硅中位错增殖的实验观察

用化学侵蚀法研究了在机械应力和热应力作用下硅中位错的增殖和非均匀成核。结果表明,在使位错增殖和成核作用上,热应力同机械应力是等效的。硅中小角晶界中的位错,原生孤立位错都能成为位错源;晶体内部的缺陷及表面蚀斑处的应力集中能够引起位错成核;硅中螺型位错能够通过交叉滑移机制发生增殖。对新生位错环空间分布的研究表明,Frank-Read机制可能是位错增殖的主要形式。位错能否发生增殖,主要决定于位错源所受分切应力的数值、晶体温度、位错本身的结构特点以及钉扎情况等。     

硅中退火多边化

用化学侵蚀法对硅单晶中的退火多边化进行了实验研究。研究了多边化过程及其与退火温度的关系。根据实验数据求出硅中位错攀移激活能,发现形变时产生双滑移系退火而不形成多边化墙的主要原因,并非由于形成Lomer-Cottrell位错。     

PbFe_(12)O_(19)单晶体中的位错蚀斑研究

应用50％HCl作为浸蚀剂,对助熔法生长的PbFe_(12)O_(19)单晶体的(0001)解理面进行了浸蚀,以显示位错蚀斑。根据蚀斑所具有的形态,将其进行了分类,并确定了各自对应的位错类型。应用Mathews等人提出的机制,解释了在(0001)基面上所观察到的位错蚀斑阵列。     

PbFe12O19单晶体中的位错蚀斑研究

应用50％HCl作为浸蚀剂,对助熔法生长的PbFe₁₂O₁₉单晶体的(0001)解理面进行了浸蚀,以显示位错蚀斑。根据蚀斑所具有的形态,将其进行了分类,并确定了各自对应的位错类型。应用Mathews等人提出的机制,解释了在(0001)基面上所观察到的位错蚀斑阵列。 关键词：     

集中力作用下硅中位错结构

本文用化学侵蚀法研究了硅单晶样品在800—1000℃印压得到的位错“花结”。实验结果说明:印压产生的位错分布在{111}滑移面上;位错线的取向大部分是<110>或<112>方向。分析并观察到在压印下有两种位错环,一种是柏格斯矢量沿<110>方向并平行于(111)印压面;一种是柏格斯矢量沿<110>方向并与印压面相交。对位错环的结构进行了分析。     

直拉法生长的GGG和YAG单晶体中螺型位错的双折射像

在直拉法生长的GGG和YAG单晶体中,从实验上首次获得了沿位错线观察的(viewed end-on)螺型位错的双折射像,确立了沿位错线观察和垂直于位错线观察(viewed from the side)的双折射像间的一一对应关系,以及与蚀斑间的一一对应关系,并基于石榴石晶体弹-光性质的各向异性,给出了沿位错线观察的螺型位错双折射像的成像规律,得到了理论与实验一致的结果。 关键词：     

含氢气氛下区熔硅单晶中缺陷的研究

利用化学腐蚀和X射线投影貌相方法研究了含氢气氛下区熔无位错硅单晶中的缺陷,发现异常腐蚀现象、缺陷密度与气氛中氢含量紧密相关,观测了纯氢气氛下无位错硅单晶退火后的缺陷,找到了貌相与蚀象的对应关系,还观察了二次退火效应,最后,综合所观测到的结果,讨论了氢在硅单晶中的集聚、沉淀和位错环列的发射、运动及交互作用。 关键词：     

区熔硅单晶中一种位错源

用化学侵蚀法研究了区熔法生长的硅单晶体中的杂质条,以及由此杂质条的体印压产生的位错环列。实验结果表明,杂质条处在硅中{111}面的〈110〉方向上,杂质条的长度约为5—230μm;其横向尺寸约为2—3μm。我们研究了杂质条体印压产生的位错环列的几何结构。杂质条的尺寸和形状决定了位错环的尺寸和形状。还观察和分析了位错环列交叠产生的位错网络。 关键词：     

硅中位错运动速度

本文用化学侵蚀法显示了硅晶体印压产生的位错。测量了在不同温度、不同切应力下“花结”上刃型(或60°)位错的运动速度。设位错运动是热激活的,激活能为～2.94eV.比较了900℃下刃型(或60°)位错及螺型位错的速度,后者较小。在不同样品上进行速度的测定,说明原生位错对形变位错运动有阻碍作用。观察到原生位错和晶界位错在外加力作用下的增殖,对位错在增殖中的速度进行了测量。讨论了本工作所用的实验方法,并分析了影响速度测量值的某些因素。     

二相介质中的运动位错

本文考虑二相介质中与平面相界平行的匀速运动直线位错。采用了与位错相对静止的运动坐标系,在此坐标系中推广位错各向异性弹性理论的普遍方法,并利用弹性力学中的格林函数方法处理相界面,计算得到此位错在介质中所产生的总弹性场,以及其所受到的“像力”。本文所提出的理论方法有一般的适用性,结果可以用于考虑此位错与其它缺陷的相互作用,以及二相介质的力学性质。 关键词：     

Reflection-pattern study of the anisotropy of the etching of gallium antimonide

An etchant has been found for the selective etching of gallium antimonide, and a study has been made of the anisotropy of the dissolution along the main crystallographic directions. The dissolution rates of the gallium antimonide faces obey $$v_{\left( {111} \right)B} > v_{\left( {1 \cdot 0} \right)} > v_{\left( {110} \right)} > v_{\left( {111} \right)A} .$$ An optical method has been developed for orienting gallium antimonide crystals on the basis of the main crystallographic planes. Reflection patterns from GaSb differ from those from gallium arsenide, germanium, and silicon.     

α—SiC晶体中的位错

用腐蚀法和X射线形貌术研究了α-SiC晶体中的位错。所用的腐蚀剂为熔融氢氧化钾。证实了尖底蚀坑与位错的一一对应关系。由于[0001]方向的螺型位错的Burgers矢量比刃型位错的Burgers矢量大得多,故可从蚀坑的深浅来判别螺型位错和刃型位错。给出了蚀坑形状和多型体晶体结构的对应关系。研究了表面生长蜷线的形态与SiC晶体中的位错及位错运动的关系。X射线形貌图显示了α-SiC晶体中相当数量的位错处于基面C面上。生长位错从晶体“根部”成核并随着晶体生长前沿的向前推进而延伸,因而位错线的方向常常沿[101O]和[1120]方向。将腐蚀法和X射线形貌术结合起来才能全面显示α-SiC晶体中的位错。 关键词：     

Hydrothermal etching as a method of quartz quality control of density and distribution of dislocations

Abstract

In this paper the effective non-destructive method of hydrothermal etching of crystals is considered to carry out estimation of density and place of dislocations in large scaled crystals of synthetic quartz. In this process of etching there are specific etch figures which appear as faceted holes of a millimetre up to several millimetres in size on all quartz facets. The size of holes depends on concentration of solution, duration of the process of etching and degree of solution saturation by silicon dioxide. The configuration of the holes on the facets of different indexes is various. Pits of symmetry, having facets, correspond to each facet there. Zcrystals are basic in quartz production. In sectional operation the expedients of defection of dislocations in pits generated on a facet are considered (0001).     

Optimum parameters to etch Nd:YAG crystals with orthophosphoric acid H3PO4

Subsurface flaws, which determine the fracture strength of crystals, can be removed by the aid of chemical etching. Above a temperature of 200°C orthophosphoric acid H₃PO₄ is an efficient etchant for yttrium aluminium garnets. However, at these temperatures the etchant decomposes into its related phosphoric acids which show negligible etching rates for garnets. It takes a long time to warm up a large volume of acid and the etchant is decomposed for the most part already before the optimum temperature is reached. We show that efficient etching is achieved when the samples are in the bath already during the warm-up phase and specify the parameters for the optimum etch process.     

Characterization of wide-band-gap semiconductors (GaN, SiC) by defect-selective etching and complementary methods

Two defect-selective etching approaches used for revealing and analysis of defects in wide-band-gap semiconductors (GaN, SiC) are described in detail: (i) orthodox etching in molten salts (KOH, NaOH) and hot acids (H₂SO₄,H₃PO₄) and (ii) electroless photo-etching (photoelectrochemical or PEC) in aqueous solutions of KOH. Characteristic features of these two techniques, their reliability and limitation in revealing different types of defects (dislocations, stacking faults, micro-defects and electrically active chemical non-homogeneities) will be discussed. Examples of the use of both etching approaches to reveal defects in bulk and epitaxial layers of different crystallographic orientation are given. Numerous references to previous work on calibration of the etch features by means of TEM, X-ray diffraction, Raman and PL methods are cited.     

β—SiC外延层中晶体缺陷的观察

用腐蚀法研究了β-SiC外延层中的晶体缺陷。腐蚀剂为熔融氢氧化钾。三角形尖底蚀坑对应于位错。在β-SiC中的全位错为立方晶系的73°位错和60°位错。不同堆垛方式的β-siC生长层相遇时将形成{111}交界层错,其腐蚀图象为平行于<110>方向的直线。60°位错可分解为两个1/6<112>SchockLey不全位错,并夹着一片{111}层错构成扩展位错。三个1/6<110>压杆位错与三片{111}层错可构成层错锥体。正、反堆垛的β-SiC可形成尖晶石律双晶,双晶面为(111)。腐蚀法和X射线劳厄法证实了这种双晶的存在。 关键词：     

A novel anti-shock silicon etching apparatus for solving diaphragm release problems

This paper presents a novel anti-shock bulk silicon etching apparatus for solving a universal problem which occurs when releasing the diaphragm (e.g.\ SiNx), that the diaphragm tends to be probably cracked by the impact of heating-induced bubbles, the swirling of heating-induced etchant, dithering of the hand and imbalanced etchant pressure during the wafer being taken out. Through finite element methods, the causes of the diaphragm cracking are analysed. The impact of heating-induced bubbles could be the main factor which results in the failure stress of the SiNx diaphragm and the rupture of it. In order to reduce the four potential effects on the cracking of the released diaphragm, an anti-shock bulk silicon etching apparatus is proposed for using during the last etching process of the diaphragm release. That is, the silicon wafer is first put into the regular constant temperature etching apparatus or ultrasonic plus, and when the residual bulk silicon to be etched reaches near the interface of the silicon and SiNx diaphragm, within a distance of 50--80~\mu m (the exact value is determined by the thickness, surface area and intensity of the released diaphragm), the wafer is taken out carefully and put into the said anti-shock silicon etching apparatus. The wafer's position is at the geometrical centre, also the centre of gravity of the etching vessel. An etchant outlet is built at the bottom. The wafer is etched continuously, and at the same time the etchant flows out of the vessel. Optionally, two symmetrically placed low-power heating resistors are put in the anti-shock silicon etching apparatus to quicken the etching process. The heating resistors' power should be low enough to avoid the swirling of the heating-induced etchant and the impact of the heating-induced bubbles on the released diaphragm. According to the experimental results, the released SiNx diaphragm thus treated is unbroken, which proves the practicality of the said anti-shock bulk silicon etching apparatus.     

Dislocations and their spatial configuration in amethyst crystals

Etch patterns produced on habit rhombohedral faces and rhombohedral cleavages of amethyst crystals are described and illustrated. Fidelity of etchants used is assessed. Also described are paired pits produced on match cleavages etched with the same or different etchants. By prolonged etching experiments it is established that the dislocations penetrate into the body of the crystal. Spatial distribution of dislocation in the body of the crystal is worked out. Uniformly spaced etch pits in an array observed on match cleavages (etched with different etchants) are attributed to low-angle tilt boundaries.     

Etch pits on fresh and grown-in dislocations and etching of antiphase domain boundaries in Fe-Si alloys

The etching of fresh and grown-in dislocations on the chemically polished (100) surface of Fe-3% Si alloy single crystals and fresh dislocations on the same surface of Fe-7% Si alloy single crystals in a 1–2% nital is described. Antiphase domain boundaries are revealed by the same etching on the surfaces of Fe-7% Si alloy single crystals with different crystallographic orientation.