Heterogeneous integration of GaAs pHEMT and Si CMOS on the same chip

In this work,we demonstrate the technology of wafer-scale transistor-level heterogeneous integration of Ga As pseudomorphic high electron mobility transistors(p HEMTs) and Si complementary metal–oxide semiconductor(CMOS) on the same Silicon substrate.Ga As p HEMTs are vertical stacked at the top of the Si CMOS wafer using a wafer bonding technique,and the best alignment accuracy of 5 μm is obtained.As a circuit example,a wide band Ga As digital controlled switch is fabricated,which features the technologies of a digital control circuit in Si CMOS and a switch circuit in Ga As p HEMT,15% smaller than the area of normal Ga As and Si CMOS circuits.     

Atomistics of Ge deposition on Si(100) by atomic layer epitaxy

Chlorine termination of mixed Ge/Si(100) surfaces substantially enhances the contrast between Ge and Si sites in scanning tunneling microscopy observations. This finding enables a detailed investigation of the spatial distribution of Ge atoms deposited on Si(100) by atomic layer epitaxy. The results are corroborated by photoemission measurements aided by an unusually large chemical shift between Cl adsorbed on Si and Ge. Adsorbate-substrate atomic exchange during growth is shown to be important. The resulting interface is thus graded, but characterized by a very short length scale of about one monolayer.     

Heterogeneous integration of InP HEMTs on quartz wafer using BCB bonding technology

Heterogeneous integrated InP high electron mobility transistors(HEMTs)on quartz wafers are fabricated successfully by using a reverse-grown InP epitaxial structure and benzocyclobutene(BCB)bonding technology.The channel of the new device is In_0.7Ga_0.3As,and the gate length is 100 nm.A maximum extrinsic transconductance gm,max of 855.5 mS/mm and a maximum drain current of 536.5 mA/mm are obtained.The current gain cutoff frequency is as high as 262 GHz and the maximum oscillation frequency reaches 288 GHz.In addition,a small signal equivalent circuit model of heterogeneous integration of InP HEMTs on quartz wafer is built to characterize device performance.     

择优取向MgO在Si衬底上的直流溅射制备及其性能表征

采用直流磁控溅射并通过优化工艺参数,在（100）Si衬底上成功制备了高度（100）择优的MgO薄膜和MgO/TiN双层膜结构.对 （100）MgO择优取向温度影响机理做了详细讨论,并利用XRD,AFM,FESEM等手段研究了在（100）Si和（100）TiN/Si两种衬底上,不同工艺条件下MgO薄膜的表面和断面微观结构,表征了MgO薄膜的柱状生长结构和与TiN薄膜的良好外延关系.在对薄膜光学特性的研究中,利用Sellmeier模型获得了Si上MgO薄膜在可见光波段的折射率参数（550 nm处折射率为1.6 关键词： MgO薄膜 择优取向 直流溅射 折射率拟合     

Growth of AgInSe<Subscript>2</Subscript> on Si(100) substrate by thermal evaporation technique

AgInSe₂ films were prepared by a thermal evaporation technique onto Si(100) substrates at a pressure of 10⁻⁵ mbar. Structural and optical properties of films deposited at 300 and 473 K have been investigated. The film composition was studied by energy dispersive analysis through X-rays. X-ray diffraction patterns indicate that AgInSe₂ films have chalcopyrite structure with strong preferred orientation in the (112) direction. Average vertical crystallite size of 25 nm was observed. The optical energy gaps of 1.20 and 1.90 eV were obtained due to the fundamental absorption edge and a transition originating from crystal field splitting, respectively. Field emission scanning electron microscopy shows loosely packed grains of spherical symmetry with some facets.     

硅基硒纳米颗粒的发光特性研究

由于尺寸缩小引起的量子效应, 硒(Se) 材料的低维纳米结构具有更高的光响应和低的阈值激射等特性, 因此成为纳米电子与纳米光电子器件领域一个重要的研究方向. 本文通过对非晶硒薄膜的快速热退火来制备硒纳米颗粒, 退火温度在100–180℃之间时, 结晶后的硒纳米颗粒均为三角晶体结构, 其颗粒尺寸随退火温度的增加而线性增大. 光致发光谱测试发现三个发光峰, 分别位于1.4eV, 1.7eV和1.83eV. 研究发现位于1.4eV处的发光峰来源于非晶硒缺陷发光, 位于1.83eV处的发光峰来源于晶体硒的带带跃迁发光; 而位于1.7eV处的发光峰强度随激发功率增强而指数增大, 且向短波长移动, 该发光峰应该来源于非晶硒与硒纳米颗粒界面处的施主-受主对复合发光. 关键词： 硅基 硒纳米颗粒 光致发光 施主-受主对     

The structure and optical properties of SiC film on Si (111) substrate with a ZnO buffer layer by RF-magnetron sputtering technique

We have fabricated a multiply layer SiC/ZnO on Si substrates using the RF-magnetron sputtering technique with the targets of a single crystalline SiC and a polycrystalline ZnO. The as-deposited films were annealed in the temperature range of 600–1000 °C under nitrogen ambient. We have observed a strong ultraviolet (UV) emission (370 nm) from the as-deposited SiC/ZnO film and an intense violet emission (412 nm) from the film annealed at high temperature (1000 °C) under nitrogen ambient. The SiC film quality and the PL intensities are considered to be strongly dependent on the crystalline quality of the ZnO buffer layer. With the increase of the annealing temperature, the crystalline quality of the ZnO buffer layer is improved, resulting in the improvement of the SiC film quality and the increase of the PL intensities. The thin films have been characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR) and scanning electron microscopy (SEM) to provide the evidences of photoluminescence (PL). We suggest that the UV emission could be attributed to the nanocrystal silicon particles, that the 395 nm band is related to ZnO buffer layer and has a great relation to the crystalline quality of the ZnO film, and that the violet emission is associated with the emission luminescence from 6H-SiC, which bears on the SiC film quality. The obtained results are expected to have important applications in modern optoelectronic devices.     

Temperature-dependent photoluminescence spectra of GaN epitaxial layer grown on Si(111) substrate

In this paper, the temperature-dependent photoluminescence(PL) properties of Ga N grown on Si(111) substrate are studied. The main emission peaks of Ga N films grown on Si(111) are investigated and compared with those grown on sapphire substrates. The positions of free and bound exciton luminescence peaks, i.e., FX A and D0 X peaks, of Ga N films grown on Si(111) substrates undergo red shifts compared with those grown on sapphire. This is attributed to the fact that the Ga N films grown on sapphire are under the action of compressive stress, while those grown on Si(111) substrate are subjected to tensile stress. Furthermore, the positions of these peaks may be additionally shifted due to different stress conditions in the real sample growth. The emission peaks due to stacking faults are found in Ga N films grown on Si(111) and an S-shaped temperature dependence of PL spectra can be observed, owing to the influence of the quantum well(QW) emission by the localized states near the conduction band gap edge and the temperature-dependent distribution of the photo-generated carriers.     

Sb-capping and decapping of MBE-grown GaSb(100)

We present a study of GaSb(100) surfaces grown by molecular beam epitaxy, protected by an Sb cap during ambient storage, and annealed in ultra-high vacuum. The surface structure, composition and electronic transitions are investigated with low energy electron diffraction, Auger electron spectroscopy, and electron energy loss spectroscopy. Successful Sb-decapping is achieved by annealing at 300° C for 30 min. It leads to a (2 × 3)−c(2 × 6) reconstructed surface with less residual damage and higher Sb concentration than surfaces prepared by sputtering and annealing.     

Study of graded Ni-Ti shape memory alloy film growth on Si(100) substrate

In-situ X-ray diffraction (XRD) was employed to study the effect of the deliberate change of the Ti/Ni ratio during the deposition of Ni-Ti films. Thus, graded films were deposited exhibiting distinctive composition and crystalline structure along the growth direction. The as-sputtered films were ex-situ characterized by Auger electron spectroscopy (AES), cross-sectional transmission electron microscopy (XTEM), and electrical resistivity (ER) measurements (during thermal cycling). In this paper results are presented concerning a film (thickness of ≈ 420 nm) with a Ti-rich composition in the central part (ranging from 50 to ≈60 at. %) and near-equiatomic composition in the extremities, following four distinct deposition periods (different Ti target powers). During the initial deposition step (near-equiatomic composition) the Ni-Ti B2 phase starts by stacking onto (h00) planes on the naturally oxidized Si(100) substrate due to the presence of the native Si oxide (2–3 nm). The increase of the power of the Ti target in the second and third steps induced the precipitation of Ti₂Ni. When stopping the Ti co-sputtering, Ti₂Ni dissolves and, thus, plays the role of a Ti reservoir for the formation of B2 phase now preferentially stacking onto (110) with the system approaching again the equiatomic composition. The ex-situ study of the morphology of the interface has shown the presence of NiSi₂ silicides (A-NiSi₂ and B-NiSi₂), Ti₄Ni₄Si₇, Ti₂Ni and a non-identified phase constituted by Ni, Ti and Si, most likely amorphous. During thermal cycling, ER measurements revealed phase transitions associated with the B2, R-phase and B19^′ phases. These type of studies allow the identification of intermediate states during deposition and annealing, and the correlation with the final structure of the film, being useful for the optimisation of the deposition parameters in order to fabricate films with a two-way reversible actuation. PACS 81.15.Cd; 61.10.Nz; 68.55.Jk     

Synthesis of epitaxial Si(100) nanowires on Si(100) substrate using vapor–liquid–solid growth in anodic aluminum oxide nanopore arrays

The synthesis of epitaxial Si nanowires with growth direction parallel to Si [100] on Si(100) substrate was demonstrated using a combination of anodic aluminum oxide (AAO) template, catalytic gold film sandwiched between the template and the Si(100) substrate and vapor-liquid-solid growth using SiH₄ as the Si source. After growing out from the AAO nanopores, most Si nanowires changed their diameter and growth direction into larger diameter and 〈111〉 direction. PACS 81.07.-b; 82.45.Cc     

Si(100)表面Se薄膜生长及其在Ti/Si欧姆接触中的应用

本文采用分子束外延(MBE)系统在Si(100)表面淀积Se薄膜. 通过控制衬底和固态Se束源炉的温度,实现了Se材料在Si(100)表面上的自限制超薄薄膜生长;在Se超薄层钝化的Si(100)表面上制备的Ti金属电极具有低的欧姆接触电阻特性,且热稳定性温度提升至400 ℃. 关键词： 硒 钝化 欧姆接触 热稳定性     

用脉冲激光方法在Si(100)上沉积的Cox-C1-x颗粒膜及其磁电阻效应

利用脉冲激光沉积方法在Si(100)上制备了Cox-C1-x颗粒膜,并研究了其正磁电阻效应.实验结果表明,样品在室温下的正磁电阻效应要远远高于低温下的正磁电阻效应;Co0.02-C0.98样品具有最大的室温正磁电阻效应,在外加磁场B=1T时,其磁电阻率MR=22%;随着Co含量的增加,Cox-C1-x颗粒膜的正磁电阻效应呈减小趋势.样品的MR-B的曲线与传统的多层膜及颗粒膜结构有很大的不同,这一现象表明在实验样品中可能存在着一种新的输运机制.     

Optical and dielectric properties of gadolinium–erbium oxide films prepared on Si(100) substrate

Samples of Er-doped Gd-oxide thin films were prepared on quartz and Si(p) substrates for optical and electrical investigations. These samples were annealed at different conditions and characterised by UV-VIS absorption spectroscopy, X-ray fluorescence, and X-ray diffraction. The constructed metal–oxide–semiconductor (MOS) devices were characterised by measuring their capacitance and ac conductance as a function of gate voltage. The ac conductance of the MOS devices was studied as a function of frequency in the range 500 Hz to 100 kHz. It was found that the corrected barrier hopping model controls experimental results and the parameters of the model were determined. PACS 77.55.+f; 72.20.-i; 78.70.En     

Electron diffraction on GaAs nanowhiskers grown on Si(100) and Si(111) substrates by molecular-beam epitaxy

The crystal structure of GaAs nanowhiskers grown by molecular-beam epitaxy on Si(111) and Si(100) substrates is investigated using reflection high-energy electron diffraction (RHEED). It is revealed that, in both cases, the electron diffraction images contain a combination (superposition) of systems of reflections characteristic of the hexagonal (wurtzite and/or 4H polytype) and cubic (sphalerite) phases of the GaAs compound. The growth on the Si(111) substrates leads to the formation of nanowhiskers with hexagonal (wurtzite and/or 4H polytype) and cubic (sphalerite) structures with one and two orientations, respectively. In the case of the Si(100) substrates, the grown array contains GaAs nanowhiskers that have a cubic structure with five different orientations and a hexagonal structure with eight orientations in the (110) planes of the substrate. The formation of the two-phase crystal structure in nanowhiskers is explained by the wurtzite—sphalerite phase transitions and/or twinning of crystallites.     

Coating of superconducting.123 compound on silver substrate by electrophoretic technique

Superconducting 123 powders have been deposited on silver metal wire and foil by an electrophoretic deposition technique, followed by appropriate heat treatment, to obtain superconducting wires and tapes. At the present stage the critical current density is rather low (85 A/cm²), however there remains a considerable scope for improvement.     

Role of buried ultra thin interlayer silicide on the growth of Ni film on Si(100) substrate

The presence of a buried, ultra-thin amorphous interlayer in the interface of room temperature deposited Ni film with a crystalline Si(100) substrate has been observed using cross sectional transmission electron microscopy (XTEM). The electron density of the interlayer silicide is found to be 2.02 e/?³ by specular X-ray reflectivity (XRR) measurements. X-ray diffraction (XRD) is used to investigate the growth of deposited Ni film on the buried ultra-thin silicide layer. The Ni film is found to be highly textured in an Ni(111) plane. The enthalpy of formation of the Ni/Si system is calculated using Miedema’s model to explain the role of amorphous interlayer silicide on the growth of textured Ni film. The local temperature of the interlayer silicide is calculated using enthalpy of formation and the average heat capacity of Ni and Si. The local temperature is around 1042 K if the interlayer compound is Ni₃Si and the local temperature is 1389 K if the interlayer compound is Ni₂Si. The surface mobility of the further deposited Ni atoms is enhanced due to the local temperature rise of the amorphous interlayer and produced highly textured Ni film. Received: 2 March 2000 / Accepted: 28 March 2000 / Published online: 11 May 2000