Formation of linear momentum in a rod during a laser pulse–matter interaction

Recently, we developed an optodynamic experimental technique that makes it possible to measure the linear momentum obtained by a metal target sample in the shape of a rod during a nanosecond laser pulse interaction in the ablative regime. The height of the rod’s rear end axial step-like displacement, caused by the first reflection of the laser-generated ultrasonic wave, is proportional to the linear momentum acquired by the rod. In comparison with commonly used ballistic methods, we can determine the acquired momentum on a much shorter time scale corresponding to the wave transition time, from the front to the rear end of the rod. Using this method we investigated the ambient air pressure dependence on the formation of linear momentum over a laser intensity range, from the ablation threshold to values about ten times higher. Steel rods of various diameters were used to demonstrate the effect of an expanding blast wave which delivers additional momentum to the target, when the laser beam on the target surface is smaller than the target itself. The typical value of the acquired target momentum is on the order of μN s and 10 μN s/J for the momentum coupling coefficient.     

Aluminum thin film enhanced IR nanosecond laser-induced frontside etching of transparent materials

Laser processing of glass is of significant commercial interest for microfabrication of precision optical engineering devices. In this work, a laser ablation enhancement mechanism for microstructuring of glass materials is presented. The method consists of depositing a thin film of aluminum on the front surface of the glass material to be etched. The laser beam modifies the glass material by being incident on this front-side. The influence of ablation fluence in the nanosecond regime, in combination with the deposition of the aluminum layer of various thicknesses, is investigated by determining the ablation threshold for different glass materials including soda-lime, borosilicate, fused silica and sapphire. Experiments are performed using single laser pulse per shot in an air environment. The best enhancement in terms of threshold fluence reduction is obtained for a 16 nm thick aluminum layer where a reduction of two orders of magnitude in the ablation threshold fluence is observed for all the glass samples investigated in this work.     

纳秒激光在K9玻璃中聚焦的损伤形貌研究

详细研究了纳秒激光脉冲在K9玻璃内部产生损伤的形貌特点.整个损伤形貌是前端较大、后端逐渐减小,呈纺锤形.损伤区可分为四种类型的损伤形貌：损伤点轴向的丝状等离子通道、熔化区域、裂纹区域和裂纹末端的折射率变化区域.给出了激光脉冲能量在空间的沉积函数和冲击波膨胀压强的表达式,并根据压强的空间分布特点对相应的损伤形貌进行了分析,理论分析与实验结果相符. 关键词： 激光损伤形貌 移动损伤模型 冲击波 激光能量沉积     

UBK7玻璃后表面缺陷诱导体内激光损伤

 对UBK7玻璃在波长为1.064靘的短脉冲激光作用下产生的损伤进行了研究。通过对体损伤的形貌的相衬显微镜观测,发现体内和后表面炸裂点间的丝状损伤,从而提出后表面缺陷导致体损伤的理论解释。同时分析了表面损伤和体损伤的机理,对后表面损伤阈值低于前表面的原因作了讨论。     

Impact of the lasr wavelength and fluence on the ablation rate of aluminium

The dependence of the ablation rate of aluminium on the fluence of nanosecond laser pulses with wavelengths of 532 nm and respectively 1064 nm is investigated in atmospheric air. The fluence of the pulses is varied by changing the diameter of the irradiated area at the target surface, and the wavelength is varied by using the fundamental and the second harmonic of a Q-switched Nd-YAG laser system. The results indicate an approximately logarithmic increase of the ablation rate with the fluence for ablation rates smaller than ∼6 μm/pulse at 532 nm, and 0.3 μm/pulse at 1064 nm wavelength. The significantly smaller ablation rate at 1064 nm is due to the small optical absorptivity, the strong oxidation of the aluminium target, and to the strong attenuation of the pulses into the plasma plume at this wavelength. A jump of the ablation rate is observed at the fluence threshold value, which is ∼50 J/cm² for the second harmonic, and ∼15 J/cm² for the fundamental pulses. Further increasing the fluence leads to a steep increase of the ablation rate at both wavelengths, the increase of the ablation rate being approximately exponential in the case of visible pulses. The jump of the ablation rate at the threshold fluence value is due to the transition from a normal vaporization regime to a phase explosion regime, and to the change of the dimensionality of the hydrodynamics of the plasma-plume.      

Peculiarity of metal drilling with a commercial femtosecond laser

A commercial femtosecond pulse laser was used to study the interaction of ultrashort laser pulses with aluminum. Tests were conducted to measure the average drilling rate over a range of laser pulse energies in both air and vacuum at the wavelengths corresponding to the fundamental and second harmonic of the laser. For the fundamental wavelength, it was observed that the drilling rates in vacuum were significantly higher than that for drilling in atmospheric air. For the laser beam that was converted to second harmonic, the drilling rate in vacuum at the same energy was slightly lower than that for drilling in air. The observed results can be explained by the presence of an energetic nanosecond pedestal in the laser pulse produced by the femtosecond laser system. This nanosecond component provides a major contribution into drilling and it is strongly affected by the optical breakdown plasma that reduces the drilling rate in air. Conversion to second harmonic reduces the relative energy content of the nanosecond component resulting in a higher contrast femtosecond pulse that is not affected by the near surface plasma. The presence of air results in self-focusing of the second harmonic laser beam, causing an increased drilling rate as compared to the interaction in vacuum.     

脉冲激光辐照氮化硅陶瓷损伤阈值的光谱测量

氮化硅陶瓷具有耐高温、耐腐蚀和耐磨损等优异性能, 可应用于金属材料和高分子材料难以胜任的极端工作环境。但具备这些优良特性的同时也给其加工带来了不便,传统的磨削加工方法效率低,设备损耗严重, 激光辅助加工为其提供了一种新途径。将等离子体光谱法和显微成像法相结合,对脉冲激光辐照氮化硅陶瓷的损伤阈值进行了测量,并分析了损伤机理。实验选用热压烧结氮化硅陶瓷为靶材,参考ISO21254国际损伤阈值测试标准搭建试验系统,采用1-on-1法利用Nd3+∶YAG固体脉冲激光分别在纳秒和微秒脉宽下辐照氮化硅陶瓷,两种脉宽分别选取10个能量密度梯度进行激光辐照,每个能量密度辐照10个点。利用光纤光谱仪采集光谱信息,利用金相显微镜获取显微图像信息,将光谱结果与显微成像结果对比分析, 发现纳秒脉宽下材料一旦损伤光谱上就会出现等离子体峰,通过分析光谱中等离子体峰,元素指认是否含有材料中特征元素即可判断损伤,为了区别空气电离击穿同时测量了空气等离子体光谱对比分析剔除干扰。微秒脉宽下显微图像观察到刚开始损伤时,光谱中只出现较强热辐射谱线并未出现等离子体谱线,进一步增加激光能量密度,光谱中会出现少量等离子体峰,因此不能直接以等离子体峰判断材料损伤阈值。利用金相显微镜观察损伤形貌,纳秒脉宽下在损伤区域内部观察到明显的烧蚀冲击状损伤,光谱呈现出大量等离子体谱线,说明纳秒激光辐照氮化硅损伤机制主要为等离子体冲击波引起的力学损伤效应。微秒脉宽在辐照区域边缘发现热烧蚀痕迹,损伤区内观察到大量熔融物,出现明显热辐射光谱,说明微秒激光辐照氮化硅损伤机制主要是由于长脉宽热积累引起的热损伤效应,随着能量密度增加热辐射谱上叠加有等离子体峰,等离子体峰值强度与损伤程度一致。利用零几率损伤阈值法对两种方法测得结果进行了拟合,分析发现等离子体光谱法更适用于纳秒脉宽下损伤阈值测量,得到结果为0.256 J·cm-2;显微成像法适用于微秒脉宽下损伤阈值测量,得到结果为6.84 J·cm-2。     

Ultra-fast diagnosis of shock waves and plasma at front and rear surfaces in the bulk of fused silica induced by an Nd:YAG pulse laser

We investigate the dynamic processes of the Nd:YAG pulse laser ablation of fused silica by ultrafast timeresolved optical diagnosis with a nanosecond time resolution. The evolution process of plasma expansion in air and shock waves propagation in the bulk are both obtained with spatial and temporal resolutions.Laser-induced damage in the bulk of fused silica with filaments and shock waves are observed. Thermoelastic wave,mechanical wave,and shock wave dependence on the laser fluence and intensity of the plasma are analyzed. The shock pressure P and temperature T calculated through the measured shock velocity D and the Hugoniot data of fused silica are measured.     

Pulsed laser ablation of solids: transition from normal vaporization to phase explosion

We present experimental data on mass removal during 1064-nm pulsed laser ablation of graphite, niobium and YBa₂Cu₃O_7-δ superconductor. Evidence for the transition from normal vaporization to phase explosion has been obtained for these materials, showing a dramatic increase in the ablation rate at the threshold fluences of 22, 15 and 17.5 J/cm², respectively. A numerical model is used to evaluate the ablation rate and temperature distribution within the targets under near-threshold ablation conditions. The results are analyzed from the viewpoint of the vaporized matter approaching the critical point with increasing laser fluence. A possible means of the estimating the thermodynamic critical temperature from the data for nanosecond laser ablation is discussed. It is suggested that the critical temperature of refractory metals is higher than that estimated with the traditional methods due to plasma effects. An analogy with the boiling crisis (the transition from nucleate to film boiling) is drawn to explain the formation of ablation craters with spallated edges. Received: 18 May 2000 / Accepted: 14 July 2000 / Published online: 22 November 2000     

Nanosecond pulsed laser ablation of silicon in liquids

Laser fluence and laser shot number are important parameters for pulse laser based micromachining of silicon in liquids. This paper presents laser-induced ablation of silicon in liquids of the dimethyl sulfoxide (DMSO) and the water at different applied laser fluence levels and laser shot numbers. The experimental results are conducted using 15 ns pulsed laser irradiation at 532 nm. The silicon surface morphology of the irradiated spots has an appearance as one can see in porous formation. The surface morphology exhibits a large number of cavities which indicates as bubble nucleation sites. The observed surface morphology shows that the explosive melt expulsion could be a dominant process for the laser ablation of silicon in liquids using nanosecond pulsed laser irradiation at 532 nm. Silicon surface’s ablated diameter growth was measured at different applied laser fluences and shot numbers in both liquid interfaces. A theoretical analysis suggested investigating silicon surface etching in liquid by intense multiple nanosecond laser pulses. It has been assumed that the nanosecond pulsed laser-induced silicon surface modification is due to the process of explosive melt expulsion under the action of the confined plasma-induced pressure or shock wave trapped between the silicon target and the overlying liquid. This analysis allows us to determine the effective lateral interaction zone of ablated solid target related to nanosecond pulsed laser illumination. The theoretical analysis is found in excellent agreement with the experimental measurements of silicon ablated diameter growth in the DMSO and the water interfaces. Multiple-shot laser ablation threshold of silicon is determined. Pulsed energy accumulation model is used to obtain the single-shot ablation threshold of silicon. The smaller ablation threshold value is found in the DMSO, and the incubation effect is also found to be absent.     

Ultraviolet and visible Raman spectroscopy characterization of diamond–like carbon film growth by pulsed laser deposition

Laser-induced removal of flash from heat sinks in integrated circuit (IC) packages has been studied. It is found that flash can be effectively removed from heat sinks in plastic IC packages by laser deflashing. An optical microscope, an α-step surface profiler and X-ray photoelectron spectroscopy are used to analyze the deflashing efficiency. Laser deflashing of IC packages is based on laser ablation of flash materials. With an increase of laser fluence, the ablation rate increases. The laser fluence is selected between the ablation threshold of flash materials and that of heat-sink materials. An acoustic wave is generated by laser ablation of flash materials. Acoustic wave detection is used to monitor the surface cleanness during laser deflashing and to determine the ablation threshold of flash materials. Received: 18 April 2001 / Accepted: 14 September 2001 / Published online: 17 October 2001     

Processing of transparent materials using visible nanosecond laser pulses

Laser micromachining of transparent materials is an intensively studied research area from the point of view of microoptical element fabrication. One of the most promising indirect processing methods is the laser-induced back-side dry etching (LIBDE). During this method, transparent targets are contacted with solid thin layers, which absorb and transform the pulse energy resulting in etching. The applicability of LIBDE technology for processing of fused silica using a visible nanosecond dye laser (λ=500 nm, FWHM=11 ns) and a 100-nm-thick aluminium absorbing layer was investigated. The applied fluence was varied in the range of 0–3050 mJ/cm²; the illuminated area was 0.1 mm². The threshold fluence of the LIBDE etching of fused silica was found to be approximately 540 mJ/cm². The chemical composition of the surface layers on and around the etched holes was investigated by field-emission scanning electron microscopy and energy-dispersive X-ray spectrometry. It was found that on average 0.4±0.3 at. % aluminium is built into the upper ∼1-μm-thick volume of the illuminated fused silica, while the aluminium content fell below the detection limit in the case of the original surface. Our experiments proved that the LIBDE procedure is suitable for microprocessing of transparent materials using visible nanosecond laser light. PACS 42.62.-b; 61.80.Ba; 81.16.Rf; 81.65.Cf     

Nanosecond and femtosecond excimer laser ablation of fused silica

Ablation of fused silica using standard excimer lasers (20–30 ns pulse duration at 193, 248, and 308 nm) and a short pulse laser system (500 fs at 248 nm) is reported. Ablation rates range from several hundred nm/pulse (193 nm or fs-laser) up to about 6 m/pulse (308 nm). The performance of the ablation is found to depend not only on wavelength and pulse duration but also on the existing or laser induced surface quality (e.g., roughness) of the material. Special ablation phenomena are observed. At 193 nm and moderate fluence (3 J/cm²) ablation takes place at the rear side of a plate without affecting the front side, whereas at higher fluence normal ablation at the front side occurs. At 248 nm (standard excimer) the existence of two consecutive ablation phases is observed: smooth ablation at low rate is followed by explosive ablation at high rate. Using fs-pulses smooth shaped holes are formed during the first pulses, whereas high pulse numbers cause the development of a ripple structure in the ablation craters.The results lead to the conclusion that two different ablation mechanisms are involved: the first is based on two photon bulk absorption, the second on controlled surface damage in relation with (partially laser induced) singularity conditions at the surface.Presented at LASERION '91, June 12–14, 1991, München (Germany)     

Thermal model for nanosecond laser sputtering at high fluences

The vaporization effect and the following plasma shielding generated by high-power nanosecond pulsed laser ablation are studied in detail based on the heat flux equation. As an example of Si target, we obtain the time evolution of the calculated surface temperature, ablation rate and ablation depth by solving the heat flow equations using a finite difference method. It can be seen that plasma shielding plays a more important role in the ablation process with time. At the same time, the variation of ablation depth per pulse with laser fluence is performed. Our numerical results are more agreed with the experiment datum than other simulated results. The result shows that the plasma shielding is very important.     

Liquid-assisted femtosecond laser drilling of straight and three-dimensional microchannels in glass

Ultra-short-pulse lasers have proved to be effective tools for micromachining a wide range of materials. When the ultra-short laser pulse is focused inside the bulk of a transparent medium, nonlinear absorption occurs only near the focal volume that is subjected to high intensity. Three-dimensional structures can be fabricated inside transparent materials by taking advantage of this volumetric absorption. In this paper, femtosecond laser pulses were used to fabricate straight and bent through-channels. Drilling was initiated from the rear surface to preserve consistent absorption of the laser pulse. When the debris was not removed efficiently, variation of the channel diameter and occasional termination of the drilling process were observed. Machining in the presence of a liquid and additional use of ultrasonic wave agitation facilitated the debris ejection. The machined channels had diameters on the order of tens of microns, high aspect ratios, and good wall-surface quality. PACS 42.62.Cf; 42.65.Re; 81.05.Kf; 43.35.+d     

Vaporization and Plasma Shielding during High Power Nanosecond Laser Ablation of Silicon and Nickel

A thermal model to describe the high-power nanosecond pulsed laser ablation is presented. It involves the vaporization and the following plasma shielding effect on the whole ablation process. As an example of Si target, we obtainthe time evolution of the calculated surface temperature, ablation rate and ablation depth. It can be seen that plasma shielding plays a more important role in the ablation process with time. At the same time, the ablation depth with laser fluence based on different models is shown. Moreover, we simulate the pulsed laser irradiation Ni target. The evolution of the transmitted intensity and the variation of ablation depth per pulse with laser fluence are performed. Under the same experimental conditions, the numerical results calculated with our thermal model are more in agreement with the experimental data.     

Deep drilling on a silicon plate with a femtosecond laser: experiment and model analysis

The ablation rate when drilling fine holes having large aspect ratios in silicon substrates with femtosecond laser pulses was estimated from mechanically ground cross sections of the ablated holes. The ablation rate shows a dramatic change at the depth at which the laser pulse reaches a certain fluence, which is nearly constant when the initial laser fluence was varied from 14.5 to 59.4 J/cm². The ablation rate, threshold fluence, in three fluence domains, and the transition fluences at which the ablation rate shows a dramatic change, were derived. However, when a pulse energy of 200 μJ was used a much greater ablation rate was obtained, suggesting that another fluence domain for larger ablation rates exists. The experimentally obtained hole depths as a function of shot numbers were reproduced by a theoretical model, which incorporates laser pulse attenuation in the holes that is the same as that in waveguides for some attenuation coefficient and ablation rates for three fluence domains. PACS 42.62.-b; 42.65.Re; 78.40.Fy; 78.47.+p; 81.20.Wk     

Effects of waveguide behavior during femtosecond-laser drilling of metals

We investigate the dynamics of femtosecond-laser drilling of metals, both theoretically and experimentally, by taking into account waveguide-like behavior of ablated cavities. In particular, we show that cylindrical holes generated during laser ablation of metals act like hollow optical waveguides. Since the drilling is generally achieved by a large number of consecutive pulses, each pulse is first guided through the channel formed by the previous pulses, and at the end of the channel, it is absorbed by the metal, making its own contribution to ablation. The ablation stops at maximum depth when attenuation in the cavity reduces the pulse fluence to the ablation threshold. We use waveguide theory to calculate attenuation constants, and perform an iterative calculation to model pulse-by-pulse ablation. We also performed detailed experiments and compare the results with the theoretical findings. When only absorption losses are included, the waveguide model predicts significantly deeper structures. On the other hand, when we include scattering losses caused by nanostructures formed on the cavity walls, quantitative agreement with experiments is achieved. The waveguide model is particularly effective at fluences close to ablation threshold, and it can explain several behaviors such as evolution of the depth per pulse and effect of the incoming pulse energy in different focusing configurations.     

Optodynamic description of a linear momentum transfer from a laser induced ultrasonic wave to a rod

We present a new optodynamic experimental technique to measure the linear momentum obtained by a rod during a nanosecond laser pulse ablation of the rod’s front face on the basis of the displacement due to an ultrasonic wave reflection at its rear end. With the help of a simple theory, we explained the step-like motion of the rod’s free end. This theory conforms well with the general shape of the measured displacement history curve. The acquired momentum can be directly estimated by measuring the height of a step from the step-like motion of the rod’s end. Measurements based on an arm-compensated Michelson interferometer also enabled us to follow the attenuation of an ultrasonic wave and so to determine the characteristic attenuation time. This quantity plays a major role in the transfer of linear momentum from within the initial ultrasonic wave to the final net uniform motion of the specimen. PACS  52.38.Mf; 43.35.Yb; 43.35.Cg     

The effect of plasma channel on the self-distortion of laser pulse propagating through the collisional plasma channel

In the present paper, laser pulse distortion/breakup and the effect of the plasma channel on the laser propagation through the collisional plasma have been studied by using moment theory approach. Second order nonlinear differential equations of the beam width parameter have been derived for the propagation of the laser through uniform homogenous plasma and preformed plasma channel having parabolic density profile. Differential equations of beam width parameter have been solved numerically using Runge Kutta method. It has been observed from analysis that when the laser pulse propagates through the homogenous plasma, the low intensity front and rear parts of the laser get defocused/diffracted and the high intensity central/main portion of the laser pulse gets self-guided. As a result of this, the laser pulse gets distorted. This distortion of the laser has not been observed when the laser pulse is propagated through the plasma channel having density minimum at the axis and maximum at the edges. The laser pulse is guided as a whole, even the low intensity front and rear parts of the laser are also guided. Therefore, the plasma channel is useful to prevent the distortion/breakup of the laser.