不同磨料对蓝宝石晶片化学机械抛光的影响研究

本文制备了几种含不同磨料(SiC、Al2O3不同粒径SiO2)的抛光液,通过纳米粒度仪分析磨料粒径分布,采用原子力显微镜观察磨料的粒径大小.研究了不同磨料对蓝宝石晶片化学机械抛光(CMP)的影响,利用原子力显微镜检测抛光前后蓝宝石晶片表面粗糙度.实验结果表明,在相同的条件下,采用SiC、Al2O3作为磨料时,材料去除速率与表面粗糙度均不理想;而采用含1;粒径为110 nm SiO2的抛光液,材料的去除速率最高为41.6 nm/min,表面粗糙度Ra=2.3 nm;采用含1;粒径为80 nm SiO2的抛光液,材料的去除速率为36.5 nm/min,表面粗糙度最低Ra=1.2 nm.     

阳离子表面活性剂对A向蓝宝石晶片化学机械抛光效率的影响

为了探究阳离子表面活性剂对A向(1120)蓝宝石晶片化学机械抛光效率的影响,采用失重法计算蓝宝石的材料去除率(MRR)、原子力显微镜观察抛光后蓝宝石晶片表面粗糙度(Ra).结果表明:纯二氧化硅磨粒抛光液中,蓝宝石晶片的MRR在pH8时最优(MRR=1984/h),此时Ra为0.867 nm;添加一定浓度的阳离子表面活性剂可以提高蓝宝石晶片的抛光效率,其MRR在pH =9时达到最大(MRR=2366 nm/h),此时Ra =0.810 nm.通过粒径和Zeta电位分析,阳离子表面活性剂改变了二氧化硅磨粒表面的Zeta电位值,进而改变了磨粒与磨粒及磨粒与蓝宝石晶片的作用力,且在碱性条件下可以获得较高的MRR.     

硒化锌的化学机械抛光研究

采用化学机械抛光(CMP)的方法,自制抛光液作为研磨介质,对(50×50×1.5)mm3硒化锌(ZnSe)晶片抛光.通过分析抛光液的pH值、抛光盘转速、抛光液的磨料浓度、压力、抛光时间和抛光液流量等参数对CMP的影响,组合出最佳工艺参数,并通过原子力显微镜和平晶测试方法对最佳工艺参数获得的ZnSe晶片进行测试,实验结果显示,ZnSe晶片抛光后的表面粗糙度Ra为0.578 nm,平面面形误差小于1.8 μm.     

LBO晶体超光滑表面抛光机理

胶体SiO2抛光LBO晶体获得无损伤的超光滑表面,结合前人对抛光机理的认识,探讨了超光滑表面抛光的材料去除机理,分析了化学机械抛光中的原子级材料去除机理.在此基础上,对胶体SiO2抛光LBO晶体表面材料去除机理和超光滑表面的形成进行了详细的描述,研究抛光液的pH值与材料去除率和表面粗糙度的关系.LBO晶体超光滑表面抛光的材料去除机理是抛光液与晶体表面的活泼原子层发生化学反应形成过渡的软质层,软质层在磨料和抛光盘的作用下很容易被无损伤的去除.酸性条件下,随抛光液pH值的减小抛光材料的去除率增大;抛光液pH值为4时,获得最好的表面粗糙度.     

影响化学机械抛光4H导电SiC晶片表面质量的关键参数研究

选用二氧化硅抛光液抛光4H导电SiC晶片表面,探究影响SiC晶片表面质量的关键参数,获得更高的去除效率和表面质量.实验结果表明,SiC表面的氧化是氢氧根离子和双氧水共同作用的结果.保持压力不变并增加氢氧根离子或双氧水的含量,SiC表面去除速率先增加后保持不变.在更大的压力下增加氢氧根离子的含量,SiC表面的抛光去除速率进一步增加.通过优化的抛光参数,SiC表面的抛光去除速率达到142 nm/h.进一步研究结果表明,保持化学机械抛光过程中氧化作用与机械作用相匹配,是获得高抛光效率和良好的表面质量的关键.表面缺陷检测仪(Candela)和原子力显微镜(AFM)的测试结果表明,SiC抛光片表面无划痕,粗糙度达到0.06 nm.外延后总缺陷密度小于1个/cm2,粗糙度达到0.16 nm.     

大直径铌酸锂晶片的化学机械抛光研究

本文采用化学机械抛光方法,以SiO2作为抛光液的研磨介质,对76mm Z切向的铌酸锂晶片的抛光进行了深入的研究.分析了影响铌酸锂晶片抛光效果的因素,通过优化工艺参数,使铌酸锂的表面粗糙度Ra达到0.387nm,平面面形误差小于4μm.     

雾化施液同质硬脆晶体互抛CMP工艺研究

探究了雾化施液同质硬脆晶体互抛CMP工艺抛光单晶硅片的可行性,分析其材料去除机理.试验采用传统的化学机械抛光CMP和雾化施液同质硬脆晶体互抛CMP,使用三种含有不同成分的抛光液对硅片进行抛光,对抛光前后的硅片进行称重比较两种工艺方法的材料去除率;通过扫面探针显微镜观察硅片的表面形貌,对其表面粗糙度进行分析.使用雾化施液同质硬脆晶体互抛CMP工艺对硅片进行抛光时,硅片表面材料去除率随着抛光压力的增大而增大,抛光压力为9 psi时达到最大为711 nm/min,高于传统化学机械抛光的630 nm/min;对两种工艺抛光后的硅片进行扫描分析得出雾化施液化学机械抛光工艺抛光后的硅片表面粗糙度为3.8 nm,低于传统化学机械抛光工艺的6.8 nm.雾化施液同质硬脆晶体互抛CMP工艺抛光硅片是可行的,优于传统化学机械抛光工艺,具有材料去除率高、抛光效果好、节约成本以及绿色环保的优点.     

酸碱性对雾化施液CMP氧化锆陶瓷的影响

采用精细雾化施液CMP这一抛光工艺对氧化锆陶瓷进行抛光,实验研究了抛光液中具有代表性的酸碱调节剂对抛光氧化锆陶瓷材料去除率、表面形貌和表面粗糙度的影响及酸碱性对精细雾化施液分散稳定性的影响.结果表明:针对精细雾化液抛光工艺配制的二氧化硅抛光液在碱性环境中分散稳定性更好,虽然酸性抛光液对材料去除率更高,但酸对氧化锆陶瓷表面腐蚀性过大,不宜抛光氧化锆陶瓷;有机碱作为调节剂抛光后的表面质量明显优于无机碱及无机酸、有机酸;乙二胺配置的碱性抛光液精细雾化后抛光氧化锆陶瓷可获得优质超光滑低损伤表面及较高加工效率,表面粗糙度Rq为1.67 nm,材料去除率达182.23 nm/min.     

HgInTe晶片表面化学抛光研究

对HgInTe(MIT)晶片表面化学抛光工艺进行了研究,采用不同浓度的Br2-C3H7ON以及Br2-MeOH作为抛光液对MIT晶片进行化学抛光后发现,5;Br2-C3H7ON抛光液的抛光速度平稳且易于控制,抛光3min后可以有效去除表面划痕,获得光亮表面,表面形貌达到最佳效果.AFM分析结果表明,5;Br2-C3H7ON抛光后的晶片表面粗糙度降低67;,平整度显著增加.相比之下,5;Br2-MeOH抛光液抛光速度过快,抛光后的表面形貌较差.     

磨料粒度对雾化施液CMP抛光速率的影响及机理研究

针对超声波雾化施液化学机械抛光过程中磨料的机械作用和化学特性从化学动力学及分子动力学两方面研究了抛光液磨料粒度对材料去除速率的影响和机理.采用不同粒度的磨料及组合进行了雾化施液CMP抛光实验.实验结果表明:磨料粒径在15 nm至30 nm范围内,粒度比较大的磨料能够传递更多的机械能,较小的磨料比较大的磨料具有更强的化学活性,对硅片表面材料的去除影响更为显著.向当前抛光液中加入5wt;的15 nmSiO2时,材料去除率增加至196.822 nm/min,而加入相同质量的30 nm SiO2时,材料去除率增加至191.828 nm/min.说明小尺寸的磨料在雾化施液CMP过程中不仅起着机械作用,还起着增强化学活性的作用.     

Modelling of mechanism of agglomeration of KCl crystallization

The article presents an analysis into agglomeration during KCl vacuum crystallization. The theoretical and experimental investigations into the mechanism of agglomeration during mass crystallization result in an extension of the growth phenomena within the known model equations. The basis for this is essentially constituted by the collision model concepts of the theory of floculation in disperse systems. The parameters derived from the microprocess analysis (energy dissipation, content of solids, growth rate of individual grains) lead to model equations which are confirmed by laboratory and test trials.     

Relationship of Morphological Types of Dynamic Forms of Crystals

Crystallography Reports - The relationship of morphological spectra (sets of data on the morphological types of real polyhedral crystals and their probabilities under current physicochemical...     

Velocities of Disappearance and Lifetime of Faces of Growing Crystals

The formulae for absolute R_disap and relative R velocities of disappearance and lifetime τ of faces of growing crystals have been derived for stationary growth. It was shown that the quantities are determined by the relative growth velocity R_A/R_critA of the vanishing face A with respect to the critical growth velocity R_critA and by the geometry of a crystal expressed by the trigonometric functions of interfacial angles β and γ formed between face A and the adjacent faces. R increases and τ decreases with the increase in R_A/R_critA to certain limiting values. The calculations have been verified and illustrated by the experimental results for triclinic potassium bichromate (KBC) crystals. Results enable ones to predict values of velocities of disappearance and lifetimes of undesirable, supplementary faces of any real crystal.     

Development of Pauling's concepts of geometric characteristics of atoms

The evolution of the geometric characteristics introduced by Pauling and their dependence on the specific features of the structure and chemical bonds have been considered. The values of the covalent and van der Waals radii are given as well as their relationships and mutual transitions.     

Comparative analysis of two methods of calculation of the orientation of domain walls in ferroelastics

Two types of domain-wall equations are analyzed: the equations derived by the Sapriel method and the equations obtained by interface matching of the thermal-expansion tensor. It is shown that, for W-type domain walls, these methods yield the same equations. For W′-type domain walls, the equations obtained by different methods coincide for proper ferroelastics and differ for improper ferroelastics.     

Dependence of the parameters of equations of viscous flow on chemical composition of silicate melts

The temperature dependence of viscosity of silicate melts is discussed in the framework of the Avramov–Milchev (AM) equation. The composition is described by means of two parameters: the molar fraction, x, and the “lubricant fraction”, l. The molar fraction is the sum of the molar parts x_i of all oxides dissolved in SiO₂, the molar fraction of the latter being 1 ? x. It is shown that, with sufficient precision, two of the parameters of the AM equation can be presented as unique functions of the molar fraction. On the other hand, x is not sufficient to determine properly the reference temperature T_r , at which viscosity is η_r = 10¹³ [dPa.s]. Therefore, additional parameter, “lubricant fraction” l, is introduced. For each of the components, l_i is a product of molar part x_i and a specific dimensionless coefficient 0 ≤ k_i ≤ 1 accounting for the specific contribution of this component to the increased mobility of the system. It is demonstrated that, for l > 0, the reference temperature is related to the “lubricant fraction” l through the reference temperature T_r,SiO2 of pure SiO₂.     

A review of measurement of thermophysical properties of silicon melt

Measurements of thermophysical properties of Si melt and supplementary study of X-ray scattering/diffraction by the authors' group were reviewed. The values obtained differed variously from those of literature. Density was 2–3% larger, surface tension 20–30% smaller, viscosity up to 40% larger, electrical conductivity 8% smaller, spectral emissivity more or less in good agreement with literature values, and thermal diffusivity a few percent larger. An anomalous density jump was found near the melting point. Surface tension and viscosity also showed anomaly. A strange time-dependent change of density was observed over 3 h after melting. X-ray analyses suggested a slight change in local atom ordering, but showed no sign of cluster formation. An addition of 0.1 at% gallium caused the density jump to disappear, while that of boron caused no change. An EXAFS study of the former melt indicated a strong interaction between Ga and Si atoms as if molecules of GaSi₃ existed. The implications of the measured properties are a possibility of soft-turbulence in an Si melt in a relatively large crucible, a more complicated manner of intake of oxygen depleted molten Si from the free surface region to underneath the growing crystal, and a relaxation of the melt after melting arising from trapped gas species.     

Generation of crystal structures of heteromolecular compounds by the method of discrete modeling of packings

Within the method of discrete modeling of packings, an algorithm of generation of possible crystal structures of heteromolecular compounds containing two or three molecules in the primitive unit cell, one of which has an arbitrary shape and the other (two others) has a shape close to spherical, is proposed. On the basis of this algorithm, a software package for personal computers is developed. This package has been approved for a number of compounds, investigated previously by X-ray diffraction analysis. The results of generation of structures of five compounds—four organic salts (with one or two spherical anions) and one solvate—are represented.