The effect of the curing agent content on the curing and liquid‐crystalline phase of liquid‐crystalline epoxy resin

The effect of the curing agent content on the curing behavior and liquid‐crystalline (LC) phase of the liquid‐crystalline epoxy (LCE) resin 4,4′‐di(2,3‐epoxypropyloxy)phenyl benzoate was studied. Diaminodiphenylester (DDE) was used as a curing agent. The curing behavior was observed via differential scanning calorimetry, and the LC phase was investigated with a polarized optical microscopy. The LC phase in the LCE/DDE mixture with a high DDE content was developed during curing. The onset time was inversely proportional to the DDE content. The mesophase stability of LCE/DDE was enhanced by the addition of large amounts of DDE. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 374–379, 2001     

Liquid crystalline epoxies bearing biphenyl ether and aromatic ester mesogenic units: Synthesis and thermal properties

Two liquid crystalline epoxies containing biphenyl ether and aromatic ester mesogenic units, oxybis(4,1-phenylene)bis(4-(oxiran-2-ylmethoxy)benzoate)(LCE1) and oxybis(4,1-phenylene) bis(4-(4-(oxiran-2-yl)butoxy)benzoate)(LCE2), were synthesized and characterized. Subsequently, the epoxy monomers were cured with diaminodiphenylsulfone (DDS). From DSC, XRD and POM results, monomers did not show liquid crystalline phase while the cured samples exhibited nematic phase. The cured samples showed good mechanical properties with strength of 99.1MPa and excellent thermal stabilities with high glass transition temperature up to 168.0?°C, 5% weight loss temperature at 343?°C and high char yield of 24.5% at 800?°C. The relationship between thermal conductivity and network structure was discussed in this work. Due to the introduction of mesogenic units into epoxy networks, the cured resins showed high thermal conductivity as high as 0.292?W/(m*K), more than 1.5times higher than conventional epoxy resins. By introducing alumina (Al₂O₃) into LCE1/DDS cured system, composites of LCE1/DDS/Al₂O₃ with the highest thermal conductivity of 1.61?W/(m*K) was obtained with the content of 80?wt% while that of diglycidyl ether of bisphenol A (DGEBA, E51) epoxy resin/DDS/Al₂O₃ was 1.10?W/(m*K). The as-prepared epoxy resins showed high glass transition temperature and excellent thermal stabilities, indicating the potential of application in microelectronics.     

Effect of substituents on the curing of liquid crystalline epoxy resin

The synthesis of an aromatic ester based liquid crystalline epoxy resin (LCE) with a substituent in the mesogenic central group is described. Chlorine and methyl groups were introduced as substituents. The curing behaviors of three epoxy resins were investigated using diaminodiphenyl ester as the curing agent. The curing rate and heat of curing of LCE were measured with dynamic and isothermal DSC. The chlorine substituent accelerated the curing of LCE, while the methyl substituent decelerated the curing of LCE. The heat of curing of substituted LCE was diminished compared to LCE with no substituent. Glass transition temperature and elastic modulus of LCE decreased with increasing the size of the substituent. Three liquid crystalline epoxy resins based on aromatic ester mesogenic groups formed a liquid crystalline phase after curing, and the liquid crystalline phase was stable up to the decomposition temperature. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 911–917, 1998     

Highly thermal conductive benzoxazine‐epoxy interpenetrating polymer networks containing liquid crystalline structures

A diamine‐based benzoxazine monomer (Bz) and a liquid crystalline epoxy monomer (LCE) are synthesized, respectively. Subsequently, a benzoxazine‐epoxy interpenetrating polymer network (PBEI) containing liquid crystalline structures is obtained by sequential curing of the LCE and the Bz in the presence of imidazole. The results show that the preferential curing of LCE plays a key role in the formation mechanism of liquid crystalline phase. Due to the introduction of liquid crystalline structures, the thermal conductivity of PBEI increases with increasing content of LCE. When the content of LCE is 80 wt %, the thermal conductivity reaches 0.32 W m^?1 K^?1. Additionally, the heat‐resistance of PBEI is superior to liquid crystalline epoxy resin. Among them, PBEI55 containing equal weight of Bz and LCE has better comprehensive performance. Its thermal conductivity, glass transition temperature, and the 5 % weight loss temperature are 0.28 W m^?1 K^?1, 160 °C, and 339 °C, respectively. By introducing boron nitride (BN) fillers into PBEI55, a composite of PBEI/BN with the highest thermal conductivity of 3.00 W m^?1 K^?1 is obtained. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55 , 1813–1821     

Dipolar motions and phase transitions in a side‐chain polysiloxane liquid crystal. A study by thermally stimulated depolarization currents

The relaxation mechanisms present in a side‐chain liquid crystalline polymer have been studied by Thermally Stimulated Depolarization Currents (t.s.d.c.), in a wide temperature range covering the glassy state, the glass transition region, and the liquid crystalline phase. The thermal sampling procedure was used to decompose the complex relaxations into its narrowly distributed components. Three relaxation mechanisms were observed in this polymer: a relaxation below the glass transition temperature that is broad and extends from −150°C up to −110°C, the glass transition relaxation whose maximum intensity appears at ∼20°C, and a relaxation above the glass transition temperature, in the liquid crystalline phase. The attribution of these relaxations at the molecular level is discussed. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 227–235, 1999     

Synthesis and characterization of liquid‐crystalline epoxy and its blend with conventional epoxy

Terephthaloyl chloride was reacted with 4‐hydroxy benzoic acid to get terephthaloylbis(4‐oxybenzoic) acid, which was characterized and further reacted with epoxy resin [diglycidyl ether of bisphenol A (DGEBA)] to get a liquid‐crystalline epoxy resin (LCEP). This LCEP was characterized by Fourier transform infrared spectrometry, ¹H and ¹³C NMR spectroscopy, differential scanning calorimetry (DSC), and polarized optical microscopy (POM). LCEP was then blended in various compositions with DGEBA and cured with a room temperature curing hardener. The cured blends were characterized by DSC and dynamic mechanical analysis (DMA) for their thermal and viscoelastic properties. The cured blends exhibited higher storage moduli and lower glass‐transition temperatures (tan δ_max, from DMA) as compared with that of the pure DGEBA network. The formation of a smectic liquid‐crystalline phase was observed by POM during the curing of LCEP and DGEBA/LCEP blends. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3375–3383, 2003     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Polymerization and viscoelastic behavior of networks from a dual‐curing,liquid crystalline monomer

The network formation and viscoelastic behavior of a liquid crystalline monomer, whose structure includes both acrylate and acetylene reactive groups, have been studied. By combining both photo and thermal polymerization, the networks can be formed in two separate steps, with the initial photopolymerization dominated by acrylate crosslinking and subsequent thermal polymerization dominated by acetylene crosslinking. In addition, the monomer exhibits a liquid crystalline phase. Photopolymerization while in the liquid crystal phase locks in the molecular ordering. Dynamic mechanical analysis shows that networks formed from the liquid crystalline phase have lower crosslink densities and narrower distributions of molecular weights between crosslinks when compared to networks formed from the isotropic phase (and at higher polymerization temperatures). After thermal postcure at 250°C, the networks formed from the isotropic monomer have a 23% higher dynamic mechanical storage modulus (in the glassy state) than the networks formed from the liquid crystalline monomer. The thermally postcured networks have unusually high glass‐transition temperatures, which exceed 300°C. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1183–1190, 1999     

Evolution of structure and properties of a liquid crystalline epoxy during curing

The evolution of structure, and thermal and dynamic mechanical properties of a liquid crystalline epoxy during curing has been studied with differential scanning calorimetry (DSC), polarized optical microscopy, x-ray scattering, and dynamic mechanical analysis. The liquid crystalline epoxy was the diglycidyl ether of 4,4′-dihydroxy-α-methylstilbene (DGEDHMS). Two curing agents were used in this study: a di-functional amine, the aniline adduct of DGEDHMS, and a tetra-functional sulfonamido amine, sulfanilamide. The effects of curing agent, cure time, and cure temperature have been investigated. Isothermal curing of the liquid crystalline epoxy with the di-functional amine and the tetra-functional sulfonamido amine causes an increase in the mesophase stability of the liquid crystalline epoxy resin. The curing also leads to various liquid crystalline textures, depending on the curing agent and cure temperature. These textures coarsen during the isothermal curing. Moreover, curing with both curing agents results in a layered structure with mesogenic units aligned perpendicular to the layer surfaces. The layer thickness decreases with cure temperature for the systems cured with the tetra-functional curing agent. The glass transition temperature of the cured networks rises with increasing cure temperature due to the increased crosslink density. The shear modulus of the cured networks shows a strong temperature dependence. However, it does not change appreciably with cure temperature. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35 : 2363–2378, 1997     

Effects of temperature on cure kinetics and mechanical properties of vinyl–ester resins

The relationships among cure temperature, chemical kinetics, microstructure, and mechanical performance have been investigated for vinyl–ester resins. Fourier transform infrared spectroscopy was used to follow the reactions of vinyl–ester and styrene during isothermal curing of Dow Derakane 411‐C‐50 at 30 and 90°C. Reactivity ratios of vinyl–ester and styrene vinyl groups were evaluated using the copolymer composition equation. The results indicate that the ratio of vinyl–ester to styrene double bonds incorporated into the network is greater for 30 than for 90°C cure. Mechanical properties were obtained for systems subjected to isothermal cures at 30 and 90°C and postcured above ultimate T_g. The results show that the initial cure temperature significantly affects the mechanical behavior of vinyl–ester resin systems. In particular, values of strength and fracture toughness for postcured samples initially cured isothermally at 30°C are significantly higher than those obtained for samples cured isothermally at 90°C. Examination of fracture surfaces using atomic force microscopy revealed the existence of a nodular microstructure possessing characteristic nodule dimensions that are affected by the temperature of cure. Such features suggest the existence of phase separation during cure. A binary interaction model in conjunction with chemical kinetic data and estimated solubility parameters was used to evaluate enthalpic interactions between the growing polymer network and monomers of the vinyl–ester system. The results indicate that the interaction energy becomes increasingly endothermic as cure progresses and that this energy is affected by the temperature of cure through differences in copolymerization behavior. Hence, in addition to entropic factors, the changes in enthalpic contribution to the Gibbs free energy suggest that the probability of phase separation increases with extent of cure and that its onset is potentially affected by cure temperature. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 725–744, 1999     

Liquid crystalline epoxy resin with improved thermal conductivity by intermolecular dipole–dipole interactions

To address tremendous needs for developing efficiently heat dissipating materials with lightweights, a series of liquid crystalline epoxy resins (LCEs) are designed and synthesized as thermally conductive matrix. All prepared LCEs possess epoxies at the molecular side positions and cyanobiphenyl mesogenic end groups. Based on several experimental results such as differential scanning calorimetry, polarized optical microscopy, and X‐ray diffraction, it is found that the LCEs exhibited liquid crystalline mesophases. When LCE is cured with a diamine crosslinker, the cured LCE maintains the oriented LC domain formed in the uncured state, ascribing to a presence of dipole–diploe and π–π interactions between cyanobiphenyl mesogenic end groups. Due to the anisotropic molecular orientation, the cured LCE exhibits a high thermal conductivity of 0.46 W m^?1 K^?1, which is higher than those of commercially available crystalline or amorphous epoxy resins. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2019 , 57, 708–715     

Curing kinetics and thermal stability of diglycidyl ether of bisphenol

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of varying molar ratios of aromatic imide-amines and 4,4′-diaminodiphenylsulfone (DDS) were investigated by the dynamic differential scanning calorimetry. The imide-amines were prepared by reacting 1 mole of benzophenone 3,3′,4,4′-tetracarboxylic acid dianhydride (B) with 2.5 moles of 4,4′-diaminodiphenyl ether (E)/ or 4,4′-diaminodiphenyl methane (M)/ or 4,4′-diaminodiphenylsulfone (S) and designated as BE/ or BM/ or BS. The mixture of imide-amines and DDS at ratio of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25 and 1:0 were used to investigate the curing behaviour of DGEBA. The multiple heating rate method (5, 10, 15 and 20°C min⁻¹) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide-amines as well as on the ratio of imide-amine: DDS used. A broad exotherm was observed in the temperature range of 180–230°C on curing with mixture of imide-amines and DDS. Curing of DGEBA with mixture of imide-amines and/or DDS resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction as determined in accordance to the Ozawa’s method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was highest in case of resins cured using mixture of DDS: BS (0.25:0.75; EBS-3), DDS: BM (0.5: 0.5; EBM-2) and DDS: BE (0.5: 0.5; EBE-2).     

Relationship between fracture toughness and domain size of liquid‐crystalline epoxy resins having polydomain structure

A liquid‐crystalline (LC) epoxy resin was cured at different temperatures and some types of curing systems having different phase structures (isotropic or polydomain, which have a microscopically ordered LC network structure) were obtained. The diameters of each domain in the polydomain system changed from the small to the larger size. The diameters of the LC domains were evaluated using a polarized optical microscope and the polarized microscopy FTIR mapping method. These systems were used to investigate the relationship between the network arrangement and mechanical properties. The fracture toughness of the cured systems was related to the enlargement of the ordered area in the network structures. With the toughness improvement, the meandering cracks were observed at the fracture surfaces. © 2008 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 156–165, 2009     

Shape recovery liquid crystal elastomer synthesized by melt‐polycondensation

A novel liquid crystal elastomer (LCE) synthesized by melt polymerization, which exhibits the capacity of shape memory, is reported here for the first time. The method of synthesize the shape memory LCE has been explored. A facile two‐step method to synthesize these anisotropic materials to realize reversible shape change behavior is reported. The first reaction is the addition of nematic liquid crystal molecules to form a kind of liquid crystal polymer. Subsequently, the polymer is crosslinked to trap the order of the liquid crystal into a crosslinked LCE. The LCE exhibits liquid crystalline behavior which has shape memory with excellent fixity and recovery. Its shape memory and actuating properties also have been studied. When reheating the LCE to 165 °C, the shape will recover. The main chains and crosslinked bonds of the LCE contain ester groups, which are sensitive to alkaline and acidic condition. It turns out that the LCE is intact under acidic condition, but it can be degraded under alkaline condition. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2017 , 55, 389–394     

TSC study and electro‐optical properties of epoxy/acrylic polymer‐dispersed liquid‐crystal film in DICY thermal cure

We report on the structures and electro‐optical properties of epoxy/acrylic polymer‐dispersed liquid‐crystal (PDLC) films. A thermal stimulated current (TSC) analysis was used to investigate the physical structures of PDLC. In the TSC spectrum of PDLC, three relaxation peaks were observed: the glass transition of the liquid crystal, the glass transition of the polymer matrix, and the ρ transition. The ρ transition represents the discharge behavior of space charges, and its intensity increased as the curing time and content of the curing agent dicyandiamide (DICY) increased. The pre‐UV‐cured films with different DICY contents were thermally cured at 130 °C for various periods. The electro‐optical properties of PDLC, such as the contrast ratio and switching voltage, increased as the curing time of DICY, the content of DICY, or both increased. As the ambient temperature increased from 10 to 40 °C, the contrast ratio and switching voltage of PDLC gradually decreased. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 507–514, 2001     

一种液晶环氧增韧环氧树脂的研究

环氧树脂具有优异的机械性能 ,耐高温以及良好的加工工艺性 .被广泛用于机械、航天、船舶等领域 .由于环氧树脂固化后断裂延伸率小 ,脆性大 ,使其应用受到了一定的限制 .为此 ,国内外学者对环氧树脂进行了大量的改性研究工作 .用含有“柔性链段”的固化剂固化环氧 ,在交联网络中引入柔性链段[1] ;在环氧基体中加入橡胶弹性体[2 ] 、热塑性树脂[3 ,4] 、液晶聚合物[5,6] 等分散相或用热固性树脂连续贯穿于环氧树脂网络中形成互穿、半互穿网络结构[7] ,以改善环氧树脂的韧性 .本文采用液晶环氧化合物原位复合增韧环氧树脂 ,考察了液晶环氧对环…     

High-temperature stability of a novel phenylethynyl liquid-crystalline thermoset

We report the synthesis of a new high-temperature liquid-crystalline thermoset based on the phenylethynyl functional group. The monomer was a nematic thermotropic liquid crystal with a melting temperature of 268 °C. The extrapolated onset of the cure exotherm occurred at 313 °C. The cured thermoset retained the nematic liquid-crystalline order of the parent monomer. The monomer and crosslinked resin were characterized by differential scanning calorimetry, optical microscopy, and thermogravimetric analysis. The thermal stability of the crosslinked resin was determined in both air and nitrogen atmospheres at various heating rates. The onset of weight loss in air and nitrogen atmospheres was determined to be 397 and 422 °C, respectively, for a heating rate of 10 °C/min. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 4184–4190, 1999     

Near‐surface structure formation in chemically imidized polyimide films

Free‐standing polyimide films are manufactured by the chemical imidization of linear, soluble polymeric precursors. The reactive solution is coated onto a heated substrate, peeled off after partial imidization, and then dried and cured as a free‐standing film. Adhesive bonds to the cast side of the final film more strongly than to the air side. Near‐surface elastic moduli of film samples were measured with a nanoindentation setup. Samples were annealed at different final temperatures. The air side of the samples annealed at 400 °C had a higher modulus of 1.4 GPa than the 0.8 GPa of the casting side. This difference diminished as the annealing temperature was raised to 460 °C. Polyamic acid and polyimide exhibit phase transitions from disordered, isotropic solutions to ordered, liquid‐crystalline states. A theoretical model of drying and curing demonstrates formation of a gradient in conversion and ordering: the air side vitrifies at a lower solvent content, lower conversion, and higher ordering; the casting side, at a greater solvent content, higher conversion, and less ordering. Subsequent high‐temperature drying and curing of the free‐standing films removes solvent, completes reaction, and nematically orders both sides. However, longer times and higher temperature annealing are needed to bring the two sides to their common equilibrium state of nematic order. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 1824–1838, 2001     

Thermomechanical properties of liquid‐crystalline epoxy networks arranged by a magnetic field

During the curing process of a liquid‐crystalline epoxy resin, a relatively strong magnetic field was applied, and the thermomechanical properties of the cured resin were investigated. The network orientation and mechanical properties of the cured system were evaluated with wide‐angle X‐ray diffraction, dynamic mechanical analysis, and fracture toughness testing. The cured system was found to have an anisotropic network structure, which arranged along the applied field, and the anisotropy was reflected in the thermomechanical properties. In particular, the fracture toughness of the system dramatically increased when the network chains were arranged across the direction of the crack propagation. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 758–765, 2004     

Effects of liquid crystalline structure formation on the curing kinetics of an epoxy resin

The curing kinetics of a system containing 4,4′-diglycidyloxy-α-methylstilbene (DOMS) and different functionality amines, N-ethylaniline (NEA), aniline, benzenesulfonamide (BSA), and sulfanilamide (SAA), have been studied by differential scanning calorimetry (DSC) under isothermal conditions. The phase transformations during curing of the systems have been monitored by a crosspolarized optical microscope equipped with a hot-stage and photo detector. It has been found that the growth of a nematic liquid crystal structure does not cause a discrepancy from the autocatalytic model for the reactions between aniline and epoxy. There is no liquid crystalline structure formed for the systems containing NEA or BSA, which follow the autocatalytic kinetic models within the temperature range of 120–150°C. For the curing reactions between DOMS and SAA, there is a big deviation from the autocatalytic model when the liquid crystals transfer from a nematic structure to a smectic structure. Unlike the usual decrease of reaction rate resulting from diffusion in a heterogeneous reaction, the reaction rate is enhanced. A modified kinetic model has been constructed for this reaction system by introducing a pseudoconcentration term caused from the liquid crystalline structure formation. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 1105–1124, 1997