. For the poly(amide‐imide) films, the birefringence varied in the range of 0.0319–0.0580, in the following increasing order: BTB‐DAM < BTB‐TFBM < BTB‐DMDB < BTB‐PDA. The capacitance method showed that the dielectric constant of poly(amide‐imide) varied with the diamine structure; no difference was found by the optical method. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 137–143, 2004  相似文献   

15.
The aim of this work is to investigate the effect of consecutive shear on the crystallization of an amorphous aromatic polyimide (PI) derived from 3,3 ′ ,4,4 ′ ‐oxydiphthalic dianhydride (3,3 ′ ,4,4 ′ ‐ODPA) and 4,4 ′ ‐oxydianiline (ODA). At 260 °C, the increase of shear rate or shear time leads to the increase of crystallinity. Indeed, increasing shear rate can also accelerate the crystallization behavior. Moreover, it was found that a new melting peak appeared at higher temperature for long time or high rate sheared sample. The enhancement of crystallization behavior appears directly linked to the increase of crystal thickness. Particularly, the effect of shear temperature was investigated, and the results revealed that the crystallization of the PI was more sensitive to shear at 260 °C, which was 10° above the glass transition temperature (250 °C) of the PI. Possible mechanism was proposed to illustrate the effect of consecutive shear on the crystallization of the PI polymer. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2344–2349, 2007  相似文献   

16.
A series of poly(o‐hydroxy amide)s having both ether and sulfone linkages in the main chain were synthesized via the low‐temperature solution polycondensation of 4,4′‐[sulfonylbis(1,4‐phenylene)dioxy]dibenzoyl chloride and 4,4′‐[sulfonylbis(2,6‐dimethyl‐1,4‐phenylene)dioxy]dibenzoyl chloride with three bis(o‐aminophenol)s including 4,4′‐diamino‐3,3′‐dihydroxybiphenyl, 3,3′‐diamino‐4,4′‐dihydroxybiphenyl, and 2,2‐bis(3‐diamino‐4‐hydroxyphenyl)hexafluoropropane. Subsequent thermal cyclodehydration of the poly(o‐hydroxy amide)s afforded polyethersulfone benzoxazoles. Most of the poly(o‐hydroxy amide)s were soluble in polar organic solvents such as N‐methyl‐2‐pyrrolidone; however, the polybenzoxazoles without the hexafluoroisopropylidene group were organic‐insoluble. The polybenzoxazoles exhibited glass‐transition temperatures (Tg) in the range of 219–282 °C by DSC and softening temperatures (Ts) of 242–320 °C by thermomechanical analysis. Thermogravimetric analyses indicated that most polybenzoxazoles were stable up to 450 °C in air or nitrogen. The 10% weight loss temperatures were recorded in the ranges of 474–593 °C in air and 478–643 °C in nitrogen. The methyl‐substituted polybenzoxazoles had higher Tg's but lower Ts's and initial decomposition temperatures compared with the corresponding unsubstituted polybenzoxazoles. For a comparative purpose, the synthesis and characterization of a series of sulfonyl polybenzoxazoles without the ether group that derived from 4,4′‐sulfonyldibenzoyl chloride and bis(o‐aminophenol)s were also reported. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2262–2270, 2001  相似文献   

17.
A novel side‐chain liquid‐crystalline polyimide (SLCPI) was prepared via copolycondensation from 3,5‐diamino‐benzonic‐4′‐biphenyl ester, 4,4′‐diamino‐ biphenyl ether, and 3,3′,4,4′‐oxydiphthalic dianhydride. The energy‐minimized structure and liquid crystallinity of SLCPI were investigated by molecular modeling, differential scanning calorimetry (DSC), wide‐angle X‐ray scattering, and polarized optical microscopy, respectively. The results indicated that this polyimide (PI) with side‐chain mesogenic units exhibited a nematic NI phase. Because of the in situ self‐reinforcement of side‐chain mesogenic units, the improved tensile strength and modulus of PI films reached 270% and 300%, respectively. The coefficient of thermal expansion of films decreased by 40%. DSC and thermogravimetric analyses indicated that the phase‐transition temperature of SLCPI was above 240 °C, and the 5% weight‐loss temperature was above 520 °C. Moreover, copolycondensation of two diamines with dianhydride and incorporation of pendent mesogenic units diminished the regularity and symmetry of main chains; as a result, SLCPI exhibits good film processability. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 554–559, 2003  相似文献   

18.
The synthesis of aromatic poly(ether imide)s containing spirobifluorene units in the polymer backbone is described. 2,2′‐Bis(3,4‐dicarboxyphenoxy)‐9,9′‐spirobifluorene dianhydride, which was used as a new monomer, was synthesized with 2,2′‐dihydroxy‐9,9′‐spirobifluorene as the starting material. In the spiro‐segment, the rings of the connected bifluorene were orthogonally arranged. This bis(ether anhydride) monomer was employed in reactions with a variety of aromatic diamines to furnish poly(ether imide)s, involving an initial ring‐opening polycondensation and subsequent chemically induced cyclodehydration. Excellent solubility in common organic solvents at room temperature, good optical transparency, and high thermal stability are the prominent characteristic features of these new polymers, which can be attributed to the presence of spiro‐fused orthogonal bifluorene segments along the polymer chain. The glass‐transition temperatures of the polyimides were 240–293 °C, and the 5% weight‐loss temperatures were greater than 500 °C. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 262–268, 2002  相似文献   

19.
Three isomeric bis(thioether anhydride) monomers, 4,4′‐bis(2,3‐dicarboxyphenylthio) diphenyl ketone dianhydride (3,3′‐PTPKDA), 4,4′‐bis(3,4‐dicarboxyphenylthio) diphenyl ketone dianhydride (4,4′‐PTPKDA), and 4‐(2,3‐dicarboxyphenylthio)‐4′‐(3,4‐dicarboxyphenylthio) diphenyl ketone dianhydride (3,4′‐PTPKDA), were prepared through multistep reactions. Their structures were determined via Fourier transform infrared, NMR, and elemental analysis. Three series of polyimides (PIs) were prepared from the obtained isomeric dianhydrides and aromatic diamines in N‐methyl‐2‐pyrrolidone (NMP) via the conventional two‐step method. The PIs showed excellent solubility in common organic solvents such as chloroform, N,N‐dimethylacetamide, and NMP. Their glass‐transition temperatures decreased according to the order of PIs on the basis of 3,3′‐PTPKDA, 3,4′‐PTPKDA, and 4,4′‐PTPKDA. The 5% weight loss temperatures (T5%) of all PIs in nitrogen were observed at 504–519 °C. The rheological properties of isomeric PI resins based on 3,3′‐PTPKDA/4,4′‐oxydianiline/phthalic anhydride showed lower complex viscosity and better melt stability compared with the corresponding isomers from 4,4′‐ and 3,4′‐PTPKDA. In addition, the PI films based on three isomeric dianhydrides and 2,2′‐bis(trifluoromethyl)benzidine had a low moisture absorption of 0.27–0.35%. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011  相似文献   

20.
A series of new polyimides were prepared via the polycondensation of (3‐amino‐2,4,6‐trimethylphenyl)‐(3′‐aminophenyl)methanone and aromatic dianhydrides, that is, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride, 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride, and 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropane dianhydride. The structures of the polyimides were characterized by Fourier transform infrared and NMR measurements. The properties were evaluated by solubility tests, ultraviolet–visible analysis, differential scanning calorimetry, and thermogravimetric analysis. The two different meta‐position‐located amino groups with respect to the carbonyl bridge in the diamine monomer provided it with an unsymmetrical structure. This led to a restriction on the close packing of the resulting polymer chains and reduced interchain interactions, which contributed to the solubility increase. All the polyimides except that derived from BPDA had good solubility in strong aprotic solvents, such as N‐methyl‐2‐pyrrolidinone, N,N′‐dimethylacetamide, N,N‐dimethylformamide, and dimethyl sulfone, and in common organic solvents, such as cyclohexanone and chloroform. In addition, these polyimides exhibited high glass‐transition values and excellent thermal properties, with an initial thermal decomposition temperature above 470 °C and glass‐transition temperatures in the range of 280–320 °C. The polyimide films also exhibited good transparency in the visible‐light region, with transmittance higher than 80% at 450 nm and a cutoff wavelength lower than 370 nm. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1291–1298, 2006  相似文献   

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