Effect of curing agent and temperature on the rheological behavior of epoxy resin systems

The effect of curing agent (6610) content and temperature on the rheological behavior of the epoxy resin CYD-128 was studied by DSC analysis and viscosity experiments. The results show that the resin system meets the requirements of processing technology. A complete reaction occurs when the curing agent content (40 parts per hundred resin, phr) is a little higher than the theoretical value (33.33 phr), while the degree of reaction of the resin system is reduced when the curing agent content is lower (25.00 phr) than theoretical value. However, excessive curing agent (50.00 phr) results in a lower reaction rate. Curing agent content has little influence on gel time when curing agent content exceeded 33.33 phr and the temperature was less than 70 °C. The isothermal viscosity-time curves shift towards the -x axis when the temperature rises from 50 °C to 80 °C. Meanwhile, higher temperature results in higher reaction rates.     

Effects of organophilic montmorillonite on hydrogen bonding, free volume and glass transition temperature of epoxy resin/polyurethane interpenetrating polymer networks

Epoxy resin nanocomposites containing organophilic montmorillonite (oM) and polyurethane were prepared by adding oM to interpenetrating polymer networks (IPNs) of epoxy resin and polyurethane (EP/PU). The dispersion degree of oM in EP/PU matrix was characterized by X-ray diffraction (XRD) and transmission electron microscopy (TEM). Fourier transform infrared spectrometry (FT-IR) showed that strong interactions existed between oM and EP/PU matrix, and oM had some effect on hydrogen bonding of these EP/PU IPNs nanocomposites. Positron annihilation spectroscopy (PALS) and differential scanning calorimetry (DSC) measurements were used to investigate the effect of oM and PU contents on free volume and glass transition temperature (T_g) of these nanocomposites. The PALS and DSC results clearly showed that the presence of oM led to a decrease in the total fractional free volume, which was consistent with increasing T_g upon addition of oM, ascribed to increasing hydrogen bonding in interfacial regions of oM and EP/PU matrix and enhancing the miscibility between EP phase and PU phase. In addition, with increasing PU content, the total fractional free volume increased, corresponding to decreasing T_g.     

Effects of reactive diluent diepoxidized cardanol and epoxy fortifier on curing kinetics of epoxy resin

Different formulations, composed of the diglycidyl ether of bisphenol-A, diepoxidized cardanol as reactive diluent, an anhydride as curing agent, and a tertiary amine as curing catalyst, with/without the use of an epoxy fortifier, were analysed. The effect of the fortifier on the diluent was also observed. The overall kinetics of curing was observed to follow a simple Arrhenius-type temperaturedependence, with an activation energy in the range 54–120 kJ/mol, with first-order kinetics up to 85% conversion. An increase in activation energy was observed with an increase of diluent content. The curing reaction was found to follow a three-step mechanism, involving a nucleophilic bimolecular displacement reaction, for which an explanation was offered. Incorporation of the fortifier lowers the curing temperature, but does not alter the final degree of reaction.

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Zusammenfassung Es wurden verschiedene Ausgangsgemische, bestehend aus dem Diglyzidyläther von Bisphenol A, diepoxydiertem Kardanol als reaktives Streckmittel, einem Anhydrid als Vernetzungsmittel und einem tertiären Amin als Vernetzungskatalysator mit bzw. ohne Anwendung eines Fortifyers untersucht. Der Einfluss des Fortifyers auf das Streckmittel wurde ebenfalls untersucht. Die Bruttokinetik der Vernetzung zeigt eine Temperaturabhängigkeit einfachen Arrhenius-Types mit einer Aktivierungsenergie im Bereich von 54–120 kJ/mol sowie einen Reaktionstyp erster Ordnung mit einer Konversionsrate von 85%. Ein steigender Streckmittelgehalt bewirkt ein Anwachsen der Aktivierungsenergie. Der Vernetzungsreaktion liegt ein Dreistufenmechanismus zu Grunde, der unter anderem auch eine nukleofile bimolekulare Substitutionsreaktion beinhaltet. Der Einsatz eines Fortifyers senkt zwar die Vernetzungstemperatur, verändert aber nicht die Endkonversionsrate.

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Study on curing of novolac epoxy resin

The optimization of proportions of novolac epoxy resin, Dobeckot E4 and polyamide hardener, EH411 has been established by DSC and the data indicates that resin-polyamide, 100∶40 and 100∶50, appear to be optimum where ‘extent of cure’ is maximum. The kinetic parameters for these formulations have been evaluated using isothermal and dynamic modes by employing DSC. The rate constants have been evaluated for curing process of these formulations using isothermal DSC mode in the temperature range of 70°–90°C. These have also been predicted at 20°±1°C (room temperature) by extrapolating the data obtained at elevated temperatures. A comparison of the predicted values with the experimental values shows that there is a good agreement between them.     

Effects of water on epoxy cure kinetics and glass transition temperature utilizing molecular dynamics simulations

Effects of water on epoxy cure kinetics are investigated. Experimental tests show that absorbed water in an uncured bisphenol‐F/diethyl‐toluene‐diamine epoxy system causes an increase in cure rate at low degrees of cure and a decrease in cure rate at high degrees of cure. Molecular simulations of the same epoxy system indicate that the initial increase in cure rate is due to an increase in molecular self‐diffusion of the epoxy molecules in the presence of water. Effects of water on the glass transition temperature (T_g) of the crosslinked thermoset are also studied. Both experiments and simulations show that water decreases T_g. Both types of results indicate that T_g effects are small below 1% water by weight, but that T_g depression occurs much quickly with increasing water content above 1%. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1150–1159     

Calorimetric measurement of the maximum glass transition temperature in a thermosetting resin

The measurement of the maximum glass transitionT _g∞ of a thermosetting resin is usually performed by differential scanning calorimetry in the second scan (T _g2scan), after a previous scan by heating up the sample to a temperature where the exothermic curing reaction has been completed. However, this method can eventually produce thermal degradation, decreasing the crosslinking density and theT _g of the sample. Values ofT _g2scan between 95? and 102?C were found in an epoxy resin based on DGEBA cured with phthalic anhydride. Thermal degradation effects can be avoided if the measurement is performed by isothermal curing and further determination ofT _g. AT _g∞ value of 109?C is achieved, which is the maximum value ofT _g according to the topological limit of conversion.     

Aspects of epoxy resin curing reactions

The progress that has been made in establishing the mechanism of the curing reaction between epoxides and amines, particularly through the use of calorimetric methods (DSC), is discussed. A novel application of tritium-labelled compounds to the study of the reaction of epoxides with imidazoles is also presented. The radiochemical method has produced an enhanced understanding of the reaction mechanism and has given kinetic data in good agreement with DSC measurements.     

The effects of glass beads and silane treatments on the curing behavior of a brominated epoxy resin: DSC analyses

The curing characteristics of a brominated epoxy resin/dicyandiamide (DICY) system filled with silane-treated glass beads are studied using isothermal differential scanning calorimetry (DSC). Three different silane coupling agents, N-(2-aminoethyl)-3-aminopropyl-trimethoxysilane, N-[2-(vinylbenzylamino)-ethyl]-3-aminopropyl-trimethoxysilane, and 3-glycidoxypropyl-trimethoxysilane, are applied. It is found that the reaction heats of the epoxy system are little affected by the curing temperature and the untreated glass fillers, but changed with the addition of silane-coated glass beads. The effect of glass beads on the curing reaction is more significant at the low curing temperature and conversion. The silane treatment results in changes in T_g, activation energy, reaction heat, reaction rate, and reaction order. Three silanes respond differently because of their differences in the activated reaction with the matrix system. Regardless of the various curing mechanisms involved, a simple kinetic expression can describe the curing extent at 170 and 180°C with a good accuracy for all systems studied. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 2063–2071, 1997     

Influence of thermal treatment on the glass transition temperature of thermosetting epoxy laminate

The influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex^® FR-4 glass fibre-reinforced epoxy laminate (used for printed circuit board manufacturing) was used in these experiments. The composite was exposed to thermal treatments at temperatures ranging from 170 °C to 200 °C for times ranging from 10 to 480 h. The glass transition temperature (T_g) was analysed via dynamic mechanical analysis (DMA). It has been proven that the glass transition temperature rapidly decreases in reaction to thermal stress. The obtained T_g data were used for Arrhenius plots for different critical temperatures (T_g-crit. = 105–120 °C). From their slopes (?E_a/R), the activation energy of the thermal degradation process was calculated as 75.5 kJ/mol. In addition to this main relaxation mechanism, DMA also recorded one smaller relaxation process in the most aged samples. Microscopic analysis of the sample structure showed the presence of pronounced small regions of degradation both on the surface and in the inner structure, which are probably the causes of microscopic delamination and the smaller relaxation process.     

Effects of moisture on the glass transition temperature of polyurethane shape memory polymer filled with nano-carbon powder

One simple approach to produce electrically conductive polymers is to fill them with conductive powders. This paper investigates the effects of moisture on the glass transition temperature of a polyurethane shape memory polymer (SMP) filled with nano-carbon powders. It is found that the SMP composites before immersion in water have a slightly lower glass transition temperature, and in the mean time, the moisture fraction at the saturation point upon immersion is also lower. On the other hand, the moisture can remarkably reduce the glass transition temperature of the composites. Heating to over 180 °C is an effective way to remove the moisture, which also results in the glass transition temperature back to the original. As the glass transition temperature can be greatly reduced by moisture, a novel feature, namely, the water actutable recovery of SMP composites is also proposed based on this study.     

Effects of liquid crystalline structure formation on the curing kinetics of an epoxy resin

The curing kinetics of a system containing 4,4′-diglycidyloxy-α-methylstilbene (DOMS) and different functionality amines, N-ethylaniline (NEA), aniline, benzenesulfonamide (BSA), and sulfanilamide (SAA), have been studied by differential scanning calorimetry (DSC) under isothermal conditions. The phase transformations during curing of the systems have been monitored by a crosspolarized optical microscope equipped with a hot-stage and photo detector. It has been found that the growth of a nematic liquid crystal structure does not cause a discrepancy from the autocatalytic model for the reactions between aniline and epoxy. There is no liquid crystalline structure formed for the systems containing NEA or BSA, which follow the autocatalytic kinetic models within the temperature range of 120–150°C. For the curing reactions between DOMS and SAA, there is a big deviation from the autocatalytic model when the liquid crystals transfer from a nematic structure to a smectic structure. Unlike the usual decrease of reaction rate resulting from diffusion in a heterogeneous reaction, the reaction rate is enhanced. A modified kinetic model has been constructed for this reaction system by introducing a pseudoconcentration term caused from the liquid crystalline structure formation. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1105–1124, 1997     

Heat of reaction and curing of epoxy resin

The heat of reaction and kinetics of curing of diglycidyl ether of bisphenol-A (DGEBA) type of epoxy resin with catalytic amounts of ethylmethylimidazole (EMI) have been studied by differential power-compensated calorimetry as a part of the program for the study of process monitoring for composite materials. The results were compared with those from 1∶1 and 1∶2 molar mixtures of DGEBA and EMI. A method of determination of heat of reaction from dynamic thermoanalytical instruments was given according to basic thermodynamic principles. The complicated mechanism, possibly involving initial ionic formation, has also been observed in other measurements, such as by time-domain dielectric spectroscopy. The behavior of commercially available DGEBA resin versus purified monomeric DGEBA were compared. The melting point of purified monomeric DGEBA crystals is 41.4 °C with a heat of fusion of 81 J/g. The melt of DGEBA is difficult to crystallize upon cooling. The glass transition of purified DGEBA monomer occurs around ?22 °C with aΔC _p of 0.60 J/K/g.     

The effect of masked isocyanates on the moisture absorption of MY 720/DDS epoxy resin

Several masked isocyanates were prepared with variations in both the type of isocyanate and masking group. They were characterized by elemental analysis and NMR spectroscopy, and their unblocking temperatures were determined. In general, higher unblocking temperatures were obtained using acyclic and cyclic aliphatic isocyanates and fluorinated phenols. Those with unblocking temperatures in the range of 120–180°C were incorporated into MY 720/DDS epoxy resin prior to cure. Highly fluorinated variations were incompatible with the resin. IR and DSC analyses showed that residual functional groups in the epoxy resin reacted with the masked isocyanates. Reductions in moisture absorption as high as 65% were obtained depending on the masked isocyanate. DMA studies showed that the T_g of the epoxy resin is lowered by incorporation of the masked isocyanate but the elastic modulus (E′) is relatively unchanged at temperatures below T_g.     

Synthesis and curing behavior of a novel liquid crystalline epoxy resin

This article described the synthesis and mesomorphic behavior transition of a novel liquid crystalline (LC) epoxy resin 4-(2,3-epoxypropoxy)biphenyl,4″-(2,3-epoxypropoxy)phenyl-4′carboxylate (EBEPC), which combined a hydroxyl benzoic aromatic ester and biphenol rigid-rod group. EBEPC showed a clear nematic schlieren texture under curtain conditions. The reaction kinetics of EBEPC cured by 4,4′-diaminodiphenyl-methane (DDM) was studied by using an isoconversional method under isothermal conditions with differential scanning calorimetry (DSC). The isothermal DSC data can be fitted reasonably by an autocatalytic curing model. Smectic phases had been observed in the EBEPC/DDM curing system. The results of DSC showed that the formation of the LC phase had pronounced influence on the curing reaction.     

Effects of moisture on glass transition and microstructure of glycerol-plasticized soy protein

The glass transition behavior of the glycerol-plasticized soy protein sheets (SL series) at various relative humidity (RH) was investigated by using differential scanning calorimetry with the aluminum pan and O-ring-sealed stainless steel capsule, and the microstructure of these sheets was detected on small-angle X-ray scattering. The results revealed that there were three glass transitions (Tg1, Tg2 and Tg3), corresponding to glycerol-rich, protein-rich and protein-water domains, in the protein-glycerol-water ternary system. The Tg1 values of the SL-series sheets at 75% RH decreased from -49.3 to -83.8 degrees C with an increase of glycerol content from 10 to 50 wt.-%, whereas Tg2 and Tg3 were almost invariable at about 60 degrees C and 3 degrees C, respectively. In addition, the Tg1, Tg2 and Tg3 values of the SL-25 containing 25 wt.-% glycerol at 0%, 35%, 58%, 75% and 98% RH were in the range of -12.7 - -83.2 degrees C, 65.8 - 53.1 degrees C and 3.5 - 1.9 degrees C, respectively. The result from small-angle X-ray scattering indicated that the radii of gyration (Rg) of protein-rich domain were in the range of 60-63 nm; this suggested the existence of protein macromolecules as aggregates in the stable protein-rich and protein-water domains. With an increase of RH, the tensile strength and Tg values of the SL-series sheets decreased, but the elongation at break increased. In view of the results above, the moisture in ambient environment significantly influenced the Tg values and microstructures of the glycerol-plasticized soy protein sheets, leading to the changes of the mechanical and thermal properties.     

The physical properties of bisphenol-a-based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature

The creep behavior of a series of fully cured epoxy resins with different crosslink densities was determined from the glassy compliance level to the equilibrium compliance J_e at temperatures above T_g and at the glassy level below T_g during spontaneous densification at four aging temperatures, 4,4-diamino diphenyl sulfone DDS was used to crosslink the epoxy resins. The shear creep compliance curves J(t) obtained with materials at equilibrium densities near and above T_g were compared at their respective T_gs. T_gs from 101 to 205°C were observed for the epoxies which were based on the diglycidyl ether of bisphenol A. Creep rates were found to be the same at short times, and equilibrium compliances J_e were close to the predictions of the kinetic theory of rubberlike elasticity. Time scale shift factors determined during physical aging were reduced to T_g. At compliances below 2 × 10^?10 cm²/dyn, Andrade creep, where J(t) is a linear function of the cube root of creep time, was observed. The time to reach an equilibrium volume at T_g was found to be longer for the epoxy resin with lower crosslink densities. The increase of density during curing is illustrated for the epoxy resin with the highest crosslink density.     

Effect of substituents on the curing of liquid crystalline epoxy resin

The synthesis of an aromatic ester based liquid crystalline epoxy resin (LCE) with a substituent in the mesogenic central group is described. Chlorine and methyl groups were introduced as substituents. The curing behaviors of three epoxy resins were investigated using diaminodiphenyl ester as the curing agent. The curing rate and heat of curing of LCE were measured with dynamic and isothermal DSC. The chlorine substituent accelerated the curing of LCE, while the methyl substituent decelerated the curing of LCE. The heat of curing of substituted LCE was diminished compared to LCE with no substituent. Glass transition temperature and elastic modulus of LCE decreased with increasing the size of the substituent. Three liquid crystalline epoxy resins based on aromatic ester mesogenic groups formed a liquid crystalline phase after curing, and the liquid crystalline phase was stable up to the decomposition temperature. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 911–917, 1998     

Water absorption in EVOH films and its influence on glass transition temperature

Moisture sorption kinetics of nonoriented ethylene vinyl alcohol copolymer (EVOH) film (EF‐E15) were studied at 25, 35, and 45°C. Anomalous diffusion was observed for the polymeric film at high relative humidities (RH) and higher temperatures. Diffusion and solubility coefficients of water were found to be concentration dependent. The moisture sorption isotherms of three types of EVOH films (EF‐E15, EF‐F15, and EF‐XL15) determined at 25, 35, and 45°C, were well described using the GAB equation. Glass transition temperatures (T_g) of the EVOH films, as influenced by RH, were measured using differential scanning calorimetry. T_g values decreased with increasing RH due to the plasticization effect of water, and were found to be dependent on ethylene content and orientation of the EVOH films. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 691–699, 1999     

Curing of neat ED-20 epoxy resin and of its aqueous emulsions

The behavior of neat ED-20 epoxy resin and of its aqueous emulsions in the course of heating in the temperature interval 20–500°С in the presence of cross-linking agents of different structures (NC-558, polyethylenepolyamine, Telalit 180, Epilink 701) was studied. The water absorption, hardness, and microstructure of coatings prepared from these epoxy systems were examined.     

Prediction of the glass transition temperature of cycloaliphatic amine–epoxy networks

Stoichiometric, completely cured binary or ternary mixtures of the diglycidylether of bisphenol A (DGEBA), isophorone diamine (IPD), and trimethylcyclohexylamine (TMCA) monomers were studied by differential scanning calorimetry. The relations between the glass transition temperature T_g and the structure of the copolymer networks were investigated. Good predictions of T_g can be obtained on the basis of the following hypothesis: (1) the molar contributions M_iT^?1_gi to the “copolymer effect” of difunctional groups are additive, (2) the crosslinking effect can be expressed by the DiMarzio relation in which the molar contribution of crosslink mers is an increasing function of the stiffness of linear segments. For the seven systems under study, the deviation between calculated and experimental T_g values is within experimental scatter.