Laser removal of copper particles from silicon wafers using UV, visible and IR radiation

Laser removal of small copper particles from silicon wafer surfaces was carried out using Nd:YAG laser radiation from near-infrared (1064 nm) through visible (532 nm) to ultraviolet (266 nm). It has been found that both 266 nm and 532 nm are successful in removing the particles from the surface whereas 1064 nm was shown to be ineffective in the removal of particles. The damage-threshold laser fluence at 266 nm was much higher than other wavelengths which provides a much wider regime for safe cleaning of the surface without causing any substrate damage. The cleaning efficiency was increased with a shorter wavelength. The effect of laser wavelength in the removal process is discussed by considering the adhesion force of the particle on the surface and the laser-induced cleaning forces for the three wavelengths. Received: 31 May 2000 / Accepted: 14 July 2000 / Published online: 20 June 2001     

Tungsten microcone arrays grown using nanosecond pulsed-Nd:YAG laser in a low-pressure He-gas atmosphere

Tungsten microcone arrays with a high aspect ratio are formed by the cumulative nanosecond pulsed-Nd:YAG laser irradiation of single-crystal tungsten under low pressure in an inert atmosphere. The morphology of the microcones and their density were strongly affected by the number of laser pulses. The microcones grew to a length of 20 μm with a diameter of about 1.5 μm at the tip after irradiation with more than 1200 pulses under our experimental conditions. They may have potential applications for emission cathodes in a field-emission display (FED) and in microelectronic devices. Received: 8 January 2001 / Accepted: 13 June 2001 / Published online: 2 October 2001     

Hybrid laser processing for microfabrication of glass

Hybrid laser processing for the precision microfabrication of glass materials, in which the interaction of a conventional pulsed laser beam and a medium on the material surface leads to effective ablation and modification, is reviewed. A major role of the medium is to produce strong absorption of the conventional laser beam by the material. Simultaneous irradiation by a vacuum ultraviolet (VUV) laser beam that possesses an extremely small laser fluence and an ultraviolet (UV) laser greatly improves the ablation quality and modification efficiency for fused silica (VUV-UV multiwavelength excitation process). The metal plasma generated by the laser beam effectively assists high-quality ablation of transparent materials by the same laser beam, resulting in microstructuring, cutting, color marking, printing, and selective metallization of glass materials (laser-induced plasma-assisted ablation (LIPAA)). The detailed discussion presented here includes the ablation mechanism of hybrid laser processing. Received: 18 December 2002 / Accepted: 20 January 2003 / Published online: 28 May 2003 RID="*" ID="*"Corresponding author. Fax: +81-48/462-4682, E-mail: ksugioka@postman.riken.go.jp     

Effect of vapor attenuation in surface ablation of cobalt by pulsed UV laser

Numerical calculations based on a thermal model were presented, which describe the process of target heating and ablation of cobalt during irradiation by 30-ns laser pulses at 308 nm. The attenuation of laser by vapor has been taken into account in this model. As results of the calculations, the temperature distribution beneath the target surface and the temporal evolution of surface temperature were given. The dependence of ablation rate on laser fluence was also studied based on this model. The surface ablation of cobalt with pulsed excimer laser was investigated experimentally. Our model considering proper vapor attenuation has shown to be in good agreement with the experimental results. Received: 20 January 2000 / Accepted: 13 March 2000 / Published online: 5 July 2000     

Phase transformation during surface ablation of cobalt-cemented tungsten carbide with pulsed UV laser

Surface ablation of cobalt-cemented tungsten carbide hard metal has been carried out in this work using a 308 nm, 20 ns XeCl excimer laser. Surface microphotography and XRD, as well as an electron probe have been used to investigate the transformation of phase and microstructure as a function of the pulse-number of laser shots at a laser fluence of 2.5 J/cm². The experimental results show that the microstructure of cemented tungsten carbide is transformed from the original polygonal grains of size 3 μm to interlaced large, long grains with an increase in the number of laser shots up to 300, and finally to gross grains of size 10 μm with clear grain boundaries after 700 shots of laser irradiation. The crystalline structure of the irradiated area is partly transformed from the original WC to βWC_1-x, then to αW₂C and CW₃, and finally to W crystal. It is suggested that the undulating ‘hill–valley’ morphology may be the result of selective removal of cobalt binder from the surface layer of the hard metal. The formation of non-stoichiometric tungsten carbide may result from the escape of elemental carbon due to accumulated heating of the surface by pulsed laser irradiation. Received: 13 July 2000 / Accepted: 27 October 2000 / Published online: 10 January 2001     

Angular laser cleaning for effective removal of particles. from a solid surface

Laser removal of small particles from a metal surface is carried out by changing the incident angle of the laser beam. It has been found that a dramatic improvement of cleaning efficiency in terms of area and energy is observed when using the laser at glancing angle of incidence as compared to perpendicular. Furthermore substrate damage is greatly reduced and probably eliminated at glancing angles. The process mechanism is discussed by considering the adhesion and the laser-induced cleaning forces for different incident angles. It is shown that there are different laser–matter interactions operating. Received: 25 April 2000 / Accepted: 9 May 2000 / Published online: 5 October 2000     

High-power laser interactions with nanostructured materials

We use short-pulse high-power lasers to selectively modify the structure of nanolaminates and nanocrystals. It is demonstrated that femtosecond pulses can achieve excellent results for microscopic thin film removal. Laser pulses can also be used to modify the crystal structure of thin films. It is also demonstrated that coherent laser excitation promotes a selective modification of nanocrystals, resulting in changes of size, shape, and crystal structure. Received: 7 October 2002 / Accepted: 20 January 2003 / Published online: 28 May 2003 RID="*" ID="*"Corresponding author. Fax: +1-414/229-5589, E-mail: yakovlev@uwm.edu     

Polarization effects in ultrashort-pulse laser drilling

A strong influence of the polarization of the laser radiation on the geometry of laser-machined microdrillings has been observed for ultrashort pulses. For drillings with a certain aspect ratio, reflections at the hole walls take place, leading to a non-uniform intensity distribution deep inside the formed hole. Experimental and theoretical results on this subject are discussed. It is shown that a rotation of the polarization during the drilling process (“polarization trepanning”) significantly improves the quality of the produced holes. Received: 21 August 1998 / Accepted: 25 November 1998 / Published online: 17 March 1999     

Microstructuring of fused silica by laser-induced backside wet etching using picosecond laser pulses

The laser-induced backside wet etching (LIBWE) is an advanced laser processing method used for structuring transparent materials. LIBWE with nanosecond laser pulses has been successfully demonstrated for various materials, e.g. oxides (fused silica, sapphire) or fluorides (CaF₂, MgF₂), and applied for the fabrication of microstructures. In the present study, LIBWE of fused silica with mode-locked picosecond (t_p = 10 ps) lasers at UV wavelengths (λ₁ = 355 nm and λ₂ = 266 nm) using a (pyrene) toluene solution was demonstrated for the first time. The influence of the experimental parameters, such as laser fluence, pulse number, and absorbing liquid, on the etch rate and the resulting surface morphology were investigated. The etch rate grew linearly with the laser fluence in the low and in the high fluence range with different slopes. Incubation at low pulse numbers as well as a nearly constant etch rate after a specific pulse number for example were observed. Additionally, the etch rate depended on the absorbing liquid used; whereas the higher absorption of the admixture of pyrene in the used toluene enhances the etch rate and decreases the threshold fluence. With a λ₁ = 266 nm laser set-up, an exceptionally smooth surface in the etch pits was achieved. For both wavelengths (λ₁ = 266 nm and λ₂ = 355 nm), LIPSS (laser-induced periodic surface structures) formation was observed, especially at laser fluences near the thresholds of 170 and 120 mJ/cm², respectively.     

3-D microstructuring inside photosensitive glass by femtosecond laser excitation

We show that a femtosecond laser enables us to produce true three-dimensional (3-D) microstructures embedded in a photosensitive glass, which has superior properties of transparency, hardness and chemical and thermal resistances. The photosensitivity arises from the cerium in the glass. After exposure to a focused laser beam, latent images are written. Modified regions are developed by a post-baking process and then preferentially etched away in a 10% dilute solution of hydrofluoric acid at room temperature. We have measured the critical dose for modification of the photosensitive glass, and fabricated 3-D microstructures with microcells and hollow microchannels embedded in the glass based on the critical dose. Received: 12 August 2002 / Accepted: 13 August 2002 / Published online: 4 December 2002 RID="*" ID="*"Corresponding author. Fax: +81-48/468-4682, E-mail: mmasudaw@postman.riken.go.jp     

Laser writing techniques for photomask fabrication using a femtosecond laser

Photomasks are the backbone of microfabrication industries. Currently they are fabricated by a lithographic process, which is very expensive and time consuming since it is a multi-step process. These issues can be addressed by fabricating photomasks by direct femtosecond laser writing, which is a single-step process and comparatively cheaper and faster than lithography. In this paper we discuss our investigations on the effect of two types of laser writing techniques, namely front- and rear-side laser writing, with regard to the feature size and the edge quality of a feature. It is proved conclusively that for the patterning of masks, front-side laser writing is a better technique than rear-side laser writing with regard to smaller feature size and better edge quality. Moreover the energy required for front-side laser writing is considerably lower than that for rear-side laser writing. Received: 22 May 2001 / Accepted: 14 September 2001 / Published online: 17 October 2001     

Photochemical effects in the UV laser ablation of polymers: Implications for laser restoration of painted artworks

0 ∝t^1/2. The best results are expected for a circular top-hat beam shape. Received: 15 January 1999 / Accepted: 18 January 1999     

Fundamentals and advantages of ultrafast micro-structuring of transparent materials

Experimental investigations using femtosecond and picosecond laser pulses at 800 nm illuminate the distinctions between the dynamics and nature of ultrafast processing of dielectrics compared with semiconductors and metals. Dielectric materials are strongly charged at the surface on the sub-ps time scale and undergo an impulsive Coulomb explosion prior to thermal ablation. Provided the laser pulse width remains in the ps or sub-ps time domain, this effect can be exploited for processing. In the case of thermal ablation alone, the high localization of energy accompanied by ultrafast laser micro-structuring is of great advantage also for high quality processing of thin metallic or semiconducting layers, in which the surface charge is effectively quenched. Received: 17 January 2003 / Accepted: 8 February 2003 / Published online: 28 May 2003 RID="*" ID="*"Corresponding author. Fax: +49-30/670-53-500, E-mail: d.ashkenasi@lmtb.dt RID="**" ID="**"Present address: LMTB GmbH, Berlin, Fabeckstr. 60–62, D-14195 Berlin, Germany     

IR pulsed laser light interaction with soiled cellulose and paper

Nd:YAG laser irradiation (1064 nm) of cellulose samples does not lead to immediate nor long-term effects on mechanical properties of paper, which renders the method increasingly interesting for cleaning of historical paper artefacts. However, the technique’s usability is so far limited due to discoloration when the treated object’s surface contains carbonaceous dirt. By using diffuse-reflectance Fourier-transform infrared spectroscopy, size-exclusion chromatography and viscometry it is demonstrated that the distinct yellowing is accompanied by formation of ether cross-links and dehydration of the cellulose, as well as its depolymerisation. Furthermore, the origin of the discoloration is discussed and it is proposed that yellow chromophores are formed due to carbon–cellulose interactions during laser irradiation. Received: 10 September 2001 / Accepted: 21 January 2002 / Published online: 3 June 2002     

Ultraviolet and visible Raman spectroscopy characterization of diamond–like carbon film growth by pulsed laser deposition

Laser-induced removal of flash from heat sinks in integrated circuit (IC) packages has been studied. It is found that flash can be effectively removed from heat sinks in plastic IC packages by laser deflashing. An optical microscope, an α-step surface profiler and X-ray photoelectron spectroscopy are used to analyze the deflashing efficiency. Laser deflashing of IC packages is based on laser ablation of flash materials. With an increase of laser fluence, the ablation rate increases. The laser fluence is selected between the ablation threshold of flash materials and that of heat-sink materials. An acoustic wave is generated by laser ablation of flash materials. Acoustic wave detection is used to monitor the surface cleanness during laser deflashing and to determine the ablation threshold of flash materials. Received: 18 April 2001 / Accepted: 14 September 2001 / Published online: 17 October 2001     

Femtosecond pulsed laser ablation of diamond-like carbon films on silicon

Femtosecond pulsed laser ablation (τ = 120 fs, λ = 800 nm, repetition rate = 1 kHz) of thin diamond-like carbon (DLC) films on silicon was conducted in air using a direct focusing technique for estimating ablation threshold and investigating the influence of ablation parameter on the morphological features of ablated regions. The single-pulse ablation threshold estimated by two different methods were ?_th(1) = 2.43 and 2.51 J/cm². The morphological changes were evaluated by means of scanning electron microscopy. A comparison with picosecond pulsed laser ablation shows lower threshold and reduced collateral thermal damage.     

Formation of conical microstructures upon laser evaporation of solids

The formation and development of the large-scale periodic structures on a single crystal Si surface are studied upon its evaporation by pulsed radiation of a copper vapor laser (wavelength of 510.6 nm, pulse duration of 20 ns). The development of structures occurs at a high number of laser shots (∼10⁴) at laser fluence of 1–2 J/cm² below optical breakdown in a wide pressure range of surrounding atmosphere from 1 to 10⁵ Pa. The structures are cones with angles of 25, which grow towards the laser beam and protrude above the initial surface for 20–30 μm. It is suggested that the spatial period of the structures (10–20 μm) is determined by the capillary waves period on the molten surface. The X-ray diffractometry reveals that the modified area of the Si substrate has a polycrystalline structure and consists of Si nanoparticles with a size of 40–70 nm, depending on the pressure of surrounding gas. Similar structures are also observed on Ge and Ti. Received: 12 February 2000 / Accepted: 28 March 2000 / Published online: 20 June 2001     

Optimization of the mode matching in pulsed cavity ringdown spectroscopy by monitoring non-degenerate transverse mode beating

A simple and reliable method is presented for optimizing the mode matching of a laser beam to the high-finesse cavity used in pulsed cavity ringdown spectroscopy (CRDS). The method is based on minimizing the excitation of higher-order transverse cavity modes through monitoring the non-degenerate transverse mode beating which becomes visible with induced cavity asymmetry caused by slight misalignment. No additional instrument is required other than a pinhole aperture, thus this method can be applied for CRDS experiments in the whole wavelength range. Measurements of the CRDS absorption spectrum of acetylene (C₂H₂) near 571 nm demonstrate that the mode-matching optimization improves the sensitivity of pulsed CRDS. Received: 22 October 2001 / Revised version: 16 January 2002 / Published online: 14 March 2002