A Unique Method to Describe the Bonding Strength in a Bonded Solid-S-olid Interface by Contact Acoustic Nonlinearity

We present a unique method to describe the bonding strength at a bonded solid-solid interface in a multilayered composite material by contact acoustic nonlinearity （CAN） parameter. A CAN model on the bonded solid-solid interface is depicted. It can be seen from the model that CAN parameter is very sensitive to the bonding strength at the interface. When an incident focusing acoustic longitudinal wave scans the interface in two dimensions, the transmitted wave can be used to extract CAN parameter. The contour of the bonding strength for a sample is obtained by CAN parameter. The results show that the region with weak bonding strength can be easily distinguished from the contour.     

涂层界面结合强度检测研究(Ⅱ)：涂层结合界面应力检测系统

利用X射线衍射技术(XRD)测试了涂层及其基体材料的应力及其变化规律，建立了一种涂层结合界面应力检测系统，进行界面结合状态的检测研究.利用涂层从基体脱粘前后的界面应力变化量，结合涂层材料的物性参数和涂层-基体系统温度场参数，用涂层残余应力衍射峰来表征涂层与基体的结合强度，创立一种研究检测涂层结合强度理论的实验新方法，适用于各种热障涂层的界面结合强度测量. 关键词： X射线衍射法(XRD) 界面结合强度 涂层 残余应力     

Formation of interface bubbles in bonded silicon wafers: A thermodynamic model

A thermodynamic model of the formation of unbonded areas or bubbles generated at the interface of bonded silicon wafers in the temperature range of 200–800°C is presented. Within this model it is assumed that the desorption of hydrocarbon contamination at the silicon wafer surfaces leads to small hydrocarbon molecules which are mobile at the bonding interface. When the vapor pressure generated by these molecules overcomes the interface bonding strength, interface bubbles are nucleated. These bubbles grow by incorporating further hydrocarbon and also possible hydrogen molecules. The model semiquantitatively explains all the essential features of interface bubble formation observed experimentally.     

三层介质超声谐振模式随材料和界面粘接性能变化的演变规律

在用超声波谐振对粘接材料的粘接强度进行无损评估时, 不同模式对粘接强度的敏感程度受到众多因素和参数的影响, 对检测结果的可靠性至关重要. 基于多层介质中声传播和界面弱粘接边界条件的理论模型, 将一个上下非对称的金属-粘接剂-金属三层结构的平面波反射系数函数中的谐振模式看作是上下铝金属层各自的Lamb波频散模式通过夹心粘接剂层相互耦合后叠加组成. 改变影响结构粘接强度的因素, 即粘接剂的性能参数(声阻抗、密度、厚度)和界面切向劲度系数k_t来分析三层结构谐振模式耦合方式的变化,得出结论: 粘接结构粘接性能的变化基本上不改变与被粘铝层相关的固有部分的Lamb波模式, 而它们的耦合模式则在谐振频率上产生平移并会与固有模式进行交换和替代; 不同参数的变化引起的模式演变有各自的规律, 大多可彼此区分.     

键合界面对面发射激光器光与热性质的影响

通过界面有效吸收系数的计算及界面对腔模的反射率的影响可知,采用双面键合技术制备面发射激光器应使键合界面处于驻波场分布零点位置,同时界面厚度应该小于20 nm以使器件光学性能受界面吸收系数的影响较小.采用有限元方法分析VCSEL温度分布,结果证实薄的键合界面使VCSEL有源区温度对界面的热导率和电导率改变不敏感,而厚的键合界面将可能使有源区温度有较大地升高,给器件带来严重的不良影响.亲水键合和疏水键合的SEM照片说明疏水处理界面较薄,适合用于器件的制备.而亲水处理界面厚度>40 nm,对器件的光、热特性不利 关键词： 键合 面发射激光器 热导率 电导率     

Influence of imperfect bonding on interface waves guided by piezoelectric/piezomagnetic composites

Interface waves, which can be guided by imperfectly bonded piezoelectric and piezomagnetic half-spaces, are studied. The cases of absorbent and permeable interfaces are discussed in detail. It is shown that imperfection of the interface bonding has significant impact on the existence of interface waves and on their velocities of propagation. Some interface waves present in the case of imperfect bonding vanish when the bonding becomes perfect. The waves that are guided by an imperfect interface are shown to be dispersive, although there is no explicit characteristic length in the structure model. The results obtained show that possible imperfections of interface bonding must be considered in the design and fabrication of piezoelectric/piezomagnetic composites.     

Energy release rate and stress field calculation for debonding crack extension at the fibre-matrix interface during single-fibre pull-out

For the micromechanical modelling of the macroscopic failure of fibre-reinforced composites the formulation of a critical parameter for initiation and extension of debonding cracks at the fibre-matrix interface is essential. This point is discussed for the 'fibre pull-out' specimen, a test commonly used to measure the adhesion quality of fibre-matrix systems. Some of the simplifying assumptions fundamental to shear lag theory-based models of the fibre pull-out test are compared with results from a detailed finite element (FE) model to examine their validity. The FE model strongly contradicts assumptions made with the shear lag theory that the axial stress gradient in the matrix can be neglected from the equilibrium equation. A critical interface shear strength is commonly used as a measure of adhesion quality. But for elastic materials the nature of the stress concentrations at the fibre end and interface crack-tip are singular. Therefore a fracture mechanic approach is better suited for a debonding criterion than a simple finite shear strength. The energy release rate shows a minimum for short crack lengths and may stabilize the moving crack.     

An experimental study of impact-induced failure events in homogeneous layered materials using dynamic photoelasticity and high-speed photography

The generation and the subsequent evolution of dynamic failure events in homogeneous layered materials that occur within microseconds after impact were investigated experimentally. Tested configurations include three-layer and two-layer, bonded Homalite specimens featuring different bonding strengths. High-speed photography and dynamic photoelasticity were utilized to study the nature, sequence and interaction of failure modes. A series of complex failure modes was observed. In most cases, and at the early stages of the impact event, intra-layer failure (or bulk matrix failure) appeared in the form of cracks radiating from the impact point. These cracks were opening-dominated and their speeds were less than the crack branching speed of the Homalite. Subsequent crack branching in several forms was also observed. Mixed-mode inter-layer cracking (or interfacial debonding) was initiated when the intra-layer cracks approached the interface with a large incident angle. The dynamic interaction between inter-layer crack formation and intra-layer crack growth (or the so-called “Cook–Gordon Mechanism”) was visualized for the first time. Interfacial bonding played a significant role in impact damage spreading. Cracks arrested at weak bonds and the stress wave intensity was reduced dramatically by the use of a thin but ductile adhesive layer.     

铝合金板疲劳微裂纹超声红外成像检测的数值及实验研究

超声红外成像检测技术是一种发展迅速的新型无损检测技术,可用于检测材料表面或近表面的缺陷,由于对缺陷具有选择性加热的特点,近年来备受检测行业的关注。该文在铝合金板中制作疲劳微裂纹,在板中激励声波,裂纹表面因振动摩擦生热,用红外摄像仪记录板表面温度分布。拍摄的红外图像序列经傅里叶变换后得到的幅值和相位图能清晰显示裂纹的特征,测量到的裂纹长度误差达到4.3%。用有限元模拟超声在板中裂纹处的生热过程,研究板中超声在裂纹处的励热机制。超声激励时间、裂纹表面间摩擦系数和裂纹开口宽度直接影响裂纹处的励热效果,最高温度通常位于裂纹尖端附近。模拟和实验结果均表明超声红外成像检测技术能对板中疲劳微裂纹实现快速检测,提供有效、可信的检测结果。     

Deformation and Spallation of Explosive Welded Steels under Gas Gun Shock Loading

We investigate deformation and spallation of explosive welded bi-steel plates under gas gun shock loading. Free surface histories are measured to obtain the Hugoniot elastic limit and spall strengths at different impact velocities.Pre-and post-shock microstructures are characterized with optical metallography, scanning electron microscopy,and electron backscatter diffraction. In addition, the Vickers hardness test is conducted. Explosive welding can result in a wavy steel/steel interface, an ultrafine grain region centered at the interface, and a neighboring high deformation region, accompanied by a hardness with the highest value at the interface. Additional shock compression induces a further increase in hardness, and shock-induced deformation occurs in the form of twinning and dislocation slip and depends on the local substructure. Spall damage nucleates and propagates along the ultrafine grain region, due to the initial cracks or weak interface bonding. Spall strengths of bimetal plates can be higher than its constituents. Plate impact offers a promising method for improving explosive welding.     

直接键合InP-GaAs结构界面的特性研究

通过对直接键合InP-GaAs结构的红外吸收光谱分析以及断面扫描电子显微镜观察发现，样品制备过程中不均匀的外加压强导致InP-GaAs交界面局部出现了不连续过渡的空间层，实验上将熔融石蜡渗透并被填充到该空间层，利用其对3.509μm波长光的强烈吸收特性可表征 这种局部的键合不连续区域，二维扫描测试样品不同区域的吸收谱得到3.509μm波长吸收强 度等值线图，从而描绘出外加压强的不均匀分布.实验上通过改进键合装置的施压均匀性， 得到了连续过渡界面且均匀键合的InP-GaAs结构，利用这种均匀键合技术有望制备大尺寸器 件例如光学微腔等. 关键词： 晶片直接键合 界面 红外吸收光谱     

金属杆内疲劳裂纹与振动/超声相互作用及其定量表征

根据同步解调的原理,考察振动声调制检测输出信号中的调制成分,对金属杆内振动/超声在裂纹面上的相互作用进行了分析.制作了含有不同尺寸裂纹的铝杆试样,以扫频激励的方式得到合适的高频激励参数,分析输出信号中的调制信息,发现工件中的高频超声可分为两部分:一部分声波通过裂纹面,受到低频振动信号的调制,另一部分则保持不变。在此基础上对非线性调制模型进行了修正,并提出了一种用于裂纹检测的定量方法。与超声C扫描检测结果对比表明,此定量方法可用于估计金属杆中疲劳裂纹尺寸。      

钢-铅粘接结构的粘接强度对超声体波反射与 透射特性的影响*

针对多层异种金属粘接结构中粘接强度的超声检测与表征困难的问题,采用线性弹簧模型和等效弹性模量模型来分别表征界面粘附强度和内聚强度,推导了超声体波斜入射N层粘接结构的反射与透射系数表达式。通过在不同入射面和入射声波模式等条件下,同时连续改变两种参数来系统研究粘接层界面粘附强度与内聚强度变化对超声波反射与透射特性的影响关系,确定了能够敏感表征粘接强度的超声参量,为粘接强度的无损检测与评价提供理论依据。     

钢-混凝土结构弱粘接界面缺陷的超声导波检测*

钢-混凝土结构是土木工程中的一种常用结构形式,钢与混凝土粘接处可能出现弱粘接甚至完全脱粘的缺陷,严重影响结构的安全性。该文提出利用空气耦合超声导波衰减的方法实现钢-混凝土结构粘接状态的非接触无损检测方法,分析不同厚度粘接界面对超声导波衰减的影响。基于全局矩阵技术对钢-混凝土结构求解理论频散方程和衰减曲线,得到界面层不同粘接条件下的理论参数及衰减特性。建立不同粘接条件的有限元模型,定量分析不同模态对粘接缺陷的检测敏感度。研究界面层厚度分别为1 mm和2 mm两种情况下S0能量的衰减情况。研究结果表明:S0模态可有效判断粘接结构的粘接状态,对于同一界面层厚度,随着界面粘接条件变弱,S0最大幅值与A0最大幅值比不断增大;不同厚度同一粘接条件下,2 mm相较于1 mm该值更大。该方法在钢-混凝土结构粘接界面缺陷的检测方面具有良好的应用价值和发展前景。     

Interaction of fatigue crack with vibration and ultrasound in metallic rod and its use for quantitative characterization

According to the principle of synchronous demodulation,the modulation information in the output signal of vibro-acoustic modulation test was investigated and the nonlinear interaction of sound and vibration with the crack interface in a metallic rod was analyzed.A swept signal excitation was used to obtain a proper high frequency parameter in the test of aluminum rod samples with different sizes of cracks and the modulation information in the output signal was analyzed.It was found that the ultrasound wave in the structure can be separated into two parts.One is the wave which passes through the crack interface modulated by the low frequency vibration,and other wave has no any changes.The nonlinear modulation model was modified and a quantitative method for crack detection was proposed.It is demonstrated by comparing with the ultrasonic C-scanning that this method can be used to estimate the fatigue crack size in the metallic rod.     

Empirical rheological model for rough or grooved bonded interfaces

In the industrial sector, it is common to use metal/adhesive/metal structural bonds. The cohesion of such structures can be improved by preliminary chemical treatments (degreasing with solvents, alkaline, or acid pickling), electrochemical treatments (anodising), or mechanical treatments (abrasion, sandblasting, grooving) of the metallic plates. All these pretreatments create some asperities, ranging from roughnesses to grooves. On the other hand, in damage solid mechanics and in non-destructive testing, rheological models are used to measure the strength of bonded interfaces. However, these models do not take into account the interlocking of the adhesive in the porosities. Here, an empirical rheological model taking into account the interlocking effects is developed. This model depends on a characteristic parameter representing the average porosity along the interface, which considerably simplifies the corresponding stress and displacement jump conditions. The paper deals with the influence of this interface model on the ultrasonic guided modes of the structure.     

Modeling the propagation of ultrasonic waves in the interface region between two bonded elements

An important task in nondestructive materials evaluation is the development of techniques to characterize the bond quality of adherent joints. Binding forces are nonlinear and cause a nonlinear modulation of transmitted and reflected ultrasonic waves. As a consequence, the higher harmonics generated by an insonified monochromatic wave give information about the adhesive bonds. The local binding forces in thin bonded interfaces can be obtained by the amplitudes of the ultrasonic waves of the insonified frequency and its higher harmonics as transmitted through the interface. Additional phase measurements may enable one to obtain the evaluation of the full hysteretic cycle of the interaction force. In order to gain a deeper understanding of the interface region and to improve the technique, numerical simulations of the ultrasonic wave propagation through specimens of two bonded elements can be used. A simple model based on the local interaction simulation approach (LISA) is described in this contribution, and a comparison between the results of the simulations and the experimental data is presented. Besides its intrinsic relevance for NDE, the problem considered in this paper may be very useful to analyze and test models for the simulation of ultrasonic wave propagation in nonclassical nonlinear mesoscopic elastic materials.     

一种测量无规则裂缝宽度的量化模型与实现

建立了一种测量无规则裂缝宽度的量化模型,提出了一种真伪裂缝区域分割新方法.该方法通过边缘检测并利用形态学膨胀运算,在待测裂缝的两侧边缘区域选取近似等量的目标像素和背景像素后,设置门限以自适应选取最佳分割阈值,提取出裂缝区域,进而提取裂缝的走势及边缘像素,用建立的量化模型,即可实现宽度测量.该测量方法能有效克服裂缝图像的噪音较大、裂缝不规则等弊端,去除裂缝图像的伪裂缝区域,测量结果的重复准确度在0.1 mm以内.实验结果表明,该方法有效地实现了裂缝宽度的准确测量,具有较强的适应性.     

Low-temperature direct wafer bonding of GaAs/InP

An approach for low-temperature direct wafer bonding of GaAs/InP was presented. The bonding procedure was carried out at temperatures from 350 to 500 ^°C, and the bonded n-GaAs/n-InP specimens were obtained even at a temperature as low as 350 ^°C. The compositional profile on the GaAs/InP heterointerface was studied by X-ray photoelectron spectroscopy. The bonded interfacial properties were also characterized by current–voltage (I–V$I\text{–}V$) and bonding strength measurement. The experimental results revealed an InGaAsP (or/and InGaAs) interlayer formed at the bonded interface, which influences the electrical property as well as the bonding strength. For the specimen bonded at 350 ^°C, the transport of major carriers could be explained by a tunneling effect. But the carrier transport was described by the thermionic emission theory for the specimen bonded at 450 ^°C. Finally, the mechanism of GaAs/InP bonding was discussed.     

Ultrasonic measurement of the diffusion bond strength

This paper presents an ultrasonic method for measurement of diffusion bond strength between two identical materials. The method requires a single normal-incidence ultrasonic measurement. When a diffusion bond is not perfect some ultrasonic energy is reflected from the interface separating the two substrates. Amplitude of a reflected signal correlates qualitatively with the bond strength. However, a quantitative correlation is difficult to establish since reflected signal amplitude depends on parameters of the test equipment. We introduce a spectroscopic analysis of a reflected signal to measure the bond strength. We show experimentally that an imperfect diffusion bond can be characterized by a single parameter: interfacial spring stiffness. The stiffness can be determined from the reflected signal spectrum and does not depend on testing equipment. It is also demonstrated that for a particular diffusion bonding procedure as applied to tool steel the interfacial stiffness correlates quantitatively with bond strength.