Calorimetric studies on an anhydride‐cured epoxy resin from diglycidyl ether of bisphenol‐A and diglycidyl ether of poly(propylene glycol). I. Onset of diffusion control during isothermal polymerization

Calorimetric studies on a series of anhydride‐cured epoxy resins, in which the epoxy oligomer is a mixture of diglycidyl ether of bisphenol‐A (DGEBA) and diglycidyl ether of poly(propylene glycol) (DGEPPG) in different mole ratios, were carried out. DGEPPG is a flexible epoxy oligomer that was used to tune glass transition temperature for the fully reacted epoxy resin. Conversion versus time curves for the systems with different DGEBA/DGEPPG mole ratios (not including the neat DGEPPG system) were found to overlap with each other in mass‐controlled reaction regime, indicating similar reactivities of epoxy groups in both epoxy oligomers. Onset of diffusion‐controlled reaction regime for different systems was estimated by fitting the conversion versus time data using a phenomenological kinetic equation, as well as from direct comparison of the conversion versus time curves. For the systems (i.e., 0, 10, and 30% DGEPPG) that vitrify during reaction, the crossover from mass‐controlled to diffusion‐controlled reaction occurs close to the onset of the vitrification, where T_g is about 25–30 K below the reaction temperature. For the system (i.e., 50% DGEPPG system) that does not vitrify during the reaction, such crossover still occurs when the T_g of the mixture reaches a value about 25 K below the reaction temperature. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 46: 2155–2165, 2008     

Copolymer networks from carboxyl‐containing polyaryletherketone and diglycidyl ether of bisphenol‐A: Preparation and properties

This article presents a new type of epoxy‐toughening system, in which high‐T_g polyaryletherketone (PEK‐L) containing one carboxyl group per repeating unit was utilized to randomly copolymerize with epoxy resin (DGEBA) to form crosslinking network. Compared to the neat epoxy resin, the PEK‐L/DGEBA copolymers showed simultaneous enhancement in flexural strains at break by 282%, G_IC value by 193%, and flexural strength by 14%. The reason was attributed to the uniform three‐dimensional copolymer network interweaved by PEK‐L and DGEBA segments through strong covalent bonds. The copolymerization process were monitored and examined by FTIR spectra. The effect of copolymer composition on the thermal and mechanical properties as well as toughening mechanism were also investigated and discussed in detail. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Thermal properties and toughness performance of hyperbranched‐polyimide‐modified epoxy resins

An amine‐terminated hyperbranched polyimide (HBPI) was prepared by the condensation polymerization of a commercially available triamine monomer with a dianhydride monomer. The effects of the HBPI content on the thermal and mechanical interfacial properties of diglycidyl ether of bisphenol A (DGEBA) epoxy resins were investigated with several techniques. The thermogravimetric analysis results showed that the thermal stability of the DGEBA/HBPI blends did not obviously change as the HBPI content increased. The glass‐transition temperature (T_g) of the DGEBA/HBPI blends increased with the addition of HBPI. Improvements in the critical stress intensity factor (K_IC) and impact strength of the blends were observed with the addition of HBPI. The K_IC value and impact strength were 2.5 and 2 times the values of the neat epoxy resins with only 4 wt % HBPI. The fractured surfaces were studied with scanning electron microscopy to investigate the morphology of the blends, and they showed that shear deformation occurred to prevent the propagation of cracks in the DGEBA/HBPI blends. These results indicated that a toughness improvement was achieved without a decrease in the thermal stability or T_g. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3348–3356, 2006     

Synthesis of hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups and its use as a toughener for epoxy resins

Hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups (PEEKTOH) was synthesized by the nucleophilic substitution reaction of 4,4′‐difluorobenzophenone with tert‐butyl hydroquinone with potassium carbonate as a catalyst and N‐methyl‐2‐pyrrolidone as a solvent. Diglycidyl ether of bisphenol A epoxy resin was toughened with PEEKTOHs having different molecular weights. The melt‐mixed binary blends were homogeneous and showed a single composition‐dependent glass‐transition temperature (T_g). Kelley–Bueche and Gordon–Taylor equations gave good correlation with the experimental T_g. Scanning electron microscopy studies of the cured blends revealed a two‐phase morphology. A sea‐island morphology in which the thermoplastic was dispersed in a continuous matrix of epoxy resin was observed. Phase separation occurred by a nucleation and growth mechanism. The dynamic mechanical spectrum of the blends gave two peaks corresponding to epoxy‐rich and thermoplastic‐rich phases. The T_g of the epoxy‐rich phase was lower than that of the unmodified epoxy resin, indicating the presence of dissolved PEEKTOH in the epoxy matrix. There was an increase in the tensile strength with the addition of PEEKTOH. The fracture toughness increased by 135% with the addition of high‐molecular‐weight PEEKTOH. The improvement in the fracture toughness was dependent on the molecular weight and concentration of the oligomers present in the blend. Fracture mechanisms such as crack path deflection, ductile tearing of the thermoplastic, and local plastic deformation of the matrix occurred in the blends. The thermal stability of the blends was not affected by blending with PEEKTOH. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 541–556, 2006     

Phosphonyl/hydroxyl hydrogen bonding–induced miscibility of poly(arylene ether phosphine oxide/sulfone) statistical copolymers with poly(hydroxy ether) (phenoxy resin): Synthesis and characterization

High molecular weight bisphenol A or hydroquinone‐based poly(arylene ether phosphine oxide/sulfone) homopolymer or statistical copolymers were synthesized and characterized by thermal analysis, gel permeation chromatography, and intrinsic viscosity. Miscibility studies of blends of these copolymers with a (bisphenol A)‐epichlorohydrin based poly(hydroxy ether), termed phenoxy resin, were conducted by infrared spectroscopy, dynamic mechanical analysis, and differential scanning calorimetry. All of the data are consistent with strong hydrogen bonding between the phosphonyl groups of the copolymers and the pendent hydroxyl groups of the phenoxy resin as the miscibility‐inducing mechanism. Complete miscibility at all blend compositions was achieved with as little as 20 mol % of phosphine oxide units in the bisphenol A poly(arylene ether phosphine oxide/sulfone) copolymer. Single glass transition temperatures (T_g) from about 100 to 200°C were achieved. Replacement of bisphenol A by hydroquinone in the copolymer synthesis did not significantly affect blend miscibilities. Examination of the data within the framework of four existing blend T_g composition equations revealed T_g elevation attributable to phosphonyl/hydroxyl hydrogen bonding interactions. Because of the structural similarities of phenoxy, epoxy, and vinylester resins, the new poly(arylene ether phosphine oxide/sulfone) copolymers should find many applications as impact‐improving and interphase materials in thermoplastics and thermoset composite blend compositions. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1849–1862, 1999     

Amine‐cured epoxy/clay nanocomposites. II. The effect of the nanoclay aspect ratio

The thermophysical and mechanical properties of a nanocomposite material composed of amine‐cured diglycidyl ether of bisphenol A (DGEBA) reinforced with organomontmorillonite clay are reported. The storage modulus at 100 °C, which was above the glass‐transition temperature (T_g), increased approximately 350% with the addition of 10 wt % (6.0 vol %) of clay. Below the T_g, the storage modulus at 30 °C increased 50% relative to the value of unfilled epoxy. It was determined that the T_g linearly increased as a function of clay volume percent. The tensile modulus of epoxy at room temperature increased approximately 50% with the addition of 10 wt % of clay. The reinforcing effect of the organoclay nanoplatelets is discussed with respect to the Tandon–Weng and Halpin–Tsai models. A pseudoinclusion model is proposed to describe the behavior of randomly oriented, uniformly dispersed platelets in nanocomposite materials. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4391–4400, 2004     

The physical properties of bisphenol-a-based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature

The creep behavior of a series of fully cured epoxy resins with different crosslink densities was determined from the glassy compliance level to the equilibrium compliance J_e at temperatures above T_g and at the glassy level below T_g during spontaneous densification at four aging temperatures, 4,4-diamino diphenyl sulfone DDS was used to crosslink the epoxy resins. The shear creep compliance curves J(t) obtained with materials at equilibrium densities near and above T_g were compared at their respective T_gs. T_gs from 101 to 205°C were observed for the epoxies which were based on the diglycidyl ether of bisphenol A. Creep rates were found to be the same at short times, and equilibrium compliances J_e were close to the predictions of the kinetic theory of rubberlike elasticity. Time scale shift factors determined during physical aging were reduced to T_g. At compliances below 2 × 10^?10 cm²/dyn, Andrade creep, where J(t) is a linear function of the cube root of creep time, was observed. The time to reach an equilibrium volume at T_g was found to be longer for the epoxy resin with lower crosslink densities. The increase of density during curing is illustrated for the epoxy resin with the highest crosslink density.     

Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000     

Degradable and chemically recyclable epoxy resins containing acetal linkages: Synthesis,properties, and application for carbon fiber‐reinforced plastics

Four sorts of epoxy resins containing degradable acetal linkages were synthesized by the reaction of bisphenol A (BA) or cresol novolak (CN) resin with vinyl ethers containing a glycidyl group [4‐vinlyoxybutyl glycidyl ether (VBGE) and cyclohexane dimethanol vinyl glycidyl ether (CHDMVG)] and cured with known typical amine‐curing agents. The thermal and mechanical properties of the cured resins were investigated. Among the four cured epoxy resins, the CN‐CHDMVG resin (derived from CN and CHDMVE) exhibited relatively high glass transition temperature (T_g = ca. 110 °C). The treatment of these cured epoxy resins with aqueous HCl in tetrahydrofuran (THF) at room temperature for 12 h generated BA and CN as degradation main products in high yield. Carbon fiber‐reinforced plastics (CFRPs) were prepared by heating the laminated prepreg sheets with BA‐CHDMVG (derived from BA and CHDMVE) and CN‐CHDMVG, in which strands of carbon fibers are impregnated with the epoxy resins containing conventional curing agents and curing accelerators. The obtained CFRPs showed good appearance and underwent smooth breakdown with the aqueous acid treatment in THF at room temperature for 24 h to produce strands of carbon fiber without damaging their surface conditions and tensile strength. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012     

Thiol–norbornene materials: Approaches to develop high Tg thiol–ene polymers

The ability to prepare high T_g low shrinkage thiol–ene materials is attractive for applications such as coatings and dental restoratives. However, thiol and nonacrylated vinyl materials typically consist of a flexible backbone, limiting the utility of these polymers. Hence, it is of importance to synthesize and investigate thiol and vinyl materials of varying backbone chemistry and stiffness. Here, we investigate the effect of backbone chemistry and functionality of norbornene resins on polymerization kinetics and glass transition temperature (T_g) for several thiol–norbornene materials. Results indicate that T_gs as high as 94 °C are achievable in thiol–norbornene resins of appropriately controlled chemistry. Furthermore, both the backbone chemistry and the norbornene moiety are important factors in the development of high T_g materials. In particular, as much as a 70 °C increase in T_g was observed in a norbornene–thiol specimen when compared with a sample prepared using allyl ether monomer of analogous backbone chemistry. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 5686–5696, 2007     

Resistive switching polymer materials based on poly(aryl ether)s containing triphenylamine and 1,2,4‐triazole moieties

A series of poly(aryl ether)s were successfully prepared via aromatic nucleophilic substitution reaction from various bisphenols and a novel bipolar aryl difluoride monomer containing electron‐donor triphenylamine and electron‐acceptor 1,2,4‐triazole moieties. The poly(aryl ether)s exhibited excellent solubility in organic solvents such as dimethylformamide, chloroform, and tetrahydrofuran at room temperature. The poly(aryl ether)s showed high thermal stability with T_d10 higher than 500 °C and glass transition temperatures (T_g) higher than 187 °C. The thin films of the poly(aryl ether)s indicated bistable resistive switching behavior with ON/OFF current ratios as high as 10³. The switching on and switching off bias voltages of the poly(aryl ether)s were affected by the bisphenol moiety. The good resistive switching behavior of the poly(aryl ether)s made them promising candidates for future nonvolatile memory applications. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6861–6871, 2008     

Synthesis and curing of amino‐containing benzoxazine as a novel hardener for diglycidyl ether of bisphenol‐A

Benzoxazines containing various additional functional groups have been extensively reported to improve the properties of polybenzoxazines. In this work, a novel amino‐containing benzoxazine (PDETDA‐NH₂) was conveniently synthesized from diethyltoluenediamine (DETDA), 2‐hydroxybenzaldehyde, and paraformaldehyde and was used as a hardener for diglycidyl ether of bisphenol‐A (DGEBA). The curing behaviors of PDETDA‐NH₂ and PDETDA‐NH₂/DGEBA systems were studied by DSC, FT‐IR, and ¹H NMR. When curing, PDETDA‐NH₂ was firstly polymerized to N,O‐acetal‐type polymer and then rearranged to Mannich‐type polymer at elevated temperature, while the addition reaction between amino and benzoxazine was discouraged because of the steric hindrance of alkyl substituents. During PDETDA‐NH₂/DGEBA curing, it was found that the reactions happened in the order of addition polymerization of amino and epoxide, ring‐opening polymerization of benzoxazine, etherification between phenolic hydroxyl of the polymerized benzoxazine, and epoxide. Compared with DETDA cured DGEBA, PDETDA‐NH₂ cured DGEBA showed higher modulus, higher char yield, and much lower water uptake.     

Synthesis and characterization of poly(arylene ether)s containing 6‐(4‐hydroxyphenyl)pyridazin‐3(2H)‐one or 6‐(4‐hydroxyphenyl)pyridazine moieties

A series of novel soluble pyridazinone‐ or pyridazine‐containing poly(arylene ether)s were prepared by a polycondensation reaction. The pyridazinone monomer, 6‐(4‐hydroxyphenyl)pyridazin‐3(2H)‐one ( 1 ), was synthesized from the corresponding acetophenone and glyoxylic acid in a simple one‐pot reaction. The pyridazinone monomer was successfully copolymerized with bisphenol A (BPA) or 1,2‐dihydro‐4‐(4‐hydroxyphenyl)phthalazin‐1(2H)‐one (DHPZ) and bis(4‐fluorophenyl)sulfone to form high‐molecular‐weight polymers. The copolymers had inherent viscosities of 0.5–0.9 dL/g. The glass‐transition temperatures (T_g's) of the copolymers synthesized with BPA increased with increasing content of the pyridazinone monomer. The T_g's of the copolymers synthesized from DHPZ with different pyridazinone contents were similar to those of the two homopolymers. The homopolymers showed T_g's from 202 to 291 °C by differential scanning calorimetry. The 5% weight loss temperatures in nitrogen measured by thermogravimetric analysis were in the range of 411–500 °C. 4‐(6‐Chloropyridazin‐3‐yl)phenol ( 2 ) was synthesized from 1 via a simple one‐pot reaction. 2 was copolymerized with 4,4′‐isopropylidenediphenol and bis(4‐fluorophenyl)sulfone to form high‐T_g polymers. The copolymers with less than 80 mol % pyridazinone or chloropyridazine monomers were soluble in chlorinated solvents such as chloroform. The copolymers with higher pyridazinone contents and homopolymers were not soluble in chlorinated solvents but were still soluble in dipolar aprotic solvents such as N‐methylpyrrolidinone. The soluble polymers could be cast into flexible films from solution. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3328–3335, 2006     

Novel,environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy

Tryptophan, an amino acid, has been used as a novel, environmentally friendly curing agent instead of toxic curing agents to crosslink the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The curing reaction of tryptophan/DGEBA mixtures of different ratios and the effect of the imidazole catalyst on the reaction have been evaluated. The optimum reaction ratio of DGEBA to tryptophan has been determined to be 3:1 with 1 wt % catalyst, and the curing mechanism of the novel reaction system has been studied and elucidated. In situ Fourier transform infrared spectra indicate that with the extraction of a hydrogen from NH₃⁺ in zwitterions from tryptophan, the formed nucleophilic primary amine and carboxylate anions of the tryptophan can readily participate in the ring‐opening reaction with epoxy. The secondary amine, formed from the primary amine, can further participate in the ring‐opening reaction with epoxy and form the crosslinked network. The crosslinked structure exhibits a reasonably high glass‐transition temperature and thermal stability. A catalyst‐initiated chain reaction mechanism is proposed for the curing reaction of the epoxy with zwitterion amino acid hardeners. The replacement of toxic curing agents with this novel, environmentally friendly curing agent is an important step toward a next‐generation green electronics industry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 181–190, 2007     

Synthesis of multiblock hyperbranched‐linear poly(ether sulfone) copolymers

Hyperbranched poly(ether sulfone) was prepared in the presence of an oligomeric linear poly(ether sulfone) to generate multiblock hyperbranched‐linear (LxHB) copolymers. The LxHB copolymers were prepared in a two‐step, one‐pot synthesis by first polymerizing AB monomer to generate a linear block of a desired molecular weight followed by addition of the AB₂ monomer in a large excess (19:1, AB₂:AB) to generate the hyperbranched block. NMR integration analysis indicates that AB₂:AB ratio is independent of the reaction time. Because the molecular weight still increases with reaction time, these results suggest that polymer growth continues after consumption of monomer by condensation into a multiblock architecture. The LxHB poly(ether sulfone)s have better thermal stability (10% mass loss > 343 vs. 317 °C) and lower T_g (200 vs. > 250 °C) than the hyperbranched homopolymer, higher T_g than the linear homopolymer (<154 °C), while little difference in the solubility character was observed between the two polymers. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4785–4793, 2008     

Relationships between molecular structure and thermomechanical properties of bio‐based thermosetting polymers

Molecular dynamics simulations are used to study highly cross‐linked epoxy networks comprised of furanyl epoxy monomer, 2,5‐bis[(2‐oxiranylmethoxy)methyl]‐furan (BOF), that is cross‐linked by two furanyl amine hardeners, 5,5'‐methylenedifurfurylamine (DFDA) and 5,5'‐ethylidenedifurfirylamine (CH₃‐DFDA). Important properties of these fully furan‐based systems, including room temperature density, glass transition temperature, and Young's modulus are found to agree with previous experimental results. We also compare the simulated and experimental values of four fully furan‐based thermosetting materials to those using the conventional resin diglycidyl ether of bisphenol A (DGEBA) cured with the two furanyl hardeners. Our simulation results predict a slight decrease in density and Young's modulus, but no impact on the glass transition temperature, upon adding the methyl group in DFDA. Detailed analyses of the MD trajectories reveal the underlying mechanisms responsible for the observed structure/property relations, which center on the lack of collinear covalent bonds in the BOF molecular structure. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 285–292     

Anionic bulk oligomerization of ethylene and propylene carbonate initiated by bisphenol‐A/base systems

When the bulk oligomerization of 1,3‐dioxolan‐2‐one (ethylene carbonate, EC) and 4‐methyl‐1,3‐dioxolan‐2‐one (propylene carbonate, PC) with the 2,2‐bis(4‐hydroxyphenyl)propane (bisphenol‐A, BPA)/base system (bases such as KHCO₃, K₂CO₃, KOH, Li₂CO₃, and t‐BuOK) was investigated at elevated temperature, significant differences were observed. Oligomerization of EC initiated by BPA/base readily takes place, but the oligomerization of PC is inhibited. The very first propylene carbonate/propylene oxide unit readily forms a phenolic ether bond with the functional groups of BPA phenolate, but the addition of the second monomer unit is rather slow. The oligomerization of EC yields symmetrical oligo(ethylene oxide) side chains. According to IR studies the oligomeric chains formed from PC with BPA contain not only ether but also carbonate bonds. The in situ step oligomerization of the BPA dipropoxylate was also identified by SEC, and a possible reaction mechanism is proposed. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 545–550, 1999     

Synthesis,characterization, and properties of polyurethanes containing 1,4:3,6‐dianhydro‐D‐sorbitol

Two‐ and three‐component polyurethanes containing 1,4:3,6‐dianhydro‐D ‐sorbitol (isosorbide) derived from glucose were synthesized using n‐BuSn(?O)OH·H₂O as a catalyst, and the thermal properties (T_g, T_d) of the polymers were investigated by differential scanning calorimetry and thermogravimetric analysis. We carried out molds for polyurethanes, the molds of polyurethanes were obtained. The dynamic mechanical analyzes showed that the storage modulus values of the three‐component polymers were constant to a higher temperature than those of the two‐component polymers. The storage moduli (E′), loss moduli (E″), and values of tan δ for the polymers were obtained. The rigidity of three‐component polymers was increased by the introduction of bisphenol A and diphenylmethane group to two‐component polymer. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 6025–6031, 2009     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005