压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距...     

增强相/夹杂内螺位错偶极子与含共焦钝裂纹椭圆夹杂的干涉效应

运用弹性力学的复势方法,研究了纵向剪切下增强相/夹杂内螺型位错偶极子与含共焦钝裂纹椭圆夹杂的干涉效应,得到了该问题复势函数的封闭形式解答,由此推导出了夹杂区域的应力场、作用在螺型位错偶极子中心的像力和像力偶矩以及裂纹尖端应力强度因子级数形式解。并分析了位错偶极子倾角 、钝裂纹尺寸和材料常数对位错像力、像力偶矩以及应力强度因子的影响。数值计算结果表明：位错像力、像力偶矩以及应力强度因子均随位错偶极子倾角做周期变化;夹杂内部的椭圆钝裂纹明显增强了硬基体对位错的排斥,减弱了软基体对位错的吸引,且对于硬夹杂,位错出现了一个不稳定平衡位置,该平衡位置随钝裂纹曲率的增大不断向界面靠近;变化 值将出现改变位错偶极子对应力强度因子作用方向的临界值。     

穿透夹杂界面的半无限楔形裂纹尖端螺型位错的发射研究

摘要：研究了穿透圆形夹杂界面的半无限楔形裂纹与裂纹尖端螺型位错的干涉问题。应用复变函数解析延拓技术与奇性主部分析方法,得到了位错位于半圆形夹杂内部时,半无限基体和半圆形夹杂内复势函数的解析解。然后利用保角映射技术得到了穿透圆形夹杂界面的半无限楔形裂纹尖端螺型位错产生的应力场以及作用在位错上的位错力的解析表达式。主要讨论了螺型位错对裂纹的屏蔽效应以及从楔形裂纹尖端发射位错的临界载荷条件。研究结果表明正的螺型位错可以削弱楔形裂纹尖端的应力强度因子,屏蔽裂纹的扩展,屏蔽效应随位错方位角的增大而减小。位错发射所需的无穷远临界应力随发射角的增加而增大,最可能的位错发射角度为零度,直线裂纹尖端位错的发射比楔形裂纹尖端位错的发射更容易,硬基体抑制位错的发射。     

螺型位错偶极子与界面钝裂纹的干涉效应

研究了螺型位错偶极子与界面钝裂纹的干涉效应.应用保角变换技术,得到了复势函数与应力场的封闭解析解,讨论了位错偶极子方位、臂长及裂纹钝化程度对位错偶板子屏蔽效应和发射条件的影响.结果表明,与单个螺型位错不同,螺型位错偶极子与x轴夹角在一定范围内时才可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随偶板子臂长的增大而增强,随裂纹钝化程度的增大而增强,屏蔽区域也随裂纹钝化程度的增大而增大;位错偶极子发射所需的临界无穷远加载随偶极子臂长的增加而减小,随位错方位角及裂纹钝化程度的增加而增大;最可能的位错偶极子发射角度为0.螺型位错偶极子的发射比单个螺型位错的发射要困难.本文解答的特殊情况与相关文献给出的解答一致.     

位错偶极子和Ⅲ型界面裂纹的干涉效应

研究了多晶体材料中螺型位错偶极子和界面裂纹的弹性干涉作用.利用复变函数方法,得到了该问题复势函数的封闭形式解答.求出了由位错偶极子诱导的应力场和裂纹尖端应力强度应子,分析了偶极子的方向,偶臂和位置以及材料失配对应力强度因子的影响.推导了作用在螺型位错偶极子中心的像力和力偶矩,并讨论了界面裂纹几何条件和不同材料特征组合对位错偶极子平衡位置的影响规律.结果表明,裂纹尖端的螺型位错偶极子对应力强度因子会产生强烈的屏蔽或反屏蔽效应.同时,界面裂纹对螺型位错偶极子在材料中运动有很强的扰动作用.     

Nanoscale rotational deformation effect on dislocation emission from an elliptically blunted crack tip in nanocrystalline materials

A grain size-dependent model is theoretically established to describe the effect of a special physical micromechanism of plastic flow on the dislocation emission from an elliptical blunt crack tip in nanocrystalline solids. The micromechanism represents the fast nanoscale rotational deformation (NRD) occurring through collective events of ideal nanoscale shear near crack tips, which as a stress source is approximately equivalent to a quadrupole of wedge disclinations. By the complex variable method, the grain size-dependent criterion for the dislocation emission from an elliptical blunt crack tip is derived. The influence of the grain size and the features of NRD on the critical stress intensity factors for dislocation emission is evaluated. The results indicate that NRD releases the high stresses near the crack tip region and thereby enhances the critical stress intensity factor for dislocation emission. The NRD has great influence on the most probable angle for dislocation emission. The critical stress intensity factor will increase with the increment of the grain size, which means the emission of the dislocation becomes more difficult for larger grain size due to the effect of NRD.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE Ⅲ INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode Ⅲ interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. zThe image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.     

Exact solutions for piezoelectric screw dislocations near two asymmetrical edge cracks emanating from an elliptical hole

The interaction between piezoelectric screw dislocations and two asymmetrical interfacial cracks emanating from an elliptic hole under combined mechanical and electric load at infinity is dealt with. The closed-form solutions are derived for complex potentials and generalized stress fields. In the limiting cases, some well-known results can be obtained from the present solutions. Moreover, some new exact solutions are shown. The stress intensity factor and the energy release rate at the right tip due to a screw dislocation near the right interfacial crack are also calculated. The results show that the shielding effect of dislocation on crack expanding decreases with the increase in dislocation azimuth angle and the distance between the dislocation and the crack tip, and the repulsion acting on the dislocation from the other half plane demotes crack propagation. The increasing of the length of the other crack promotes crack growth, but the increasing of the minor semi-axis demotes it.     

The interaction between a screw dislocation and a rigid wedge inhomogeneity with an elastic circular inhomogeneity at the tip

The interaction between a screw dislocation and an elastic semi-cylindrical inhomogeneity abutting on a rigid half-plane is investigated. Utilizing the image dislocations method, the closed form solutions of the stress fields in the matrix and the inhomogeneity region are derived. The image force acting on the dislocation is also calculated. The results were used to study the interaction between a screw dislocation and a rigid wedge inhomogeneity with an elastic circular inhomogeneity at the tip by means of conformal mapping. The results show that an unstable equilibrium point of the dislocation near the semi-cylindrical inhomogeneity is found when the inhomogeneity is softer than the matrix. Moreover, the force on the dislocation is strongly affected by the position of the dislocation and the shear modulus of the semi-circular inhomogeneity. Positive screw dislocations can reduce the SIF of the rigid wedge inhomogeneity (shielding effect) only when it located in the lower half-plane. The shielding effect increases with the increase of the shear modulu of both the matrix and the inhomogeneity and increases with the increase of the wedge angle. The shielding effect (or anti-shielding effect) reaches the maximum when the dislocation tends to the wedge inhomogeneity interface.     

Cracking characteristics of mixed mode dislocations near a lip-like mode crack

This work is concerned with the cracking characteristics of mixed mode dislocations near a lip-like mode crack, stress intensity and strain energy density factor are obtained by using conformal mapping, singularity analysis and Cauchy integrals. Shielding effect generated by screw dislocation near a lip-like mode crack decreases with the increment of the distance between screw dislocation and crack tip. Larger distance between two faces of the crack leads to the shielding effect waning. The strain energy density factor of mode III decreases with the increment of the distance between dislocation and crack tip. Larger distance between two faces of lip-like mode crack also leads to the strain energy density factor waning and encourages crack initiation; the shielding effects generated by edge dislocation near the crack decrease with the increment of the distance between edge dislocation and crack tip.     

A generalized screw dislocation interacting with interfacial cracks along a circular inhomogeneity in magnetoelectroelastic solids

The interaction of a generalized screw dislocation with circular arc interfacial cracks under remote antiplane shear stresses, in-plane electric and magnetic loads in transversely isotropic magnetoelectroelastic solids is dealt with. By using the complex variable method, the general solutions to the problem are presented. The closed-form expressions of complex potentials in both the inhomogeneity and the matrix are derived for a single circular-arc interfacial crack. The intensity factors of stress, electric displacement and magnetic induction are provided explicitly. The image forces acting on the dislocation are also calculated by using the generalized Peach–Koehler formula. For the case of piezoelectric matrix and piezomagnetic inclusion, the shielding and anti-shielding effect of the dislocation upon the stress intensity factors is evaluated in detail. The results indicate that if the distance between the dislocation and the crack tip remains constant, the dislocation in the interface will have a largest shielding effect which retards the crack propagation. In addition, the influence of the interfacial crack geometry and materials magnetoelectroelastic mismatch upon the image force is discussed. Numerical computations show that the perturbation effect of the above parameters upon the image force is significant. The main result shows that a stable or unstable equilibrium point may be found when a screw dislocation approaches the surface of the crack from infinity which differs from the perfect bonded case under the same conditions. The present solutions contain a number of previously known results which can be shown to be special cases.     

A technique for studying interaction between a screw dislocation dipole or a concentrated load and a mode III crack crossing an interface

A method of potentially wide application is developed for deriving analytical expressions of the elastic interaction between a screw dislocation dipole or a concentrated force and a crack cutting perpendicularly across the interface of a bimaterial. The cross line composed of the interface and the crack is mapped into a line, and then the complex potentials are educed. The Muskhelishvili method is extended by creating a Plemelj function that matches the singularity of the real crack tips, and eliminates the pseudo tips’ singularity induced by the conformal mapping. The stress field is obtained after solving the Riemann–Hilbert boundary value problem. Based on the stress field expressions, crack tip stress intensity factors, dislocation dipole image forces and image torque are formulated. Numerical curves show that both the translation and rotation must be considered in the static equilibrium of the dipole system. The crack tip stress intensity factor induced by the dipole may rise or drop and the crack may attract or reject the dipole. These trends depend not only on the crack length, but also on the dipole location, the length and the angle of the dipole span. Generally, the horizontal image force exerted at the center of the dislocation dipole is much smaller than the vertical one. Whether the dipole subjected to clockwise torque or anticlockwise torque is determined by whether the Burgers vector of the crack-nearby dislocation of the dipole is positive or negative. A concentrated load induces no singularity to crack tip stress fields as the load is located at the crack line. However, as the concentrated force is not located on the crack line but approaches the crack tip, the nearby crack tip stress intensity factor K_IIIu increases steeply to infinity.     

向错偶极子对楔型裂纹尖端场

研究了材料中楔型向错偶极子与楔型裂纹的弹性干涉问题. 运用复变函数方法获得了复势函 数和应力场的封闭形式解答,导出了楔型裂纹尖端应力强度因子的解析表达式. 讨论了向错 偶极子的位置、方向和偶臂长度对楔型裂纹尖端应力强度因子的屏蔽和反屏蔽作用规律. 研 究结果表明,向错偶极子靠近裂纹尖端时,对应力强度因子的屏蔽或反屏蔽作用非常强烈. 在一定条件下,楔型向错偶极子能够延缓楔型裂纹的扩展;偶极子的方向也存在一个临界值 使其对应力强度因子的屏蔽或反屏蔽效应最大. 此外,楔型裂纹张开角以及偶极子臂长对应 力强度因子也有较大的影响.     

Special rotational deformation effect on the emission of dislocations from a crack tip in deformed nanocrystalline solids

The interaction between the special rotational deformation and the crack in deformed nanocrystalline ceramics and metals is investigated by the complex variable method. We have theoretically described the effects of the disclination quadrupole produced by the special rotational deformation on the emission of lattice dislocations from the crack tip. The complex form expressions of the stress field and the force field are divided. The critical stress intensity factors for the first dislocation emission are calculated. The influence of the disclination strength, the grain size (the quadrupole arms), the location of the disclinations and the angle between the crack plane and one of the quadrupole arms, as well as the crack length on the critical stress intensity factors is discussed in detail. And the results show that, the special rotational deformation has great influence on the dislocation emission from the crack tip.     

On a semi-infinite crack penetrating a piezoelectric circular inhomogeneity with a viscous interface

We investigate a semi-infinite crack penetrating a piezoelectric circular inhomogeneity bonded to an infinite piezoelectric matrix through a linear viscous interface. The tip of the crack is at the center of the circular inhomogeneity. By means of the complex variable and conformal mapping methods, exact closed-form solutions in terms of elementary functions are derived for the following three loading cases: (i) nominal Mode-III stress and electric displacement intensity factors at infinity; (ii) a piezoelectric screw dislocation located in the unbounded matrix; and (iii) a piezoelectric screw dislocation located in the inhomogeneity. The time-dependent electroelastic field in the cracked composite system is obtained. Particularly the time-dependent stress and electric displacement intensity factors at the crack tip, jumps in the displacement and electric potential across the crack surfaces, displacement jump across the viscous interface, and image force acting on the piezoelectric screw dislocation are all derived. It is found that the value of the relaxation (or characteristic) time for this cracked composite system is just twice as that for the same fibrous composite system without crack. Finally, we extend the methods to the more general scenario where a semi-infinite wedge crack is within the inhomogeneity/matrix composite system with a viscous interface.     

Dislocation emission criterion from a blunt crack tip

Simple closed-form solutions for critical stress intensity factors were developed for edge dislocation emission from a blunt crack under mode I and mode II loading conditions. The solutions are applicable both for a slender elliptical hole and a long slit with blunted head. When the blunt crack considered degenerates to a sharp crack, the present solutions reduce to those previously reported in literature.     

A crack along the interface of a circular inclusion embedded in an infinite solid

The two-dimensional problem of an arc shaped crack lying along the interface of a circular elastic inclusion embedded in an infinite matrix with different elastic constants is considered. Based on the complex variable method of Muskhelishvili, closed-form solutions for the stresses and the displacements around the crack are obtained when general biaxial loads are applied at infinity. These solutions are then combined with A.A. Griffith's virtual work argument to give a criterion of crack extension, namely the de-bonding of the interface. The critical applied loads are expressed explicitly in terms of a function of the inclusion radius and the central angle subtended by the crack arc. In the case of simple tension the critical load is inversely proportional to the square-root of the inclusion radius. By analyzing the variation of the cleavage stress near the crack tip, the deviation of the crack into the matrix is discussed. The case of uniaxial tension is worked out in detail.     

Electroelastic interaction between a piezoelectric screw dislocation and a confocal elliptic blunt crack with elliptical inhomogeneity

The electroelastic interaction between a piezoelectric screw dislocation and an elliptical inhomogeneity containing a confocal blunt crack under infinite longitudinal shear and in-plane electric field is investigated. Using the sectionally holomorphic function theory, Cauchy singular integral, singularity analysis of complex functions and theory of Rieman boundary problem, the explicit series solution of stress field is obtained when the screw dislocation is located in inhomogeneity. The intervention law of the interaction between blunt crack and screw dislocation in inhomogeneity is discussed. The analytical expressions of generalized stress and strain field of inhomogeneity are calculated, while the image force, field intensity factors of blunt crack are also presented. Moreover, a new matrix expression of the energy release rate and generalized strain energy density (SED) are deduced. With the size variation of blunt crack, the results can be reduced to the case of the interaction between a piezoelectric screw dislocation and a line crack in inhomogeneity. Numerical analysis are then conducted to reveal the effects of the dislocation location, the size of inhomogeneity and blunt crack and the applied load on the image force, energy release rate and strain energy density. The influence of dislocation on energy release rate and strain energy density is also revealed.     

温度对金属材料钼位错发射的影响

应用关联参照模型、随位错位置变化的柔性位移边界条件和三维分子动力学方法研究了体心立方（ＢＣＣ）金属晶体钼在不同温度下裂尖发射位错的力学行为，随着温度的提高，不但发射位错的临界应力强度因子下降而且在同一应 度因子条件下，发射位错的数量出增加，位错速度和不全位错之间的扩展距离对温度不敏感，在位错发射过程中，发现了稳定的和不稳定的两个变形状态，在稳定的有状态，位错发射后，塞积在远离裂纹尖端处；必须增加外