金属辅助化学刻蚀法制备硅纳米线及应用

金属辅助化学刻蚀是近些年发展起来的一种各向异性湿法刻蚀,利用该方法可以制备出高长径比的半导体一维纳米结构。 本文综述了金属辅助化学刻蚀法可控制备硅纳米线的最新进展,简要概述了刻蚀的基本过程与机制,重点阐述了基于不同模板的金属辅助化学刻蚀可控制备高度有序、高长径比的硅纳米线阵列的具体流程与工艺,并介绍了其在锂离子电池、太阳能电池、气体传感检测和仿生超疏水等方面的潜在应用,探讨了目前存在的问题及其今后的研究发展方向。     

半导体的化学刻蚀

半导体的化学刻蚀，俗称湿法刻蚀，它是半导体器件制作中的一个重要工艺，按照化学作用的原理，它可分为化学反应刻蚀、电化学刻蚀和光电化学刻蚀，半导体的化学刻蚀是在众多刻蚀方法中最基本和最终不能全部被取代的一种方法，它在高新技术中有着各种挂用途，如选择准刻蚀、各向异性刻蚀和计算机控制无掩模刻蚀等。     

湿化学法制备硅纳米线阵列及其光电化学产氢性能分析

为了探究不同方法条件下制备的硅纳米线阵列电极产氢性能异同,文中分别采用了两步金属辅助催化无电刻蚀法、一步金属辅助催化无电刻蚀法以及阳极氧化法来制备硅纳米线阵列用作为光电分解水电池光阴极材料.通过FESEM、XRD和UV-Vis-IRDRS等手段对实验样品的形貌、晶型、减反性表征,发现相比于其他2种方法所得硅纳米线样品,两步金属辅助催化无电刻蚀法制备的硅纳米线结构晶型保持更好,表面缺陷更少.光电化学测试表明两步金属辅助催化无电刻蚀法制备的硅纳米线光电化学性能表现最优,其光电流密度值是一步法的4倍,阳极氧化法的40倍;转移电荷电阻仅是一步法制备的硅纳米线阵列阻值的1/3,阳极氧化法制备的1/1000.     

湿化学法制备硅纳米线阵列及其光电化学产氢性能分析

为了探究不同方法条件下制备的硅纳米线阵列电极产氢性能异同,文中分别采用了两步金属辅助催化无电刻蚀法、一步金属辅助催化无电刻蚀法以及阳极氧化法来制备硅纳米线阵列用作为光电分解水电池光阴极材料。通过FESEM、XRD和UVVis-IR DRS等手段对实验样品的形貌、晶型、减反性表征,发现相比于其他2种方法所得硅纳米线样品,两步金属辅助催化无电刻蚀法制备的硅纳米线结构晶型保持更好,表面缺陷更少。光电化学测试表明两步金属辅助催化无电刻蚀法制备的硅纳米线光电化学性能表现最优,其光电流密度值是一步法的4倍,阳极氧化法的40倍;转移电荷电阻仅是一步法制备的硅纳米线阵列阻值的1/3,阳极氧化法制备的1/1 000。     

电化学法制备硅纳米线

Silicon nanowires were synthesized from nanometer silicon dioxide powder under potentiostatic electrolysis at -1.20 V (vs Pt reference) for 4 h in molten CaCl₂ at 900 ℃. The morphology, structure and chemical composition of the samples prepared by electroreduction method were characterized by field-emission scanning electron microscopy(FE-SEM), High-resolution transmission electron microscopy(HRTEM) coupled with electron energy dispersive spectroscopy(EDS), laser Raman and X-ray diffraction(XRD). The results revealed that silicon nanowires were crystalline with a diamond cubic structure, the diameter was distributed from 50 nm to 80 nm and the length was generally several micrometers. The formed nanowires basically consisted of silicon monocrystalline and amorphous oxide sheath.     

金属的电化学微区刻蚀方法

本文概述了现行的金属微区刻蚀方法并详细地介绍几种电化学刻蚀方法 ,比较了掩膜法、扫描电化学显微镜法、约束刻蚀剂层法、电化学扫描隧道显微镜法和超短电位脉冲法各自的特点 .从加工精度 (能否进行微米和纳米级加工 )、加工效率 (工序复杂程度 ,能否批量制造或复制 )、可用范围 (主要是能否加工复杂三维立体结构 )等各项因素进行了综合分析 ,结果表明 ,各种加工方法各有其优缺点 ,从总的效果来看 ,约束刻蚀剂层技术在微加工方面具有较大优势     

银辅助化学刻蚀半导体材料

微电子器件的发展趋势是小型化和多功能化,这就对半导体材料的加工技术提出了更高的要求。与传统的加工技术相比,近年发展起来的贵金属粒子辅助化学刻蚀半导体材料制备微结构技术因操作简单、不需要精密设备、反应迅速和可批量生产等优点引起了国内外学者的广泛关注。本文以Si为主,详细介绍了Ag辅助化学刻蚀半导体材料的机理、反应现象及影响因素,总结了各种微结构的制备技术及其应用。此外,对Ge,Si1-xGex和GaAs等其他半导体材料的贵金属粒子辅助化学刻蚀技术也进行了综述。同时分析了贵金属粒子辅助化学刻蚀半导体目前存在的问题,并对未来的研究方向进行了展望。     

SiO-Au法制备硅纳米线

在低真空的CVD系统中直接热蒸发SiO粉末并以金为催化剂在硅衬底上制备出大量长达几十微米的硅纳米线(SiNWs), 通过X 射线衍射谱(XRD)、场发射扫描电子显微镜(FESEM)、透射电子显微镜(TEM)、选区电子衍射仪(SAED)和Raman光谱等技术对硅纳米线进行形貌及结构分析. 实验结果表明, 在不同生长温度下制备得到的硅纳米线质量不同, 其中在700 ℃温区生长的硅线质量最好; 与晶体硅Raman的一级散射特征峰(TO)520.3 cm−1相比, 纳米硅线的Raman特征峰(TO)红移至514.8 cm−1.     

熔盐电解法制备硅纳米线的过程机理

采用FESEM、XRD和EDS分析了纳米二氧化硅烧结片在900℃的CaCl2熔盐中浸泡后结构和组成的变化,结果表明,由于纳米尺寸效应和CaCl2熔盐对二氧化硅的熔融(软化)具有助熔作用,纳米二氧化硅烧结片在900℃的CaCl2熔盐中由固态转变为熔融或半熔融态。根据对900℃的CaCl2熔盐中-1.2V恒电位电解不同时间电极片上反应区的结构和组成分析结果,提出了纳米二氧化硅电极片的硅/熔融二氧化硅/熔盐三相界面沿极片径向方向均匀推进的电解还原过程。通过对900℃的CaCl2熔盐中-1.2V恒电位电解5和15min电解产物的形貌、结构和成份分析,提出了硅纳米线在熔盐中的电化学成核与生长机理。     

硅纳米线阵列电极作为细胞色素c传感器的研究

利用化学刻蚀法由p型硅片制备了硅纳米线阵列,经过表面去氧化层处理后,制备了检测蛋白质细胞色素c的电化学传感器.实验表明,硅纳米线阵列电极对细胞色素c有良好的电化学响应,并且在低浓度条件下具备线性响应的特点.根据与未经表面处理的硅纳米线阵列电极的实验结果相对比,提出了细胞色素c所具备的羧基末端与硅纳米线阵列电极表面的Si-H相互作用从而改善传感性能的检测机理.     

A Novel Silicon Etching Method Using Vapor of Tetramethylammonium Hydroxide Solution

Silicon bulk etching is an important part of micro-electro-mechanical system (MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide (TMAH) solution heated up to boiling point. The monocrystalline silicon wafer is positioned over the solution surface and can be anisotropically etched by the produced vapor. This etching method does not rely on the expensive vacuum equipment used in dry etching. Meanwhile, it presents several advantages like low roughness, high etching rate and high uniformity compared with the conventional wet etching methods. The etching rate and roughness can reach 2.13 μm/min and 1.02 nm, respectively. Furthermore, the diaphragm structure and Al-based pattern on the non-etched side of wafer can maintain intact without any damage during the back-cavity fabrication. Finally, an etching mechanism has been proposed to illustrate the observed experimental phenomenon. It is suggested that there is a water thin film on the etched surface during the solution evaporation. It is in this water layer that the ionization and etching reaction of TMAH proceed, facilitating the desorption of hydrogen bubble and the enhancement of molecular exchange rate. This new etching method is of great significance in the low-cost and high-quality micro-electro-mechanical system industrial fabrication.     

Au掺杂硅纳米线的稳定性和电子结构

采用基于密度泛函理论的第一性原理的方法, 对Au掺杂[100]方向氢钝化硅纳米线(SiNWs)不同位置的形成能、能带结构、态密度及磁性进行了计算, 考虑了Au占据硅纳米线的替代、四面体间隙和六角形间隙的不同位置. 结果表明: Au偏爱硅纳米线中心的替代位置. Au掺杂后的硅纳米线引入了杂质能级, 禁带宽度变窄. 对于Au替代掺杂, 杂质能级主要来源于Au的d、p态和Si的p态, 由于Au的d态和Si的p态的耦合, Au掺杂硅纳米线具有铁磁性. 对于间隙掺杂, 杂质能级主要来源于Au的s态, 是非磁性的. 另外, 根据原子轨道和电子填充模型分析了其电子结构和磁性.     

优化金属辅助法腐蚀液组分制备多孔硅

金属辅助化学腐蚀法可以在无外加电路的条件下,在40%HF/30%H2O2/乙醇的混合溶液中完成多孔硅的制备,该方法简单快速。本文研究了金属辅助法腐蚀液体系各组分(HF、H2O2、乙醇)含量对多孔硅表面的SiHx成分和多孔层结构的影响,根据Si-H和Si-O的红外吸收峰强度的变化曲线优化了腐蚀液体系中各组分含量。在腐蚀液各组分体积比为V40%HF∶V30%H2O2∶V乙醇=2∶2∶1和腐蚀时间为4 min的条件下制备了形貌均匀、化学活性(SiHx成分)和多孔结构稳定性较好的多孔硅,并对金属辅助法与阳极蚀刻法制得的两种多孔硅进行比较,结果显示金属辅助法制备的多孔硅的化学活性和稳定性在后续的生物技术应用中具有明显的优越性。     

低温湿化学法可控制备一维Te纳米线/棒

采用低温湿化学法制备了形貌可调的Te纳米线/棒. 考察了反应温度和还原剂滴加速率对产物的物相和微观结构的影响规律. 研究结果表明, 随着反应温度的升高, Te纳米线的长度逐渐变小, 直径逐渐增大; 随着还原剂滴加速率减慢, 产物Te纳米线长度增加, 直径增大. 通过考察不同反应阶段产物的形貌和结构, 可推测Te纳米线/棒的生长模式为: 反应初期, 溶解在乙二醇内的TeO₂被还原为亚稳态的活性α-Te和稳态的τ-Te, 随着反应的进行, 亚稳态的活性α-Te将重新溶解, 并被还原为稳态的τ-Te析出. τ-Te沿[001]方向轴向生长的特性应归因于其晶体的各向异性.     

碱性水溶液中甲醛在硅电极表面的电化学行为及其对硅化学刻蚀的影响

研究了KOH水溶液中氧化剂甲醛在p-Si和n-Si(100)单晶半导体电极表面的电化学行为及其对硅化学刻蚀表面形貌的影响．实验结果表明,甲醛不仅影响p-和n-型半导体电极在碱性溶液中的阳极氧化峰电流,而且在负电位区能在Si(100)电极上发生还原．在光照条件下,p-Si(100)电极上也观测到了HCHO的电化学还原及光电流倍增效应．甲醛在硅电极表面的电化学还原反应分两步进行,反应终产物为甲醇．此外,HCHO能有效抑制碱性溶液中Si表面“金字塔”型表面粗糙颗粒的形成。     

One-step Fabrication of Nanoporous Black Silicon Surfaces for Solar Cells using Modified Etching Solution

Currently, a conventional two-step method has been used to generate black silicon (BS) surfaces on silicon substrates for solar cell manufacturing. However, the performances of the solar cell made with such surface generation method are poor, because of the high surface recombination caused by deep etching in the conventional surface generation method for BS. In this work, a modified wet chemical etching solution with additives was developed. A homogeneous BS layer with random porous structure was obtained from the modified solution in only one step at room temperature. The BS layer had low reflectivity and shallow etching depth. The additive in the etch solution performs the function of pH-modulation. After 16-min etching, the etching depth in the samples was approximately 200 nm, and the spectrum-weighted-reflectivity in the range from 300 nm to 1200 nm was below 5%. BS solar cells were fabricated in the production line. The decreased etching depth can improve the electrical performance of solar cells because of the decrease in surface recombination. An efficiency of 15.63% for the modified etching BS solar cells was achieved on a large area, p-type single crystalline silicon substrate with a 624.32-mV open circuit voltage and a 77.88% fill factor.     

锂离子电池硅纳米线负极材料研究

采用涂膜法和直接生长成膜法分别制备两种硅纳米线电极.XRD、SEM和充放电曲线表征、观察和测定材料嵌锂状态过程的结构、形貌及电化学性能.与涂膜法相比,直接生长成膜法制备的硅纳米线电极具有较高的比容量、良好的循环寿命及较好的倍率性能;直接生长成膜法制备的硅纳米线电极,其嵌锂过程硅由晶态逐渐转变为非晶态,且其纳米线直径逐渐增大,但线状结构仍保持完好,进而防止了电极粉化和脱落.     

Silver‐Assisted Chemical Etching on Silicon with Polyvinylpyrrolidone‐Mediated Formation of Silver Dendrites

Metal‐assisted chemical etching (MaCE) on silicon (Si)—mediated by polyvinylpyrrolidone (PVP)—is systematically investigated herein. It is found that the morphologies and crystallographic natures of the grown silver (Ag) dendrites can be significantly modulated, with the presence of PVP in the MaCE process leading to the formation of faceted Ag dendrites preferentially along the (111) crystallographic phase, rather than along the (200) phase. Further explorations of the PVP‐mediated effect on Si etching are also revealed. In contrast to the aligned Si nanowires formed by MaCE without PVP addition, only distributed nanopores with sizes of 200 to 400 nm appear on the Si surfaces in the presence of PVP. The origin of surface polishing on Si in the PVP‐mediated MaCE process can be attributed to the distinct transport pathway of holes supplied by the Ag⁺ ions, where the holes are injected directly into the primary Ag seeds, rather than through Ag dendrites, thus leading to the isotropic etching of the Si surface.