压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距...     

Shielding effect and emission condition of a screw dislocation near a blunt crack in elliptical inhomogeneity

The shielding effect and emission condition of a screw dislocation near a blunt crack in elastic elliptical inhomogeneity is dealt with. Utilizing the Muskhelishvili complex variable method, the explicit series form solutions of the complex potentials in the matrix and the inclusion regions are derived. The stress intensity factor and critical stress intensity factor for dislocation emission are also calculated. The influences of the orientation of the dislocation and morphology of the blunt crack as well as the material elastic dissimilarity upon the shielding effect and emission criterion are discussed in detail. As a result, numerical analysis and discussion show that the positive screw dislocation can reduce the stress intensity factor of the crack tip (shielding effect) only when it is located in the certain region. The shielding effect increases with the increase of the shear modulus of the matrix and the curvature radius of the blunt crack tip, but decreases with the increase of dislocation azimuth angle. The critical loads at infinity for dislocation emission increases with the increment of the emission angle and the curvature radius of the blunt crack tip, and the most probable angle for screw dislocation emission is zero. The present solutions contain previous results as the special cases.     

Exact solutions for piezoelectric screw dislocations near two asymmetrical edge cracks emanating from an elliptical hole

The interaction between piezoelectric screw dislocations and two asymmetrical interfacial cracks emanating from an elliptic hole under combined mechanical and electric load at infinity is dealt with. The closed-form solutions are derived for complex potentials and generalized stress fields. In the limiting cases, some well-known results can be obtained from the present solutions. Moreover, some new exact solutions are shown. The stress intensity factor and the energy release rate at the right tip due to a screw dislocation near the right interfacial crack are also calculated. The results show that the shielding effect of dislocation on crack expanding decreases with the increase in dislocation azimuth angle and the distance between the dislocation and the crack tip, and the repulsion acting on the dislocation from the other half plane demotes crack propagation. The increasing of the length of the other crack promotes crack growth, but the increasing of the minor semi-axis demotes it.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE Ⅲ INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode Ⅲ interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. zThe image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

Elastic interaction between edge dislocation,concentrated force,point heat source and edge crack in a semi-infinite plane

We investigate the interaction between edge crack and edge dislocation as well as concentrated force and point heat source. The stress intensity factors at the edge crack tip and the image forces acting on the edge dislocation are calculated. The influence of the concentrated force, point heat source and edge dislocation on the shielding and anti-shielding effects to edge crack as well as the glide and climb forces acting on the edge dislocation is examined in detail. The results indicate that the shielding and anti-shielding effects increase acutely with the increment of concentrated force and point heat source. In addition, the glide and climb forces increase acutely with the decrement of the distance between dislocation and crack tip.     

位错偶极子和Ⅲ型界面裂纹的干涉效应

研究了多晶体材料中螺型位错偶极子和界面裂纹的弹性干涉作用.利用复变函数方法,得到了该问题复势函数的封闭形式解答.求出了由位错偶极子诱导的应力场和裂纹尖端应力强度应子,分析了偶极子的方向,偶臂和位置以及材料失配对应力强度因子的影响.推导了作用在螺型位错偶极子中心的像力和力偶矩,并讨论了界面裂纹几何条件和不同材料特征组合对位错偶极子平衡位置的影响规律.结果表明,裂纹尖端的螺型位错偶极子对应力强度因子会产生强烈的屏蔽或反屏蔽效应.同时,界面裂纹对螺型位错偶极子在材料中运动有很强的扰动作用.     

穿透夹杂界面的半无限楔形裂纹尖端螺型位错的发射研究

摘要：研究了穿透圆形夹杂界面的半无限楔形裂纹与裂纹尖端螺型位错的干涉问题。应用复变函数解析延拓技术与奇性主部分析方法,得到了位错位于半圆形夹杂内部时,半无限基体和半圆形夹杂内复势函数的解析解。然后利用保角映射技术得到了穿透圆形夹杂界面的半无限楔形裂纹尖端螺型位错产生的应力场以及作用在位错上的位错力的解析表达式。主要讨论了螺型位错对裂纹的屏蔽效应以及从楔形裂纹尖端发射位错的临界载荷条件。研究结果表明正的螺型位错可以削弱楔形裂纹尖端的应力强度因子,屏蔽裂纹的扩展,屏蔽效应随位错方位角的增大而减小。位错发射所需的无穷远临界应力随发射角的增加而增大,最可能的位错发射角度为零度,直线裂纹尖端位错的发射比楔形裂纹尖端位错的发射更容易,硬基体抑制位错的发射。     

螺型位错偶极子与界面钝裂纹的干涉效应

研究了螺型位错偶极子与界面钝裂纹的干涉效应.应用保角变换技术,得到了复势函数与应力场的封闭解析解,讨论了位错偶极子方位、臂长及裂纹钝化程度对位错偶板子屏蔽效应和发射条件的影响.结果表明,与单个螺型位错不同,螺型位错偶极子与x轴夹角在一定范围内时才可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随偶板子臂长的增大而增强,随裂纹钝化程度的增大而增强,屏蔽区域也随裂纹钝化程度的增大而增大;位错偶极子发射所需的临界无穷远加载随偶极子臂长的增加而减小,随位错方位角及裂纹钝化程度的增加而增大;最可能的位错偶极子发射角度为0.螺型位错偶极子的发射比单个螺型位错的发射要困难.本文解答的特殊情况与相关文献给出的解答一致.     

Dynamic stress intensity factors of multiple cracks in a functionally graded orthotropic half-plane

In the present paper dynamic stress intensity factor and strain energy density factor of multiple cracks in the functionally graded orthotropic half-plane under time-harmonic loading are investigated. By utilizing the Fourier transformation technique the stress fields are obtained for a functionally graded orthotropic half-plane containing a Volterra screw dislocation. The variations of the material properties are assumed to be exponential forms which the equilibrium has an analytical solution. The dislocation solution is utilized to formulate integral equation for the half-plane weakened by multiple smooth cracks under anti-plane deformation. The integral equations are of Cauchy singular type at the location of dislocation which are solved numerically to obtain the dislocation density on the faces of the cracks. The dislocation densities are employed to determined stress intensity factor and strain energy density factors (SEDFs) for multiple smooth cracks under anti-plane deformation. Numerical examples are provided to show the effects of material properties and the crack configuration on the dynamic stress intensity factors and SEDFs of the functionally graded orthotropic half-plane with multiple curved cracks.     

Electroelastic interaction between a piezoelectric screw dislocation and a confocal elliptic blunt crack with elliptical inhomogeneity

The electroelastic interaction between a piezoelectric screw dislocation and an elliptical inhomogeneity containing a confocal blunt crack under infinite longitudinal shear and in-plane electric field is investigated. Using the sectionally holomorphic function theory, Cauchy singular integral, singularity analysis of complex functions and theory of Rieman boundary problem, the explicit series solution of stress field is obtained when the screw dislocation is located in inhomogeneity. The intervention law of the interaction between blunt crack and screw dislocation in inhomogeneity is discussed. The analytical expressions of generalized stress and strain field of inhomogeneity are calculated, while the image force, field intensity factors of blunt crack are also presented. Moreover, a new matrix expression of the energy release rate and generalized strain energy density (SED) are deduced. With the size variation of blunt crack, the results can be reduced to the case of the interaction between a piezoelectric screw dislocation and a line crack in inhomogeneity. Numerical analysis are then conducted to reveal the effects of the dislocation location, the size of inhomogeneity and blunt crack and the applied load on the image force, energy release rate and strain energy density. The influence of dislocation on energy release rate and strain energy density is also revealed.     

Mixed mode axisymmetric annular cracks in a finite layer: Off angle crack initiation

The solutions of axisymmetric Volterra type climb and glide edge dislocations are obtained in a layer by means of the Hankel transforms. Utilizing the same procedure, Green’s function solution is obtained for a layer under self-equilibration normal ring traction. The distributed dislocation technique is used to construct integral equations for a system of co-axial annular cracks where the layer is under axisymmetric normal loads. These equations are solved numerically to obtain dislocation density on the cracks surfaces. The results are employed to determine stress intensity factors for annular and penny-shaped cracks and the interaction between two co-axial penny-shaped cracks is studied. Moreover, the stress intensity factors of the interacting cracks are determined such that they can be further used in conjunction with strain energy density (SED) failure criterion to obtain the possible direction of crack initiation that may not be apparent under mixed mode conditions.     

A generalized screw dislocation interacting with interfacial cracks along a circular inhomogeneity in magnetoelectroelastic solids

The interaction of a generalized screw dislocation with circular arc interfacial cracks under remote antiplane shear stresses, in-plane electric and magnetic loads in transversely isotropic magnetoelectroelastic solids is dealt with. By using the complex variable method, the general solutions to the problem are presented. The closed-form expressions of complex potentials in both the inhomogeneity and the matrix are derived for a single circular-arc interfacial crack. The intensity factors of stress, electric displacement and magnetic induction are provided explicitly. The image forces acting on the dislocation are also calculated by using the generalized Peach–Koehler formula. For the case of piezoelectric matrix and piezomagnetic inclusion, the shielding and anti-shielding effect of the dislocation upon the stress intensity factors is evaluated in detail. The results indicate that if the distance between the dislocation and the crack tip remains constant, the dislocation in the interface will have a largest shielding effect which retards the crack propagation. In addition, the influence of the interfacial crack geometry and materials magnetoelectroelastic mismatch upon the image force is discussed. Numerical computations show that the perturbation effect of the above parameters upon the image force is significant. The main result shows that a stable or unstable equilibrium point may be found when a screw dislocation approaches the surface of the crack from infinity which differs from the perfect bonded case under the same conditions. The present solutions contain a number of previously known results which can be shown to be special cases.     

Micro-crack tip fracture of commercial grade aluminum under mixed mode loading

In situ tensile tests were made in a scanning electron microscope (SEM) to investigate the deformation and micro-fracture in the immediate vicinity of a micro-crack tip in commercial pure aluminum with large-size crystal. Examined are the slip line field, stress intensity factor, strain energy density factor and crack tip opening displacement (CTOD) for mixed mode loading. Blunting and sharpening effects are observed. The latter is controlled by localized slip while the former by uniformed slip of the operating slip system with the highest crack tip Schmid factor. The operating slip system depends on the crystallographic orientation of crystal containing micro-cracks.The damage and fracture take place in the blunted region and depend on the coarsening and spacing of uniformed slip lines. The mixed mode micro-crack propagates along the direction where the voids grow and coalesce into the micro-crack. The direction also depends on the orientation of the applied loading. This suggests that the formation of macro-fracture mechanics could be applied. In particular, the minimum strain energy density criterion is suitable for determining the direction of micro-crack instability in the mixed mode. The in situ data were used to yield a nearly constant critical, minimum strain energy density factor for onset of micro-cracking.     

界面下主微裂纹间干涉的研究

涉及两相正交各向异性体界面干涉问题的研究,多裂纹问题被分解为只含单裂纹的子问题,利用位错理论和裂面应力自由条件,列出一组可数值求解位错密度函数的奇异积分方程,从耐 注得应力强度因子。     

三点弯曲试样动态应力强度因子计算研究

利用Hopkinson压杆对三点弯曲试样进行冲击加载,采集了垂直裂纹面距裂尖2mm和与裂纹面成60°距裂尖5mm处的应变信号。根据裂尖附近测试的应变信号计算试样的动态应力强度因子,并与有限元计算结果进行比较,结果表明由于裂尖有一段疲劳裂纹区,通过裂尖附近应变信号来计算动态应力强度因子时,如果裂尖位置确定不准及粘贴应变片位置不够准确对计算结果将带来很大影响。因此利用应变片法计算动态应力强度因子时,为了获得更准确的计算结果,在实验后应对试件裂纹面进行分析测量,重新确定裂尖位置,必要时需对应变片至裂尖距离进行修正后再计算动态应力强度因子值。     

Arbitrarily oriented crack near interface in piezoelectric bimaterials

Arbitrarily oriented crack near interface in piezoelectric bimaterials is considered. After deriving the fundamental solution for an edge dislocation near the interface, the present problem can be expressed as a system of singular integral equations by modeling the crack as continuously distributed edge dislocations. In the paper, the dislocations are described by a density function defined on the crack line. By solving the singular integral equations numerically, the dislocation density function is determined. Then, the stress intensity factors (SIFs) and the electric displacement intensity factor (EDIF) at the crack tips are evaluated. Subsequently, the influences of the interface on crack tip SIFs, EDIF, and the mechanical strain energy release rate (MSERR) are investigated. The J-integral analysis in piezoelectric bimaterals is also performed. It is found that the path-independent of J₁-integral and the path-dependent of J₂-integral found in no-piezoelectric bimaterials are still valid in piezoelectric bimaterials.     

导电薄板内电流密度分布与反平面剪切的比拟

定量分析电流密度在含裂纹载流薄板内的分布是当前利用电流热效应止裂技术中一个首先要解决的问题．由于裂纹的存在,电流密度在裂尖形成带奇异性分布的高度密集．现有的分析方法往往比较复杂或局限于特殊布置形式的裂纹．通过电流密度分布与弹性力学里反平面剪切问题的比拟,把分析含裂纹载流薄板内电流密度的分布等效于考虑相应的III型裂纹问题,并比照III型裂纹的应力强度因子来定义电流密度因子．而对于裂纹问题的处理可采用分布位错法这一断裂力学里便利有效的分析手段．由给出的算例可见,所提出的比拟解法可以方便精确地求解电流密度在裂尖附近的奇异分布,并有助于对这一奇异性在概念上的直观理解．     

Thermo-electro-structural coupled analyses of crack arrest by Joule heating

Using the finite element method, thermo-electro-structural coupled analyses of the cracked conducting plate under high electric current have been solved. The crack contact condition and temperature-dependent material properties are considered in this analysis. The crack tip temperature, electric current density factor, stress intensity factor and strain energy density factor are obtained for discussions. Due to high electric current density and Joule heating at the crack tip, a circular melting area may exist around the tip. After cooling, a circular void or hole may occur at the crack tip and the crack arrest is achieved. The crack tip temperature decreases when the crack contact area increases. The proper tensile load is necessary for making the crack open enough and causing high current density at the crack tip and associated crack arrest. On the other hand, the crack tip temperature increases with time by the increasing external current and Joule heating. The values of mode-I stress intensity factor and strain energy density factor decrease with time due to the thermal deformation around the crack tip. Because of the temperature-dependent resistivity, the variation of the electric current density factor is complicated. In addition, it is not easy to create a crack-arrest condition when the crack length relative to the plate width is too small.     

A finite element study of the near crack tip deformation of a ductile material under mixed mode loading

In ductile fracture, voids near a crack tip play an important role. From this point of view, a large deformation finite element analysis has been made to study the deformation, stress and strain, and void ratio near the crack tip under mixed mode plane strain loading conditions, employing Gurson's constitutive equation which has taken into account the effects of void nucleation and growth. The results show that: (i) one corner of the crack tip sharpens while the other corner blunts, (ii) the stress and strain distributions except for the near crack tip region, can be superimposed by normalizing distance from the crack tip by a crack tip deformation length, i.e., a steady-state solution under a mixed mode condition has been obtained, (iii) the field near a crack tip can be divided into four characteristic fields (K field, HRR field, blunted crack tip field, and damaged region), and (iv) the strain and void volume fraction become concentrated in the sharpened part of a crack tip with increasing Mode II component.