6～18 GHz宽带GaN功率放大器MMIC

报道了一款采用三级拓扑结构的6～18 GHz宽带单片微波功率放大器芯片.放大器采用了微带结构,并使用电抗匹配进行设计,减小输出匹配电路的损耗和提高效率.经匹配优化后放大器在6～18 GHz整个频带内脉冲输出功率大于6 W,小信号增益达到25 dB,在14 GHz频点处峰值输出功率达到10 w,对应的功率附加效率为21%...     

2W6～18GHz宽带MMIC功率放大器

运用微波在片测试技术和IC-CAP模型提取软件对总栅宽为850μm PHEMT器件进行了大信号建模,并利用此模型,采用分布式放大器与电抗匹配相结合的方法,制备了一款三级宽带功率放大器。实验测试结果和ADS仿真结果相吻合。其测试结果为:在6～18GHz频段内,平均输出功率Po为33dBm,功率增益Gp在22～24dB之间,功率附加效率PAE在23%～28%之间,输入输出端口电压驻波比VSWR<1.8,稳定性判断因子K>1(在5～19GHz内)。     

6～27 GHz GaAs宽带功率放大器MMIC

基于90 nm GaAs赝配高电子迁移率晶体管(PHEMT)工艺研制了一款6～27 GHz宽带功率放大器单片微波集成电路(MMIC)。采用预匹配电路降低带内低频段的增益,将宽带电路设计简化为窄带电路设计。采用滤波器匹配网络,将GaAs PHEMT的栅极等效电容和漏极等效电容加入匹配电路中,缩小了宽带功率放大器MMIC的尺寸。在片测试结果表明,该放大器MMIC在6～27 GHz内,增益大于23 dB,增益平坦度约为±0.8 dB,饱和输出功率大于20.9 dBm。放大器MMIC的工作电压为4 V,电流为125 mA,芯片尺寸为1.69 mm×0.96 mm。该宽带功率放大器MMIC有利于降低宽带系统的复杂度和成本。     

V波段3 W GaN功率放大器MMIC

以50 μm厚的SiC为衬底,基于T型栅GaN HEMT工艺技术,设计并制作了一款V波段GaN功率放大器单片微波集成电路(MMIC).该功率放大器MMIC电路采用三级放大拓扑结构进行设计;采用高低阻抗微带传输线进行阻抗匹配和片上功率合成;采用介质电容和薄膜电阻进行偏置网络设计,实现稳定工作和低损耗输出.经测试,在55～65 GHz频带内,漏极工作电压+20V、栅极工作电压-2.3 V的偏置条件下,在占空比20％、脉宽100 μs脉冲状态时,该功率放大器MMIC的饱和输出功率达到3 W以上,功率附加效率达到22％;连续波状态时,其饱和输出功率达到2.5 W以上,60 GHz时最高功率达到3 W.     

高效率X波段GaN MMIC功率放大器的研制

突破了GaN MMIC功率放大器的设计、制造、测试等关键技术,研制成功X波段GaN MMIC功率放大器。设计及优化了电路拓扑结构及电路参数,放大器芯片采用了国产外延材料及标准芯片制作工艺。单片功率放大器包含两级放大电路,采用了功率分配及合成匹配电路,输入输出阻抗均为50Ω。制作了微波测试载体及夹具,最终实现了X波段GaN MMIC功率放大器微波参数测试。在8.7～10.9 GHz频率范围内,该功率放大器输出功率大于16 W,功率增益大于14 dB,增益波动小于0.4 dB,输入驻波比小于2∶1,功率附加效率大于40%,带内效率最高达52%。     

2~6 GHz紧凑型、高效率GaN MMIC功率放大器

基于0.25 μm SiC衬底的GaN高电子迁移率晶体管(HEMT)工艺,根据有源器件的G_max和输出功率密度,选择末级功率器件尺寸并确定其最优阻抗;采用三级放大器,其栅宽比为1:4:16,实现高功率增益和高效率;利用等Q匹配技术,把偏置电路融入匹配电路中,实现简单、低损耗和宽带阻抗变换;借助电磁场寄生参数提取技术实现紧凑型芯片版图,尺寸为2.8 mm×2.0 mm。测试结果表明,偏置条件漏极电压U_D=28 V、U_G=-2.2 V,在2~6 GHz频率范围内,功率放大器增益大于24 dB,饱和输出功率大于43 dBm,功率附加效率大于45%,可广泛应用于电子对抗和电子围栏等领域。     

1～2GHz宽带GaN功率放大器的设计与实现

针对GaN HEMT的自身特性,采用电抗匹配放大器结构,基于ADS谐波平衡仿真软件,设计了一个1～2 GHz宽带功率放大器.设计采用Cree公司提供的CGH400系列GaNHEMT大信号模型,并用混合集成电路工艺实现了功率放大器.测试结果显示,功率放大器在1～2 GHz频带内,饱和输出功率大于40.2 dBm,小信号增益大于14 dB,最大PAE大于70％.     

2～6GHz单片功率放大器

报道了有耗匹配宽带单片功率放大器的研究方法和结果。该两级单片功放电路采用自建的 Root非线性模型进行了谐波平衡分析。在 2 .0～ 6.7GHz频带上线性增益为 17d B,平坦度为± 0 .75d B,输入和输出驻波分别小于 2。全频带上 ,饱和输出功率为 1～ 1.4 W,功率附加效率大于2 0 %。该宽带单片功率放大器在 76mm Ga As单片 MMIC工艺线上用全离子注入、0 .5μm栅长工艺研制完成 ,电路芯片面积为 0 .1mm× 2 .6mm× 2 .7mm。     

K波段2.5 W GaN功率MMIC设计

报道了一款采用0.15μm GaN功率MMIC工艺研制的功率放大器芯片。芯片工作在5G毫米波候选频段24.75~27.50GHz,采用三级放大结构。结合小信号参数和带有预匹配的Load-pull进行设计,末级匹配电路使用宽带匹配拓扑,在满足输出功率的条件下,尽可能降低损耗并兼顾效率匹配,以提升芯片附加效率;使用RCL稳定网络提高电路的稳定性,优化级间网络的版图布局提高功率分配网络和合成网络的幅相一致性;在输入级使用有耗匹配以降低芯片输入驻波。芯片在漏级电压24V连续波工作条件下,在24.5~27.5GHz范围内饱和输出功率大于34dBm(2.5 W),附加效率25%~30%。     

S波段35W GaN功率MMIC

报道了一款采用两级拓扑结构的2～4 GHz宽带高功率单片微波功率放大器芯片.放大器采用了微带结构,并使用电抗匹配进行设计,重点在于宽带功率效率平坦化设计.经匹配优化后放大器在2～4 GHz整个频带内脉冲输出功率大于35 W,小信号增益达到22 dB,在2.4 GHz频点处峰值输出功率达到40 W,对应的功率附加效率为3...     

6-18 GHz高效率功率MMIC设计与测试

A three-stage monolithic microwave integrated circuit （MMIC） power amplifier from 6-18 GHz, which achieves high output power with excellent efficiency, is designed, fabricated and tested. Measured results show that the saturated output power and the small signal gain are about 32 dBm and 23 dB, respectively. Thus, the power added efficiency of about 28% indicates that it is useful in various communication systems.     

一个8~18GHz的宽带高功率放大器

设计研制了一个8~18GHz的混合集成电路宽带高功率放大器。高功率放大器由基于GaAs MMIC工艺的4指微带兰格耦合器实现。为了减小电磁干扰,采用散热效果好的多层AlN材料作为功率放大器的载体。当输入功率为25dBm时,功率放大器输出连续波饱和功率在8–13 GHz 频率范围内大于39dBm,在其他频率范围内大于38.6dBm,在11.9GHz我们得到最大输出功率39.4dBm。在整个频带内,功率附加效率大于18%,当输入功率为18dBm时小信号增益为15.70.7 dB。高功率功率放大器尺寸为25mm*15mm*1.5mm.     

An 8-18 GHz broadband high power amplifier

An 8-18 GHz broadband high power amplifier(HPA) with a hybrid integrated circuit(HIC) is designed and fabricated.This HPA is achieved with the use of a 4-fingered micro-strip Lange coupler in a GaAs MMIC process.In order to decrease electromagnetic interference,a multilayer AlN material with good heat dissipation is adopted as the carrier of the power amplifier.When the input power is 25 dBm,the saturated power of the continuous wave(CW) outputted by the power amplifier is more than 39 dBm within the frequency range of 8-13 GHz,while it is more than 38.6 dBm within other frequency ranges.We obtain the peak power output,39.4 dBm,at the frequency of 11.9 GHz.In the whole frequency band,the power-added efficiency is more than 18%.When the input power is 18 dBm,the small signal gain is 15.7±0.7 dB.The dimensions of the HPA are 25×15×1.5 mm~3.     

A unique MMIC broadband power amplifier approach

A broadband monolithic microwave integrated circuit (MMIC) power amplifier design approach is described using lossy matching networks in the form of a bridged-T all-pass network. This approach offers the advantage of exceptional gain flatness, good input VSWR, high efficiency, and small size. A two-stage amplifier is described that delivers power greater than 1 W across the 2 to 6-GHz range with a linear gain of 20 dB, an input VSWR better than 1.7:1, and a power-added efficiency of 30% to 37% with a chip area less than 4.4 mm²     

2~4 GHz宽带高效率功放的设计

针对宽带高效率功放的设计要求,基于宽带匹配网络设计了一款GaN宽带高效率功率放大器,其工作频率覆盖整个S波段。仿真结果显示,该功放在整个S频段内漏极效率(DE)大于62%,功率附加效率(PAE)大于57%,增益大于10.6 dB。实测结果表明,该功放在整个频段内DE大于54%,PAE大于48%,增益大于9 dB,增益平坦度在1 dB以内,实现了S波段高效率宽带功率放大器的设计。     

Design of 20-44 GHz broadband doubler MMIC

This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz.This chip is composed of a single ended-into differential-out active Balun,balanced FETs in push-push configuration,and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power,and the fundamental frequency suppression is typically -20 dBc up to 44 GHz.The MMIC works at...     

Design of 20-44 GHz broadband doubler MMIC

This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15 μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz. This chip is composed of a single ended-into differential-out active Balun, balanced FETs in push-push configuration, and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power, and the fundamental frequency suppression is typically -20 dBc up to 44 GHz. The MMIC works at VDD = 3.5 V, VSS = -3.5 V, Id = 200 mA and the chip size is 1.5 ×1.8 mm2.     

0.3～8GHz超十倍频程MMIC低噪声放大器设计

为应对未来射电天文发展对超过十倍频程带宽接收性能的需求,实现厘米波多波段同时观测,使用法国OMMIC公司70 nm GaAs mHEMT工艺研究并设计一款工作频率为0.3～8 GHz的超宽带单片微波集成低噪声放大器芯片.放大器电路采用三级级联放大结构,双电源供电,芯片尺寸为2000μm×1000μm.仿真结果显示,常温...     

An indium phosphide MMIC amplifier for 180-205 GHz

This paper describes a high-performance indium phosphide (InP) monolithic microwave integrated circuit (MMIC) amplifier, which has been developed for application in radioastronomy and imaging-array receivers. Implemented using coplanar waveguide, the six-stage amplifier exhibits 15 db gain, 10 dB input and output return loss, and low noise figure over the 180-205 GHz frequency range. Only one design pass was needed to obtain excellent agreement between the predicted and measured characteristics of the circuit, a unique achievement in this frequency band. The circuit is also the first 180-205 GHz amplifier designed for and successfully fabricated using TRW's standard 0.1-μm InP HEMT process     

A monolithic three-stage 2-8-GHz feedback amplifier

A monolithic three-stage resistive-feedback amplifier has been developed for the 2-8-GHz band. This amplifier uses a novel approach which incorporates three stages with varying FET gate widths. The measured gain is 19 ± 1 dB and the VSWR is 2.3:1 in this band. The amplifier chip has a noise figure of ∼6 dB over the bandwidth. The chip size is less than 2.0 × 1.6 mm²and includes the bias circuitry. The amplifier also has AGC capability with more than 20 dB of gain control.