GaSb基PECVD法制备SiO2薄膜的应力研究

为了实现在GaSb衬底上获得低应力的SiO₂薄膜,研究了等离子体增强化学气相沉积法（PECVD）在晶格失配较大的GaSb衬底上沉积SiO₂薄膜的应力情况。通过改变薄膜沉积时的工艺条件,如反应温度、射频功率、反应压强、气体流量比,并基于曲率法模型,对镀膜前后的曲率半径进行了实验测量,利用Stoney公式计算相关应力值并绘制应力变化曲线。详细讨论了PECVD工艺条件的改变对SiO₂薄膜应力所产生的影响。同时通过在Si衬底上沉积SiO₂薄膜,对比分析了导致薄膜应力产生的因素及变化过程。实验结果表明,在沉积温度为300℃、射频功率为20 W、腔体压强为90 Pa、气体流量比SiH₄/N₂O为125/70 cm³·min^-1的工艺参数下,PECVD法在GaSb衬底上沉积的SiO₂薄膜应力相对较小。     

MoO_3/Si界面区钼掺杂非晶氧化硅层形成的第一性原理研究

采用基于密度泛函理论的第一性原理计算方法,通过模拟MoO_3/Si界面反应,研究了MoO_x薄膜沉积中原子、分子的吸附、扩散和成核过程,从原子尺度阐明了缓冲层钼掺杂非晶氧化硅(a-SiO_x(Mo))物质的形成和机理.结果表明,在1500 K温度下, MoO_3/Si界面区由Mo, O, Si三种原子混合,可形成新的稳定的物相.热蒸发沉积初始时, MoO_3中的两个O原子和Si成键更加稳定,同时伴随着电子从Si到O的转移,钝化了硅表面的悬挂键. MoO_3中氧空位的形成能小于SiO_2中氧空位的形成能,使得O原子容易从MoO_3中迁移至Si衬底一侧,从而形成氧化硅层;替位缺陷中, Si替位MoO_3中的Mo的形成能远远大于Mo替位SiO_2中的Si的形成能,使得Mo容易掺杂进入氧化硅中.因此,在晶硅(100)面上沉积MoO_3薄膜时, MoO_3中的O原子先与Si成键,形成氧化硅层,随后部分Mo原子替位氧化硅中的Si原子,最终形成含有钼掺杂的非晶氧化硅层.     

Formation of luminescent (NH4)2SiF6 phase from vapour etching-based porous silicon

In this paper we describe the formation of a luminescent (NH₄)₂SiF₆ via porous silicon (PS) obtained from HNO₃/HF vapour etching (VE) silicon (Si) substrates. It was found that at specific conditions, PS transforms in a luminescent thick white powder (WP) layer. Scanning electron microscopy (SEM) revealed that the WP has a coral-like structure. It was also found that PS persists as an intermediate layer between the Si substrate and the WP, and seems to be the seed that transforms into the WP. SEM microanalysis show that the WP is essentially composed of silicon (Si), nitrogen (N) and fluorine (F). Fourier transform infrared (FTIR) spectroscopy investigations show that this WP contains SiF₆²⁻ and NH₄⁺ ions and N---H chemical bonds. X-ray diffraction (XRD) patterns of the WP confirm that a (NH₄)₂SiF₆ cubic phase is concerned. SEM microanalyses show an excess of Si in the WP matrix. FTIR spectroscopy and XRD analysis reveal the presence of crystalline Si particles and SiO_x, both originating from the excess of Si. The (NH₄)₂SiF₆ WP phase emits an intense photoluminescence (PL) band, shifted towards higher energies as compared to the starting PS layer. The possible origin and mechanism of the luminescence emission was discussed taking into account the ability of small SiO_x-surrounded Si particles to emit PL at rather high energy. The wide range variation of the thickness of the (NH₄)₂SiF₆ WP may be easily used for the grooving of Si wafers.     

低压MOCVD生长参量对Ⅱ型InAs/GaSb超晶格材料表面形貌的影响

采用自制低压金属有机源化学气相沉积设备,在（100）面GaSb单晶衬底上生长了Ⅱ型InAs/GaSb超晶格材料.利用双晶X射线衍射、光学显微镜、原子力显微镜和光致发光谱等分析手段对材料特性进行了表征,获得了表面光亮的晶体质量较好的Ⅱ型InAs/GaSb超晶格材料,在77 K下得到光致发光谱峰值波长为3.25 μm.研究了生长温度、过渡层、界面层对其表面形貌的影响,得出生长温度在500 ℃~520 ℃,无过渡层,使用InAsSb界面层有利于改善材料的表面形貌.     

基于GaSb/CdS薄膜热光伏电池的器件设计

基于GaSb薄膜热光伏器件是降低热光伏系统成本的有效途径之一, 本文主要针对GaSb/CdS薄膜热光伏器件结构进行理论分析. 采用AFORS-HET软件进行模拟仿真, 分析GaSb和CdS两种材料各自的缺陷态密度、界面态对电池性能的影响. 根据软件模拟可以得知, 吸收层GaSb的缺陷态密度以及GaSb与CdS之间的界面态密度是影响电池性能的重要因素. 当GaSb缺陷态增加时, 主要影响电池的填充因子, 电池效率明显下降. 而作为窗口层的CdS缺陷态密度对电池性能影响不明显, 当CdS缺陷态密度上升4个数量级时, 电池效率仅下降0.11%.     

GaSb/AlSb/GaAs应变层结构的分子束外延生长

本文以反射式高能电子衍射(RHEED)和其强度振荡为监测手段,在半绝缘GaAs衬底上成功地生长GaSb/AlSb/GaAs应变层结构,RHEED图样表明,GaSb正常生长时为Sb稳定的C(2×6)结构,AlSb为稳定的(1×3)结构,作者观察并记录GaSb,AlSb生长时的RHEED强度振荡,并利用它成功地生长10个周期的GaSb/AlSb超晶格,透射电子显微镜照片显示界面平整、清晰,采用较厚的AlSb过渡层及适当的生长条件,可在半绝缘GaAs衬底上生长出质量好的GaSb外延层,其X射线双晶衍射半峰宽小于 关键词：     

TPV系统热辐射发电模块数值分析

建立TPV系统热辐射发电模块的数理模型,通过数值模拟获得SiC辐射器分别配合GaSb和Si电池所构成的TPV系统的输出伏安特性曲线;以GaSb电池为例,分别分析SiC辐射器温度和电池温度对系统性能的影响,得出如下结论:辐射器温度升高,系统输出电能密度迅速增大,电池效率稳步提高,辐射器温度从1400 K升至1900 K,系统输出电能密度从0.67 W·cm^-2增至5.43 W·cm^-2,电池效率从16.3%上升到24.8%;电池温度升高导致系统性能下降,电池温度每升高10 K,系统输出电能密度减少约0.15 W·cm^-2,电池效率也大幅下降.最后讨论与GaSb匹配的一种选择性辐射器的辐射能量分布情况,与SiC辐射器相比,选择性辐射器可以显著减少辐射能量中的不可用部分,从而有效提高系统的性能与稳定性.     

Evolution of step-terrace structure at Si–SiO2 interface in SIMOX substrate during annealing

The step-terrace structures at the interface between the Si layer and the buried SiO₂ layer of a Separation by IMplanted OXygen substrate has been observed by using atomic force microscopy (AFM) after removing the SiO₂ and Si layers. The time evolution of the Si–SiO₂ interface roughness during high-temperature annealing was analyzed by the scaling analysis of AFM data. The correlation length exhibited a nice correspondence to the size of square domain structures. Decreasing in the index of the length scale indicates that the growth mechanism changes as the annealing proceeds.     

Strain relief and growth optimization of GaSb on GaP by molecular beam epitaxy

In this paper, the impact of growth parameters on the strain relaxation of highly lattice mismatched (11.8%) GaSb grown on GaP substrate by molecular beam epitaxy has been investigated. The surface morphology, misfit dislocation and strain relaxation of the GaSb islands are shown to be highly related to the initial surface treatment, growth rate and temperature. More specifically, Sb-rich surface treatment is shown to promote the formation of Lomer misfit dislocations. Analysis of the misfit dislocation and strain relaxation as functions of the growth temperature and rate led to an optimal growth window for a high quality GaSb epitaxial layer on (001) GaP. With this demonstrated optimized growth, a high mobility (25?500?cm(2)?V (-1)?s(-1) at room temperature) AlSb/InAs heterostructure on a semi-insulating (001) GaP substrate has been achieved.     

Perpendicular magnetic anisotropy of Pd/Co2MnSi/NiFe2O4/Pd multilayers on F-mica substrates

Pd/Co₂MnSi(CMS)/NiFe₂O₄(NFO)/Pd multilayers were fabricated on F-mica substrate by magnetron sputtering.The best PMA performance of the multilayer structure Pd(3 nm)/CMS(5 nm)/NFO(0.8 nm)/Pd(3 nm)was obtained by adjusting the thickness of the CMS and NFO layers.F-mica substrate has a flatter surface than glass and Si/SiO₂ substrate.The magnetic anisotropy energy density(K_eff)of the sample deposited on F-mica substrates is 0.6711 Merg/cm³(1 erg=10^-7 J),which is about 30%higher than that of the multilayer films deposited on glass(0.475 Merg/cm³)and Si/SiO₂(0.511 Merg/cm³)substrates,and the R_Hall and H_C are also significantly increased.In this study,the NFO layer prepared by sputtering in the high purity Ar environment was exposed to the high purity O₂ atmosphere for 5 min,which can effectively eliminate the oxygen loss and oxygen vacancy in NFO,ensuring enough Co-O orbital hybridization at the interface of CMS/NFO,and thus effectively improve the sample PMA.     

Very long wavelength infrared focal plane arrays with 50% cutoff wavelength based on type-Ⅱ In As/GaSb superlattice

A very long wavelength infrared(VLWIR) focal plane array based on In As/Ga Sb type-Ⅱ super-lattices is demonstrated on a Ga Sb substrate. A hetero-structure photodiode was grown with a 50% cut-off wavelength of 15.2 μm, at 77 K.A 320×256 VLWIR focal plane array with this design was fabricated and characterized. The peak quantum efficiency without an antireflective coating was 25.74% at the reverse bias voltage of-20 mV, yielding a peak specific detectivity of 5.89×1010cm·Hz~(1/2)·W~(-1). The operability and the uniformity of response were 89% and 83.17%. The noise-equivalent temperature difference at 65 K exhibited a minimum at 21.4 mK, corresponding to an average value of 56.3 mK.     

A self-driven photodetector based on a SnS2/WS2 van der Waals heterojunction with an Al2O3 capping layer

Photodetectors based on two-dimensional (2D) materials have attracted considerable attention because of their unique properties. To further improve the performance of self-driven photodetectors based on van der Waals heterojunctions, a conductive band minimum (CBM) matched self-driven SnS₂/WS₂ van der Waals heterojunction photodetector based on a SiO₂/Si substrate has been designed. The device exhibits a positive current at zero voltage under 365 nm laser illumination. This is attributed to the built-in electric field at the interface of the SnS₂ and WS₂ layer, which will separate and transport the photogenerated carriers, even at zero bias voltage. In addition, the Al₂O₃ layer is covered by the surface of the SnS₂/WS₂ photodetector to further improve the performance, because the Al₂O₃ layer will introduce tensile stress on the surface of the 2D materials leading to a higher electron concentration and smaller effective mass of electrons in the films. This work provides an idea for the research of self-driven photodetectors based on a van der Waals heterogeneous junction.     

Growth of high-density InGaSb quantum dots on silicon atoms irradiated GaAs substrates

We discuss a technique that allows us to grow high-density GaSb and InGaSb quantum dots (QDs) on (0 0 1)-oriented GaAs substrates. We study the use of Si atom irradiation on the substrate surface as an anti-surfactant before the QDs fabrication. It is clear that the densities of GaSb and InGaSb QDs are drastically enhanced with the Si atom irradiation. Photoluminescence intensities from these QDs are also increased with the Si atom irradiation. These results indicate that the Si atom irradiation technique is useful to improve the properties of the Sb-based QDs.     

Toplayer-dependent crystallographic orientation imaging in the bilayer two-dimensional materials with transverse shear microscopy

Nanocontact properties of two-dimensional (2D) materials are closely dependent on their unique nanomechanical systems, such as the number of atomic layers and the supporting substrate. Here, we report a direct observation of toplayer-dependent crystallographic orientation imaging of 2D materials with the transverse shear microscopy (TSM). Three typical nanomechanical systems, MoS₂ on the amorphous SiO₂/Si, graphene on the amorphous SiO₂/Si, and MoS₂ on the crystallized Al₂O₃, have been investigated in detail. This experimental observation reveals that puckering behaviour mainly occurs on the top layer of 2D materials, which is attributed to its direct contact adhesion with the AFM tip. Furthermore, the result of crystallographic orientation imaging of MoS₂/SiO₂/Si and MoS₂/Al₂O₃ indicated that the underlying crystalline substrates almost do not contribute to the puckering effect of 2D materials. Our work directly revealed the top layer dependent puckering properties of 2D material, and demonstrate the general applications of TSM in the bilayer 2D systems.     

Dependence of surface distribution of self-assembled InSb nanodots on surface morphology and spacer layer thickness

Self-assembled InSb nanodots (NDs) were grown on a GaSb (1 0 0) substrate using metal-organic vapour phase epitaxy (MOVPE). The effects of etching depth of the substrate and thickness of the GaSb buffer layer on the density and size distribution of single and double layer dots were studied for detector applications. The etch depth of the substrate was varied up to 30 μm. In this particular study, the dots were grown at 450 °C and the GaSb spacer thickness was varied between 50 nm and 200 nm. The optimum substrate etch depth was found to be 30 μm while the best spacer thickness was found to be 200 nm.     

GaSb layers with low defect density deposited on (001) GaAs substrate in two-dimensional growth mode using molecular beam epitaxy

We report on the growth of fully relaxed and smooth GaSb layers with reduced density of threading dislocations, deposited on GaAs substrate. We prove that three parameters have to be controlled in order to obtain applicable GaSb buffers with atomically smooth surface: interfacial misfit (IMF), the etch pit density (EPD) and the growth mode.The GaSb/GaAs interfacial misfit array and reduced EPD ≤1.0 × 10⁷ cm^?2 were easily obtained using As-flux reduction for 3 min and Sb-soaking surface for 10 s before the GaSb growth initiation. The successive growth of GaSb layer proceeded under the technological conditions described by the wide range of the following parameters: r_G ∈ (1.5 ÷ 1.9) Å/s, T_G ∈ (400 ÷ 520)°C, V/III ∈ (2.3 ÷ 3.5). Unfortunately, a spiral or 3D growth modes were observed for this material resulting in the surface roughness of 1.1 ÷ 3.0 nm. Two-dimensional growth mode (layer by layer) can only be achieved under the strictly defined conditions. In our case, the best quality 1-μm-thick GaSb buffer layer with atomically smooth surface was obtained for the following set of parameters: r_G = 1.5 Å/s, T_G = 530 °C, V/III = 2.9. The layer was characterized by the strain relaxation over 99.6%, 90° dislocations array with the average distance of 5.56 nm, EPD ～8.0 × 10⁶ cm^?2 and 2D undulated terraces on the surface with roughness of about 1 ML. No mounds were observed. We belive that only thin and smooth GaSb layer with reduced EPD may be applied as the buffer layer in complex device heterostructures. Otherwise, it may cause the device parameters deterioration.     

氧化物隔离对Si基片上生长L1_0相FePt薄膜磁性的影响

用MgO和SiO_2两种氧化物将FePt薄膜与Si(100)基片隔离,分析隔离层在FePt层发生A1→L1_0转变过程中的作用,寻找用Si母材涂敷L1_0-FePt磁性层来提高磁力显微镜针尖矫顽力的合理方案.采用磁控溅射法在400?C沉积Fe Pt薄膜,在不同温度进行2 h的真空热处理,分析晶体结构和磁性的变化.结果表明:没有隔离层,Si基片表层容易发生扩散,50 nm厚FePt薄膜的矫顽力最大只有5kOe(1 Oe=10~3/(4π)A·m~(-1));而插入隔离层,矫顽力可以超过10 kOe;MgO在Si基片上容易碎裂,热处理温度不能高于600?C,用作隔离层,FePt的最大矫顽力为12.4 kOe;SiO_2与Si基片的晶格匹配更好,热膨胀系数差较小,能承受的最高热处理温度可以超过800?C,使得Fe Pt的矫顽力可以在5 kOe到15 kOe范围内调控,更适合用于制作矫顽力高并可控的磁力显微镜针尖.     

InAs/GaSb superlattices grown by LP-MOCVD for ∼10 μm wavelength infrared range

A type-II InAs/GaSb superlattice (SL) was grown on Te-doped (1 0 0) GaSb substrate by low pressure metal organic chemical vapor deposition (LP-MOCVD). The samples were obtained at different growth temperatures and with different interface layers. By introducing an InAsSb interface layer between InAs and GaSb, a good surface morphology of the superlattice was achieved when the sample growth temperature was around 500–520 °C. The photoluminescence (PL) peak wavelength of the sample was 10.7 μm at 77 K, with FWHM of ∼30 meV.     

Growth, structure and oxidation of ordered silicon layers on nickel (001)

Thin silicon films deposited in ultra-high vacuum on Ni(001) have been studied, as a function of annealing and/or O₂ exposure, using Auger spectroscopy and low energy electron diffraction. Annealing at temperatures as low as 200 ° C causes rapid intermixing, with only about one monolayer of Si (θ ≈ 1) remaining in a disordered surface layer. Annealing at successively higher temperatures causes further intermixing and the appearance of a c(2 × 2) ordered overlayer (θ = 0.5). The rate of O chemisorption and the structure of the oxide are found to depend on the structure of the adsorbed Si layer. For the c(2 × 2) layer, O₂ exposure leads to the rapid formation of multiple Si---O bonds at all surface Si sites, as in the case of bulk Ni₃Si. This effect is less pronounced (and the saturation O coverage lower) for a surface having a somewhat higher Si coverage but in the form of a disordered layer. The results are interpreted in terms of the involvement of underlayer Ni atoms in promoting O₂ dissociation.