Stress-strain state in the vicinity of a crack tip under mixed loading

A method is proposed to calculate the eigenvalues of the class of nonlinear eigenvalue problems resulting from the problem of determining the stress-strain state in the vicinity of a crack tip in power-law materials over the entire range of mixed modes of deformation, from the opening mode to pure shear. The proposed approach was used to found eigenvalues of the problem that differ from the well-known eigenvalue corresponding to the Hutchinson-Rice-Rosengren solution. The resulting asymptotic form of the stress field is a self-similar intermediate asymptotic solution of the problem of a crack in a damaged medium under mixed loading. Using the new asymptotic form of the stress field and introducing a self-similar variable, we obtained an asymptotic solution of the problem of a crack in a damaged medium and constructed the regions of dispersed material near the crack.     

Mode III stress intensity factors for edge-cracked circular shafts,bonded wedges,bonded half planes and DCB’s

Antiplane shear deformation of several edge-cracked geometries is considered. Analytical expressions are derived for the mode III stress intensity factor (SIF) of circular shafts with edge cracks, bonded half planes containing an interfacial edge crack, bonded wedges with an interfacial edge crack and also DCB’s. The results are extracted for simple isotropic materials as well as anisotropic materials and also bonded dissimilar materials and it is shown that the same expressions are obtained for the SIF under the same geometries but with different above-mentioned material properties. Different boundary conditions are assumed and the SIF relations are derived in each case. As the special cases, the SIF’s of the two bonded quarter planes containing an edge crack at the interface and infinite strip with a semi-infinite edge crack are extracted which coincide with the results cited in the literature.     

Energy release rate and phase angle of delamination in sandwich beams and symmetric adhesively bonded joints

Delamination in sandwich structures along the interface between the face sheet and the core, or along the adherend/adhesive interface in adhesively bonded joints, is one of the most common failure modes of this type of tri-layer structure. This delamination is usually modeled as an interface crack problem, for which the energy release rate and phase angle can be calculated using interface fracture mechanics solutions. Existing interface fracture mechanics solutions, however, ignore the effect of transverse shear deformation, which can be significant for short crack. In an effort to overcome this shortcoming, this study presents new analytical solutions for the energy release rate and for the phase angle of the interface crack in sandwich structures or adhesively bonded joints. Since the new solutions incorporate relative rotation at the tip of the delamination, transverse shear effects are taken into account in this study. Typical delaminated sandwich and adhesively bonded joint specimens are analyzed by using the new solutions, as well as by the existing solutions. The energy release rate predicted by the present model agrees very well with that predicted by FEA, and furthermore it is considerably more accurate relative to existing models. As the existing model neglects the transverse shear force, it underestimates the total energy release rate. A stress field analysis is also conducted in this study in order to clarify some misunderstandings in the literature on the determination of the phase angle of adhesively bonded joints using an interface stress-based method.     

基于非协调元特征法的奇异性问题分析

提出了一个基于位移的、分析平面尖劈尖端奇性应力场和位移场问题的非协调FE特征分析法．该方法与过去原有求解裂纹尖端近似场的有限元特征分析方法导出公式的出发点不同，并且采用的单元形式为非协调元，尖劈尖端邻域内的位移场假定没有采用奇异变换技术，运用该方法处理了若干尖劈和接头的算例，所有的计算结果表明，该方法较原有方法使用的单元少而且精度高，具有应用广泛性。     

各向异性复合材料尖劈和接头的奇性应力指数研究

提出了一个新的、基于位移的、求解三维尖劈端部奇性应力指数问题的非协调元特征分析法。该方法假定尖劈端部邻域内的位移场没有采用奇异变换技术，导出虚功方程的出发点不同于过去原有求解裂纹尖端近似场的有限元特征分析法，在有限元离散时采用的单元形式为非协调元。文中运用该方法给出了若干求解各向异性复合材料尖劈／接头端部奇性应力指数的算例。所有的计算结果表明，本文方法能够求解复杂尖劈／接头的全部奇性应力指数，使用的单元少而且精度高。     

Three-dimensional asymptotic stress field in the vicinity of the circumference of a penny shaped discontinuity

An eigenfunction expansion method is presented to obtain three-dimensional asymptotic stress fields in the vicinity of the front of a penny shaped discontinuity, e.g., crack, anticrack (infinitely rigid lamella), etc., subjected to the far-field torsion (mode III), extension/bending (mode I) and sliding shear/twisting (mode II) loadings. Five different discontinuity-surface boundary conditions are considered: (i) penny shaped crack, (ii) penny shaped anticrack or perfectly bonded thin rigid inclusion, (iii) penny shaped thin transversely rigid inclusion (frictionless planar slip permitted), (iv) penny shaped thin rigid inclusion in part perfectly bonded, the remainder with frictionless slip, and (v) penny shaped thin rigid inclusion alongside penny shaped crack. The computed stress singularity for a penny shaped anticrack is the same as that of the corresponding crack. The main difference is, however, that all the stress components at the circular tip of an anticrack depend on Poisson’s ratio under modes I and II.     

与界面相交的裂纹尖端的应力奇异性分析

为了确定与结合材料的界面相交的裂纹尖端附近的应力奇异性次数，提出了一种基于最小势能原理的一维特殊有限元法，以奇异点为原点半径r0的扇形奇异区域，可以简化为一维线性领域，即一条以代表结合材料的两个自由表面为端点的线段。对该一维线性领域作网格划分，采用三节点一维等参数二次单元。数值计算结果与已有理论解的比较表明，该方法具有很高的精度和效率，最后，利用文中给出的方法，得到了各向异性结合材料中与界面以任意角相交的裂纹尖端的奇异性次数随裂纹的变化规律。     

裂纹垂直于双相介质界面时的应力强度因子

本文利用Ｊ积分与应力强度因子的关系,采用有限元数值方法研究了当裂纹与双相介质的界面垂直时,其裂纹的近界面端和远界面端的应力强度因子随双相介质参数和裂纹端部到界面的距离的变化规律,同时还分析了当边裂纹逐渐扩展时,应力强度因子的变化特征。     

Edge-cracked stiffened panels analyzed by caustics

Externally bonded composite patches have been proven to be an effective method for repairing damaged aircraft structural components. They are ease in application and provide excellent in-service performance. The major function of a repair is to reduce the stress intensity factor at the crack tip. Calculation of stress intensity factor of a repaired crack has been performed by analytical and numerical methods. However, these methods are based on simplifying assumptions regarding material behavior and repair conditions. In the present paper an experimental determination of mode-I stress intensity factor (SIF), K_I, at the tip of an edge-crack or a V-notch reinforced with double bonded strips or with compression pre-stresses applied along the crack surfaces is undertaken by using the optical method of caustics. This method is simple in its application and has successfully been used for the solution of a host of crack problems of engineering importance.     

The computation of stress intensity factors in dissimilar materials

A reciprocal work contour integral method for calculating stress intensity factors is extended to treat the problem of two bonded dissimilar materials containing a crack along the bond. The method is based on Betti's Reciprocal work theorem from which the singular stress intensities at the crack tip may be evaluated in terms of an integral involving tractions and displacements on a contour remote from the crack tip.     

Finite element analysis of void growth near a blunting crack tip

Large deformation finite element analysis has been used to study the near crack tip growth of long cylindrical holes aligned parallel to the plane of a mode I plane strain crack. The near crack tip stress and deformation fields are analyzed. The results show that the holes are pulled towards the crack tip and change their shape to approximately elliptical with the major axis radial to the crack. They also grow faster directly ahead of the crack than at an angle to the crack plane. Several crack-hole coalescence criteria are discussed and estimates for the conditions for fracture initiation are given and compared with experimental results. The range of estimates now available from finite element calculations coincides quite well with the range of experimental data for materials containing inclusions which are only loosely bonded to the matrix.     

Interfacial transient thermal fracture of adhesively bonded dissimilar materials

The effect of a transient thermal load on an interface crack in adhesively bonded dissimilar materials was experimentally studied by using photothermoelasticity. It is determined that the effect of the thermal load is to cause mostly shearing deformations at the crack tip. For two configurations, a horizontal crack (normal to the heat flow direction) and a vertical crack (parallel to the heat flow direction), it is shown that increasing the adhesive thickness results in steady-state and maximum transient strain-energy release rates and stress-intensity factors of smaller magnitudes. It is also found that the ratio of mode I to mode II stressintensity factors for the vertical crack is larger than the one for the horizontal crack.     

Anti-plane shear crack normal to and terminating at the interface of two bonded piezoelectric ceramics

The electroelastic analysis of two bonded dissimilar piezoelectric ceramics with a crack perpendicular to and terminating at the interface is made. By using Fourier integral transform, the associated boundary value problem is reduced to a singular integral equation with generalized Cauchy kernel, the solution of which is given in closed form. Results are presented for a permeable crack under anti-plane shear loading and in-plane electric loading. Obtained results indicate that the electroelastic field near the crack tip in the homogeneous piezoelectric ceramic is dominated by a traditional inverse square-root singularity, while the electroelastic field near the crack tip at the interface exhibits the singularity of power law r^−α, r being distance from the interface crack tip and α depending on the material constants of a bi-piezoceramic. In particular, electric field has no singularity at the crack tip in a homogeneous solid, whereas it is singular around the interface crack tip. Numerical results are given graphically to show the effects of the material properties on the singularity order and field intensity factors.     

Crack propagation in an orthotropic medium with coupled elastodynamic properties

In this paper the Mode-I elastodynamic problem of a crack propagating in an orthotropic medium is studied under the condition that the matrix of elastodynamic coefficients has repeated eigenvalues. It is shown that the crack is constrained in an elastodynamic state which is defined through a compulsory condition coupling its velocity with the elastic parameters of the orthotropic medium. The dynamic stress and displacement components ahead of the crack tip as well as the energy release rate are explicitly obtained.     

Discrete modeling of crack bridging by a discontinuous platelet with a controlled interface

Crack bridging by discontinuous fibers can make brittle materials tougher by transferring stresses from the crack tip to elsewhere in the matrix material. One important aspect of crack bridging is the nature of the interface between the fibers and the matrix material. In this paper, a two-dimensional numerical model of bridging a Mode I loaded crack by linear elastic discontinuous platelets is developed for two different types of interfaces. The first type is a perfectly bonded interface. The second type is an imperfect interface described as a stick–slip interface. A shear-lag model to predict platelet pullout is developed in detail to verify the numerical implementation of the stick–slip interface. An example of a crack tip bridged by a platelet is examined for both interfaces. The perfectly bonded interface will reduce the Stress Intensity Factor (SIF) of the crack greatly but introduces new stress concentrations at the platelet ends. The stick–slip interface can be tailored to also reduce the SIF while not introducing new stress concentrations.     

Interfacial mixed-mode fracture of adhesive bonds undergoing large deformation

Interfacial fracture of adhesive bonds undergoing large-scale yielding is studied using a combined experimental/finite-element approach. The full range of in-plane mode mixity is produced over bond thickness ranging from 30 to 500 μm using the scarf and the ENF joint geometries. Novel techniques for introducing pre-cracks and surface decoration, together with in situ observations, facilitate accurate determination of the bond-average and the local shear strains at the crack tip during the onset as well as the rest of the crack propagation event. The crack generally grew along one of the two interfaces of the bond, although the failure was always fully cohesive. The local shear strain at the crack tip is independent of the bond thickness, and, under quasi-static conditions, it remains constant throughout the growth, which make it a viable fracture parameter. This quantity strongly depends on the mode mixity, the sign of the phase angle (i.e., shearing direction) and the crack speed, however.A finite-element analysis is used to obtain the crack tip deformation field for an interface crack in adhesively bonded scarf and ENF joints. Large-strain and quasi-static conditions are assumed. A distinct material model in the fracture process zone that allows for volume change in the post-yield regime is incorporated into the analysis. The local deformation is characterized by a pair of bond-normal and tangential displacements corresponding to the nodal points adjacent to the crack tip. The critical values of these quantities are obtained when the FEM bond-average shear strain at the crack tip becomes equal to its experimental counterpart. The so defined critical local displacements, after an appropriate normalization, seem to conform to a single-valued, linear type interrelationship over the entire range of mode mixity. The fact that this relationship is independent of the bond thickness, and furthermore it encompasses both cases of positive and negative phase angles, makes it a viable candidate for characterizing mixed-mode interfacial fracture under large-deformation conditions.     

单纤维与裂纹交互微力学:完整粘接纤维

使用微拉曼光谱技术研究裂纹前喙Kevlar49芳纶纤维交互微力学行为.在建立Kevlar49芳纶纤维轴向变形与拉曼频移线性关系的基础上,通过逐点测量裂尖前喙完整粘接纤维上的应力分布,探讨了裂纹与完整粘接纤维的交互作用,建立了完整粘接纤维上的应力传递模型.Ⅰ型裂纹切口前方的高应力区造成粘接完好纤维上出现应力集中,应力强度因子K1影响着纤维应力集中长度.     

Three-dimensional finite element analysis of thin films cracking along ceramic substrates

In the present work, three-dimensional finite element method is used to calculate the J integral and the size of plastic zone at the interfacial crack tip of ductile films bonded to a ceramic substrate in mode I. The effects of the specimen thickness and the crack length on the variation of the J integral and the size of the plastic zone at the crack tip were highlighted. The J integral and the plastic zones were computed in the surface and the middle of the film/substrate composite.     

Dynamic crack kinking from a PMMA/Homalite interface

The behavior of a pre-existing, dynamically loaded, interfacial crack kinking away from the interface separating two materials was experimentally investigated under dynamic loading conditions. Dynamic fracture experiments were performed on pre-cracked bimaterial panels of PMMA bonded with Homalite-100 impact loaded using a high-speed gas gun. By varying the location of impact, a large range of mixed mode loading at the crack tip was produced. Information about the stress state surrounding the crack tip was obtained through use of the lateral shearing interferometer of coherent gradient sensing in conjunction with high-speed photography. The high-speed interferogram corresponding, to the time of crack initiation was analyzed in each case to find the preinitiation mode mixity at the crack tip. Measurement of both the local initiation mode mixity and the crack kink angle allows for possible extension of existing quasi-static interface crack kinking criteria, such as maximum opening stress or maximum energy release rate, to the case of dynamic loading. It was found that for bimaterial systems with small material property mismatch, such as the PMMA/Homalite system, the maximum opening stress criterion accurately predicts the relation between crack tip mode mixity and resulting kink angle for small initial crack kinking speeds.     

Crack tip field in piezoelectric/piezomagnetic media

This paper considers the magnetoelectroelastic problem of a crack in a medium possessing coupled piezoelectric, piezomagnetic and magnetoelectric effects. Based on the extended Stroh formalism, the general two-dimensional solutions to the magnetoelectroelastic problem are obtained, involving five analytic functions of different variables. The magnetoelectroelastic field around the crack tip is given. It contains five modes of square root singularities. Expressions of the stresses, electric displacements and magnetic inductions in the vicinity of the crack tip are derived and the field intensity factors are provided. The path-independent conservative integral is derived. The energy release rate is written in terms of those field intensity factors. The explicit algebraic results are given for a special case of an anti-plane crack in a magnetoelectroelastic medium.