共查询到20条相似文献,搜索用时 0 毫秒
1.
The electromigration failure mechanism in flip-chip solder joints through the rapid dissolution of the Cu metallization was
studied in detail. The ambient temperature was found to be a very important factor in this failure mechanism. When the ambient
temperature was changed from 100°C to 70°C, the time to failure changed from 95 min to 31 days. The results of this study
indicate that temperature, as an experimental variable, is not less important than the current density in electromigration
study. The surface temperatures of the chip and substrate during electromigration were also measured. The temperature of the
Si chip was reasonably homogeneous because of the fact that Si is a very good thermal conductor. It was also reasoned that
the high thermal conductivity of the PbSn solder could not support a temperature gradient large enough to induce thermomigration
across the solder joint in the present study. Experimentally, no evidence of mass transport caused by thermomigration was
observed. 相似文献
2.
Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure
In this work, the simulating analysis of PoP structure under the temperature range from 0 °C to 125 °C is carried out using direct thermal-cycle analysis and Coffin-Manson method. The results show that the maximum accumulating inelastic hysteresis energy appears on the solder ball in the bottom fine-pitch ball grid array (FBGA) structure. The thermal-fatigue crack initiates in the two symmetrical corners of solder ball in FBGA structure. The thermal-fatigue damage evolves fast in the outer row corner's balls then slowly propagates into the inner row balls in FBGA structure. By analyzing the failure data of solder balls, a thermal-fatigue failure criterion is defined where the critical failure probability value is about 80%. 相似文献
3.
4.
5.
Failure of solder joints under shear frequently occurs along a path near and parallel to, but not necessarily exactly at, the interface between the alloy and the bonding material. A numerical finite element analysis was employed to simulate the deformation in solder during cyclic lap-shear testing. High magnitudes of equivalent plastic strain were seen to initiate from the corner regions and spread into the solder along a concentrated band close to the interface. Damage can be expected to occur along the localized band, thus rationalizing the experimentally observed failure path. The effect of solder geometry was also explored in this study. 相似文献
6.
Single solder interconnects were subjected to a series of combined tension-shear and compression-shear tests to determine their failure load. The failure envelope of these interconnects was obtained by plotting the normal component against the shear component of the failure load. The interconnect failure force map was found to be elliptical like the failure envelopes of many materials. The failure map can be described by a simple mathematical expression to give a simple force-based criterion for combine loading of solder joints. Post mortem analyses were conducted on the solder joint specimens to identify the failure mechanisms associated with various segments of the failure map. Computational simulations of actual board tests show that the failure map obtained for joint tests provides good predictions of board-level interconnect failures and hence suggest that such failure maps are useful in the design and analysis of board assemblies subjected to mechanical loads. The industry could adopt the methodology to obtain failure envelopes for solder joints of different alloys, bump size and reflow profiles which they could later use to aid in board-level and system-level designs of their products for mechanical reliability. 相似文献
7.
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
Two substrate surface finishes, Au/Ni and organic solderable preservative (OSP), were used to study the effect of the surface
finish on the reliability of flip-chip solder joints under electromigration at 150°C ambient temperature. The solder used
was eutectic PbSn, and the applied current density was 5×103 A/cm2 at the contact window of the chip. The under bump metallurgy (UBM) on the chip was sputtered Cu/Ni. It was found that the
mean-time-to-failure (MTTF) of the OSP joints was six times better than that of the Au/Ni joints (3080 h vs. 500 h). Microstructure
examinations uncovered that the combined effect of current crowding and the accompanying local Joule heating accelerated the
local Ni UBM consumption near the point of electron entrance. Once Ni was depleted at a certain region, this region became
nonconductive, and the flow of the electrons was diverted to the neighboring region. This neighboring region then became the
place where electrons entered the joint, and the local Ni UBM consumption was accelerated. This process repeated itself, and
the Ni-depleted region extended further on, creating an ever-larger nonconductive region. The solder joint eventually, failed
when the nonconductive region became too large, making the effective current density very high. Accordingly, the key factor
determining the MTTF was the Ni consumption rate. The joints with the OSP surface finish had a longer MTTF because Cu released
from the substrate was able to reduce the Ni consumption rate. 相似文献
8.
T. L. Shao S. H. Chiu Chih Chen D. J. Yao C. Y. Hsu 《Journal of Electronic Materials》2004,33(11):1350-1354
The thermal gradient and temperature increase in SnAg3.5 solder joints under electrical-current stressing have been investigated
by thermal infrared microscopy. Both positive and negative thermal gradients were observed under different stressing conditions.
The magnitude of the thermal gradient increases with the applied current. The measured thermal gradients reached 365°C/cm
as powered by 0.59 A, yet no obvious thermal gradient was observed when the joints were powered less than 0.25 A. The temperature
increase caused by joule heating was as high as 54.5°C when powered by 0.59 A, yet only 3.7°C when stressed by 0.19 A. The
location of heat generation and path of heat dissipation are believed to play crucial roles in the thermal gradient. When
the major heat source is the Al trace, the thermal gradient in the solder bumps is positive; but it may become negative because
the heat generated in the solder itself is more prominent. 相似文献
9.
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints 总被引:1,自引:1,他引:1
In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs on PCBs, solder paste deposition volume and reflow profiles. Lead-free SnAgCu plastic-ball-grid-array (PBGA) components were assembled onto PCBs using SnAgCu solder paste. The assembled boards were subjected to the thermal cycling test (−40 °C/+125 °C), and crack initiation and crack propagation during the test were studied. Microstructure analysis and measurements of interface intermetallic growth were conducted using samples after 0, 1000, 2000 and 3000 thermal cycles. Failures were not found before 5700 thermal cycles and the characteristic lives of all solder joints produced using different process and design parameters were more than 7200 thermal cycles, indicating robust solder joints produced with a wide process window. In addition, the intermetallic interfaces were found to have Sn–Ni–Cu. The solder joints consisted of two Ag–Sn compounds exhibiting unique structures of Sn-rich and Ag-rich compounds. A crystalline star-shaped structure of Sn–Ni–Cu–P was also observed in a solder joint. The intermetallic thicknesses were less than 3 μm. The intermetallics growth was about 10% after 3000 thermal cycles. However, these compounds did not affect the reliability of the solder joints. Furthermore, findings in this study were compared with those in previous studies, and the comparison proved the validity of this study. 相似文献
10.
11.
Tz-Cheng Chiu Jyun-Ji Lin Hung-Chun Yang Vikas Gupta 《Microelectronics Reliability》2010,50(12):2037-2050
The ever increasing power density in high performance microelectronic devices for applications such as large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. For characterizing the solder joint response to compressive load and model the corresponding reliability failure, the compressive creep behavior of Sn3.8Ag0.7Cu solder was first investigated. A viscoplastic constitutive model developed from the creep characterization was then incorporated into numerical finite element (FE) analysis to predict solder joint creep collapse and bridging under heatsink compressive load. The numerical analysis results were validated by experimental studies of solder joint collapse under compressive load and isothermal aging condition. A simplified power-law formula is also provided for modeling the creep collapse of Sn3.8Ag0.7Cu solder joint. The model may be applied for predicting solder joint compressive reliability under a prescribed heatsink compression, or to determine the maximum allowable heatsink load for a given life expectancy. 相似文献
12.
13.
The present study investigates the thermal fatigue crack propagation path in a eutectic solder joint between a 2512 leadless
chip resistor and a printed wiring board which had experienced thermal cycling between -55 and 125°C. This was achieved through
the microstructural examination of fractured surfaces of the joints. Patches of finely spaced striations were observed in
a predominant shear strain field in the joints. These striations were attributed to the tensile strain components in the field
and used to add the identification of the fatigue crack propagation direction. It was observed that cracks did not simply
propagate across the depth of the joint from the inner end (the heel) to the outer end (the toe) in the longitudinal direction,
but from a corner point on the free edge of the heel to the center across the joint depth, making an angle of about 70° with
respect to the longitudinal direction. 相似文献
14.
Y. L. Lin C. W. Chang C. M. Tsai C. W. Lee C. R. Kao 《Journal of Electronic Materials》2006,35(5):1010-1016
Eutectic PbSn flip chip solder joint was subjected to 5×103 A/cm2 current stressing at 150°C and 3.5 × 104 A/cm2 current stressing at 30°C. The under bump metallurgy (UBM) on the chip was sputtered Ni/Cu, and the substrate side was a
thick Cu trace. It was shown through in-situ observation that the local temperature near the entrance of electrons from the
Al interconnect to the solder became higher than the rest of the joint. The accelerated local Ni UBM consumption near the
entrance was also observed. Once the Ni was consumed at a location, a porous structure formed, and the flow of the electrons
was blocked there. It was found that the formation of the void and the formation of the porous structure were competing with
each other. If the porous structure formed first, then the void would not be able to nucleate there. On the other hand, if
the void could nucleate before the UBM above lost its conductivity, then the joint would fail by the void formation-and-propagation
mechanism. 相似文献
15.
H. Rhee F. Guo J. G. Lee K. C. Chen K. N. Subramanian 《Journal of Electronic Materials》2003,32(11):1257-1264
Mechanical incorporation of metallic particles in the Sn-Ag-based solder resulted in various intermetallic compound (IMC)
morphologies around these particles during reflow. Unlike with the Ni particles, the IMCs formed around Cu and Ag particles
are relatively insensitive to reflow profiles employed. The IMC formed around the Ni particles ranges from “sunflower” morphology
to “blocky” morphology with increasing time and temperature above liquidus during the heating part of the reflow profile.
Mechanical properties, such as simple shear strength and creep behavior, of these composite solders were affected by the IMC
morphologies in the composite solders investigated. Sunflower-shaped IMC formed around an Ni particles resulted in higher
simple shear strength and better creep properties. 相似文献
16.
17.
Reliability of solder joints under drop impact loading is important to mobile electronic products. In this paper, dynamic four-point impact bending tests of board level electronic packages are carried out to investigate mechanical behavior of solder joints. In the test, strain gauges, a high speed camera and the digital image correlation method are used to acquire strain and deflection of the printed circuit board (PCB). After validated by the test data, a finite element model of the dynamic four-point impact bending test is used to obtain strain and stress in the solder joints. Then, failure predictions of the solder joints are made by strain index, and the predictions are compared with the experimental observations. Furthermore, a strain rate dependent Johnson-Cook material model and rate independent elastic-plastic model of lead-free solder are used to investigate the effect of strain rate on behavior of solder joints under drop impact loading. We find that the material model has insignificant influence on the deflection of the PCB during the drop impact but severely affect the stress and strain in solder joints. The rate independent elastic-plastic solder material model always underestimates the stress and overestimates the strain of the solder joints. The index of equivalent plastic strain computed by the strain rate dependent Johnson-Cook model can predict more realistic failure behavior of the solder joints. 相似文献
18.
19.
K. C. Chen A. Telang J. G. Lee K. N. Subramanian 《Journal of Electronic Materials》2002,31(11):1181-1189
To better understand the effect of repeated reverse stress in solder joints, a new testing method was developed. Tin-silver
solder joints were fabricated, constrained between Cu blocks, and then subjected to repeated shear loading in a tensile tester.
Constant strain amplitudes were applied to simulate service conditions. However, large loads were used to accelerate the damage
accumulation. Microstructural features of the damage were very similar to those found with studies on thermomechanical fatigue
(TMF) of small, single shear lap samples. Concentrated-shear banding or striations were observed to form along Sn dendrites.
The load behavior of the solder with each cycle and during hold times at the extreme strain amplitude was consistent with
damage accumulating with each successive cycle. Effects of strain amplitude, hold times at the stress extremes, number of
cycles, and solder-joint thickness were found to play significant roles on the stress-strain behavior and surface damage. 相似文献
20.
Janne J. Sundelin Sami T. Nurmi Toivo K. Lepistö Eero O. Ristolainen 《Journal of Electronic Materials》2006,35(7):1600-1606
The effect of microstructure on the creep properties and the failure mechanism of SnAgCu solder joints was studied. Single
overlap shear specimens made of FR-4 printed circuit boards (PCBs) with organic solderability preservative (OSP), NiAu, and
immersion Sn surface finish were reflow-soldered with hypoeutectic, eutectic, and hypereutectic SnAgCu solder paste. Creep
tests of the solder joints were performed at 85°C and 105°C under constant load. The effect of microstructure on the creep
behavior of the joints was studied by examining the fracture surfaces and cross-sectional samples of the tested joints. Results
show that the intermetallic compound at the interface between the PCB and solder affects the fracture behavior of SnAgCu solder
joints, thus creating a significant difference in the creep properties of solder joints on different surface finishes. Composition
of SnAgCu solder was also found to affect the creep properties of the joints. 相似文献