Synthesis of a novel epoxy resin containing diphenylether moiety and thermal properties of its cured polymer with phenol novolac

A new type of epoxy resin containing 4,4′-diphenylether moiety in the backbone (2) was synthesized, and was confirmed by gel permeation chromatography, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. In addition, in order to evaluate the influence of 4,4′-diphenylether moiety in the structure, epoxy resins having 4,4′-biphenylene moiety (4) and having 1,4-phenylene moiety (6) in place of 4,4′-diphenylether moiety were synthesized. The cured polymer obtained through the curing reaction between the new diphenylether-containing epoxy resin and phenol novolac was used for making a comparison of its thermal and physical properties with those obtained from 4, 6, and bisphenol-A (4,4′-isopropylidenediphenol) type epoxy resin. The cured polymer obtained from 2 showed markedly higher anaerobic char yield at 700°C of 44.0 wt %, higher fracture toughness, and higher mechanical strength and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3687–3693, 1999     

Flame‐retardant epoxy resin compounds containing novolac derivatives with aromatic compounds

New flame‐retardant epoxy resin compounds containing novolac derivatives with specific aromatic compounds have been developed. After crosslinking reactions between epoxy resin and hardener, the epoxy resin compounds formed highly flame‐retardant network structures that were obtained by including biphenylene and phenylene moieties in the main chains of novolac‐type epoxy resin and phenol novolac resin hardener. The high flame retardancy is due mainly to the stable foam layers that form during combustion because of the low elasticity at high temperatures and the high pyrolysis resistance of the compounds. Furthermore, the addition of excess phenol derivative hardener not only facilitates the formation of the foam layers by decreasing the crosslink densities but also reduces the amount of flammable substances generated from the epoxy resin compounds during combustion. The use of a multifunctional epoxy resin containing four glycidyloxy groups in the compounds improved characteristics such as heat resistance and strength at high temperatures, while maintaining excellent flame retardancy. Copyright © 2001 John Wiley & Sons, Ltd.     

Cure kinetics of biphenyl epoxy‐phenol novolac resin system using triphenylphosphine as catalyst

The effects of the concentration of triphenylphosphine as a catalyst on the cure reaction of the biphenyl epoxy/phenol novolac resin system were studied. The kinetic study was carried out by means of the analysis of isothermal experiments using a differential scanning calorimeter. All kinetic parameters including the reaction orders, activation energy and kinetic rate constants were evaluated. To describe the cure reaction with the catalyst concentration, the normalized kinetic model was developed. The suggested kinetic model with a diffusion term was successfully able to describe and predict the cure reaction of epoxy resin compositions as functions of the catalyst content and temperature. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 713–720, 1999     

Synthesis and curing of liquid crystalline epoxy resin based on naphthalene mesogen

Aromatic liquid crystalline epoxy resin (LCE) based on naphthalene mesogen was synthesized and cured with aromatic diamines to prepare heat‐resistant LCE networks. Diaminodiphenylester (DDE) and diaminodiphenylsulfone (DDS) were used as curing agents. The curing reaction and liquid crystalline phase of LCE were monitored, and mechanical and thermal properties of cured LCE network were also investigated. Curing and postcuring peaks were observed in dynamic DSC thermogram. LCE network cured with DDE displayed liquid crystalline phase in the curing temperature range between 183 and 260°C, while that cured with DDS formed one between 182 and 230°C. Glass transition temperature of cured LCE network was above 240°C, and crosslinked network was thermally stable up to 330°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 419–425, 1999     

Synthesis of novel boron‐containing epoxy–novolac resins and properties of cured products

Epoxy–novolac resins were synthesized by modifying a commercial novolac resin with epichlorohydrin. These epoxy–novolac resins were characterized and further modified with different contents of bis(benzo‐1,3,2‐dioxa‐borolanyl)oxide or bis(4,4,5,5‐tetramethyl‐1,3,2‐dioxa‐borolanyl)oxide. The boron‐containing epoxy–novolac resins were autocatalytically crosslinked or crosslinked with BF₃MEA and their thermal stability and flame retardancy were determined by thermogravimetric analysis and limiting oxygen index (LOI) values. These LOI values for the bis(benzo‐1,3,2‐dioxa‐borolanyl)oxide derivatives were higher than the boron‐free novolac resins, which shows the benefit of the presence of boron. To test the role of boron in the enhancement of flammability, scanning electronic microscopy and energy‐dispersive X‐ray spectroscopy images were made. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6332–6344, 2006     

胺固化环氧酚醛树脂对Hg~(2+)的吸附性能

螯合树脂能与金属离子形成稳定的配合物,在无机、冶金、分析药物、催化、海洋化学、放射化学、环境保护各领域都有非常重要的应用[1-3]。我们曾以酚醛树脂为大分子骨架与多胺反应制备了一系列螯合树脂并对其结构及对多种金属离子的吸附性能进行了探讨[4,5]。本文则以线型环氧酚醛树脂为大分子骨架、多乙烯多胺为固化剂,制备了五种不同氮含量的氨基环氧酚醛螯合树脂,并考察其对金属离子Ｈｇ2+的吸附性能。1　实验部分1.1　仪器与试剂ＮｉｃｏｌｅｔＭＡＧＮＡ ＩＲ550(ＳｅｒｉｅｓＩＩ)红外分光光度计,ＳＨＡ-Ｃ水浴恒温振荡器,ＰＥ2000…     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Curing reaction of o-cresol novolac epoxy resin according to hardener change

The investigations of cure kinetics and glass transition temperature (T_g) versus reaction conversion (α) of o-cresol novolac epoxy resin with the change of hardener were performed. All kinetic parameters of the curing reaction such as the reaction rate order, activation energy, and frequency factor were calculated. The curing mechanisms were classified into two types. One was an autocatalytic mechanism and the other was a nth order kinetic mechanism. The constants related to the chain mobility of polymer segments were obtained by using the DiBenedetto equation. We have tried to correlate the relationships between curing mechanism and molecular structures of hardeners from these results. © 1993 John Wiley & Sons, Inc.     

环氧树脂在热塑性树脂改性中的应用

本文综述了国内外有关利用环氧树脂改性热塑性树脂共混体系研究的最新进展。着重阐述了环氧树脂在热塑性树脂之间的增容作用,如尼龙6(PA6)合金体系,改性聚苯乙烯塑料(ABS)合金体系,以及聚对苯二甲酸丙二醇酯(PTT)合金体系等。同时,介绍了利用环氧树脂的反应活性提高无机填料在聚合物中分散性研究的情况,如二氧化硅纳米粒子在聚醚砜(PES)中,以及滑石粉在聚丙烯(PP)中分散性的提高。最后,简介了环氧树脂改性热塑性树脂提高热塑性树脂物理机械性能方面的研究方向和成果并展望了环氧树脂在热塑性树脂改性研究中的前景。     

Crystallization kinetics of crosslinkable polymer complexes of novolac resin and poly(ethylene oxide)

Results of a study on the isothermal crystallization and thermal behavior of both uncured and hexamine-cured novolac/poly(ethylene oxide) (PEO) complexes are reported. The crystallization behavior of PEO in complexes is strongly influenced by factors such as composition, crystallization temperature, complexation, and crosslinking. The time dependence of the relative degree of crystallinity at high conversion deviated from the Avrami equation. The cured complexes exhibited an obvious two-stage crystallization (primary crystallization and crystal perfection), and this was more evident at higher crystallization temperature and high PEO-content. The addition of a noncrystallizable component into PEO caused a depression of both the overall crystallization rate and the melting temperature. In general, complexation and curing resulted in an increase in the overall crystallization rate. Complexation and curing are beneficial to the nucleation of PEO. Additionally, curing led to changes of the nucleation mechanism. Experimental data on the overall kinetic rate constant K_n were analyzed by means of the nucleation and crystal growth theory. For uncured complexes, the surface free energy of folding, σ_e, increased with increasing novolac content, whereas for cured complexes, σ_e displayed a maximum with the variation of composition. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2726–2736, 1999     

Enthalpy relaxation in a partially cured epoxy resin

The enthalpy relaxation of a partially cured (70%) epoxy resin, derived from diglycidyl ether of bisphenol-A cured by methyl-tetrahydrophthalic anhydride with accelerator, has been investigated. The key parameters of the structural relaxation (the apparent activation energy Δh*, the nonlinearity parameter x, and the nonexponentiality parameter β) are compared with those of the fully cured epoxy resin. The aging rates, characterized by the dependences of the enthalpy loss and peak temperature on log(annealing time), are greater in the partially cured epoxy than they are in the fully cured resin at an equivalent aging temperature (T_a = T_g − 20°C). There is a significant reduction in Δh*, from 1100 kJ mol⁻¹ for the fully cured system to 615 kJ mol⁻¹, as the degree of cure is reduced. The parameter x determined by the peak-shift method appears essentially independent of the degree of cure (x = 0.41 ± 0.03 for the partially cured resin compared with 0.42 ± 0.03 obtained previously for the fully cured resin), and does not follow the usually observed correlation of increasing x as Δh* decreases. This invariability of the parameter x seems to indicate that it is determined essentially by the local chemical structure of the backbone chain, and rather little by the supramolecular structure. On the other hand, the estimated nonexponentiality parameter β lies between 0.3 and 0.456, which is significantly lower than in the fully cured epoxy (β ≅ 0.5), indicative of a broadening of the distribution of relaxation times as the degree of cross-linking is reduced. Like the parameter x, this also does not follow the usual correlation with Δh*. These results are discussed in the framework of strong and fragile behavior of glass-forming systems, but it is difficult to reconcile these results in any simple way with the concept of strength and fragility. © 1996 John Wiley & Sons, Inc.     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Synthesis and characterization of a novel cycloaliphatic epoxy resin starting from dicyclopentadiene

A novel tri-functional cycloaliphatic epoxy resin was synthesized starting from dicyclopentadiene. The chemical structures of the resultant epoxy resin and its precursor were characterized with FTIR spectroscopy, EEW, ¹H NMR and Mass spectrographic analyses. The thermal and mechanical properties of the resulting polymer were evaluated with differential scanning calorimeter (DSC), thermo-gravimetric and thermal mechanical analysis. Compared to that of the common cycloaliphatic epoxy resin ERL-4221, the cured polymer of the novel epoxy resin exhibited lower thermal degradation temperature with much higher char yield and similar thermal expansion coefficient. These excellent overall performances make it a promising packaging material.     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Curing reaction characteristics and phase behaviors of biphenol type epoxy resins with phenol novolac resins

Diglycidyl ether of 4,4′-dihydroxybiphenol (BPDGE) is a liquid crystalline epoxy. The biphenyl epoxy (diglycidyl ether of 3,3′,5,5′-tetramethyl-4,4′-biphenyl, TMBPDGE) has found great applications in plastic encapsulated semiconductor packaging. Phenol novolac (PN) was used as curing agent. The reaction kinetics of BPDGE/PN and TMBPDGE/PN systems in the presence of triphenylphosphine (TPP) were characterized by an isoconversional method under dynamic conditions using differential scanning calorimetry (DSC) measurements. The results showed that the curing of epoxy resins involves different reaction stages and the values of activation energy are dependent on the degree of conversion. The effects of curing temperature on their phase structure have been investigated with polarized optical microscopy and Wide-angle X-ray diffraction. With proper curing process, BPDGE showed a nematic phase when cured with PN.     

A flame‐retardant phosphate and cyclotriphosphazene‐containing epoxy resin: Synthesis and properties

A novel flame‐retardant epoxy resin, (4‐diethoxyphosphoryloxyphenoxy)(4‐glycidoxyphenoxy)cyclotriphosphazene (PPCTP), was prepared by the reaction of epichlorohydrin with (4‐diethoxyphosphoryloxyphenoxy)(4‐hydroxyphenoxy)cyclotriphosphazene and was characterized by Fourier transform infrared, ³¹P NMR, and ¹H NMR analyses. The epoxy resin was further cured with diamine curing agents, 4,4′‐diaminodiphenylmethane (DDM), 4,4′‐diaminodiphenylsulfone (DDS), dicyanodiamide (DICY), and 3,4′‐oxydianiline (ODA), to obtain the corresponding epoxy polymers. The curing reactions of the PPCTP resin with the diamines were studied by differential scanning calorimetry. The reactivities of the four curing agents toward PPCTP were in the following order: DDM > ODA > DICY > DDS. In addition, the thermal properties of the cured epoxy polymers were studied by thermogravimetric analysis, and the flame retardancies were estimated by measurement of the limiting oxygen index (LOI). Compared to a corresponding Epon 828‐based epoxy polymer, the PPCTP‐based epoxy polymers showed lower weight‐loss temperatures, higher char yields, and higher LOI values, indicating that the epoxy resin prepared could be useful as a flame retardant. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 972–981, 2000     

Curing characteristics of o-cresol novolac epoxy resin modified by bismaleimide

Curing characteristics of o-cresol novolac epoxy resin modified by 4,4-diaminodiphenylmethane bismaleimide (DDM-BMI) using FTIR were investigated and the glass transition temperature was measured. With the addition of DDM as hardener, the relative curing reaction conversion of DDM-BMI increased with equivalent weight ratio [R₁ = (equiv wt summation of epoxy and DDM-BMI)/equiv wt of DDM] and weight ratio of epoxy and DDM-BMI (R₂ = wt of epoxy resin/wt of DDM-BMI). Using phenol novolac resin (PN) as hardener, the curing reaction conversion of DDM-BMI was hardly changed, but the variation of that in the epoxy resin was observed with R₂ change. © 1996 John Wiley & Sons, Inc.     

水性环氧树脂的研制及其固化性能研究

采用端甲氧基聚乙二醇、马来酸酐、E-44环氧树脂合成了反应型环氧树脂乳化剂MeO-PEG-Ma-E-44,以相反转乳化技术制备E-44水性环氧树脂,研究了工艺条件对其性能的影响。结果表明:酯化率达98.5%的MeO-PEG-Ma-E-44,用量为E-44的ω=16.5%-20%得到的水性环氧树脂乳液最稳定。DSC和TG分析结果表明:乳化前后的E-44环氧树脂都能室温条件2h内很好的固化,固化后热性能基本不变,分解温度约在380℃,热失重率89%,其玻璃转变温度有所降低,韧性有所提高,其它性能基本不受影响。     

Properties of methyltetrahydrophthalic anhydride‐cured epoxy resin modified with MITU

Methylimidazole‐terminated chain‐extended urea (MITU) containing polypropylene oxide spacer was synthesized and employed to modify epoxies composed of a diglycidyl ether of bisphenol‐A (E‐51) and methyltetrahydrophthalic anhydride (MTHPA). The curing behavior, viscoelastic property, impact response, and fracture surface morphology of the curing systems were systematically investigated. Differential scanning calorimeter (DSC) analysis reveals that the curing reactivity of the epoxy system is greatly enhanced with the addition of MITU. From the dynamic mechanical analysis, besides the low‐temperature β relaxation, shoulder at higher temperature side appears for the MITU‐modified systems. Meanwhile, the addition of MITU leads to the increase of loss factor (tan δ) over the temperature range of 0–75°C. Impact tests show that the modifier can be effective in toughening the epoxy resin at relatively low loading, and the scanning electron microscope (SEM) images of the fracture surface for the modified systems display signs of ductility. Copyright © 2008 John Wiley & Sons, Ltd.     

Fabrication of high thermal stable cured novolac/Cloisite 30B nanocomposites by chemical modification of resin structure

Cloisite 30B as a modified kind of nanoclay was utilized for the formation of 3D network based on novolac resin with high thermal stable properties. Two types of phenolic resins including neat novolac (NR) and modified novolac resin were used to create a compatible matrix with nanoclay. For this purpose, NR modified with (3‐chloropropyl)triethoxysilane (CPTES) to form SiNR. For improvement of thermal behaviors, Cloisite 30B was dispersed in matrix via ultrasonic waves and cured with hexamethylenetetramine (HMTA) to form 3D network. X‐ray diffraction (XRD) analysis was used to measure the d‐spacing in intercalated systems and results indicated the optimum amount of clay for appropriate thermal properties. Investigation of the thermal properties of the samples by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) showed that the presence of Cloisite 30B in matrix resulted in much higher thermal stability and char yield with respect to modification of novolac resin originated from formation of 3D Si–O–Si network. Also, cured modified resin and its nanocomposites showed much higher thermal stability than cured NR and its nanocomposites. Such nanocomposite materials with high thermal stability have potential applications in advanced fields such electronic, industrial molds, coatings, adhesives, and aerospace composites.