Synthesis and properties of poly(amic acid)s and polyimides based on 2,2′,6,6′‐biphenyltetracarboxylic dianhydride

Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2′,6,6′‐biphenyltetracarboxylic dianhydride (2,2′,6,6′‐BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2′,6,6′‐BPDA and 4,4′‐(1,3‐phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass‐transition temperatures (T_g)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385–6393, 2006     

Syntheses and properties of organosoluble polyimides based on 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4, 7‐methanohexahydroindan

A series of organosoluble aromatic polyimides (PIs) was synthesized from 5,5′‐bis[4‐(4‐aminophenoxy)phenyl]‐4,7‐methanohexahydroindan (3) and commercial available aromatic dianhydrides such as 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA), 4,4′‐sulfonyl diphthalic anhydride (SDPA), or 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropanic dianhydride (6FDA). PIs (III_c–f), which were synthesized by direct polymerization in m‐cresol, had inherent viscosities of 0.83–1.05 dL/g. These polymers could easily be dissolved in N,N′‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), N,N‐dimethylformamide (DMF), pyridine, m‐cresol, and dichloromethane. Whereas copolymerization was proceeded with equivalent molar ratios of pyromellitic dianhydride (PMDA)/6FDA, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA)/6FDA, or BTDA/SDPA, or ½ for PMDA/SDPA, copolyimides (co‐PIs), derived from 3 and mixed dianhydrides, were soluble in NMP. All the soluble PIs could form transparent, flexible, and tough films, and they showed amorphous characteristics. These films had tensile strengths of 88–111 MPa, elongations at break of 5–10% and initial moduli of 2.01–2.67 GPa. The glass transition temperatures of these polymers were in the range of 252–311°C. Except for III_e, the 10% weight loss temperatures (T_d) of PIs were above 500°C, and the amount of carbonized residues of the PIs at 800°C in nitrogen atmosphere were above 50%. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 1681–1691, 1999     

Novel Non‐Coplanar and Tertbutyl‐Substituted Polyimides: Solubility,Optical, Thermal and Dielectric Properties

A novel aromatic diamine monomer bearing tertbutyl and 4‐tertbutylphenyl groups, 3,3′‐ditertbutyl‐4,4′‐diaminodiphenyl‐4′′‐tertbutylphenylmethane (TADBP), was prepared and characterized. A series of non‐coplanar polyimides (PIs) were synthesized via a conventional one‐step polycondensation from TADBP and various aromatic dianhydrides including pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (OPDA), 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 4,4′‐(hexafluoroisopropylidene)dipthalic anhydride (6FDA). All PIs exhibit excellent solubility in common organic solvents such as N,N‐dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), N‐methyl‐2‐pyrrolidone (NMP), dimethyl sulfoxide (DMSO), chloroform (CHCl₃), tetrahydrofuran (THF), and so on. Furthermore, the obtained transparent, strong and flexible polyimide films present good thermal stability and outstanding optical properties. Their glass transition temperatures (T_gs) are in the range of 298 to 347°C, and 10% weight loss temperatures are in excess of 490°C with more than 53% char yield at 800°C in nitrogen. All the polyimides can be cast into transparent and flexible films with tensile strength of 80.5–101 MPa, elongation at break of 8.4%–10.5%, and Young's modulus of 2.3–2.8 GPa. Meanwhile, the PIs show the cutoff wavelengths of 302–356 nm, as well as low moisture absorption (0.30% –0.55%) and low dielectric constant (2.78–3.12 at 1 MHz).     

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Polyimide thin films were synthesized from 3,3′,4,4′‐biphenyltetracarboxylic acid dianhydride (BPDA) and four different diamines (p‐phenylene diamine, 4,4′‐oxydiphenylene diamine, 4,4′‐biphenylene diamine, and 4,4′‐sulfonyldiphenylene diamine). The nanoindentation behavior of the resulting polyimides, namely, poly(p‐phenylene biphenyltetracarboximide) (BPDA‐PDA), poly(4,4′‐biphenylene biphenyltetracarboximide) (BPDA‐BZ), poly(4,4′‐oxydiphenylene biphenyltetracarboximide) (BPDA‐ODA), and poly(4,4′‐sulfonyldiphenylene biphenyltetracarboximide) (BPDA‐DDS), were investigated. Also, the morphological properties were characterized with a prism coupler and wide‐angle X‐ray diffraction and were correlated to the nanoindentation studies. The nanoindentation behavior and hardness varied quite significantly, depending on the changes in the chemical and morphological structures. The hardness of the polyimide thin films increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐BZ < BPDA‐PDA. For all the polyimide thin films, except that of BPDA‐BZ, the hardness decreased with an increase in the load. The birefringence, a measure of the molecular in‐plane orientation, increased in the following order: BPDA‐DDS < BPDA‐ODA < BPDA‐PDA < BPDA‐BZ. The X‐ray diffraction studies revealed that the crystallinity of the polyimide thin films varied with the changes in the chemical structure. The studies showed that the indentation response with an applied load and the hardness by nanoindentation for the BPDA‐based polyimides were closely related to the morphological structure. The nanoindentation and birefringence results revealed that the mechanical properties of the polyimide thin films were dependent on the crystallinity, which arose because of the chain order along the chain axis and the molecular packing order. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 861–870, 2004     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Heat-resistant polyimides with low CTE and water absorption through hydrogen bonding interactions

A novel diamine, 1H,1′H-(2,2′-bibenzimidazole)-5,5′-diamine (DPABZ), containing bisbenzimidazole unit was successfully synthesized, and used to prepare a series of copolyimides BPDA:(ODAm/DPABZn) by polycondensation with 4,4-diaminodiphenyl ether (ODA) and 4,4-biphthalic anhydride (BPDA). For comparison, a series of copolyimides BPDA:(ODAm/PABZn) based on another benzimidazole diamine 5-amino-2-(4-aminobenzene)-benzimidazole (PABZ) was also prepared. As a result, with the increase of PABZ or DPABZ content, the heat resistance (T_g and T_d) and mechanical properties (σ and E) of the resulting polyimide (PI) films increased, while the coefficient of thermal expansion (CTE) decreased. Overall, the DPABZ-based PIs showed higher T_g values and much lower CTE values than PABZ. As the content of PABZ increased, the water absorption of PABZ-based PIs increased obviously, but no significant change in DPABZ-based PIs. The intramolecular hydrogen bonding in DPABZ-based PIs caused by the diamine DPABZ was believed to be the reason for the aforementioned differences. The BPDA: DPABZ film with low-water adsorption of 2.1%, high-T_g value of 436°C and low-CTE value of 5.4 ppm/°C could be a promising new generation of flexible display substrates.     

Phosphinated phenols from acid‐fragmentation of bisphenols and their unsymmetrical diamine derivatives for copolyimides

Four novel diamines (9–12) were prepared by a two‐step procedure from phosphinated phenols (1–4) that were prepared from acid‐fragmentation of four bisphenols, including bisphenol A, 4,4′‐isopropylidenebis(2,6‐dimethylphenol), cis(4‐hydroxyphenyl)cyclohexane, and 9,9′‐bis(4‐hydroxyphenyl)fluorene, followed by nucleophilic addition of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO). Copolyimides based on (9–12) /4,4′‐diaminodiphenyl ether (ODA)/dianhydride were prepared. The structure‐property relationship on the copolyimides was discussed. Due to the structural similarity, (9) /ODA‐based copolyimides were compared with (10) /ODA‐based copolyimides, while (11) /ODA‐based copolyimides were compared with (12) /ODA‐based copolyimides. The dimethyl substitutents cause (10) /ODA‐based copolyimides to display higher T_g, modulus, dimensional stability, contact angle, and better solubility than (9) /ODA‐based copolyimides. (12) /ODA‐based copolyimides that exhibit fluorene moieties display higher T_g and thermal stability, but a lower contact angle and poorer solubility than (11) /ODA‐based copolyimides that exhibit cyclohexane moieties. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 390–400     

High modulus polyimide/polyimide molecular composite films that utilize acetylene unit as a crosslink site

Polyimide/polyimide molecular composite (MC) films comprised of a rigid polyimide derived from biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) and a flexible polyimide derived from BPDA and bis (3,3'-diaminodiphenyl) acetylene (intA) and/or oxydianiline (ODA) were prepared by blending the polyamic acid solutions in 7 : 3 weight ratio, and then imidizing the blend films. Acetylene content in the flexible polyimide backbone was controlled by the ratio of intA and ODA. Cold-drawing of the blend polyamic acid films, followed by imidization, gives high modulus polyimide/polyimide MC films. The modulus of the MC films increased almost linearly with the draw ratio, reaching 25.5 GPa for the 40% drawn film. Acetylene groups in the flexible polyimide can be thermally cured to crosslink. The onset of exotherm appeared at 340°C on DSC, reaching maximum at 398°C. After the thermal crosslinking, the MC films maintained the high modulus, though elongation became small. Taking advantage of the crosslinkable acetylene units, two MC films were laminated and processed at 400°C for 20 min under 100 kg/cm² to give a good-quality laminate film. The interface of the two films was strongly bonded through the crosslinking of acetylene groups. Laminate films maintained the high modulus afforded by the cold-drawing. © 1994 John Wiley & Sons, Inc.     

Preparation of novel,high‐modulus,swollen‐ or jungle‐gym‐type polyimide gels end‐crosslinked with 1,3,5‐tris(4‐aminophenyl)benzene

A novel preparation approach for high‐performance polyimide gels that are swollen or have a jungle‐gym‐type structure is proposed. A new rigid and symmetric trifunctional amine, 1,3,5‐tris(4‐aminophenyl)benzene (TAPB), was synthesized as a crosslinker. Three different kinds of amic acid oligomers derived from pyromellitic dianhydride (PMDA), 4,4′‐oxydiphthalic anhydride (ODPA), p‐phenylenediamine (PDA), and 4,4′‐oxydianiline (ODA) were end‐crosslinked with TAPB at a high temperature to make polyimide networks with different structures. Transparent polyimide gels were obtained from the ODPA–ODA/TAPB series with high compression moduli of about 1 MPa at their equilibrium swollen states in N‐methylpyrrolidone. Microscopic phase separation occurred during the gelation–imidization process when polyimide networks were generated from PMDA–PDA/TAPB and PMDA–ODA/TAPB. After these opaque polyimide networks were dried, a jungle‐gym‐like structure was obtained for the PMDA–PDA/TAPB and PMDA–ODA/TAPB series; that is, there was a high void content inside the networks (up to 70%) and little volume shrinkage. These polyimide networks did not expand but absorbed the solvent and showed moduli as high as those of solids. Therefore, using the highly rigid crosslinker TAPB combined with the flexible monomers ODPA and ODA and the rigid monomers PMDA and PDA, we prepared swollen, high‐performance polyimide gels and jungle‐gym‐type polyimide networks, respectively. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2501–2512, 2002     

Organosoluble polyimides and copolyimides based on 1,1‐bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane and aromatic dianhydrides

1,1‐Bis[4‐(4‐aminophenoxy)phenyl]‐1‐phenylethane (BAPPE) was prepared through nucleophilic substitution reaction of 1,1‐bis(4‐hydroxyphenyl)‐1‐phenylethane and p‐chloronitrobenzene in the presence of K₂CO₃ in N,N‐dimethylformamide, followed by catalytic reduction with hydrazine and Pd/C. Novel organosoluble polyimides and copolyimides were synthesized from BAPPE and six kinds of commercial dianhydrides, including pyromellitic dianhydride (PMDA, I_a ), 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA, I_b ), 3,3′,4,4′‐ biphenyltetracarboxylic dianhydride (BPDA, I_c ), 4,4′‐oxydiphthalic anhydride (ODPA, I_d ), 3,3′,4,4′‐diphenylsulfonetetracarboxylic dianhydride (DSDA, I_e ) and 4,4′‐hexafluoroisopropylidenediphthalic anhydride (6FDA, I_f ). Differing with the conventional polyimide process by thermal cyclodehydration of poly(amic acid), when polyimides were prepared by chemical cyclodehydration with N‐methyl‐2‐pyrrolidone as used solvent, resulted polymers showed good solubility. Additional, I_a,b were mixed respectively with the rest of dianhydrides (I_c–f) and BAPPE at certain molar ratios to prepare copolyimides with arbitrary solubilities. These polyimides and copolyimides were characterized by good mechanical properties together with good thermal stability. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2082–2090, 2000     

Synthesis and Characterization of Fluorinated Polyimide Derived from 3,3′‐Diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane

A novel aromatic diamine monomer, 3,3′‐diisopropyl‐4,4′‐diaminodiphenyl‐3′′,4′′‐difluorophenylmethane (PAFM), was successfully synthesized by coupling of 2‐isopropylaniline and 3,4‐difluorobenzaldehyde. The aromatic diamine was adopted to synthesize a series of fluorinated polyimides by polycondensation with various dianhydrides: pyromellitic dianhydride (PMDA), 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) via the conventional one‐step method. These polyimides presented excellent solubility in common organic solvents, such as N,N‐dimethylformamide (DMF), N,N‐dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N‐methyl‐2‐pyrrolidone (NMP), chloroform (CHCl₃), tetrahydrofuran (THF) and so on. The glass transition temperatures (T_g) of fluorinated polyimides were in the range of 260–306°C and the temperature at 10% weight loss in the range of 474–502°C. Their films showed the cut‐off wavelengths of 330–361 nm and higher than 80% transparency in a wavelength range of 385–463 nm. Moreover, polymer films exhibited low dielectric properties in the range of 2.76–2.96 at 1 MHz, as well as prominent mechanical properties with tensile strengths of 66.7–97.4 MPa, a tensile modulus of 1.7–2.1 GPa and elongation at break of 7.2%–12.9%. The polymer films also showed outstanding hydrophobicity with the contact angle in the range of 91.2°–97.9°.     

High solubility,low‐dielectric constant,and optical transparency of novel polyimides derived from 3,3′,5,5′‐tetramethyl‐4,4′‐diaminodiphenyl‐4″‐isopropyltoluene

A series of novel polyimides (PIs) ( 3a–d ) were prepared from 3,3′,5,5′‐tetramethyl‐4,4′‐diaminodiphenyl‐4 ″ ‐isopropyltoluene ( 1 ) with four aromatic dianhydrides via a one‐step high temperature polycondensation procedure. The obtained PIs showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents and chlorinated solvents. Their films were nearly colorless and exhibited high‐optical transparency, with the UV cutoff wavelength in the range of 328–353 nm and the transparency at 450 nm >80%. They also showed low‐dielectric constant (2.49–2.94 at 1 MHz) and low‐water absorptions (0.44–0.65%). Moreover, these PIs possessed high‐glass transition temperatures (T_g) beyond 327 °C and excellent thermal stability with 10% weight loss temperatures in the range of 530–555 °C in nitrogen atmosphere. In comparison with some fluorinated poly(ether imide)s derived from the trifluoromethyl‐substituted bis(ether amine)s, the resultant PIs 3a–d showed better solubility, lower cutoff wavelength, and higher T_g. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3309–3317, 2009     

Poly(ester imide)s possessing low coefficients of thermal expansion and low water absorption (IV): Effects of ester‐linked tetracarboxylic dianhydrides with longitudinally extended structures

A series of poly(ester imide)s (PEsIs) were prepared using longitudinally extended structures of ester‐linked tetracarboxylic dianhydrides with different numbers of aromatic rings (N_Ar = 4‐6). In the PEsIs obtained using p‐phenylenediamine (p‐PDA), a clear trend was observed: the water absorption (W_A) decreased with increasing N_Ar. In contrast, no clear decrease in the T_g with increasing N_Ar was observed for the PEsIs obtained using 4,4′‐oxydianiline (4,4′‐ODA). The PEsIs obtained using a methyl‐substituted tetracarboxylic dianhydride (N_Ar = 5) showed more suppressed W_A and higher elongation at break (ε_b) values than those of the nonsubstituted counterparts. The former result is probably closely related to the enhanced crystallinity. However, methyl substitution caused an appreciable reduction in the thermal stability. Thus, the methyl‐substituted PEsIs did not meet the V‐0 standard in the UL‐94V test, unlike the substituent‐free counterparts. The PEsI copolymer obtained using the substituent‐free tetracarboxylic dianhydride (N_Ar = 6) with p‐PDA (75 mol%) and 4,4′‐ODA (25 mol%) had excellent combined properties, ie, a very high T_g (361°C), an ultralow coefficient of thermal expansion (2.2 ppm K^?1), an extremely low coefficient of hygroscopic expansion (3.3 ppm/RH%), moderate film ductility (ε_b^max = 23%), a moderate dielectric constant (3.22), and a low tan δ (2.76 × 10^?3) at 10 GHz in 50% relative humidity. Thus, this PEsI is a promising novel dielectric substrate material for use in the next generation of high‐performance flexible printed circuit boards.     

A thermodynamic analysis of specific interactions in blends of poly(styrene‐co‐N,N‐dimethylacrylamide) and poly(styrene‐co‐acrylic acid). Screening and self‐association effects

In a first step of this contribution, the observed glass transition temperature‐composition behavior of miscible blends of poly(styrene‐co‐N,N‐dimethylacrylamide) (SAD17) containing 17 mol % of N,N‐dimethylacrylamide and poly(styrene‐co‐acrylic acid) (SAA18, SAA27, and SAA32) containing increasing acrylic acid content, are analyzed according to theoretical approaches. Both Kwei and Brostow equations describe well the experimental data though better fits were obtained with the Brostow's approach. The specific interactions involved in these systems are a combination of intra and interassociation hydrogen bonding. The positive deviation from the linear mixing rule of T_g‐composition observed within the SAA18+SAD17 blend system, indicates that interassociation interactions are prevailing. More pronounced intra‐association interactions within the SAA32+SAD17 blend system led to a large negative deviation while a fine balance is established between these two types of interactions within the SAA27+SAD17 blend. A thermodynamic analysis was carried out according to the Painter‐Coleman association model. The miscibility and phase behavior of SAD17+SAA18 and SAD17+SAA27 blends are well predicted. However, this model predicts a partial miscibility of SAD17+SAA32 system. Finally, the fitting parameter free method developed by Coleman to predict the T_g‐composition behavior is applied. This method predicts fairly well the evolution trend of experimental T_gs of the SAA18+SAD17 and SAA27+SAD17 blend systems. However, the compositional dependence of SAA32+SAD17 blend T_g was not predictable by this method. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47:2074–2082, 2009     

Phase behavior of ternary poly‐(2‐vinylpyridine)/poly‐(N‐vinyl‐2‐pyrrolidone)/bis‐(4‐hydroxyphenyl)methane blends

The phase behavior of ternary poly‐(2‐vinylpyridine) (P2VPy)/poly‐(N‐vinyl‐2‐pyrrolidone) (PVP)/bis‐(4‐hydroxyphenyl)methane (BHPM) blends was studied. Fourier transform infrared spectroscopic examinations demonstrated that BHPM interacts with P2VPy and PVP through hydrogen‐bonding interactions. The addition of a sufficiently large amount of BHPM transformed an opaque blend with two glass‐transition temperatures (T_g's) to a transparent single‐T_g blend. Scanning electron microscopic studies showed that the transparent single‐T_g blend is micro‐phase‐separated at a scale of about 30 nm. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 1815–1823, 2001     

Synthesis and properties of highly refractive polyimides derived from fluorene‐bridged sulfur‐containing dianhydrides and diamines

Highly refractive and transparent polyimides (PIs) based on fluorene‐bridged and sulfur‐containing monomers have been developed. An aromatic dianhydride, 4,4′‐[p‐thiobis(phenylenesulfanyl)]diphthalic anhydride (3SDEA), was polymerized with several fluorene‐containing diamines, including commercially available 9,9′‐bis(p‐aminophenyl)fluorene (APF), 9,9′‐bis[4‐(p‐aminophenoxy)phenyl]fluorene (OAPF), and newly synthesized 9,9′‐bis[4‐(p‐aminophenyl)sulfanylphenyl]fluorene (ASPF) to afford series A PIs. Meanwhile, series B PIs were obtained from a new dianhydride, 4,4′‐[(9H‐fluorene‐9‐ylidene)bis(p‐phenylsulfanyl)]diphthalic anhydride (FPSP) and two aromatic diamines, ASPF and 4,4′‐thiobis[(p‐phenylenesulfanyl)aniline] (3SDA) via a two‐step polycondensation procedure. The PIs exhibit good thermal stabilities, such as relatively high glass transition temperatures in the range of 220–270 °C and high initial thermal decomposition temperatures (T_10%) exceeding 490 °C. The 9,9′‐disubstituted fluorene moieties endow the PI films with good optical transparency. The optical transmittances of the PI films at 450 nm are all higher than 80% for the thickness of about 10 μm. Furthermore, the highly aromatic fluorene moiety and flexible thioether linkages in the molecular chains of the PIs provide them with high refractive indices of 1.6951–1.7258 and small birefringence of 0.0056–0.0070. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 1510–1520, 2008     

Role of the in‐plane orientation of polyimide films in graphitization

Poly(amide acid) labeled with perylenetetracarboxydiimide (PEDI) was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), p‐phenylenediamine (PDA), and diamino‐PEDI. Poly(amide acid) was then reacted with sodium hydride and various kinds of alkyl iodides for transformation into various poly(amide ester)s. The cast films were imidized while fixed on glass substrates to give BPDA/PDA polyimide films. The degree of in‐plane molecular orientation (f) of the polyimides and their precursors, poly(amide acid) and poly(amide ester)s, were determined via measurements of the visible dichroic absorption at an incidence angle for a rodlike dye (PEDI) bound to the main chain. All precursor films showed relatively low degrees of in‐plane orientation. After imidization of the precursors fixed on glasses, however, striking spontaneous in‐plane orientation behavior was observed. The f value for polyimide film from a poly(amide acid) precursor was as high as 0.7–0.8. The f value for polyimide film from a methyl ester precursor, however, was lowered to 0.4–0.5, but it increased with the increasing size of the alkyl groups. Good correlations of the in‐plane orientation of the polyimide films with the tensile modulus of the films and the in‐plane orientation of the graphitized films were observed. © 2001 John Wiley & Sons, Inc. J Polym Sci Part B: Polym Phys 39: 3011–3019, 2001     

Direct patterning of poly(amic acid) and low‐temperature imidization using a crosslinker,a photoacid generator,and a thermobase generator

A positive‐type photosensitive polyimide (PSPI) based on poly(amic acid) (PAA), a crosslinker 1,1,1‐tris{4‐[2‐(vinyloxy)ethoxy]phenyl}ethane (TVPE), a photoacid generator (PAG) (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA), and a thermobase generator (TBG) t‐butyl 2,6‐dimethylpiperidine‐1‐carboxylate (BDPC) has been developed as a promising material in microelectronics. The PAA was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) in dimethyl sulfoxide (DMSO). The PSPI, consisting of PAA (69 wt %), TPVE (21 wt %), PTMA (3 wt %), and BDPC (7 wt %), showed high sensitivity of 21 mJ/cm² and a high contrast of 6.8 when it was exposed to a 436‐nm line (g‐line), postbaked at 90 °C for 5 min, and developed with 1.69 wt % TMAHaq. A clear positive image of 8 μm line and space pattern was printed on film, which was exposed to 50 mJ/cm² of g‐line by a contact printing mode and fully converted to the corresponding polyimide (PI) pattern on heating at 200 °C, confirmed by FTIR spectroscopy. Thus, this system will be a good candidate for next generation PSPIs. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3362–3369, 2009     

Complex phase behavior and state of miscibility in Poly(ethylene glycol)/Poly(l‐lactide‐co‐ε‐caprolactone) Blends

A miscibility and phase behavior study was conducted on poly(ethylene glycol) (PEG)/poly(l ‐lactide‐ε‐caprolactone) (PLA‐co‐CL) blends. A single glass transition evolution was determined by differential scanning calorimetry initially suggesting a miscible system; however, the unusual T_g bias and subsequent morphological study conducted by polarized light optical microscopy (PLOM) and atomic force microscopy (AFM) evidenced a phase separated system for the whole range of blend compositions. PEG spherulites were found in all blends except for the PEG/PLA‐co‐CL 20/80 composition, with no interference of the comonomer in the melting point of PEG (T_m = 64 °C) and only a small one in crystallinity fraction (X_c = 80% vs. 70%). However, a clear continuous decrease in PEG spherulites growth rate (G) with increasing PLA‐co‐CL content was determined in the blends isothermally crystallized at 37 °C, G being 37 µm/min for the neat PEG and 12 µm/min for the 20 wt % PLA‐co‐CL blend. The kinetics interference in crystal growth rate of PEG suggests a diluting effect of the PLA‐co‐CL in the blends; further, PLOM and AFM provided unequivocal evidence of the interfering effect of PLA‐co‐CL on PEG crystal morphology, demonstrating imperfect crystallization in blends with interfibrillar location of the diluting amorphous component. Significantly, AFM images provided also evidence of amorphous phase separation between PEG and PLA‐co‐CL. A true T_g vs. composition diagram is proposed on the basis of the AFM analysis for phase separated PEG/PLA‐co‐CL blends revealing the existence of a second PLA‐co‐CL rich phase. According to the partial miscibility established by AFM analysis, PEG and PLA‐co‐CL rich phases, depending on blend composition, contain respectively an amount of the minority component leading to a system presenting, for every composition, two T_g's that are different of those of pure components. © 2013 Wiley Periodicals, Inc. J. Polym. Sci. Part B: Polym. Phys. 2014 , 52, 111–121     

A study of the kinetics of the microwave cure of a phenylethynyl‐terminated imide model compound and imide oligomer (PETI‐5)

The kinetic mechanism of the microwave cure of a simple phenylethynyl‐terminated imide model compound, 3,4′‐bis[(4‐phenylethynyl)phthalimido]diphenyl ether (PEPA‐3,4′‐ODA) and a phenylethynyl‐terminated imide oligomer (PETI‐5, M_n 5000 g/mol) was studied. Dielectric properties of the model compound and PETI‐5 were measured in the microwave range from 0.4 GHz to 3 GHz. FTIR was used to follow the cure of the model compound (PEPA‐3,4′‐ODA), while thermal analysis (DSC) was used to follow the cure of the PETI‐5 oligomer. The changes in room temperature IR absorbance of phenylethynyl triple bonds at 2214 cm⁻¹ of PEPA‐3,4′‐ODA as a function of cure time were measured after cure temperatures of 300, 310, 320, and 330 °C. The changes in the glass‐transition temperature, T_g, of PETI‐5 as a function of cure time were measured after cure at 350, 360, 370, and 380 °C, respectively. The T_g 's were determined to calculated the relative extent of cure, x, of the PETI‐5 oligomer according to the DiBenedetto equation. For the model compound, the reaction followed first order kinetics, yielding an activation energy of 27.6 kcal/mol as determined by infrared spectroscopy. For PETI‐5, the reaction followed 1.5th order, yielding an activation energy of 17.1 kcal/mol for the whole cure reaction, as determined by T_g using the DiBenedetto method. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2526–2535, 2000