Investigation of GaAs—InyGa1−yPzAs1−z–InxGa1−x-As grading heterojunctions formation

The initial stages of growth of GaAs–InGaAsP_var–In_xGa_1−xAs heterostructures (x = 0.1 and 0.17) were investigated for the equilibrium-cooling method of LPE growth. Similar investigations were carried out for GaAs–InGaAsP_var–In_0.05Ga_0.95As heterocompositions, but for the step-cooling technique. The scheme of growing of In_0.17Ga_0.83As films of GaAs substrates with several intermediate buffler InGaAsP_var layers is represented. These heterostructures were shown to have less than 10⁶ cm⁻² dislocation density on the overall area of the film (> 2 cm²).     

Electrical Properties of Praseodymium-doped GaAs and Al0.3Ga0.7As Epilayers

Praseodymium-doped GaAs and Al_0.3Ga_0.7As epilayers grown on Semi-Insulating (SI) GaAs substrates by Liquid Phase Epitaxy (LPE) were first studied in this present work. Measurement techniques, such as microscopic observation, X-ray diffraction, Secondary Ion Mass Spectroscopy (SIMS), and Hall measurement were employed. Layers doped with Pr resulted in a mirror-like surface, except several high Pr-doped layers having droplet surfaces. Hall measurements reveal that the grown layers contained p-type layers, carrier concentrations from 6.3 × 10¹⁵ to 1.2 × 10¹⁶ cm⁻³, and from 6.3 × 10¹⁵ to 3.5 × 10¹⁶ cm⁻³ for Pr-doped GaAs and Al_0.3Ga_0.7As epilayers, respectively. Although p-type conduction exists, in the light of electrical features, doping of Pr into the GaAs and Al_0.3Ga_0.7As growth melts, is still considered to exhibit gettering properties rather than to become a new acceptor itself. Additional photoluminescence examinations were taken. Their results also indicate that Pr-doped layers produce no new emission lines and support the electrical observations.     

Growth of Semiinsulating GaAs Crystals by Vertical Gradient Freeze Technique

GaAs crystals having dislocation densities of 1–2 10³ cm⁻² were grown using VGF technique. In the grown crystals Si_Ga is the dominant donor and C_As the dominant acceptor. Theoretical and experimental investigations have shown the possibilities to influence on the silicon and carbon content in GaAs. Based on these results, semiinsulating properties in the crystals could be achieved reproducibly.     

Electrical Characterization of Irradiation plus Annealing – induced VAsZnGa Pairs in p-type GaAs (Zn) Crystals

Effect of fast electron irradiation (E =2.2 Mev, ϕ_c = 1 × 10¹⁶ el/cm²) and subsequent annealings (T = 150 to 350 °C, t = 10 to 600 min) of zinc-doped p-type GaAs crystals on the formation and dissociation of V_AsZn_Ga, pairs is studied. An analysis of the formation and dissociation kinetics of V_AsZn_Ga pairs permitted to find the diffusion coefficient of radiation-induced arsenic vacancies D(D = 1.5 × 10⁻¹⁸, 1 × 10⁻¹⁷ and 5 × 10⁻¹⁷ cm²/s at 150, 175 and 200 °C accordingly), their migration energy ϵ_m(ϵ_m = 1.1 eV), the binding energy of V_AsZn_Ga, pairs ϵ_b(ϵ_b = 0.5 eV), and also their dissociation energy ϵ_d(ϵ_d = 1.6 eV).     

Zur Realstruktur von Ga1–xInxAs LPE-Schichten

Ga_1–xIn_xAs epitaxial layers (0.02 ≦ × ≦ 0.12) are grown on (111)-oriented GaAs substrates from nonstoichiometric melts. The etch pit densities – determined by chemical etching – yield values between 2 · 10⁵ cm⁻² and 3 · 10⁷ cm⁻² and were found to be dependent on composition, layer thickness and cooling rate. X-ray topography of cleaved {110}-planes gives information on layer quality and indicates the existence of stress in the substrate lattice near the heterojunction. The validity of Vegard's law in the investigated concentration range was confirmed by X-ray determination of the lattice constants. The half width of double crystal spectrometer rocking-curves, the epd and the relative intensity of photoluminescence show similar dependence on the composition of the mixed crystal layers.     

Incorporation of nitrogen into galliumarsenide grown by chloride VPE

The incorporation of nitrogen into GaAs in the halide-VPE system using NH₃ as the doping source is investigated. The concentration of incorporated N depends on the NH₃ flow rate and increases with decreasing deposition temperature. Concentrations up to 6 × 10¹⁷ cm⁻³ could be detected far above the calculated equilibrium value. By a comparison of SIMS-data with those obtained from IR it is found that most of the N-atoms are situated substitutionally on As lattice sites. Normal-pressure 2 K photoluminescence measurements show N-related luminescence peaks at 1.508 and 1.496 eV. Most probably this luminescence arises from complexes of N with undeliberately introduced impurities. For the 1.508 eV center a complex Si_Ga-N_As is discussed. — A new N-related metastable deep center with the energy levels E_c-0.33, E_c-0.41, and E_c-0.68 eV could be found by DLTS.     

Effect of Neutron Irradiation and Annealing on the Intensity of the Copper Related 1.01 eV Emission Band in n-type GaAs

Effect of neutron irradiation (E = 2 MeV, ϕ ≤ 10¹⁵ n/cm²) and subsequent annealing (T ≤ 700 °C, t = 30 min) on the intensity of the copper-related peaked at hvm =1.01 eV emission band in n-type GaAs (n₀ = 2 × 10¹⁸ cm⁻³) is studied. A strong irradiation-induced increase of the above emission intensity was observed testifying about the irradiation-stimulated growth in the concentration of copper-related 1.01 eV radiative centres (Cu_GaV_As pairs). A model is presented to explain this effect.     

Infrared optical characterization of epitaxial layer – substrate systems (II). Experimental results for AlxGa1−xAs/GaAS

Infrared reflectance and transmittance spectra and Raman scattering spectra of the epitaxial layer-substrate system Al_xGa_1−xAs/GaAs with compositions in the range x = = 0.08–0.49 are measured in the wavenumber range from 40 to 4000 cm⁻¹. In analysing the spectra in terms of the respective theoretical relations for an optical two-layer system the thickness of the layers, the optical mode characteristics and the free carrier parameters are determined. From a comparison with existing literature data for Al_xGa_1−xAs it is concluded that infrared optical measurements on epitaxial layer-substrate systems can be successfully employed to evaluate the material parameters of epitaxial layers with thicknesses down to a few micrometers.     

Generation of VGaTeAsVAs Complexes in Tellurium-doped n-type GaAs by Low-temperature Annealing

It is shown that low-temperature annealing (T= 425 to 625 °C, t ⩾ 0.5 h) of tellurium-doped n-type GaAs crystals (n₀ = 2 × 10¹⁸ cm⁻³) leads to a generation of V_GaTe_AsV_As complexes as a result of a diffusion of arsenic vacancies to V_GaTe_As complexes or arsenic and gallium vacancies to isolated tellurium atoms. The observed regularities of generation of V_GaTe_AsV_As complexes as the annealing temperature and the annealing time are varied are well explained by the proposed model of diffusion-limited formation of V_GaTe_AsV_As complexes.     

Germanium Incorporation in Ga1–xInxAs LPE Layers and GaAs Bulk Crystals

Atomic absorption spectroscopy (AAS) is used to determine the Ge concentration in Ga_1–xIn_xAs and GaAs. The orientation dependence of Ge incorporation in (111)A-and (111)B oriented samples has been studied. The distribution coefficients for both the orientations were determined to be k_Ge^(111)A = 2.6 · 10⁻² and k_Ge^(111B = 1.4 · 10⁻² for Ga_1–xIn_xAs with 0 ≦ x ≦ 0.13. The differences between the two orientations are explained with the aid of the band bending model. Doping gradients in thick epitaxial layers and along crystal length of polycristalline TGS-grown GaAs ingots have been investigated too. In Ga_1–xIn_xAs layers any Ge concentration gradient couldn't be observed, but in TGS compact crystals Ge concentration increases with crystal length because the melt composition changes significantly during solidification. The results are compared with those of electrical measurements.     

Micromorphology and defects of non-doped gallium arsenide layers

Electron microscopy was used to study non-doped GaAs layers obtained in a chloride system Ga-AsCl₃-H₂. Electron concentrations is 10¹³–10¹⁵ cm⁻³, mobility at liquid nitrogen temprature reaches 200000 cm²/v. sec. It is shown that a fraction of the growth surface taken with (110) faces is less for films with less electron concentration. The main type of defects in pure GaAs layers is precipitates at pinning centres of growth steps. Estimations based on microdiffraction patterns and irradiation effects show that the impurity concentration in them is 10¹⁶–10¹⁹ cm⁻³. The impurity in precipitates is assumed to be electrically non-active, mainly, in interstitial positions.     

Zum Wachstum von AIIIBV-Halbleitern aus nichtstöchiometrischen Schmelzen (II) Dotierung von GaAs und Ga1−xAlxAs mit Zink

Doping of GaAs and Ga_1−xAl_xAs with Zn in the LPE process was studied by a radioanalytical method. It is found that Zn diffuses from the Ga-(Al)-As-Zn-solution into the n-GaAs substrate before epitaxial growth starts. This “pre-diffusion” and the following diffusion of Zn out of the epitaxial layer into the substrate results in three regions with distinct Zn-graduation in the vicinity of the pn-junction. There are no striking differences for GaAs/GaAs and Ga_1−xAl_xAs/GaAs structures. The Zn concentration in GaAs epitaxial layers decreases exponentially from the substrate up to the layer surface. From this profile the temperature dependence of the Zn segregation coefficient is calculated. At 900°C a value k_eff = 5,2 · 10⁻² is found. The doping profile in Ga_1−xAl/As layers is more complex. It is influenced by the changings of temperature during the growth of the layer and by the nonuniform Aldistribution over the layer thickness.     

X-ray diffraction study and quantitative measurements of high dislocation densities in superlattices and single crystal layers of heteroepitaxial systems with pronounced lattice mismatch

Plastic deformation in a single-crystal layer of the In_0.12Ga_0.88As/(111)InP solid solution is identified by the methods of X-ray diffractometry (XRD) and the double-crystal pseudorocking curves (DCPRC). X-ray topographs showed the generation of three intersecting systems of straight dislocations in the layer. In a one-layer ZnSe/GaAs structure and multilayer ZnSe/ZnSe_{1 − x} S_x/ZnSe/GaAs structures, the elastic and plastic strains were detected by the combined XRD-DCPRC method. The major components of the thermoelastic and plastic-deformation tensors were determined as ε_xx = ε_yy = 3.5 × 10⁻³ and ε_zz = 2.35 × 10⁻³. Using these data, the dislocation densities were determined as N _d ∼ 2.5 × 10⁸ cm⁻² and N _d ∼ 3 × 10¹⁰ cm⁻² for the 7 μm-thick ZnSe and 1 μm-thick InAs layers, respectively. In a superlattice of the Al_xGa_{1 − x} As/GaAs/⋯/GaAs-type with a large lattice parameter, the plastic deformation was detected. X-ray topography confirmed that the dislocation density in this superlattice equals ∼10⁵ cm⁻². __________ Translated from Kristallografiya, Vol. 45, No. 2, 2000, pp. 326–331. Original Russian Text Copyright ? 2000 by Kuznetsov.     

A study of the vacancy-defect distribution in a GaAs/AlxGa1−xAs multi-layer structure grown at low temperature

We have grown a multilayer structure of GaAs and Al_xGa_1−xAs (x=0.25) by molecular beam epitaxy at low substrate temperature (250°C) in order to investigate the effects of annealing on arsenic precipitation and vacancy-defect formation. The as-grown heterostructure contained ∼5×10¹⁷ cm⁻³ gallium vacancies, but information about the individual layers was lost because the layer width (∼45 nm) was smaller than the average positron diffusion length (∼70 nm). Annealing at 500 and 600°C showed increases in the S-parameter (above the bulk value) of ∼2.5% and ∼1.5%, respectively, smaller than for a single LT-GaAs layer (∼3–4%). We explain this phenomenon by suggesting that the excess arsenic which migrates from the material with the higher precipitate/matrix energy (LT-Al_xGa_1−xAs) reduces the gallium vacancy concentration in the LT-GaAs and hence the S-parameter. This hypothesis is supported by SIMS data which shows a build-up of As in the LT-GaAs layers, and TEM images which indicate that arsenic precipitation occurs to a greater extent in the LT-GaAs than in the LT-Al_xGa_1−xAs.     

Investigation of InxGa1−xAs films grown from thin solution layer

In_xGa_1−xAs films with x⩽0.12 were grown from a thin solution layer between substrates. The calculation of final film thickness as a function of liquid phase composition, based on supposition of film deposition only on the substrate, is in a good agreement with experimental results. The dependences between compositions of liquid and solid phases at 800°, 750° and 700°C were determined. The morphology of the film surface was investigated as a function of liquid phase composition and (100), (111) A, (111) B substrate orientations. Dislocation density increases from 10⁴ cm⁻² to 10⁷ cm⁻² with change of x from 0 to 0.12.     

Spektrochemische Bestimmung von Silizium in AlxGa1–xAs und physikalische Eigenschaften der Kristalle

A direct spectrochemical method for the quantitative determination of silicon in Al_xGa_1–xAs (x ≈ 0,8) crystals was elaborated. The results of the analysis of highly doped samples (10¹⁹ … 10²⁰ cm⁻³) were discussed in connection with photoluminescence spectra and electrical measurements.     

The growth of high-quality MCT films by MBE using in-situ ellipsometry

The ellipsometry and RHEED study of high-quality MCT films grown on (112)- and (130) CdTe and GaAs by MBE was carried out. The dependence of the ellipsometric parameter ψ on MCT composition is evaluated. It was shown that such parameters as growth rate, the surface roughness, initial substrate temperature, and film composition may be measured by the in-situ ellipsometry. The appearance of surface roughness was observed in the initial stage of MCT growth under various compositions (x_CdTe = 0 ÷ 0.4). The further growth at optimum conditions leads to the smoothing of the surface and supplies us with high-quality MCT films. The concentration, mobility, and life time of carriers in MCT films were respectively: n = 1.8 × 10¹⁴ ÷ 8.2 × 10¹⁵ cm⁻³, μ_n = 44000 ÷ 370000 cm² V⁻¹ s⁻¹, τ_n = 40 ÷ 220 ns; p = 1.8 × 10¹⁵ ÷ 8.4 × 10¹⁵ cm⁻³, μ_p = 215 ÷ 284 cm² V⁻¹ s⁻¹, τ_p = 12 ÷ 20 ns.     

GaAs LPE growth and its application to FET

Residual impurities and deep levels in the LPE GaAs layers grown by a sliding boat method were studied. Residual impurities were investigated by monitoring oxygen and water vapor contents in the exhaust gas during heat treatment. The results are satisfactorily explained by assuming oxygen as a dominant residual impurity. Electron traps with a density higher than 5 × 10¹² cm^-3 were not observed in the LPE layers, whereas in VPE layers, 0.82 eV electron traps were always observed. LPE double layers (high purity buffer layer and active layer) were fabricated into FET's. GaAs FET's with a 1 μm gate showed no hysteresis loops in the I–V characteristics and had fairly good high-frequency characteristic (f_max = 70 GHz, NF = 2.4 dB at 10.4 GHz).     

Investigation of the nature of point defects in in Te-doped gallium antimonide

Precision lattice constant and density measurements held on gallium antimonide single crystals grown from stoichiometric melts showed that doping of such crystals with Te lead to the intensification of Ga-supersaturated solid solution decomposition process with initial Frenkel defect (Ga_i + V_Ga) production. It is supposed that Te_sb — simple donors form complexes with V_Ga which are believed to be acceptors. Doping of GaSb with Te up to the levels above 2 · 10¹⁸ cm⁻³ leads to partial decomposition of GaSb(Te) solid solution supersaturated with Te.     

Liquid phase epitaxial growth of undoped gallium arsenide from bismuth and gallium melts

Electrical properties of undoped GaAs layers grown from Ga and Bi melts under identical conditions are compared as a function of growth temperature and pregrowth baking time. Identification of residual shallow donors and acceptors is performed by means of laser photoelectrical magnetic spectroscopy and low temperature photoluminescence. It is shown that a change of solvent metal results in complete alteration of major background impurities in grown epilayers due, mainly, to changes of distribution coefficients of these impurities. High purity, low compensation n-GaAs layers can be grown from Bi melt (epilayers with the Hall mobility of electrons μ77K ≈ 150000 cm²/V · sat n = 2.5 · 10¹⁴ cm⁻³ has been grown).