Thermal stability and toughening of epoxy resin with polysulfone resin

The cure behavior, thermal stability, and mechanical properties of diglycidylether of bisphenol A (DGEBA)/polysulfone (PSF) blends initiated by 1 wt % N‐benzylpyrazinium hexafluoroantimonate as a cationic latent catalyst were investigated. The DGEBA/PSF content was varied within 100/0–100/40 wt %. Latent properties were studied through the measurement of the conversion as a function of the curing temperature, and the cure activation energy (E_a) was studied by the Kissinger method with a dynamic differential scanning calorimetry analysis. The thermal stabilities, largely based on the integral procedural decomposition temperature (IPDT) and decomposed activation energy (E_t), were investigated by the measurement of thermogravimetric analysis. For the mechanical properties of the casting specimens, the critical stress intensity factor (K_IC) test was performed, and their fractured surfaces were examined with scanning electron microscopy. E_a, IPDT, E_t, and K_IC increased with PSF increasing in the neat epoxy resin up to 30 wt %. However, there was a marginal decrease in the blend system in both the thermal and mechanical properties due to the phase separation between DGEBA and PSF. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 121–128, 2001     

Synthesis of a novel epoxy resin containing diphenylether moiety and thermal properties of its cured polymer with phenol novolac

A new type of epoxy resin containing 4,4′-diphenylether moiety in the backbone (2) was synthesized, and was confirmed by gel permeation chromatography, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. In addition, in order to evaluate the influence of 4,4′-diphenylether moiety in the structure, epoxy resins having 4,4′-biphenylene moiety (4) and having 1,4-phenylene moiety (6) in place of 4,4′-diphenylether moiety were synthesized. The cured polymer obtained through the curing reaction between the new diphenylether-containing epoxy resin and phenol novolac was used for making a comparison of its thermal and physical properties with those obtained from 4, 6, and bisphenol-A (4,4′-isopropylidenediphenol) type epoxy resin. The cured polymer obtained from 2 showed markedly higher anaerobic char yield at 700°C of 44.0 wt %, higher fracture toughness, and higher mechanical strength and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3687–3693, 1999     

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. I. Phase diagrams

Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF). The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline). The influence of the TPs on the epoxy–amine kinetics is investigated. It is found that PSF can act as a catalyst. The presence of the TP provokes an increase of the gel times. Cloud‐point curves (temperature vs. composition) are shown for epoxy/PSF/PEI and epoxy/PSF/PEI/AD initial mixtures. Phase separation conversions are reported for the reactive mixtures with various TP contents and PSF/PEI proportions. On the basis of phase separation and gelation curves, conversion–composition phase diagrams at constant temperature are generated for both systems. These diagrams can be used to design particular cure cycles to generate different morphologies during the phase separation process, which is discussed in the second part of this series. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3953–3963, 2004     

Diglycidyl ether of bisphenol‐A epoxy resin modified using poly(ether ether ketone) with pendent tert‐butyl groups

Bisphenol‐A‐based difunctional epoxy resin was modified with poly(ether ether ketone) with pendent tert‐butyl groups (PEEKT). PEEKT was synthesized by the nucleophilic substitution reaction of 4,4′‐difluoro benzophenone with tert‐butyl hydroquinone in N‐methyl‐2‐pyrrolidone. Blends with various amounts of PEEKT were prepared by melt‐mixing. All the blends were homogeneous in the uncured state. The glass transition temperature of the binary epoxy/PEEKT blends was predicted using several equations. Reaction‐induced phase separation was found to occur upon curing with a diamine 4,4′‐diaminodiphenyl sulfone. The phase morphology of the blends was studied using scanning electron microscopy. From the micrographs, it was found that PEEKT‐rich phase was dispersed in a continuous epoxy matrix. The domain size increased with the amount of PEEKT in the blends. The increase in domain size was due to the coalescence of the domains after phase separation. Dynamic mechanical analysis of the blends gave two peaks corresponding to epoxy‐rich phase and thermoplastic‐rich phase. The tensile strength and modulus of the blends remained close to that of the unmodified resin, while the flexural properties decreased with the addition of PEEKT to epoxy resin. The fracture toughness of the epoxy resin increased with the addition of PEEKT. Investigation of the fracture surfaces revealed evidences for local plastic deformation of the matrix, crack pinning, crack path deflection, and ductile tearing of PEEKT‐rich phase. Thermogravimetric analysis revealed that the initial decomposition temperature of the blends were close to that of the unmodified resin. Finally, the properties of the blends were compared with other modified PEEK/epoxy blends. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2481–2496, 2007     

Morphological development and rheological changes of phenoxy/SAN blends during in‐situ polymerization

This article reports the results of an investigation into the time‐dependent morphological and rheological changes that accompany the in‐situ polymerization of blends composed of poly(hydroxyether of bisphenol A) (phenoxy) and poly(styrene‐co‐acrylonitrile) (SAN). The rheological behavior was monitored continuously during the in‐situ polymerization, whereas the miscibility and phase structure of blends formed in situ were examined at discrete stages of polymerization by differential scanning calorimetry and transmission electron microscopy. In the blend with 30 wt % SAN, a co‐continuous blend morphology was associated with gradual changes in the dynamic moduli, suggesting that phase separation proceeded by spinodal decomposition (SD). In contrast, phenoxy‐rich dispersions were uniformly dispersed in a continuous SAN‐rich matrix in the blend with 50 wt % SAN, and the corresponding rheological signature revealed a sharp initial increase in the dynamic moduli, followed by slower growth after long times, indicative of phase separation via nucleation and growth (NG). The rheological property changes are closely related to morphology development and mechanisms of phase separation induced duringin‐situ polymerization. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2614–2619, 2007     

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. II. Generated morphologies

Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF), in concentrations ranging from 5 to 15 wt %. The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone (DDS) or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline) (MCDEA). Using phase diagrams developed in Part I of this series, thermal cycles are selected to generate different morphologies. It is found that, whatever the AD employed, a particulate morphology is obtained when curing blends that are initially homogeneous. In the case of DDS‐cured blends, a unimodal particle size distribution of PSF and PEI dispersed in a continuous epoxy‐rich phase is observed. By contrast, the MCDEA‐cured blends show a bimodal particle size distribution for all PSF/PEI relations that are analyzed. A completely different morphology, characterized by a distribution of irregular TP‐rich domains dispersed in an epoxy‐rich phase (double phase morphology), is obtained when curing blends that are initially immiscible. An X‐ray analysis of the different phases makes it possible to determine their qualitative composition. The dynamic mechanical behavior of fully cured blends is also discussed. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3964–3975, 2004     

Synthesis of hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups and its use as a toughener for epoxy resins

Hydroxyl‐terminated poly(ether ether ketone) with pendent tert‐butyl groups (PEEKTOH) was synthesized by the nucleophilic substitution reaction of 4,4′‐difluorobenzophenone with tert‐butyl hydroquinone with potassium carbonate as a catalyst and N‐methyl‐2‐pyrrolidone as a solvent. Diglycidyl ether of bisphenol A epoxy resin was toughened with PEEKTOHs having different molecular weights. The melt‐mixed binary blends were homogeneous and showed a single composition‐dependent glass‐transition temperature (T_g). Kelley–Bueche and Gordon–Taylor equations gave good correlation with the experimental T_g. Scanning electron microscopy studies of the cured blends revealed a two‐phase morphology. A sea‐island morphology in which the thermoplastic was dispersed in a continuous matrix of epoxy resin was observed. Phase separation occurred by a nucleation and growth mechanism. The dynamic mechanical spectrum of the blends gave two peaks corresponding to epoxy‐rich and thermoplastic‐rich phases. The T_g of the epoxy‐rich phase was lower than that of the unmodified epoxy resin, indicating the presence of dissolved PEEKTOH in the epoxy matrix. There was an increase in the tensile strength with the addition of PEEKTOH. The fracture toughness increased by 135% with the addition of high‐molecular‐weight PEEKTOH. The improvement in the fracture toughness was dependent on the molecular weight and concentration of the oligomers present in the blend. Fracture mechanisms such as crack path deflection, ductile tearing of the thermoplastic, and local plastic deformation of the matrix occurred in the blends. The thermal stability of the blends was not affected by blending with PEEKTOH. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 541–556, 2006     

The surface tension of aqueous poly(N-isopropylacrylamide-co-acrylamide)

A series of poly(N-isopropylacrylamide-co-acrylamide) copolymers with N-isopropylacrylamide (NIPAM) to acrylamide (AM) ratios varying from 95/05 to 10/90 was synthesized and surface tensions, cloud point temperatures, and enthalpies of phase separation were measured. At 25°C, 1 wt % poly(N-isopropylacrylamide) homopolymer has a surface tension of 41.8 mJ/m². Incorporation of AM moieties in the copolymer increased surface tension approaching the limiting value of 65.3 mJ/m² which was obtained for polyacrylamide solutions. The surface tension values of copolymer solutions were predicted from the surface tensions of the homopolymers applied to a one-parameter model analogous to the Margules model for the excess free energy of mixing. Heats of phase separation for the copolymer were less than expected compared with PNIPAM homopolymer. It was proposed that NIPAM moieties directly bonded to acrylamide did not contribute to the enthalpy of phase separation. Finally, surface tension lowering kinetics were slower above the cloud point temperatures because at high temperatures the copolymers were present as colloidally dispersed particles which had to diffuse to the air/water interface, unwrap, and spread to give an adsorbed monolayer. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 2137–2143, 1999     

Fluorescence probes for investigation of epoxy systems and monitoring of crosslinking processes

The fluorescence behavior of 1,1′‐dimethyl‐2,2′‐carbocyanine and p‐N,N‐dimethylamino‐styryl‐2‐ethylpyridinium was investigated in several epoxy systems. Time‐correlated single photon counting was used for all fluorescence measurements to obtain the rate constant for viscosity or mobility‐dependent nonradiative processes of the probe. Microviscosity effects were discussed on the basis of a model describing the microfriction between matrix and probe molecules. The probes investigated are able to detect the glass‐transition temperature of the materials investigated. These compounds also show a dependence on the mobility in the glassy state. The probes applied in this work also can be used to monitor the crosslinking process of several epoxy systems containing 4,4′‐diaminodiphenylmethane (DDM) as curing agent. The epoxides used for the crosslinking process were 2,2′‐[(1‐methylethylidene)bis(4,1‐phenyleneoxymethylene)bis‐oxiranemethaneamine] [common name, diglycidyl ether of bisphenol A (DGEBA)], N‐oxiranylmethyl‐N‐phenyl‐oxiranylmethane [common name, diglycidyl aniline (DGA)], and epoxy novolacs of different functionality. The networks obtained have a different morphology, which was studied by the fluorescence probe technology. The structure of the epoxy compound has an important influence on the probe behavior because both network density and size of the free volume influence the photochemical behavior of the probe. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1367–1386, 1999     

Effect of PS‐b‐PCL block copolymer on reaction‐induced phase separation in epoxy/PEI blend

PS‐b‐PCL block copolymer is used to study its influence on the phase evolution of epoxy resin/polyetherimides (PEI) blends cured with methyl tetrahydrophthalic anhydride. The effect of PS‐b‐PCL on the reaction‐induced phase separation of the thermosetting/thermoplastic blends is studied via optical microscopy, scanning electron microscope, and time‐resolved light scattering. The results show that secondary phase separation and typical phase inverted morphologies are obtained in the epoxy/PEI blends with addition of PS‐b‐PCL. It can be attributed to the preferential location of the PS‐b‐PCL in the epoxy‐rich phase, which enhances the viscoelastic effect of epoxy/PEI system and leads to a dynamic asymmetry system between PEI and epoxy. The PS‐b‐PCL block copolymer plays a critical role on the balance of the diffusion and geometrical growth of epoxy molecules. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 1395–1402     

Syntheses and properties of organosoluble polyimides based on 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4, 7‐methanohexahydroindan

A series of organosoluble aromatic polyimides (PIs) was synthesized from 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4,7‐methanohexahydroindan (3) and commercial available aromatic dianhydrides such as 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA), 4,4′‐sulfonyl diphthalic anhydride (SDPA), or 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropanic dianhydride (6FDA). PIs (III_c–f), which were synthesized by direct polymerization in m‐cresol, had inherent viscosities of 0.83–1.05 dL/g. These polymers could easily be dissolved in N,N′‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), N,N‐dimethylformamide (DMF), pyridine, m‐cresol, and dichloromethane. Whereas copolymerization was proceeded with equivalent molar ratios of pyromellitic dianhydride (PMDA)/6FDA, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA)/6FDA, or BTDA/SDPA, or ½ for PMDA/SDPA, copolyimides (co‐PIs), derived from 3 and mixed dianhydrides, were soluble in NMP. All the soluble PIs could form transparent, flexible, and tough films, and they showed amorphous characteristics. These films had tensile strengths of 88–111 MPa, elongations at break of 5–10% and initial moduli of 2.01–2.67 GPa. The glass transition temperatures of these polymers were in the range of 252–311°C. Except for III_e, the 10% weight loss temperatures (T_d) of PIs were above 500°C, and the amount of carbonized residues of the PIs at 800°C in nitrogen atmosphere were above 50%. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1681–1691, 1999     

A polymer of bisphenol A and bisphenol A diglycidyl ether and its blends with poly(styrene‐co‐acrylonitrile): In situ polymerization preparation,morphology, and mechanical properties

The poly(hydroxy ether of bisphenol A)‐based blends containing poly(acrylontrile‐co‐styrene) (SAN) were prepared through in situ polymerization, i.e., the melt polymerization between the diglycidy ether of bisphenol A (DGEBA) and bisphenol A in the presence of poly(acrylontrile‐co‐styrene) (SAN). The polymerization reaction started from the initial homogeneous ternary mixture of SAN/DGEBA/bisphenol A, and the phenoxy/SAN blends with SAN content up to 20 wt % were obtained. Both the solubility behavior and Fourier transform infrared (FTIR) spectroscopy studies demonstrate that no intercomponent reaction occurred in the reactive blend system. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electronic microscopy (SEM) were employed to characterize the phase structure of the as‐polymerized blends. All the blends display the separate glass transition temperatures (T_g's); i.e., the blends were phase‐separated. The morphological observation showed that all the blends exhibited well‐distributed phase‐separated morphology. For the blends with SAN content less than 15 wt %, very fine SAN spherical particles (1–3 μmm in diameter) were uniformly dispersed in a continuous matrix of phenoxy and the fine morphology was formed through phase separation induced by polymerization. Mechanical tests show that the blends containing 5–15 wt % SAN displayed a substantial improvement of tensile properties and Izod impact strength, which were in marked contrast to those of the materials prepared via conventional methods. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 525–532, 1999     

Influence of the type of epoxy hardener on the structure and properties of interpenetrated vinyl ester/epoxy resins

The morphology–toughness relationship of vinyl ester/cycloaliphatic epoxy hybrid resins of interpenetrating network (IPN) structures was studied as a function of the epoxy hardening. The epoxy was crosslinked via polyaddition reactions (with aliphatic and cycloaliphatic diamines), cationic homopolymerization (via a boron trifluoride complex), and maleic anhydride. Maleic anhydride worked as a dual‐phase crosslinking agent by favoring the formation of a grafted IPN structure between the vinyl ester and epoxy. The type of epoxy hardener strongly affected the IPN morphology and toughness. The toughness was assessed by linear elastic fracture mechanics, which determined the fracture toughness and energy. The more compact the IPN structure was, the lower the fracture energy was of the interpenetrated vinyl ester/epoxy formulations. This resulted in the following toughness ranking: aliphatic diamine > cycloaliphatic diamine ≥ boron trifluoride complex > maleic anhydride. For IPN characterization, the width of the entangling bands and the surface roughness parameters were considered. Their values were deduced from atomic force microscopy scans taken on ion‐etched surfaces. More compact, less rough IPN‐structured resins possessed lower toughness parameters than less compact, rougher structured ones. The latter were less compatible according to dynamic mechanical thermal and thermogravimetric analyses. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 5471–5481, 2004     

Synthesis and photochemical properties of poly(ester–amide)s containing norbornadiene (NBD) residues

N,N′‐Bis[(3‐carboxynorbornadien‐2‐yl)carbonyl]‐N,N′‐diphenylethylenediamine (BNPE) was synthesized in 70% yield by the reaction of 2,5‐norbornadiene‐2,3‐dicarboxylic acid anhydride with N,N′‐diphenylethylenediamine. Other dicarboxylic acid derivatives containing norbornadiene (NBD) residues having N,N′‐disubstituted amide groups were also prepared by the reaction of 2,5‐NBD‐2,3‐dicarboxylic acid anhydride with certain secondary diamines. When the polyaddition of BNPE with bisphenol A diglycidyl ether (BPGE) was carried out using tetrabutylammonium bromide as a catalyst in N‐methyl‐2‐pyrrolidone at 100°C for 12 h, a polymer with number average molecular weight of 69,800 was obtained in 98% yield. Polyadditions of other NBD dicarboxylic acid derivatives containing N,N′‐disubstituted amide groups with BPGE were also performed under the same conditions. The reaction proceeded very smoothly to give the corresponding NBD poly(ester–amide)s in good yields. Photochemical reactions of the obtained polymers with N,N′‐disubstituted amide groups on the NBD residue were examined, and it was found that these polymers were effectively sensitized by adding appropriate photosensitizers such as 4‐(N,N‐dimethylamino)benzophenone and 4,4′‐bis(N,N‐diethylamino)benzophenone in the film state. The stored energies in the quadricyclane groups of the polymers were also evaluated to be about 94 kJ/mol by DSC measurement of the irradiated polymer films. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 917–926, 1999     

Synthesis and properties of poly(ether imide)s based on the bis(ether anhydride)s from hydroquinone and its derivatives

Four bis(ether anhydride)s, 4,4′‐(1,4‐phenylenedioxy)diphthalic anhydride (IV), 4,4′‐(2,5‐tolylenedioxy)‐diphthalic anhydride (Me‐IV), 4,4′‐(2‐chloro‐1,4‐phenylenedioxy)diphthalic anhydride (Cl‐IV), and 4,4′‐(2,5‐biphenylenedioxy)diphthalic anhydride (Ph‐IV), were prepared in three steps starting from the nucleophilic nitrodisplacement reaction of 4‐nitrophthalonitrile with the potassium phenoxides of hydroquinone and various substituted hydroquinones such as methylhydroquinone, chlorohydroquinone, and phenylhydroquinone in N,N‐dimethylformamide, followed by alkaline hydrolysis and dehydration. Four series of poly(ether imide)s were prepared from bis(ether anhydride)s with various aromatic diamines by a classical two‐step procedure. The inherent viscosities of the intermediate poly(amic acid)s were in the range of 0.40–2.63 dL/g. Except for those derived from p‐phenylenediamine and benzidine, almost all the poly(amic acid)s could be solution‐cast and thermally converted into transparent, flexible, and tough polyimide films. Introduction of the chloro or phenyl substituent leads to a decreased crystallinity and an increased solubility of the polymers. The glass transition temperatures (T_g) of these polyimides were recorded in the range of 204–263°C. In general, the methyl‐ and chloro‐substituted polyimides exhibited relatively higher T_gs, whereas the phenyl‐substituted ones exhibited slightly lower T_gs compared to the corresponding nonsubstituted ones. Thermogravimetric analysis (TG) showed that 10% weight loss temperatures of all the polymers were above 500°C either in nitrogen or in air. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 665–675, 1999     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005     

Block copolymer modified novolac epoxy resin

The phase behavior of uncured and cured mixtures containing stoichiometric amounts of Epon164 novolac epoxy resin and 4,4′‐methylenedianiline combined with a nearly symmetric poly(methyl acrylate‐co‐glycidyl methacrylate‐b‐polyisoprene) diblock copolymer was investigated with small‐angle X‐ray scattering and transmission electron microscopy. A series of morphologies were documented as a function of the copolymer concentration, which ranged from pure diblock to 2.5 wt % in the thermoset resin. Ordered lamellae bordered a wide multiphase region followed by disordered wormlike micelles that transformed continuously into vesicles at the lowest compositions. The thermal curing of this pentafunctional epoxy system to complete conversion had little impact on the phase behavior of the mixtures, and this was consistent with previous experiments with difunctional epoxy and the same hardening agent. However, changing the epoxy component led to gross changes in the phase behavior that were interpreted with the concept of a wet‐to‐dry brush transition. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 41: 1994–2003, 2003     

Phase separation dynamics of a poly(vinyl methyl ether)/polystyrene (PVME/PS) blend studied by ultrafast differential scanning calorimetry

In this work, ultrafast differential scanning calorimetry (UFDSC) is used to study the dynamics of phase separation. Taking poly(vinyl methyl ether)/polystyrene (PVME/PS) blend as the example, we firstly obtained the phase diagram that has lower critical solution temperature (LCST), together with the glass transition temperature (T_g) of the homogeneous blend with different composition. Then, the dynamics of the phase separation of the PVME/PS blend with a mass ratio of 7:3 was studied in the time range from milliseconds to hours, by the virtue of small time and spatial resolution that UFDSC offers. The time dependence of the glass transition temperature (T_g) of PVME‐rich phase, shows a distinct change when the annealing temperature (T_a) changes from below to above 385 K. This corresponds to the transition from the nucleation and growth (NG) mechanism to the spinodal decomposition (SD) mechanism, as was verified by morphological and rheometric investigations. For the SD mechanism, the temperature‐dependent composition evolution in PVME‐rich domain was found to follow the Williams–Landel–Ferry (WLF) laws. © 2017 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2017 , 55, 1357–1364     

Toughening of a copolyester with a maleated core‐shell toughener

A reactive extrusion process was developed to toughen an amorphous copolyester (PETG) of ethylene glycol, terephthalic acid and 1,4‐cyclohexanedimethanol using either a maleic anhydride grafted polyethylene–octene elastomer (POEg), or a maleic anhydride grafted mixture (TPEg) of the polyethylene–octene elastomer and a semicrystalline polyolefin plastic as the impact modifier. TPEg showed an important toughening effect on the PETG. A sharp ductile‐brittle transition was observed when the TPEg content was about 10 wt %. For POEg toughened PETG, the ductile–brittle transition required a higher content in POEg, ∼15 wt %. Evolution of the topography and morphology of the blends and the relationship between impact strength and topography were discussed. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 2801–2809, 2000     

Effect of compatibilizer on morphology and properties of HDPE/Nylon 6 blends

The compatibilization effect of linear low‐density polyethylene‐grafted maleic anhydride (LLDPEgMA) and high‐density polyethylene‐grafted maleic anhydride (HDPEgMA) on high‐density polyethylene (HDPE)/polyamide 6 (Nylon 6) blend system is investigated. The morphology of 45 wt %/55 wt % polyethylene/Nylon 6 blends with three compatibilizer compositions (5 wt %, 10 wt %, and 15 wt %) are characterized by atomic force microscopic (AFM) phase imaging. The blend with 5 wt % LLDPEgMA demonstrates a Nylon 6 continuous, HDPE dispersed morphology. Increased amount of LLDPEgMA leads to sharp transition in morphology to HDPE continuous, Nylon 6 dispersed morphology. Whereas, increasing HDPEgMA concentration in the same blends results in gradual morphology transition from Nylon 6 continuous to co‐continuous morphology. The mechanical properties, oxygen permeability, and water vapor permeability are measured on the blends which confirm the morphology and indicate that HDPEgMA is a better compatibilizer than LLDPEgMA for the HDPE/Nylon 6 blend system. © 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2019 , 57, 281–290